JP6104724B2 - Probe unit, substrate inspection apparatus, and probe unit manufacturing method - Google Patents

Description

  The present invention relates to a probe unit including a support unit for supporting a probe, a substrate inspection apparatus including the probe unit, and a probe unit manufacturing method for manufacturing the probe unit.

  As this type of probe unit, an inspection jig disclosed in JP-A-2005-338065 is known. This inspection jig is an inspection jig that is mounted and used in an inspection apparatus that performs an electrical inspection of an inspection object, and includes a probe, a distal end side support that supports the distal end side of the probe, and a rear end of the probe. The rear end side support body which supports the side, and the support pillar which connects a front end side support body and a rear end side support body are comprised. The front end side support is configured by laminating three support plates. Each support plate is formed with a through hole, and each through hole constitutes a distal end side insertion hole through which the distal end portion of the probe is inserted. The distal end side insertion hole is formed along a direction perpendicular to the support plate. The rear end side support is configured by stacking three support plates. Each support plate is formed with a through hole, and a rear end side insertion hole through which the rear end side portion of the probe is inserted is formed by each through hole. In this case, the rear end side insertion hole is formed with respect to the front end side insertion hole (in a direction orthogonal to the front end side support body) by stacking the support plate with the center axis of each through hole being slightly displaced. It is formed so as to be inclined. In this inspection jig, since the rear end side insertion hole is inclined with respect to the front end side insertion hole, the intermediate portion of the probe supported by the front end side support body and the rear end side support body is inclined. For this reason, when the tip portion of the probe is pressed against the object to be inspected at the time of inspection, it is possible to easily bend the intermediate portion of the inclined probe.

  However, when manufacturing this inspection jig, it is necessary to perform a complicated operation of inserting the probe through the rear end side insertion hole inclined with respect to the front end side insertion hole many times (for many probes). Therefore, it is difficult to improve the manufacturing efficiency of the inspection jig. As a technique for improving this problem, the applicant, in the manufacturing process, has a state where the central axes of the through holes of the plurality of support plates constituting the rear end side support body are coaxial (that is, the rear end side insertion hole is inclined). In this state, the probe is inserted into each through hole, and then the center axis of the through hole of each support plate is slightly shifted so that the rear end side insertion hole is inclined with respect to the front end side insertion hole. We are developing a probe unit that can In this probe unit, since the probe can be easily inserted into the rear end side insertion hole, the manufacturing efficiency can be improved.

Japanese Patent Laying-Open No. 2005-338065 (page 6-9, FIG. 2-4)

  However, the conventional probe unit developed by the applicant also has the following problems to be improved. That is, in this probe unit, in the manufacturing process, the probe is inserted into each through hole in a state where the central axes of the through holes of the plurality of support plates constituting the rear end side support body are coaxial. On the other hand, inspection probes are becoming increasingly finer in response to higher density of substrates to be inspected, and accordingly, the diameters of through holes in each support plate are also becoming smaller. In this case, since a fine drill bit for drilling a fine through hole corresponding to a fine probe has low rigidity, it is necessary to reduce the thickness of the support plate in order to reliably drill the through hole. On the other hand, if the thickness of the support plate is reduced, the rigidity of the support plate is lowered and it is difficult to reliably support the probe. For this reason, in this probe unit, as shown in FIG. 16, only the thickness of the formation region 500a in which the support hole (through hole) 501 is formed is thinned, and the thickness of the non-formation region 500b in which the support hole 501 is not formed. The structure which laminated | stacked each support plate 500 in the state which contact | abutted the non-formation area | region 500b in each support plate 500 using the several support plate 500 formed thickly is employ | adopted. However, in this configuration, since the formation regions 500a are separated from each other and the thickness of the formation region 500a is thin (that is, the length of the support hole 501 is short), the probe 11 is inserted into the support hole 501 of each support plate 500. As shown in the figure, the probe 11 inserted through the support hole 501 of the first support plate 500 is guided straight toward the corresponding support hole 501 of the second support plate 500. The probe 11 may be guided to another (adjacent) support hole 501, and it is difficult to efficiently perform the operation of correctly inserting the probe 11 into the support hole 501 to be inserted. It is difficult to further improve the production efficiency of the unit.

  The present invention has been made in view of such problems, and has as its main object to provide a probe unit, a substrate inspection apparatus, and a probe unit manufacturing method that can improve manufacturing efficiency.

  In order to achieve the above object, a probe unit according to claim 1 is a probe unit including a probe for inputting and outputting an electric signal by bringing a tip portion into contact with a contact target, and a support portion for supporting the probe. The support portion includes a distal end side support plate that has a distal end portion side support hole and supports the distal end portion of the probe inserted through the distal end portion side support hole, and a proximal end portion side support hole. And three or more base end side support plates that support the base end portion of the probe inserted through the base end side support hole, and each base end side support plate includes the base end The portion-side support hole formation region is formed thinner than the non-formation region, and the central axes of the base-end side support holes are in contact with or close to each other in a coaxial state. In the manufacturing process of the probe unit. The first posture when the insertion of the probe into the base end side support hole is started, and the posture in the state where the manufacturing process is completed, and the base end side support plate is defined in advance. The base end that is configured to be switchable between the second postures stacked in order and that is disposed at a position that is the farthest from the distal end side support plate in the second posture among the base end side support plates. The first support plate as the part-side support plate is arranged such that the center position in the thickness direction of the formation region is farther from the tip-side support plate in the second posture than the center position in the thickness direction of the non-formation region. The second support plate as the base end side support plate that is formed and disposed at a position closest to the tip end side support plate in the second posture of the base end side support plates, The center position in the thickness direction of the formation region is not formed It is formed so as to be closer to the tip end side support plate in the second posture than the center position in the thickness direction of the region, and is further away from the tip end side support plate than the first support plate in the first posture. And it arrange | positions so that the said formation area of the said 2nd support plate may contact | abut or adjoin to the said formation area of the said 1st support plate.

  The probe unit according to claim 2 is the probe unit according to claim 1, wherein the first support plate is positioned on the second support plate side in the first posture in the formation region and the non-formation region. The second support plate is formed such that one surface located on the first support plate side in the first posture in the formation region and the non-formation region is flush with each other. Has been.

  Further, the probe unit according to claim 3 is the probe unit according to claim 1 or 2, wherein each of the base end side support plates has the center axes of the base end side support holes arranged in the second direction. The posture is arranged so as to be displaced by a predetermined amount of displacement.

  According to a fourth aspect of the present invention, there is provided the substrate inspection apparatus according to any one of the first to third aspects, and the probe of the probe unit in contact with the conductor portion of the substrate as the contact target. And an inspection unit for inspecting the substrate based on the electrical signal.

  The probe unit manufacturing method according to claim 5 manufactures a probe unit including a probe for inputting / outputting an electric signal by bringing a tip portion into contact with a contact target and a support portion for supporting the probe. A probe unit manufacturing method, comprising: a distal end side support plate that has a distal end side support hole and supports the distal end portion of the probe inserted through the distal end side support hole; and a proximal end side support hole. The base end portion supporting hole is formed so that the thickness of the formation region of the base end side support hole is smaller than the thickness of the non-formation region, and the base end portion of the probe inserted through the base end side support hole is supported. In the manufacturing process of the probe unit, using the support portion including three or more base end side support plates, the central axes of the base end side support holes are in contact with each other in a coaxial state. Or in close proximity to each of the groups The base end side support plates are maintained in the first posture in which the part side support plates are stacked, and insertion of the probe into the base end side support holes is started. The base end side support plates are switched to the second posture in which the base end side support plates are stacked in a predetermined order, and the central position of the formation region in the thickness direction is the thickness direction of the non-formation region. A first support plate as the base end portion side support plate formed so as to be separated from the distal end portion side support plate in the second posture from the center position is separated from the distal end portion side support plate in the second posture. The center position in the thickness direction of the formation region is arranged so as to be closer to the tip end side support plate in the second posture than the center position in the thickness direction of the non-formation region. As the base end side support plate In the first posture, the support plate is further away from the tip side support plate than the first support plate, and the formation region of the second support plate is in contact with the formation region of the first support plate or It arrange | positions so that it may adjoin, and is arrange | positioned in the position which adjoins the said front-end | tip part side support plate in the said 2nd attitude | position.

  The probe unit according to claim 1, the substrate inspection apparatus according to claim 4, and the probe unit manufacturing method according to claim 5, wherein the base region side support is formed such that the thickness of the forming region is thinner than the thickness of the non-forming region. The center position in the thickness direction of the formation region is the center position in the thickness direction of the non-formation region when each base end side support plate is set to the first posture at the start of insertion of the probe into each base end side support hole of the plate. The tip of the second support plate formed so as to be closer to the tip side support plate in the second posture than in the second posture in the center position in the thickness direction of the formation region than in the thickness direction of the non-formation region. The second support plate formation region is in contact with or close to the first support plate formation region and is more distant from the tip support plate than the first support plate formed so as to be separated from the portion support plate. To be placed. For this reason, according to this probe unit, board | substrate inspection apparatus, and probe unit manufacturing method, in the 1st attitude | position, each base end part side support hole formed in each formation area of a 2nd support plate and a 1st support plate Since it can be made continuous, even if the probe is inserted in an oblique direction with respect to each base end side support hole, the probe inserted into each base end side support hole is not connected to the second support plate and the first support. It is possible to prevent the probe from being greatly inclined with respect to the plate, and to smoothly insert the probe into the base end side support hole of the other base end side support plate positioned in the insertion direction. Therefore, according to the probe unit, the substrate inspection apparatus, and the probe unit manufacturing method, the probe is inserted into the support hole to be inserted due to the probe being inserted into another support hole different from the support hole to be inserted. Compared with the conventional configuration in which it is difficult to efficiently perform the operation of inserting the probe correctly, the efficiency of the probe insertion operation can be sufficiently improved.

  In the probe unit according to claim 2 and the substrate inspection apparatus according to claim 4, the one surface (upper surface) located on the second support plate side in the first posture in the formation region and the non-formation region of the first support plate is provided. The first support plate is formed so as to be flush with each other, and the first surface (lower surface) located on the first support plate side in the first posture in the formation region and the non-formation region of the second support plate is flush with each other. Two support plates are formed. For this reason, according to the probe unit and the substrate inspection apparatus, the support hole of the first support plate and the second support plate are brought into contact with one surface (upper surface) of the first support plate and one surface (lower surface) of the second support plate. As a result of being able to continue (connect) the support holes of the support plate without gaps, the probe inserted through each of the continuous support holes is directed toward the support holes of the other support plates located in the front of the insertion direction. It can be guided accurately.

  In the probe unit according to claim 3 and the substrate inspection apparatus according to claim 4, the central axes of the base end side support holes in each base end side support plate are predetermined in the second posture. Each base end side support plate is disposed so as to be displaced by the amount of displacement. Therefore, according to the probe unit and the substrate inspection apparatus 1, for example, when replacing a damaged probe, a new probe is placed on the base end side while maintaining each base end side support plate in the second posture. Simply insert the support plate at the base end side support hole and the tip end side support hole at the tip end side support plate, and tilt the probe's middle and base end portions (excluding the tip) relative to each support plate. It can extend along the direction.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. 2 is a configuration diagram showing a configuration of a probe unit 2. FIG. 2 is a plan view of a probe 11. FIG. It is a disassembled perspective view of the support part 12 in the state which faced the front-end | tip part side support part 31 downward. It is a disassembled perspective view of the support part 12 of the state which faced the base end side support part 32 downward. FIG. 4 is a cross-sectional view showing the configuration of a distal end side support portion 31 and a proximal end side support portion 32. FIG. 6 is a perspective view of the support portion 12 in a state where a distal end side support portion 31 and a proximal end side support portion 32 are brought close to each other. It is a perspective view of the support part 12 in case the support plates 41-46 are a 2nd attitude | position. FIG. 5 is a first explanatory view illustrating a method for manufacturing the probe unit 2. FIG. 5 is a second explanatory view explaining the method for manufacturing the probe unit 2. FIG. 6 is a third explanatory view explaining the method for manufacturing the probe unit 2. FIG. 10 is a fourth explanatory view explaining the method for manufacturing the probe unit 2. FIG. 10 is a fifth explanatory diagram (a cross-sectional view taken along the X plane in FIG. 7) illustrating a method for manufacturing the probe unit 2; It is a 6th explanatory view explaining the manufacturing method of probe unit. It is a 7th explanatory view explaining the manufacturing method of probe unit 2 (Y surface sectional view in Drawing 8). It is a block diagram which shows the structure of the conventional probe unit.

  Hereinafter, embodiments of a probe unit, a substrate inspection apparatus, and a probe unit manufacturing method will be described with reference to the drawings.

  First, the configuration of the substrate inspection apparatus 1 as an example of the substrate inspection apparatus will be described. A substrate inspection apparatus 1 shown in FIG. 1 includes a probe unit 2, a moving mechanism 3, a mounting table 4, a measurement unit 5, an inspection unit 6, a storage unit 7, and a processing unit 8, as shown in FIG. It is configured to be inspectable.

  As shown in FIG. 2, the probe unit 2 includes a plurality of probes 11, a support portion 12, and an electrode plate 13.

  The probe 11 is used to input / output an electric signal by contacting a conductor portion such as a conductor pattern on the substrate 100 at the time of inspection. As an example, a conductive metal material (for example, beryllium copper alloy, SKH, etc.) is used. (High-speed tool steel) and tungsten steel) are formed into a rod having a circular cross section that can be elastically deformed (see FIG. 3). In addition, an insulating layer made of an insulating coating material (for example, fluorine resin, polyurethane, polyester, polyimide, or the like) is formed on the peripheral surface of the intermediate portion 22 of the probe 11. Therefore, the intermediate portion 22 has a diameter L2 larger than the diameter L1 of the distal end portion 21 and the diameter L3 of the proximal end portion 23, as shown in FIG. That is, the probe 11 has a distal end portion 21 and a proximal end portion 23 that are smaller in diameter than the intermediate portion 22.

  As shown in FIGS. 2, 4, 5, and 8, the support portion 12 includes a distal end portion side support portion 31, a proximal end portion side support portion 32, and a spacer 33, and is configured to support the probe 11.

  The distal end side support portion 31 is a member that supports the distal end portion 21 side of the probe 11, and includes support plates 41 and 42 corresponding to the distal end portion side support plate, as shown in FIGS. It is configured.

  For example, the support plate 41 is formed in a plate shape from a non-conductive resin material. As shown in FIGS. 5 and 6, the support plate 41 has a plurality of support holes 51 (tip-side support holes) that are circular in the plan view (the same number as the number of probes 11). The support hole 51 has a diameter R1 (see FIG. 6) slightly larger than a diameter L1 (see FIG. 3) of the distal end portion 21 of the probe 11 and a diameter R2 (see the same drawing) of the intermediate portion 22 of the probe 11. It is formed with a slightly smaller diameter so that only the distal end portion 21 can be inserted without inserting the intermediate portion 22. As shown in FIG. 6, an inclined portion (tapered portion) is provided at the edge of the opening of the support hole 51. 9 and 15, only a part of the support hole 51 and support holes 52 to 56 described later are illustrated.

  Further, as shown in FIGS. 5, 6, 13, and 15, the support plate 41 has two insertion holes 61a (FIGS. 6, 13) into which positioning pins 34a and 34c used in the manufacturing process of the probe unit 2 described later can be inserted. 15, only one is shown). Further, as shown in FIG. 5, the support plate 41 is formed with six fixing holes 61 b into which the bolts 35 used when fixing the support plate 41 and the support plate 42 to the spacer 33 can be inserted. The probe unit 2 includes a plurality of positioning pins 34a and 34c, bolts 35, and positioning pins 34b described later. FIGS. 4 and 5 show these one by one.

  The support plate 42 is formed in the shape of a plate having the same thickness as that of the support plate 41 by using the same material (non-conductive resin material) as that of the support plate 41. As shown in FIGS. 4 and 6, the support plate 42 is formed with a plurality of support holes 52 (tip-side support holes) that are circular in plan view (the same number as the number of probes 11). As shown in FIG. 6, the support hole 52 has a diameter R2 that is the same as the diameter R1 of the support hole 51 of the support plate 41, and allows only the distal end portion 21 to be inserted without inserting the intermediate portion 22. It is possible. Further, as shown in the figure, an inclined portion (tapered portion) is provided at the edge of the opening of the support hole 52.

  Further, as shown in FIGS. 4, 6, 13, and 15, the support plate 42 has two insertion holes 62a through which the positioning pins 34a and 34c can be inserted (only one is shown in FIGS. 6, 13, and 15). Is formed). Further, as shown in FIG. 4, the support plate 42 is formed with six fixing holes 62b through which the bolts 35 can be inserted.

  The base end side support portion 32 is a member that supports the base end portion 23 side of the probe 11 and, as shown in FIGS. 2 and 4 to 8, four pieces (three pieces) corresponding to the base end portion side support plate. The support plates 43 to 46 in the above example) are provided.

  As an example, the support plate 43 is formed in a plate shape from a non-conductive resin material. Further, as shown in FIGS. 5 and 6, a plurality of support holes 53 (base end side support holes) having a circular shape in the plan view (the same number as the number of probes 11) are formed in the support plate 43. As shown in FIG. 6, the support hole 53 is formed so that its diameter R3 is slightly larger than the diameter L2 (see FIG. 3) of the intermediate portion 22 of the probe 11, and the intermediate portion 22 can be inserted. It has become. Further, as shown in FIG. 6, an inclined portion (tapered portion) is provided at the edge of the opening of the support hole 53.

  Further, as shown in FIGS. 5, 6, 13 and 15, the support plate 43 has two insertion holes 63 a and 63 b (FIG. 6 and FIG. 6) through which positioning pins 34 b and 34 c used in the manufacturing process of the probe unit 2 can be inserted. 13, only one is shown). Further, as shown in FIG. 5, the support plate 43 is formed with six fixing holes 63 c into which the bolts 35 used when fixing the support plate 43 and the support plate 44 to the spacer 33 can be inserted.

  The support plate 44 is formed in a plate shape having the same thickness as the support plate 43 by using the same material (non-conductive resin material) as the support plate 43. Further, as shown in FIG. 6, a plurality of support holes 54 (base end side support holes) having a circular shape in plan view (the same number as the number of probes 11) are formed in the support plate 44. In this case, as shown in the figure, the support hole 54 has a diameter R4 that is the same as the diameter R3 of the support hole 53 of the support plate 43 so that the intermediate portion 22 can be inserted therethrough. . Further, as shown in the figure, an inclined portion (tapered portion) is provided at the edge of the opening of the support hole 54.

  Further, as shown in FIGS. 6, 13 and 15, the support plate 44 has two insertion holes 64 a and 64 b (only one is shown in each figure) through which the positioning pins 34 b and 34 c described above can be inserted. ) Is formed. The support plate 44 has six fixing holes (not shown) through which the bolts 35 can be inserted.

  The support plate 45 is formed in the shape of a plate about twice as thick as the support plates 43 and 44 by the same material (non-conductive resin material) as the support plates 43 and 44. As shown in FIG. 6, the support plate 45 is formed with a plurality of support holes 55 (base end side support holes) that are circular in the plan view (the same number as the number of probes 11). In this case, as shown in the figure, the support hole 55 is formed such that its diameter R5 is the same as the diameters R3 and R4 of the support holes 53 and 54 of the support plates 43 and 44, and the intermediate portion 22 is inserted. Is possible. Further, as shown in the figure, an inclined portion (tapered portion) is provided at the edge of the opening of the support hole 55.

  Further, as shown in FIGS. 6, 13 and 15, the support plate 45 has two insertion holes 65 a and 65 b (only one is shown in each figure) through which the positioning pins 34 b and 34 c described above can be inserted. ) Is formed. The support plate 45 is formed with six fixing holes (not shown) through which the bolts 35 described above can be inserted.

  The support plate 46 is formed in a plate shape having the same thickness as that of the support plate 45 by using the same material (non-conductive resin material) as the support plates 43 to 45. As shown in FIGS. 4 and 6, a plurality of support holes 56 (base end side support holes) having a circular shape in the plan view (the same number as the number of probes 11) are formed in the support plate 46. In this case, as shown in FIG. 6, the support hole 56 is formed such that its diameter R6 is the same as the diameters R3 to R5 of the support holes 53 to 55 of the support plates 43 to 45, and the intermediate portion 22 is inserted. Is possible. Further, as shown in the figure, an inclined portion (tapered portion) is provided at the edge of the opening of the support hole 56.

  Further, as shown in FIGS. 4, 6, 13, and 15, the support plate 46 has two insertion holes 66a and 66b (one in FIGS. 6, 13, and 15) through which the positioning pins 34b and 34c can be inserted. Only is shown). Further, as shown in FIG. 4, the support plate 46 is formed with six fixing holes 66c through which the bolts 35 can be inserted.

  In this probe unit 2, as shown in FIG. 13, when the central axes of the insertion holes 61a to 66a of the support plates 41 to 46 are coaxial, the support holes 51 to 56 of the support plates 41 to 46 are supported. The center part of each opening part in the support holes 51-56 along the direction perpendicular | vertical with respect to each support plate 41-46 (henceforth only a "perpendicular direction") where each center axis becomes a coaxial state The positions where the insertion holes 61a to 64a are formed are defined so that they are aligned.

  Further, in the probe unit 2, as shown in FIG. 15, the central axes of the insertion holes 61a and 62a of the support plates 41 and 42 and the insertion holes 67a of the spacer 33 described later are coaxial, and the support plate 43 When the central axes of the insertion holes 63b to 66b of .about.46 and the insertion holes 67b of the spacer 33 described later are coaxial, the central axes of the support holes 51 and 52 are coaxial along the vertical direction. In addition, the center axes of the support holes 52 to 56 are displaced by a predetermined amount of displacement (a virtual straight line in which the centers of the opening surfaces of the support holes 52 to 56 are inclined with respect to the support plates 42 to 46). Each support plate 41 to 46 is configured to be in a state of being positioned above.

  Therefore, in this probe unit 2, for example, the order of stacking the support plates 43 to 46 constituting the base end side support portion 32 is arbitrarily changed, for example, as shown in FIG. 46 and 43 can be stacked in this order from the bottom, and as shown in FIG. 15, the support plates 43, 44, 45, and 46 can be stacked in this order (prescribed order) from the bottom. Even in this case, the positioning pins 34c are inserted into the insertion holes 63a to 64a of the support plates 43 to 46 so that the central axes of the support holes 53 to 56 are kept coaxial, or the insertion holes 63b to 66b are inserted into the insertion holes 63b to 66b. The positioning pin 34b can be inserted to maintain the center axis of each of the support holes 53 to 56 displaced. Note that a posture (the posture shown in FIG. 9) in which the support plates 44, 45, 46, and 43 are stacked in this order from below and the central axes of the support holes 53 to 56 are coaxial is equivalent to the first posture. The posture in which the support plates 43, 44, 45, and 46 are stacked in this order from the bottom and the central axes of the support holes 53 to 56 are displaced (the posture shown in FIG. 15) corresponds to the second posture.

  Here, the support holes 51 to 56 are formed by drilling the support plates 41 to 46 using a drill. In this case, the small-diameter drill for forming the small-diameter support holes 51 to 56 has low rigidity, and when the support plates 41 to 46 are thick, it is difficult to drill the support holes 51 to 56. It is necessary to form a thickness of ~ 46 thin. On the other hand, when the support plates 41 to 46 are formed to be thin as a whole, the rigidity of the support plates 41 to 46 is lowered, and bending or the like is likely to occur, and it is difficult to reliably support the probe 11. For this reason, in this probe unit 2, as shown in FIG. 6, while forming the thickness of the formation area 41a-46a in which the support holes 51-56 in each support plate 41-46 are formed, each support plate 41-46 is formed. By forming the non-formation regions 41b to 46b where the support holes 51 to 56 in 46 are not formed thicker than the formation regions 41a to 46a, the support of the probe 11 can be surely supported while making the support holes 51 easy. doing.

  Further, in the probe unit 2, the position closest to the support plate 42 (distal end side support plate) in the above-described second posture (see FIG. 15) among the support plates 43 to 46 (base end side support plate). As shown in FIG. 6, the support plate 43 (corresponding to the second support plate) disposed on the lowermost side in the drawing has a center position in the thickness direction of the formation region 43a of the non-formation region 43b. More closely to the support plate 42 in the second posture than the center position in the thickness direction (so as to be located on the lower side in the figure), that is, the formation region 43a is below the non-formation region 43b in the thickness direction in the second posture. It is formed to be unevenly distributed on the side. Further, as shown in the figure, the support plate 43 is one surface located on the support plate 46 (first support plate) side in the lower surface (first posture (see FIG. 9)) of the formation region 43a and the non-formation region 43b. ) Are flush with each other.

  Further, in the probe unit 2, a position (that is, a position farthest from the support plate 42 (front end side support plate) in the second posture (see FIG. 15) among the support plates 43 to 46 (base end side support plates). , The support plate 46 (corresponding to the first support plate) arranged on the uppermost side in the same figure is, as shown in FIG. 6, the center position in the thickness direction of the formation region 46a is in the thickness direction of the non-formation region 46b. In the second posture from the center position so as to be separated from the support plate 42 (so as to be located on the upper side in the figure), that is, the formation region 46a is unevenly distributed in the thickness direction of the non-formation region 43b in the second posture. Is formed. Further, as shown in the figure, the support plate 46 is a surface located on the support plate 43 (second support plate) side in each upper surface (first posture (see FIG. 9)) in the formation region 46a and the non-formation region 46b. ) Are flush with each other.

  Furthermore, in this probe unit 2, as shown in FIG. 6, the support plates 44 and 45 are formed in the same manner as the support plate 46, and the center positions in the thickness direction of the formation regions 44a and 45a are the thicknesses of the non-formation regions 44b and 45b. The upper surface of each of the formation regions 44a and 45a and the non-formation regions 44b and 45b is formed so as to be separated from the support plate 42 in the second posture with respect to the center position in the direction (located on the upper side in the figure). Is formed to be flush with each other.

  As shown in FIGS. 4 and 5, the spacer 33 is formed in a U shape in plan view, and as shown in FIGS. 8, 14, and 15, the spacer 33 is formed between the distal end side support portion 31 and the proximal end side support portion 32. It is arrange | positioned between (the support plate 42 and the support plate 43). The spacer 33 has a function of maintaining the distal end side support portion 31 configured by the support plate 41 and the support plate 42 and the proximal end side support portion 32 configured by the support plates 43 to 46 in a separated state. have.

  As shown in FIG. 5, an insertion hole 67a through which the positioning pin 34a can be inserted is formed on the end surface of the spacer 33 on the tip end side (upper side in the figure). As shown in FIG. 4, an insertion hole 67b through which the positioning pin 34b can be inserted is formed in the end surface of the spacer 33 on the base end side (upper side in the figure). Further, as shown in FIGS. 4 and 5, six screw holes 67 c (12 in total) into which the bolts 35 described above can be screwed are formed on the end surface on the distal end side and the end surface on the proximal end side of the spacer 33. Has been.

  The electrode plate 13 is formed in a plate shape from a non-conductive resin material or the like, and is detachably disposed on the base end side support portion 32 in the support portion 12 as shown in FIG. . In addition, an electrode (not shown) is fitted into a contact portion of each electrode 11 with each base end 23 of the electrode plate 13, and the probe 11 and the measurement unit 5 are electrically connected to each electrode. Cables 14 (see FIG. 2) are connected to each other. Further, the electrode plate 13 is configured to be attachable to the moving mechanism 3 by a fixing tool (not shown).

  The moving mechanism 3 moves the probe unit 2 in a direction toward and away from the mounting table 4 (the substrate 100 mounted on the mounting table 4) according to the control of the processing unit 8. The mounting table 4 is configured to be able to mount the substrate 100 and to be able to fix the mounted substrate 100. The measurement unit 5 performs a measurement process for measuring a physical quantity (for example, a resistance value) based on an electrical signal input / output via the probe 11.

  Under the control of the processing unit 8, the inspection unit 6 executes an inspection process for inspecting the quality of the substrate 100 (whether the conductor is disconnected or short-circuited) based on the resistance value as a physical quantity measured by the measurement unit 5. The storage unit 7 temporarily stores the resistance value measured by the measurement unit 5 and the result of the inspection performed by the inspection unit 6 according to the control of the processing unit 8. The processing unit 8 controls each unit constituting the substrate inspection apparatus 1.

  Next, a manufacturing method (manufacturing process) of the probe unit 2 will be described with reference to the drawings.

  First, the support plates 43 to 46 constituting the base end side support portion 32 are set to the first posture. Specifically, as shown in FIG. 9, the support plates 44, 45, 46, and 43 are stacked in this order from the bottom. In other words, in the second posture (see FIG. 15) of the support plates 43 to 46, the support plate 43 (located at the lowermost position in the drawing) closest to the support plate 42 (tip end side support plate) (the lowermost side in the figure). The support plate 46 (corresponding to the first support plate) disposed at the position (the uppermost side in the drawing) farthest from the support plate 42 in the second posture (refer to the figure) Stack on top.

  Subsequently, it aligns so that the center axis | shaft of each penetration hole 63a-66a in each support plate 43-46 may become coaxial. Subsequently, as shown in FIG. 9, the positioning pins 34c are inserted through the insertion holes 63a to 66a. Thereby, each support plate 43-46 is maintained in a 1st attitude | position. In this case, as shown in the figure, the formation region 43a of the support plate 43 is unevenly distributed on the lower side, and the formation region 46a of the support plate 46 is unevenly distributed on the upper side. The support holes 53 and 56 formed in each of the formation regions 43a and 46a are in contact with the formation region 46a.

  Next, as shown in FIGS. 9 and 10, the distal end portion 21 of the probe 11 is inserted into the support hole 53 of the support plate 43 to support the support hole 56 of the support plate 46, the support hole 55 of the support plate 45, and the support plate 44. The probe 11 is inserted into the support hole 54.

  Here, as shown in FIG. 16, in the configuration in which the formation regions 500a in the two adjacent support plates 500 are separated from each other, when the formation region 500a is thin, the support holes 501 formed in the formation region 500a. Therefore, when the probe 11 is inserted in an oblique direction with respect to the support hole 501, the probe 11 inserted into the support hole 501 of the first support plate 500 is the second support plate 500. Without being guided toward the corresponding support hole 501, there is a risk of being inserted into another adjacent support hole 501.

  On the other hand, in the probe unit 2, since the support holes 53 and 56 formed in the formation regions 43a and 46a of the support plates 43 and 46 are continuous in the first posture, the probe unit 2 is indicated by a broken line in FIG. Thus, even if the probe 11 is inserted in an oblique direction with respect to the support holes 53 and 56, the probe 11 inserted through the support holes 53 and 56 is inserted into the support plates 43 and 46 as indicated by solid lines. Therefore, the support plates 45 and 44 are guided through the support holes 55 and 54 corresponding to the support holes 53 and 56 and smoothly inserted into the support holes 55 and 54.

  Moreover, in this probe unit 2, since the inclined part (taper part) is provided in the edge part of the opening part of each support hole 53-56, the center axis | shaft of the probe 11 has shifted a little from the center of the opening part. Even in such a case, the probe 11 can be smoothly inserted into the support holes 53 to 56.

  Subsequently, the probe 11 is inserted into the other support holes 53 to 56. Next, when the insertion of the probe 11 into all the support holes 53 to 56 is completed, the support plate 43 is moved upward and separated from the support plate 46 as shown in FIG. The probe 11 is pulled out from the hole 53, and the positioning pin 34c is pulled out from the insertion hole 63a.

  Subsequently, the support plate 43 is disposed below the support plate 44. Next, alignment is performed so that the central axis of the insertion hole 63a of the support plate 43 and the central axis of each of the insertion holes 64a to 66a in the support plates 44 to 46 are coaxial, and then, as shown in FIG. The positioning pins 34c are inserted through the insertion holes 63a. Next, as shown in the figure, the distal end portion 21 of the probe 11 is inserted into each support hole 53 of the support plate 43. In this case, since the probe 11 is inserted through the support holes 56, 55, and 54 of the three support plates 46 to 44 at the time when the support plate 43 is disposed below the support plate 44, each probe 11 is By simply pushing in toward the support plate 43 (downward), each tip portion 21 of each probe 11 is guided to each support hole 53 of the support plate 43, whereby each tip portion 21 smoothly enters each support hole 53. Is inserted.

  Subsequently, as shown in FIGS. 7 and 13, the support plate 42 is disposed below the support plate 43, and then the support plate 41 is disposed below the support plate 42 (FIG. 7 illustrates the probe 11. Omitted). Subsequently, alignment is performed so that the central axis of the insertion holes 62a and 61a of the support plates 42 and 41 and the central axis of the insertion holes 63a to 66a in the support plates 43 to 46 are coaxial, and each insertion hole 62a. , 61a is inserted through the positioning pin 34c. Next, the distal end portion 21 of the probe 11 is inserted into the support holes 52 and 51 of the support plates 42 and 41.

  Subsequently, the positioning pin 34c is pulled out from each of the insertion holes 61a to 66a, and then, as shown in FIG. 14, the support plate 42 and the support plate 43 are separated from each other, and a spacer is provided between the support plate 42 and the support plate 43. 33 is disposed.

  Subsequently, as shown in FIG. 15, alignment is performed so that the central axes of the insertion holes 61 a and 62 a of the support plates 41 and 42 and the insertion holes 67 a of the spacer 33 are coaxial, and then each insertion hole 61 a. , 62a and 67a are inserted through the positioning pins 34a. At this time, the central axes of the support holes 51 and 52 in the support plates 41 and 42 are maintained in a coaxial state.

  Subsequently, the bolt 35 is inserted into the fixing holes 61 b and 62 b of the support plates 41 and 42, and the tip end of the bolt 35 is screwed into the screw hole 67 c formed on the end face on the tip end side of the spacer 33. Thereby, the support plate 41 and the support plate 42 are fixed to the spacer 33.

  Next, as shown in FIG. 15, alignment is performed so that the central axes of the insertion holes 63 b to 66 b of the support plates 43 to 46 and the insertion holes 67 b of the spacer 33 are coaxial, and then each insertion hole The positioning pin 34b is inserted through 63b to 66b and 67b. At this time, the center axes of the support holes 52 to 56 of the support plates 42 to 46 are displaced by a predetermined amount of displacement (the center of the opening surface of each support hole 52 to 56 is the support plate 42. In a state where the intermediate portion 22 and the base end portion 23 of the probe 11 are inclined with respect to the support plates 42 to 46 along the virtual straight line. Supported by part 12.

  Next, the bolt 35 is inserted into the fixing holes 63 c to 66 c of the support plates 43 to 46, and the distal end portion of the bolt 35 is screwed into the screw hole 67 c formed on the end surface on the proximal end side of the spacer 33. Thereby, the support plates 43 to 46 are fixed to the spacer 33. Subsequently, the electrode plate 13 is fixed to the outside of the base end side support portion 32. Thus, as shown in FIG. 8, the manufacture of the probe unit 2 is completed (illustration of the electrode plate 13 is omitted in the figure).

  In the probe unit 2, as described above, in the first posture (when insertion of the probe 11 is started), the support holes 53 and 56 formed in the formation regions 43 a and 46 a of the support plates 43 and 46 are continuous. Therefore, even if the probe 11 is inserted in an oblique direction with respect to the support holes 53 and 56, the probe 11 inserted through the support holes 53 and 56 is larger than the support plates 43 and 46. The tilting situation is prevented, and the probe 11 can be guided and smoothly inserted into the support holes 55 and 54 of the support plates 45 and 44 located at the front in the insertion direction. For this reason, in this probe unit 2, the work of correctly inserting the probe 11 into the support hole to be inserted due to the probe 11 being inserted into another support hole different from the support hole to be inserted efficiently. Compared with the conventional configuration that is difficult to perform, the efficiency of the insertion work of the probe 11 can be sufficiently improved.

  Next, a substrate inspection method for inspecting the substrate 100 using the substrate inspection apparatus 1 will be described with reference to the drawings.

  First, the probe unit 2 with the distal end side support portion 31 facing downward is fixed to the moving mechanism 3 (see FIG. 1). Next, the substrate 100 is mounted on the mounting surface of the mounting table 4, and then, the substrate 100 is fixed to the mounting table 4 by a fixing tool (not shown). Next, the substrate inspection apparatus 1 is operated. At this time, the processing unit 8 controls the moving mechanism 3 to move (lower) the probe unit 2 in a direction (downward in FIG. 1) close to the substrate 100 (the mounting surface of the mounting table 4). .

  Subsequently, the processing unit 8 controls the movement mechanism 3 to stop the movement when the probe unit 2 is moved by a predetermined movement amount. Next, the processing unit 8 controls the measurement unit 5 to execute measurement processing. In this measurement process, the measurement unit 5 measures a resistance value as a physical quantity based on an electric signal input / output via each probe 11.

  Subsequently, the processing unit 8 controls the inspection unit 6 to execute inspection processing. In this inspection process, the inspection unit 6 inspects the conductor portion for disconnection and short circuit based on the resistance value measured by the measurement unit 5. Next, the processing unit 8 displays the inspection result on a display unit outside the drawing. Thus, the inspection of the substrate 100 is completed. Subsequently, when a new substrate 100 is inspected, the new substrate 100 is mounted on the mounting table 4 and fixed, and then the substrate inspection apparatus 1 is operated. At this time, the processing unit 8 executes each process described above.

  On the other hand, when a part of the probe 11 disposed in the probe unit 2 is damaged, the probe 11 is replaced by the following procedure. First, the probe unit 2 is removed from the moving mechanism 3. Subsequently, the electrode plate 13 is removed from the support portion 12 (base end side support portion 32). Next, the tip 21 of the damaged probe 11 is pushed into the support plate 46 side. At this time, the base end portion 23 of the probe 11 slightly protrudes from the support plate 46. Subsequently, the protruding proximal end portion 23 is picked and pulled out from the support portion 12.

  Next, the new probe 11 is inserted through the support holes 56 to 51 of the support plates 46 to 41. In this case, the center axes of the support holes 51 and 52 in the support plates 41 and 42 are coaxial along the vertical direction, and the center axes of the support holes 53 to 56 in the support plates 43 to 46 are determined in advance. Since the positions are shifted from each other, the boundary portion between the tip portion 21 and the intermediate portion 22 is elastically deformed, the tip portion 21 extends along the vertical direction, and the portion excluding the tip portion 21 (intermediate portion) 22 and the base end 23) extend along the tilt direction. Subsequently, the probe 11 is further pushed to cause the tip 21 to protrude from the support plate 41, and the exchange of the probe 11 is completed. Thus, in this probe unit 2, it is possible to replace the probe 11 while maintaining the postures of the support plates 41 to 46 in the second posture. Next, the electrode plate 13 is attached to the support portion 12, and then the probe unit 2 is attached to the moving mechanism 3.

  Thus, in this probe unit 2, the board | substrate inspection apparatus 1, and the probe unit manufacturing method, each support of the support plates 43-46 in which the thickness of formation area 43a-46a was formed thinner than the thickness of non-formation area | region 43b-46b. When the support plates 43 to 46 are set to the first posture at the start of insertion of the probe 11 into the holes 53 to 56, the center position in the thickness direction of the formation region 43a is greater than the center position in the thickness direction of the non-formation region 43b. The support plate 43 (second support plate) formed so as to be close to the support plates 41 and 42 in the two postures has a center position in the thickness direction of the formation region 46a that is greater than a center position in the thickness direction of the non-formation region 46b. Formation of the support plate 46 that is farther from the support plates 41 and 42 than the support plate 46 (first support plate) that is formed so as to be separated from the support plates 41 and 42 in two positions. The band 46a forming region 43a of the support plate 43 is arranged so as to abut. For this reason, according to this probe unit 2, the board | substrate inspection apparatus 1, and the probe unit manufacturing method, the support holes 53 and 56 currently formed in the formation area 43a and 46a of the support plates 43 and 46 are made continuous in a 1st attitude | position. Therefore, even if the probe 11 is inserted in an oblique direction with respect to the support holes 53 and 56, the probe 11 inserted through the support holes 53 and 56 is larger than the support plates 43 and 46. The tilting can be prevented, and the probe 11 can be guided and smoothly inserted into the support holes 55 and 54 of the support plates 45 and 44 located at the front of the insertion direction. Therefore, according to the probe unit 2, the substrate inspection apparatus 1, and the probe unit manufacturing method, the support hole to be inserted due to the probe 11 being inserted into another support hole different from the support hole to be inserted. Compared with the conventional configuration in which it is difficult to efficiently perform the operation of correctly inserting the probe 11, the efficiency of the insertion operation of the probe 11 can be sufficiently improved.

  Moreover, in this probe unit 2, the board | substrate inspection apparatus 1, and the probe unit manufacturing method, in the 1st attitude | position in the formation area 46a and the non-formation area | region 46b of the support plate 46 (1st support plate), the support plate 43 (2nd support plate). The support plate 46 is formed so that one surface (upper surface) located on the side is flush with the support plate 46 (first support plate 43 (second support plate) in the first posture in the formation region 43a and the non-formation region 43b). The support plate 43 is formed so that one surface (lower surface) located on the (1 support plate) side is flush. Therefore, according to the probe unit 2, the substrate inspection apparatus 1, and the probe unit manufacturing method, the support hole 56 and the support plate 43 of the support plate 46 are brought into contact with the upper surface of the support plate 46 and the lower surface of the support plate 43. As a result, the probe 11 inserted through the support holes 53 and 56 can be connected to the support holes 55 and 54 of the support plates 45 and 44 located at the front in the insertion direction. Can be guided more accurately.

  Moreover, in this probe unit 2, the board | substrate inspection apparatus 1, and the probe unit manufacturing method, the central axes of each support hole 53-56 in each support plate 43-46 which comprises the base end side support part 32 are 2nd attitude | positions. Each of the support plates 43 to 46 is arranged so as to be displaced by a predetermined amount of displacement. For this reason, according to this probe unit 2, the board | substrate inspection apparatus 1, and the probe unit manufacturing method, when replacing | exchanging the damaged probe 11, for example, it is new, maintaining each support plates 43-46 in a 2nd attitude | position. By simply inserting the probe 11 through the support holes 56 to 51 of the support plates 46 to 41, the intermediate portion 22 and the base end portion 23 (portion excluding the distal end portion 21) of the probe 11 are inclined with respect to the support plates 46 to 41. It can extend along the direction.

  The substrate inspection apparatus and the substrate inspection method are not limited to the above configuration and method. For example, the support plates 43 to 46 are brought into contact with each other in the first posture, the support plates 41 and 42 are brought into contact with each other in the second posture, and the support plates 43 to 46 are kept in contact with each other. Although the method has been described above, a configuration and a method of maintaining the support plates 41 and 42 and the support plates 43 to 46 close to each other in each posture may be employed.

  Further, instead of the configuration and method using the support plate 43 formed so that the lower surfaces of the formation region 43a and the non-formation region 43b are flush with each other, the support plate 43 whose lower surfaces are not flush with each other is used. It is also possible to adopt a configuration and method in which the formation region 43a of the support plate 43 and the formation region 46a of the support plate 46 are brought close to each other. Further, in place of the configuration and the method using the support plate 46 formed so that the upper surfaces of the formation region 46a and the non-formation region 46b are flush with each other, the support plate 46 whose upper surfaces are not flush with each other is used. It is also possible to adopt a configuration and method in which the formation region 43a of the support plate 43 and the formation region 46a of the support plate 46 are brought close to each other.

  In addition, the configuration and method using the base end side support portion 32 including the four support plates 43 to 46 have been described above, but the number of support plates constituting the base end side support portion 32 is limited to four. The base end side support part 32 provided with the arbitrary number of support plates of 3 or more can be used.

  In the above example, as shown in FIG. 6, inclined portions (tapered portions) are provided at the edges of both the upper and lower openings in the support holes 51 to 56 of the support plates 41 to 46. Adopting a configuration and method using support plates 41 to 46 provided with inclined portions only at the edge of the opening located on the insertion side when inserting (the edge of the upper opening in the example in the figure) You can also.

  In addition, the configuration and method for maintaining the support plates 41 to 44 in the second posture by arranging the U-shaped spacers 33 in a plan view between the support plates 42 and 43 are described above. A configuration or method using a spacer having an arbitrary shape such as a rectangular parallelepiped shape or a cylindrical shape can be employed.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Probe unit 6 Inspection part 11 Probe 12 Support part 21 Tip part 23 Base end part 41-46 Support plate 41a-46a Formation area 41b-46b Non-formation area 51-56 Support hole 100 Board | substrate

Claims (5)

A probe unit that includes a probe for making an input / output of an electric signal by bringing a tip part into contact with a contact target, and a support part for supporting the probe,
The support portion includes a distal end side support hole that has a distal end portion side support hole and supports the distal end portion of the probe inserted through the distal end portion side support hole, and a proximal end portion side support hole. Comprising three or more base end side support plates that support the base end portion of the probe inserted through the base end side support hole;
Each of the base end side support plates is formed such that the formation region of the base end side support hole is thinner than the thickness of the non-formation region, and the central axes of the base end side support holes are Is a posture in which they are in contact with each other or stacked close to each other in a coaxial state, and the first posture when the insertion of the probe into the base end side support hole is started in the manufacturing process of the probe unit, It is configured to be switchable between a second posture in which each base end side support plate is stacked in a predetermined order in a posture in a state where the manufacturing process is completed,
The first support plate as the base end side support plate disposed at the position farthest from the tip end side support plate in the second posture among the base end side support plates is the formation region. The center position in the thickness direction is formed so as to be separated from the tip end side support plate in the second posture than the center position in the thickness direction of the non-formation region,
Of the base end side support plates, the second support plate as the base end side support plate disposed at the position closest to the tip end side support plate in the second posture is the formation region. The center position in the thickness direction is formed so as to be closer to the tip end side support plate in the second posture than the center position in the thickness direction of the non-formation region, and from the first support plate in the first posture. And a probe unit that is spaced apart from the tip side support plate and arranged so that the formation region of the second support plate is in contact with or close to the formation region of the first support plate. The first support plate is formed such that one surface located on the second support plate side in the first posture in the formation region and the non-formation region is flush.
2. The probe unit according to claim 1, wherein the second support plate is formed such that one surface located on the first support plate side in the first posture in the formation region and the non-formation region is flush.   The base end side support plates are arranged such that the central axes of the base end side support holes are displaced by a predetermined amount of displacement in the second posture. 2. The probe unit according to 2.   An inspection for inspecting the substrate based on the probe unit according to any one of claims 1 to 3 and an electric signal input through the probe of the probe unit brought into contact with a conductor portion of the substrate as the contact target. Board inspection apparatus. A probe unit manufacturing method for manufacturing a probe unit that includes a probe for inputting and outputting an electric signal by bringing a tip portion into contact with a contact target, and a support unit that supports the probe,
A distal-end-side support plate that supports the distal-end portion of the probe that has a distal-end-side support hole and is inserted through the distal-end-portion-side support hole, and a proximal-end-side support hole that has a proximal-end-side support hole Three or more base end sides that support the base end portion of the probe that is formed so that the thickness of the support hole forming region is thinner than the thickness of the non-formation region and is inserted through the base end side support hole. Using the support part provided with a support plate,
In the manufacturing process of the probe unit, the respective base end side support plates are stacked in a first posture in which the base axes of the base end side support holes are in contact or close to each other in a coaxial state. The base end side support plate is maintained to start insertion of the probe into the base end side support hole, and the base end side support plate is defined in advance before the manufacturing process is completed. Switch each base end side support plate to the second posture stacked in order,
As the base end side support plate formed so that the center position in the thickness direction of the formation region is separated from the tip end side support plate in the second posture than the center position in the thickness direction of the non-formation region. The first support plate is disposed at a position farthest from the tip end side support plate in the second posture,
As the base end side support plate formed so that the center position in the thickness direction of the formation region is closer to the tip end side support plate in the second posture than the center position in the thickness direction of the non-formation region. In the first posture, the second support plate is further away from the tip end side support plate than the first support plate, and the formation region of the second support plate is in contact with the formation region of the first support plate. A probe unit manufacturing method, wherein the probe unit is disposed so as to be in contact with or close to each other and is disposed at a position closest to the tip side support plate in the second posture.

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