JP6101504B2 - 真空処理装置のモジュール検査装置 - Google Patents
真空処理装置のモジュール検査装置 Download PDFInfo
- Publication number
- JP6101504B2 JP6101504B2 JP2013026156A JP2013026156A JP6101504B2 JP 6101504 B2 JP6101504 B2 JP 6101504B2 JP 2013026156 A JP2013026156 A JP 2013026156A JP 2013026156 A JP2013026156 A JP 2013026156A JP 6101504 B2 JP6101504 B2 JP 6101504B2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum processing
- module
- sample
- processing module
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013026156A JP6101504B2 (ja) | 2013-02-14 | 2013-02-14 | 真空処理装置のモジュール検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013026156A JP6101504B2 (ja) | 2013-02-14 | 2013-02-14 | 真空処理装置のモジュール検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014154854A JP2014154854A (ja) | 2014-08-25 |
| JP2014154854A5 JP2014154854A5 (enExample) | 2016-03-17 |
| JP6101504B2 true JP6101504B2 (ja) | 2017-03-22 |
Family
ID=51576373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013026156A Active JP6101504B2 (ja) | 2013-02-14 | 2013-02-14 | 真空処理装置のモジュール検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6101504B2 (enExample) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283099A (ja) * | 1994-04-04 | 1995-10-27 | Kokusai Electric Co Ltd | 半導体製造装置 |
| JPH10242233A (ja) * | 1997-02-26 | 1998-09-11 | Hitachi Ltd | 半導体製造方法 |
| US6312525B1 (en) * | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
| JP4256551B2 (ja) * | 1998-12-25 | 2009-04-22 | 東京エレクトロン株式会社 | 真空処理システム |
| TW484170B (en) * | 1999-11-30 | 2002-04-21 | Applied Materials Inc | Integrated modular processing platform |
| JP5025609B2 (ja) * | 2003-09-04 | 2012-09-12 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
| US20080072820A1 (en) * | 2006-06-30 | 2008-03-27 | Applied Materials, Inc. | Modular cvd epi 300mm reactor |
-
2013
- 2013-02-14 JP JP2013026156A patent/JP6101504B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014154854A (ja) | 2014-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5188385B2 (ja) | プラズマ処理装置及びプラズマ処理装置の運転方法 | |
| US20220389575A1 (en) | Vacuum processing apparatus | |
| JP5925474B2 (ja) | ウエハ処理装置 | |
| TWI824271B (zh) | 粒子束檢測設備 | |
| CN102934198B (zh) | 常温接合装置及常温接合方法 | |
| CN102738042B (zh) | 衬底处理设备、控制该设备的程序及制造半导体器件的方法 | |
| JP2010171286A (ja) | プラズマ処理装置 | |
| CN1326202C (zh) | 基板处理装置及其控制方法 | |
| TWI718674B (zh) | 電漿處理裝置 | |
| TWI843917B (zh) | 量測裝置及量測方法 | |
| JP6655516B2 (ja) | 基板検査装置 | |
| TWI445076B (zh) | Vacuum processing device | |
| KR20210149598A (ko) | 검사 장치 및 검사 방법 | |
| US8197704B2 (en) | Plasma processing apparatus and method for operating the same | |
| JP5205045B2 (ja) | プラズマ処理装置及びプラズマ処理方法 | |
| JP5047541B2 (ja) | 統合されたプローバドライブを備えた基板支持部 | |
| JP5042686B2 (ja) | プラズマ処理装置 | |
| JP2014154854A (ja) | 真空処理装置のモジュール検査装置 | |
| US6723172B2 (en) | Method and system for processing semiconductor wafers | |
| KR102523364B1 (ko) | 기판 처리 장치 | |
| US12594619B2 (en) | Systems and methods for ex-situ bakeout of differentially pumped vacuum chambers | |
| TWI818313B (zh) | 真空處理裝置的異物測定方法 | |
| KR102690175B1 (ko) | 플라즈마 처리 장치의 검사 방법 | |
| CN119452736A (zh) | 等离子体处理方法和等离子体处理装置 | |
| JP5282008B2 (ja) | 真空処理装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160128 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160128 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161104 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161115 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170116 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170131 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170227 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6101504 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |