JP6098443B2 - LED lamp and manufacturing method thereof - Google Patents

LED lamp and manufacturing method thereof Download PDF

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JP6098443B2
JP6098443B2 JP2013181324A JP2013181324A JP6098443B2 JP 6098443 B2 JP6098443 B2 JP 6098443B2 JP 2013181324 A JP2013181324 A JP 2013181324A JP 2013181324 A JP2013181324 A JP 2013181324A JP 6098443 B2 JP6098443 B2 JP 6098443B2
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recess
lead
bottom plate
resin
sealing resin
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JP2015050338A (en
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加藤　英昭
英昭 加藤
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Description

本発明は、ＬＥＤチップを封止樹脂で封止したＬＥＤランプ及びその製造方法に関するものである。   The present invention relates to an LED lamp in which an LED chip is sealed with a sealing resin and a manufacturing method thereof.

発光ダイオード（ＬＥＤ）等の半導体発光素子は、封止樹脂で封止するのが一般的である。封止の目的は、半導体発光素子の保護（大気中の水分やごみにより発光特性が低下しないように大気を遮断）、ボンディングワイヤの保護、光取出効率の向上（屈折率のマッチング）、波長変換（封止材中に分散させた蛍光体粒子による）、レンズ効果（封止樹脂の形状を部分球面状にして光の強度配向を狭くする）等である。このうち、封止樹脂の形状を部分球面状にするには種々の方法があるが、その一つに、封止樹脂の外周囲に配置された撥液層により、液状の封止樹脂をはじいて部分球面状に制御するというものがある。   A semiconductor light emitting element such as a light emitting diode (LED) is generally sealed with a sealing resin. The purpose of sealing is to protect the semiconductor light emitting device (block the atmosphere so that light emission characteristics do not deteriorate due to moisture and dust in the atmosphere), protect the bonding wire, improve the light extraction efficiency (refractive index matching), wavelength conversion (Depending on the phosphor particles dispersed in the encapsulant), lens effect (encapsulating resin has a partially spherical shape and narrows the intensity orientation of light), and the like. Among these, there are various methods for making the shape of the sealing resin into a partial spherical shape. One of the methods is to repel the liquid sealing resin by a liquid repellent layer disposed on the outer periphery of the sealing resin. There is a method of controlling to a partial spherical shape.

［従来例１］
まず、傾斜面に撥液層を塗布形成した従来例について説明する。特許文献１に記載された表面実装型発光装置１００は、図８（ａ）に示すように、基板１０１、配線パターン１０２、ＬＥＤチップ１０３、封止樹脂１０４及びリフレクタ１０５と、リフレクタ１０５の傾斜面である内壁面１０５ａを覆う撥液（溌液）層１０６とを備える。基板１０１の材質は、例えばセラミックである（段落００４１）。リフレクタ１０５の材質は、アルミニウムである（段落００５４）。撥液層１０６の材質はフッ素系樹脂であり（請求項４）、ＰＴＦＥ等が例示されている（段落００３０、００５６）。滴下した液状の封止樹脂１０４は、撥液層１０６に接触し、基板１０１上で部分球面状になる。 [Conventional example 1]
First, a conventional example in which a liquid repellent layer is applied and formed on an inclined surface will be described. As shown in FIG. 8A, the surface mount light emitting device 100 described in Patent Document 1 includes a substrate 101, a wiring pattern 102, an LED chip 103, a sealing resin 104, a reflector 105, and an inclined surface of the reflector 105. And a liquid repellent (salt) layer 106 covering the inner wall surface 105a. The material of the substrate 101 is, for example, ceramic (paragraph 0041). The material of the reflector 105 is aluminum (paragraph 0054). The material of the liquid repellent layer 106 is a fluororesin (Claim 4), and PTFE is exemplified (paragraphs 0030 and 0056). The dropped liquid sealing resin 104 comes into contact with the liquid repellent layer 106 and becomes a partial spherical shape on the substrate 101.

また、撥液層１０６の配置方法の説明（段落００４７以降）によれば、基板１０１のチップ配置面１０９にＬＥＤチップ１０３をダイボンディングした後、ワイヤ１０７でワイヤボンディングを行い、リフレクタ１０５を接着シート１０８によって基板１０１に接着した後、内壁面１０５ａにコーティング材を塗布し、乾燥して撥液層１０６として用いるとされている。なお、リフレクタの内壁面が略垂直になっている例もあるが（段落００８３以降の第４の実施例）、同例での具体的な撥液層の塗布方法は示されていない。   Further, according to the description of the method for arranging the liquid repellent layer 106 (after paragraph 0047), the LED chip 103 is die-bonded to the chip arrangement surface 109 of the substrate 101, and then wire bonding is performed with the wire 107, and the reflector 105 is attached to the adhesive sheet. After bonding to the substrate 101 by 108, a coating material is applied to the inner wall surface 105 a, dried and used as the liquid repellent layer 106. Although there is an example in which the inner wall surface of the reflector is substantially vertical (fourth example after paragraph 0083), a specific method for applying the liquid repellent layer in the example is not shown.

このように、撥液層１０６をリフレクタ１０５に後から塗布形成する場合、次の問題があった。
（ａ）撥液層１０６に塗布ムラがあった場合、撥液性が不均一になり、封止樹脂の部分球面状がいびつになるおそれがある。
（ｂ）リフレクタ１０５を基板１０１に配置した後に撥液層１０６を塗布すると、基板１０１のチップ配置面１０９（凹部の内底面）へもコーティング材が塗布される懸念が生じ、塗布された場合には、その箇所でも撥液作用が生じることになる。仮に、チップ配置面１０９の全体に、撥液作用が生じた場合には、ドーム形状の封止樹脂１０４が外れる可能性が生じ、機能不全に陥ることになる。その程度については、特許文献１で説明されていない。 As described above, when the liquid-repellent layer 106 is applied and formed on the reflector 105 later, there are the following problems.
(A) When there is uneven coating on the liquid repellent layer 106, the liquid repellency becomes non-uniform, and the partial spherical shape of the sealing resin may be distorted.
(B) When the liquid-repellent layer 106 is applied after the reflector 105 is disposed on the substrate 101, there is a concern that the coating material may be applied to the chip placement surface 109 (inner bottom surface of the recess) of the substrate 101. The liquid repellent action will also occur at that location. If a liquid repellency occurs on the entire chip placement surface 109, the dome-shaped sealing resin 104 may be detached, resulting in malfunction. The degree is not described in Patent Document 1.

［従来例２］
次に、平面上に撥水撥油機能材を塗布した従来例について説明する。特許文献２の光源装置１２０は、図８（ｂ）に示すように、基板１２１、電極１２２、ＬＥＤチップ１２３、封止樹脂１２４及び白色レジスト層１２５と、白色レジスト層１２５上に印刷法により塗布形成した撥水性を有する白色又は透明の部材１２６とを備える。白色又は透明の部材１２６の材質として、撥水／撥油性インク、撥水撥油処理剤が記載されている（段落００２７）。この白色又は透明の部材１２６によって封止樹脂１２４の形状をドーム形状に制御する。この部材１２６の上にさらに撥水性塗料を形成することも記載されている（段落００３９）。
さらに、特許文献３〜７にも、特許文献２の光源装置と類似のものが記載されている。 [Conventional example 2]
Next, a conventional example in which a water / oil repellent functional material is applied on a flat surface will be described. As shown in FIG. 8B, the light source device 120 of Patent Document 2 is applied on the substrate 121, the electrode 122, the LED chip 123, the sealing resin 124, the white resist layer 125, and the white resist layer 125 by a printing method. And a formed white or transparent member 126 having water repellency. As the material of the white or transparent member 126, water / oil repellent ink and water / oil repellent treatment agent are described (paragraph 0027). The shape of the sealing resin 124 is controlled to be a dome shape by the white or transparent member 126. It is also described that a water-repellent paint is further formed on the member 126 (paragraph 0039).
Further, Patent Documents 3 to 7 also describe a device similar to the light source device of Patent Document 2.

このように、特許文献２〜７では、概略平面形状で、撥水もしくは撥油機能を生じさせる必要の部分の外周囲に撥水撥油機能材を配置し、その平面的内側において、例えば樹脂材料を部分球面状に形成させる方法が提案されている。これによれば、撥水撥油機能材を周囲に平面形状に配置すれば、部分球面状の樹脂形状が実現できることが開示されている。しかし、撥水撥油機能材を塗布形成するので、従来例１で述べた（ａ）（ｂ）と同様の問題がある。また、従来例１のような傾斜を持つ部分に撥水剤を配置することに関しては開示されていない。   As described above, in Patent Documents 2 to 7, the water / oil repellent functional material is arranged on the outer periphery of the portion that has a substantially planar shape and needs to generate the water / oil repellent function. A method for forming a material into a partial spherical shape has been proposed. According to this, it is disclosed that a partially spherical resin shape can be realized if the water / oil repellent functional material is arranged in a planar shape around the periphery. However, since the water / oil repellent functional material is applied and formed, there are the same problems as (a) and (b) described in the conventional example 1. Further, there is no disclosure regarding disposing a water repellent agent in a portion having an inclination as in Conventional Example 1.

［従来例３］
次に、傾斜部分を熱硬化性樹脂で形成した従来例について説明する。特許文献８に記載された表面実装型発光装置１４０は、図８（ｃ）に示すように、底面１４１ａと側面１４１ｂとを持つ第１の樹脂成形体１４１、リード１４２、発光素子１４３及び封止樹脂である第２の樹脂成形体１４４を備える。第１の樹脂成形体１４１の材質は、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂、アクリレート樹脂、ウレタン樹脂からなる群から選択され（請求項８）、トランスファモールドにより成形される。また、第１の樹脂成形体１４１には、フィラー、拡散剤、顔料、蛍光物質、反射性物質、遮光性物質からなる群から選択される少なくとも１種が混合される（請求項９）。 [Conventional Example 3]
Next, a conventional example in which the inclined portion is formed of a thermosetting resin will be described. As shown in FIG. 8C, the surface-mounted light emitting device 140 described in Patent Document 8 includes a first resin molded body 141 having a bottom surface 141a and a side surface 141b, a lead 142, a light emitting element 143, and a sealing device. A second resin molded body 144 that is a resin is provided. The material of the first resin molded body 141 is selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, and a urethane resin (Claim 8), and is molded by transfer molding. Further, at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, and a light shielding material is mixed in the first resin molded body 141 (claim 9).

このように、特許文献８では、第１の樹脂成形体１４１を熱硬化性樹脂で成形したことは開示されているが、撥水性樹脂に関しては開示されていない。   As described above, Patent Document 8 discloses that the first resin molded body 141 is molded from a thermosetting resin, but does not disclose a water-repellent resin.

特開２０１２−２３１８４号公報JP 2012-23184 A 特開２００７−２０１１７１号公報JP 2007-201171 A 特開２００８−２５８２９６号公報JP 2008-258296 A 特開２００９−２６８９３号公報JP 2009-26893 A 特開２０１１−２０４３９７号公報JP 2011-204397 A 特開２０１２−２０４３７０号公報JP 2012-204370 A 特開２０１３−４８１５号公報JP2013-4815A 特開２００６−１５６７０４号公報JP 2006-156704 A

本発明の目的は、ＬＥＤチップの封止材が整った部分球面状となり、同封止材の剥離を抑止できるＬＥＤランプを提供することにある。   An object of the present invention is to provide an LED lamp that has a partially spherical shape with a sealing material for an LED chip and can prevent peeling of the sealing material.

１．ケースの凹部形成枠と底板とが硬化前粘度が１０００ｍＰａＳ以下である封止樹脂に対する撥液性を有するケース用高分子材料で成形され、凹部形成枠の内側に凹部が形成されるとともに、ケースに第１リード及び第２リードが接合され、
凹部の内底面に現れた、底板の上面と、該底板の上面を挟む第１リードの上面の一部と第２リードの上面の一部とに、封止樹脂に対する接着性を有する硬化前粘度が１００００ｍＰａＳ以上である被膜用樹脂よりなる被膜が形成され、
凹部の内底面に現れた第１リードの上面に、ＬＥＤチップが実装され、
凹部に注入された液状の前記封止樹脂が凹部形成枠の撥液性により形状制御されて固化した封止材が、ＬＥＤチップを封止し、被膜を介して底板に接着されていることを特徴とするＬＥＤランプ。
ここで、凹部形成枠と底板とがケース用高分子材料で一体成形されていることが好ましい。ケース用高分子材料が、フッ素樹脂、フッ素ゴム又はフッ素エラストマ−であることが好ましい。 1. The recess forming frame and the bottom plate of the case are molded with a case polymer material having liquid repellency with respect to the sealing resin having a viscosity before curing of 1000 mPaS or less, and a recess is formed inside the recess forming frame. The first lead and the second lead are joined,
The pre-curing viscosity having adhesiveness to the sealing resin on the top surface of the bottom plate, the part of the top surface of the first lead sandwiching the top surface of the bottom plate, and the part of the top surface of the second lead appearing on the inner bottom surface of the recess Is formed of a coating resin having a viscosity of 10,000 mPaS or more ,
An LED chip is mounted on the upper surface of the first lead that appears on the inner bottom surface of the recess,
Said liquid sealing resin injected into the recess sealing material solidified been shape control by liquid repellency of the recess forming frame, an LED chip is sealed and bonded to the bottom plate via a film Characteristic LED lamp.
Here, it is preferable that the recess forming frame and the bottom plate are integrally formed of a case polymer material. The polymer material for the case is preferably a fluororesin, a fluororubber, or a fluoroelastomer.

２．ケースの凹部形成枠と底板とを硬化前粘度が１０００ｍＰａＳ以下である封止樹脂に対する撥液性を有するケース用高分子材料で成形し、凹部形成枠の内側に凹部を形成するとともに、ケースに第１リード及び第２リードを接合するステップと、
凹部の内底面に現れた、底板の上面と、該底板の上面を挟む第１リードの上面の一部と第２リードの上面の一部とに、封止樹脂に対する接着性を有する硬化前粘度が１００００ｍＰａＳ以上である被膜用樹脂で被膜を形成するステップと、
凹部の内底面に現れた第１リードの上面に、ＬＥＤチップを実装するステップと、
凹部に液状の前記封止樹脂を注入し、液状の封止樹脂を凹部形成枠の撥液性により形状制御するステップと、
液状の封止樹脂を固化させ、ＬＥＤチップを封止し、被膜を介して底板に接着されている封止材を得るステップとを含むことを特徴とするＬＥＤランプの製造方法。 2. With a viscosity before curing of the recess forming frame and the bottom plate of the case is formed of a polymeric material for casing having liquid repellency against the sealing resin is not more than 1000 mPas, forming a recess in the inner side of the recess forming frame, the case Joining one lead and a second lead ;
The pre-curing viscosity having adhesiveness to the sealing resin on the top surface of the bottom plate, the part of the top surface of the first lead sandwiching the top surface of the bottom plate, and the part of the top surface of the second lead appearing on the inner bottom surface of the recess Forming a film with a coating resin having a viscosity of 10,000 mPaS or more ;
Mounting an LED chip on the upper surface of the first lead that appears on the inner bottom surface of the recess;
Said liquid sealing resin is injected into the recess, a step of shape control by liquid repellency of the recess forming frame a liquid sealing resin,
Solidifying the liquid sealing resin, sealing the LED chip, and obtaining a sealing material bonded to the bottom plate through a coating film.

本発明によれば、ＬＥＤチップを封止樹脂で封止したＬＥＤランプにおいて、ケースの凹部形成枠を撥液性のケース用高分子材料で成形するので、凹部形成枠の内壁面の撥液性が均一に発現し、封止材が整った部分球面状となる。また、ケースの底板も撥液性のケース用高分子材料で成形するが、封止樹脂を注入する前に、凹部の内底面に現れた底板の上面を接着性の被膜用樹脂よりなる被膜で覆うので、封止材の剥離を抑止できる。   According to the present invention, in the LED lamp in which the LED chip is sealed with the sealing resin, the recess forming frame of the case is formed from the liquid repellent polymeric material for the case. Is expressed in a uniform and spherical shape with a sealing material. The bottom plate of the case is also formed of a liquid-repellent polymeric material for the case. Before injecting the sealing resin, the top surface of the bottom plate that appears on the inner bottom surface of the recess is coated with a coating made of an adhesive coating resin. Since it covers, peeling of a sealing material can be suppressed.

実施例１のＬＥＤランプのケース形成ステップを示し、（ａ）は平面図、（ｂ）はＩｂ−Ｉｂ断面図、（ｃ）は側面図、（ｄ）はＩｄ−Ｉｄ断面図である。The case formation step of the LED lamp of Example 1 is shown, (a) is a plan view, (b) is an Ib-Ib sectional view, (c) is a side view, and (d) is an Id-Id sectional view. 同ＬＥＤランプの被膜形成ステップを示し、（ａ）は平面図、（ｂ）はＩＩｂ−ＩＩｂ断面図である。The film formation step of the LED lamp is shown, (a) is a plan view, (b) is a IIb-IIb sectional view. 同ＬＥＤランプの実装ステップを示し、（ａ）は平面図、（ｂ）はＩＩＩｂ−ＩＩＩｂ断面図である。The mounting step of the LED lamp is shown, (a) is a plan view, (b) is a IIIb-IIIb sectional view. 封止ステップを経て完成した同ＬＥＤランプを示し、（ａ）は平面図、（ｂ）はＩＶｂ−ＩＶｂ断面図、（ｃ）は側面図である。The LED lamp completed through the sealing step is shown, (a) is a plan view, (b) is a sectional view taken along IVb-IVb, and (c) is a side view. 実施例２のＬＥＤランプを示し、（ａ）は平面図、（ｂ）はＶｂ−Ｖｂ断面図、（ｃ）は側面図、（ｄ）はＶｄ−Ｖｄ断面図である。The LED lamp of Example 2 is shown, (a) is a top view, (b) is Vb-Vb sectional drawing, (c) is a side view, (d) is Vd-Vd sectional drawing. 実施例３のＬＥＤランプを示し、（ａ）は平面図、（ｂ）はＶＩｂ−ＶＩｂ断面図である。The LED lamp of Example 3 is shown, (a) is a top view, (b) is VIb-VIb sectional drawing. 実施例４のＬＥＤランプを示す平面図である。6 is a plan view showing an LED lamp of Example 4. FIG. （ａ）は従来例１の断面図、（ｂ）は従来例２の断面図、（ｃ）は従来例３の断面図である。(A) is sectional drawing of the prior art example 1, (b) is sectional drawing of the prior art example 2, (c) is sectional drawing of the prior art example 3. FIG.

上記の手段１．及び２．における各事項の態様等について、以下説明する。   The above means 1. And 2. A description will be given below of the aspects of each item.

１．ケース用高分子材料
ケース用高分子材料としては、封止樹脂に対する撥液性を有する高分子材料であれば特に限定されないが、フッ素樹脂、フッ素ゴム、フッ素エラストマ−等を例示できる。より具体的には、ＰＴＦＥ（ポリテトラフルオロチレン）、ＰＦＡ（テトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体）、ＦＥＰ（テトラフルオロエチレン・ヘキサフルオロピルビレン共重合体）、ＥＴＦＥ（テトラフルオロエチレン・エチレン共重合体）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、ＥＣＴＦＥ（クロロトリフルオロエチレン・エチレン共重合体）、ＰＶＤＦ（ポリビニリデンフルオライド）、ＰＶＦ（ポリビニルフルオライド）、ＰＦＥＰ（パーフルオロエチレンプロペンコポリマー）、フッ素化ポリエーテル骨格と末端にシリコーン架橋反応基を有するフッ素ゴム等を例示できる。
ケース用高分子材料は、フィラー、拡散剤、顔料、蛍光物質、反射性物質、遮光性物質からなる群から選択される少なくとも１種が混合されていてもよい。硬化後の強度強化や、光反射性向上等の光学的機能の付加のためである。これらは、非極性化して混合されることが好ましい。
ケース用高分子材料は、熱硬化性樹脂であることが好ましい。
ケース用高分子材料は、物理的性質が等方性を有していることが好ましい。 1. Polymer material for case The polymer material for case is not particularly limited as long as it is a polymer material having liquid repellency with respect to the sealing resin, and examples thereof include fluororesin, fluororubber, and fluoroelastomer. More specifically, PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), FEP (tetrafluoroethylene / hexafluoropyruvylene copolymer), ETFE (tetrafluoroethylene · Ethylene copolymer), PCTFE (polychlorotrifluoroethylene), ECTFE (chlorotrifluoroethylene-ethylene copolymer), PVDF (polyvinylidene fluoride), PVF (polyvinyl fluoride), PFEP (perfluoroethylene propene copolymer) ), A fluororubber having a fluorinated polyether skeleton and a silicone crosslinking reactive group at the terminal.
The case polymer material may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances. This is for the addition of optical functions such as strength enhancement after curing and improvement of light reflectivity. These are preferably mixed nonpolarized.
The case polymer material is preferably a thermosetting resin.
The case polymer material preferably has an isotropic physical property.

２．封止樹脂
封止樹脂としては、特に限定されないが、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂、アクリレート樹脂、ウレタン樹脂等を例示でき、これらからなる群から選択される少なくとも１種の樹脂であることが好ましい。さらには、可能な限り芳香族成分を有しないものが好ましい。封止樹脂に使用できる市販品としては、信越化学工業株式会社の製品名ＡＳＰ１１１１Ａ／Ｂ（粘度７６０ｍＰａ／Ｓ）、同社の製品名ＳＣＲ−１０１６Ａ／Ｂ（粘度３５０ｍＰａ／Ｓ）、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社の製品名ＸＥ１４−Ｃ２８６０（粘度８００ｍＰａ／Ｓ）、ペルノックス株式会社の製品名ＭＥ５６２（粘度４３０ｍＰａ／Ｓ）等を例示できる。
封止樹脂は、硬化前粘度が、１０００ｍＰａＳ以下のものが好適である。
封止樹脂は、透光性が必要であるが、フィラー、拡散剤、顔料、蛍光物質、反射性物質からなる群から選択される少なくとも１種が混合されていてもよい。 2. Sealing resin Although it does not specifically limit as sealing resin, An epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, a urethane resin etc. can be illustrated, At least 1 sort (s) selected from the group which consists of these A resin is preferred. Furthermore, the thing which does not have an aromatic component as much as possible is preferable. Commercial products that can be used for the sealing resin include the product name ASP1111A / B (viscosity 760 mPa / S) of Shin-Etsu Chemical Co., Ltd., the product name SCR-1016A / B (viscosity 350 mPa / S) of the company, Momentive Performance Material The product name XE14-C2860 (viscosity 800 mPa / S) of The Japan Co., Ltd., the product name ME562 (viscosity 430 mPa / S) of Pernox Co., Ltd., etc. can be illustrated.
The sealing resin preferably has a viscosity before curing of 1000 mPaS or less.
The sealing resin needs translucency, but at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, and a reflective material may be mixed.

３．被膜用樹脂
被膜用樹脂としては、封止樹脂に対する接着性を有する樹脂であれば特に限定されないが、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂、アクリレート樹脂、ウレタン樹脂等を例示でき、これらからなる群から選択される少なくとも１種の樹脂であることが好ましい。被膜用樹脂に使用できる市販品としては、信越化学工業株式会社の製品名ＫＥＲ−２０００−ＤＡＭ（非流動）、モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社の製品名ＸＥ１３−Ｃ２４７６（粘度３００００ｍＰａ／Ｓ）、ペルノックス株式会社の製品名ＭＥ−５０００（粘度２５０００ｍＰａ／Ｓ）等を例示できる。
被膜用樹脂は、硬化前粘度が、１００００ｍＰｓＳ以上のものが好適である。
被膜用樹脂は、フィラー、拡散剤、顔料、蛍光物質、反射性物質、遮光性物質からなる群から選択される少なくとも１種が混合されていてもよい。
被膜用樹脂は、硬化前の液体状におけるチクソ性があるものでもよい。
被膜用樹脂は、発光素子の接着固定に使用されるダイボンディング剤と同材、いずれかの熱硬化性樹脂である。 3. Resin for coating The resin for coating is not particularly limited as long as it has adhesiveness to the sealing resin, but examples include epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, urethane resins, It is preferably at least one resin selected from the group consisting of these. Commercially available products that can be used as coating resins include Shin-Etsu Chemical Co., Ltd., product name KER-2000-DAM (non-fluid), Momentive Performance Materials Japan G.K., product name XE13-C2476 (viscosity 30000 mPa / S ), Product name ME-5000 (viscosity 25000 mPa / S) of Pernox Corporation.
The resin for coating is preferably one having a viscosity before curing of 10,000 mPsS or more.
The coating resin may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances.
The coating resin may have a thixotropy in a liquid state before curing.
The coating resin is a thermosetting resin that is the same material as the die bonding agent used for bonding and fixing the light emitting element.

上記のケース用高分子材料として例示した各材料と、封止樹脂として例示した各材料及び市販品と、被膜用樹脂として例示した各材料及び市販品とは、特定の組み合わせに限定されず、どのような組み合わせでも使用可能である。   Each material exemplified as the polymer material for the case, each material exemplified as the sealing resin and the commercial product, and each material exemplified as the resin for the film and the commercial product are not limited to a specific combination. Such combinations can also be used.

４．凹部形成枠
凹部形成枠の内壁面は、開口側ほど拡がる傾斜面でもよいし、リード面に対し垂直面でもよい。
凹部形成枠の内側に形成される凹部の平面視形状は、特に限定されず、円形、楕円形、正方形（隅丸正方形も含む）、長方形（隅丸長方形も含む）等を例示できる。
凹部形成枠の内側に形成される凹部の数は、特に限定されず、１つでも複数でもよい。 4). Recessed Forming Frame The inner wall surface of the recessed part forming frame may be an inclined surface that expands toward the opening side or a surface that is perpendicular to the lead surface.
The planar view shape of the recess formed inside the recess forming frame is not particularly limited, and examples thereof include a circle, an ellipse, a square (including a rounded square), and a rectangle (including a rounded rectangle).
The number of recesses formed inside the recess formation frame is not particularly limited, and may be one or more.

５．形状制御
液状の封止樹脂を凹部形成枠の撥液性により形状制御したときの、液状の封止樹脂（ひいては封止材）の形状としては、特に限定されないが、部分球面状、部分円柱面状等を含む形状を例示できる。 5. Shape control The shape of the liquid sealing resin (and thus the sealing material) when the liquid sealing resin is subjected to shape control by the liquid repellency of the recess forming frame is not particularly limited, but is partially spherical or partially cylindrical. Examples include shapes including shapes.

６．ＬＥＤチップ
ＬＥＤチップは、特に限定されない。ＬＥＤチップの材料、層構造、実装タイプ、発光波長等は、どのようなものでもよい。 6). LED chip The LED chip is not particularly limited. The LED chip material, layer structure, mounting type, emission wavelength, etc. may be anything.

図１〜図４に示す実施例１のＬＥＤランプ及びその製造方法について説明する。製造するＬＥＤランプ１は、図４に示すように、ケース２、第１リード６、第２リード７、ＬＥＤチップ８、ボンディングワイヤ９、被膜１０及び封止材１１を備えた表面実装型発光装置である。   The LED lamp of Example 1 shown in FIGS. 1-4 and its manufacturing method are demonstrated. As shown in FIG. 4, the LED lamp 1 to be manufactured includes a case 2, a first lead 6, a second lead 7, an LED chip 8, a bonding wire 9, a coating 10, and a sealing material 11. It is.

ケース２の凹部形成枠３と底板４とが封止樹脂に対する撥液性を有するケース用高分子材料としての例えばフッ素樹脂で成形され、凹部形成枠３の内側に凹部５が形成されるとともに、ケース２に第１リード６と第２リード７が接合されている。凹部形成枠３の内壁面は、開口側ほど拡がる傾斜面である。第１リード６及び第２リード７は、金属板からなり、いずれか一方が正側とされ、他方が負側とされる。第１リード６及び第２リード７は、それらの上面が前記底板４の上面とともに凹部５の内底面を構成するようにして、ケース２と接合されている。第１リード６と第２リード７との間は、その間に底板４の一部が介在することにより、隔てられて電気的に絶縁されている。本例では、この介在した底板４の一部が凹部５の内底面に現れている。 The recess forming frame 3 and the bottom plate 4 of the case 2 are formed of, for example, a fluororesin as a case polymer material having liquid repellency with respect to the sealing resin, and the recess 5 is formed inside the recess forming frame 3. A first lead 6 and a second lead 7 are joined to the case 2. The inner wall surface of the recess forming frame 3 is an inclined surface that expands toward the opening side. The first lead 6 and the second lead 7 are made of a metal plate, and one of them is a positive side and the other is a negative side. The first lead 6 and the second lead 7 are joined to the case 2 such that their upper surfaces constitute the inner bottom surface of the recess 5 together with the upper surface of the bottom plate 4. The first lead 6 and the second lead 7 are separated and electrically insulated by interposing a part of the bottom plate 4 therebetween. In this example, a part of the interposed bottom plate 4 appears on the inner bottom surface of the recess 5.

凹部５の内底面に現れた、底板４の上面と、該底板４の上面を挟む第１リード６の上面の一部と第２リード７の上面の一部とに、封止樹脂に対する接着性を有する被膜用樹脂としての例えばエポキシ樹脂よりなる被膜１０が形成されている。凹部５の内底面に現れたリード６，７の上面に、ＬＥＤチップ８が実装されている。凹部５に注入された液状の封止樹脂が凹部形成枠３の撥液性により形状制御されて固化してなる封止材１１が、ＬＥＤチップ８を封止し、被膜１０を介して底板４に接着されている。封止材１１の形状は、平面視中央部において上面が平らで、平面視外周付近部において上面が部分球面状となったものである。封止樹脂は、例えばエポキシ樹脂であり、これに蛍光体粒子、フィラー等を混合してある。蛍光体粒子は、ＬＥＤランプが必要とする発光色に応じて濃度調整を行い、調合してある。例えば、ＬＥＤチップの発光波長域が青系で、蛍光体粒子の蛍光色が黄系の場合、白色ＬＥＤランプとなる。このＬＥＤランプ１は、次のような方法で製造される。 Adhesiveness to the sealing resin on the upper surface of the bottom plate 4, the part of the upper surface of the first lead 6 sandwiching the upper surface of the bottom plate 4, and the part of the upper surface of the second lead 7 appearing on the inner bottom surface of the recess 5. A film 10 made of, for example, an epoxy resin is formed as a resin for a film having the following. The LED chip 8 is mounted on the top surfaces of the leads 6 and 7 that appear on the inner bottom surface of the recess 5. A sealing material 11 in which the liquid sealing resin injected into the recess 5 is solidified by controlling its shape by the liquid repellency of the recess forming frame 3 to seal the LED chip 8, and the bottom plate 4 through the coating 10. It is glued to. The shape of the sealing material 11 is such that the upper surface is flat in the central portion in plan view and the upper surface is partially spherical in the vicinity of the outer periphery in plan view. The sealing resin is, for example, an epoxy resin, and phosphor particles, fillers, and the like are mixed therein. The phosphor particles are prepared by adjusting the concentration according to the emission color required by the LED lamp. For example, when the emission wavelength range of the LED chip is blue, and the fluorescent color of the phosphor particles is yellow, a white LED lamp is obtained. The LED lamp 1 is manufactured by the following method.

［１］リード付きケースの成形ステップ
成形型（図示略）に第１リード６及び第２リード７をインサート材としてセットし、その成形型にケース用高分子材料としてのフッ素樹脂を射出成形する等の方法により、図１に示すような、リード６，７が接合されたケース２を成形する。 [1] Molding step of case with lead The first lead 6 and the second lead 7 are set as insert materials in a molding die (not shown), and fluororesin as a polymer material for the case is injection-molded in the molding die. By this method, the case 2 to which the leads 6 and 7 are joined as shown in FIG. 1 is formed.

［２］被膜の形成ステップ
図２に示すように、凹部５の内底面に現れた底板４（前記のとおり第１リード６と第２リード７との間に介在する部分）の上面は、フッ素樹脂ゆえに封止樹脂に対する撥液性が機能することになる。この撥液性を抑止して封止樹脂の剥離を防止するために、この底板４の上面と、該底板４の上面を挟む第１リード６の上面の一部と第２リード７の上面の一部とを覆うように被膜用樹脂としてのエポキシ樹脂を塗布して固化させ（但し、固化は次のステップによる）、被膜１０を形成する。 [2] Film Formation Step As shown in FIG. 2, the upper surface of the bottom plate 4 (the portion interposed between the first lead 6 and the second lead 7 as described above) that appears on the inner bottom surface of the recess 5 is fluorine. Because of the resin, the liquid repellency with respect to the sealing resin functions. In order to suppress this liquid repellency and prevent peeling of the sealing resin, the upper surface of the bottom plate 4, a part of the upper surface of the first lead 6 sandwiching the upper surface of the bottom plate 4, and the upper surface of the second lead 7 An epoxy resin as a coating resin is applied and solidified so as to cover a part (however, solidification is performed in the next step) to form the coating 10.

この被膜用樹脂の塗布は、第１リード６（又は第２リード７）の上面へのダイボンディング剤１２の塗布と同工程で行うことができる。すなわち、第１リード６にダイボンディング剤１２をスタンピングもしくはポッティングにて塗布するが、このとき、ダイボンディング剤１２と被膜用樹脂とが同じ材料である場合には、被膜用樹脂を同一の塗布装置で塗布し、材料が違う場合には、同工程で別の塗布装置を使用して塗布を行う。塗布装置としては、画像による位置計算が塗布精度や、発光素子の搭載精度に影響するので、同一であることが望ましい。   The coating resin can be applied in the same process as the application of the die bonding agent 12 to the upper surface of the first lead 6 (or the second lead 7). That is, the die bonding agent 12 is applied to the first lead 6 by stamping or potting. At this time, if the die bonding agent 12 and the coating resin are the same material, the coating resin is applied to the same coating device. If the materials are different, the coating is performed using another coating device in the same process. As the coating device, it is desirable that the position calculation by the image is the same because the position calculation by the image affects the coating accuracy and the mounting accuracy of the light emitting element.

［３］ＬＥＤチップの実装ステップ
図３に示すように、ＬＥＤチップ８をダイボンディング剤１２に載せてから、加熱を行い、ダイボンディング剤１２を固化してＬＥＤチップ８を接着するとともに、被膜用樹脂を固化させ被膜１０を形成する。続いて、ＬＥＤチップ８のｐ電極及びｎ電極をそれぞれボンディングワイヤ９により第１リード６及び第２リード７に電気的に結合する。 [3] LED Chip Mounting Step As shown in FIG. 3, after the LED chip 8 is placed on the die bonding agent 12, heating is performed to solidify the die bonding agent 12 to bond the LED chip 8, and for coating The resin is solidified to form the coating 10. Subsequently, the p electrode and the n electrode of the LED chip 8 are electrically coupled to the first lead 6 and the second lead 7 by the bonding wires 9, respectively.

［４］封止材の配置ステップ
図４に示すように、凹部５に液状の封止樹脂を注入する。凹部形成枠３の内壁面は、フッ素樹脂ゆえに封止樹脂に対する撥液性が機能することになる。この撥液性により、液状の封止樹脂ははじかれて形状制御され、平面視外周付近部において部分球面状になる。 [4] Step of Placing Sealant As shown in FIG. 4, liquid sealing resin is injected into the recess 5. Since the inner wall surface of the recess forming frame 3 is a fluororesin, the liquid repellency with respect to the sealing resin functions. Due to this liquid repellency, the liquid sealing resin is repelled and its shape is controlled, and becomes a partially spherical shape in the vicinity of the outer periphery in plan view.

［５］封止材の固化ステップ
液状の封止樹脂を反応硬化、熱硬化等により固化させれば、ＬＥＤチップ８を封止し、被膜１０を介して底板４に接着されている部分球面状の封止材１１が形成される。以上でＬＥＤランプ１が完成する。封止材１１の平面視外周付近部の部分球面状により、光の放射方向を上方に制御するとともに、光の強度配向を狭くすることができる。また、凹部形成枠３の内壁面も、光の放射方向を上方に制御する。 [5] Solidifying Step of Sealing Material If the liquid sealing resin is solidified by reaction curing, thermosetting or the like, the LED chip 8 is sealed, and a partial spherical shape bonded to the bottom plate 4 via the coating 10 The sealing material 11 is formed. Thus, the LED lamp 1 is completed. With the partial spherical shape in the vicinity of the outer periphery of the sealing material 11 in plan view, the light emission direction can be controlled upward and the light intensity orientation can be narrowed. The inner wall surface of the recess forming frame 3 also controls the light emission direction upward.

本実施例によれば、次の作用効果が得られる。
（ａ）ケース２の凹部形成枠３を封止樹脂に対する撥液性を有するケース用高分子材料で成形するので、凹部形成枠３の内壁面の撥液性が周方向にも傾斜面方向にも均一に発現し、液状の封止樹脂の平面視外周付近部が、形状の整った部分球面状となる。
（ｂ）そのケース用高分子材料として、耐熱性の高いフッ素樹脂を用いることで、長寿命化が期待できる。
（ｃ）ケース２の底板４も、凹部形成枠３と同じく封止樹脂に対する撥液性を有するケース用高分子材料で成形するので、ケース２を一体に成形することができ、効率的である。 According to the present embodiment, the following effects can be obtained.
(A) Since the concave portion forming frame 3 of the case 2 is formed of a case polymer material having liquid repellency with respect to the sealing resin, the liquid repellency of the inner wall surface of the concave portion forming frame 3 is in the circumferential direction as well as in the inclined surface direction. Is also expressed uniformly, and the vicinity of the outer periphery in a plan view of the liquid sealing resin has a partially spherical shape.
(B) Long life can be expected by using a highly heat-resistant fluororesin as the case polymer material.
(C) Since the bottom plate 4 of the case 2 is also formed of the case polymer material having liquid repellency with respect to the sealing resin in the same manner as the recess forming frame 3, the case 2 can be formed integrally and is efficient. .

（ｄ）但し、その底板４の一部が、必ず凹部５の内底面に現れる。なぜなら、ＬＥＤチップ８に電力を供給するため、導電性のリード６，７が最低２極必要であり、この２極のリード６，７の間を絶縁するための底板４の一部が、凹部５の内底面に現れるからである。その底板４の一部も撥液性のケース用高分子材料よりなるため、そこに封止樹脂が直接接触した場合には、非接着部分になって空間が生じ、封止材１１の剥離が起こりうる。また、封止材１１の全体形状の一部に、その空間に起因する意図しない凸部分が生じうる。また、この部分は極細いボンディングワイヤ９が通過するが、空間が生じるとボンディングワイヤ９破断の要因になる。しかし、本発明では、封止樹脂を注入する前に、凹部５の内底面に現れた底板４の一部の上面を、封止樹脂に対する接着性を有する被膜用樹脂よりなる被膜１０で覆うことで、撥液性を抑止するので、これらの問題が起きない。すなわち、封止材１１の剥離を抑止でき、封止材１１の全体形状に一部に意図しない凸部分が生じず、ボンディングワイヤ９の破断の要因が生じない。 (D) However, a part of the bottom plate 4 always appears on the inner bottom surface of the recess 5. This is because, in order to supply power to the LED chip 8, at least two conductive leads 6 and 7 are necessary, and a part of the bottom plate 4 for insulating between the two leads 6 and 7 is a recess. This is because it appears on the inner bottom surface of 5. Since part of the bottom plate 4 is also made of a liquid repellent polymeric material for the case, when the sealing resin is in direct contact therewith, a space is formed as a non-adhered portion, and the sealing material 11 is peeled off. It can happen. Moreover, an unintended convex part resulting from the space may arise in a part of the whole shape of the sealing material 11. In addition, the extremely thin bonding wire 9 passes through this portion, but if a space is generated, it causes breakage of the bonding wire 9. However, in the present invention, before injecting the sealing resin, a part of the upper surface of the bottom plate 4 appearing on the inner bottom surface of the recess 5 is covered with a coating 10 made of a coating resin having adhesiveness to the sealing resin. Therefore, these problems do not occur because the liquid repellency is suppressed. That is, peeling of the sealing material 11 can be suppressed, and an unintended convex portion is not formed in a part of the entire shape of the sealing material 11, and a factor of breakage of the bonding wire 9 does not occur.

図５に示す実施例２のＬＥＤランプ１は、複数の縦横比違いの凹部５と、複数対の第１リード６及び第２リード７と、複数のＬＥＤチップ８と、複数の封止材１１とを備えた表面実装型発光装置である。複数のＬＥＤチップ８の具体的個数は、図示例では３個であるが、これに限定されない。また、複数のＬＥＤチップ８の発光波長域は、同一でもよいし、相違するもの組み合わせ（例えば赤系と緑系と青系との組み合わせ）でもよい。   The LED lamp 1 of Example 2 shown in FIG. 5 includes a plurality of recesses 5 having different aspect ratios, a plurality of pairs of first leads 6 and second leads 7, a plurality of LED chips 8, and a plurality of sealing materials 11. Is a surface-mounted light emitting device. The specific number of the plurality of LED chips 8 is three in the illustrated example, but is not limited thereto. In addition, the emission wavelength ranges of the plurality of LED chips 8 may be the same, or may be different combinations (for example, a combination of red, green, and blue).

本実施例のその他の基本的な構成及び製造方法は実施例１と同様であり、封止樹脂を注入する前に、各凹部５の内底面に現れた底板４の上面に、封止樹脂に対する接着性を有する被膜用樹脂よりなる被膜１０が形成されるため、実施例１で述べた（ａ）〜（ｄ）と同様の作用効果を奏する。さらに、本実施例によれば、次の作用効果が得られる。
（ｅ）特に発光素子の発光波長域を色の３元色域（赤系と緑系と青系との組み合わせ）とすることで、ディスプレイに使用可能な発光装置を提供できる。
（ｆ）特に凹部５の縦横比違いにより、撥液性を活かし、封止材１１も縦横比違い（平面視で縦が短く横が長い細長形状）になる。この細長形状から、発光配向も縦横方向で変化することを利用し、従来使用されている楕円型砲弾発光装置からの置き換えが容易になる。光の配向は短い方向では狭くなり、長い方向では広くなる。 Other basic configurations and manufacturing methods of the present embodiment are the same as those of the first embodiment. Before injecting the sealing resin, the top surface of the bottom plate 4 that appears on the inner bottom surface of each recess 5 is applied to the sealing resin. Since the coating 10 made of the coating resin having adhesiveness is formed, the same effects as (a) to (d) described in Example 1 are achieved. Furthermore, according to the present embodiment, the following effects can be obtained.
(E) In particular, by setting the light emission wavelength region of the light emitting element to a ternary color gamut (a combination of red, green, and blue), a light emitting device that can be used for a display can be provided.
(F) In particular, due to the difference in the aspect ratio of the recess 5, the repellency is utilized, and the sealing material 11 is also different in the aspect ratio (elongated shape having a short length and a long width in plan view). This elongated shape makes it easy to replace the conventionally used elliptical bullet light emitting device by utilizing the fact that the light emitting orientation also changes in the vertical and horizontal directions. The light orientation is narrow in the short direction and wide in the long direction.

図６に示す実施例３のＬＥＤランプ１は、凹部形成枠３の高さを大きくし、封止樹脂の注入量を多くして、高さが高い略半球状の封止材１１を形成した点において、実施例１と相違するものである。図示例の封止材１１は、凹部５からはみ出ていないが、はみ出してもよい。   In the LED lamp 1 of Example 3 shown in FIG. 6, the height of the recess forming frame 3 is increased, the amount of sealing resin injected is increased, and a substantially hemispherical sealing material 11 having a high height is formed. This is different from the first embodiment. The sealing material 11 in the illustrated example does not protrude from the recess 5, but may protrude.

本実施例のその他の基本的な構成及び製造方法は実施例１と同様であるから、実施例１で述べた（ａ）〜（ｄ）と同様の作用効果を奏する。さらに、本実施例によれば、次の作用効果が得られる。
（ｇ）略半球状の封止材１１の凸レンズ効果により、より狭い光の配向を得ることができる。 Since the other basic configuration and manufacturing method of the present embodiment are the same as those of the first embodiment, the same operational effects as (a) to (d) described in the first embodiment are obtained. Furthermore, according to the present embodiment, the following effects can be obtained.
(G) Narrower light orientation can be obtained by the convex lens effect of the substantially hemispherical sealing material 11.

図７に示す実施例４のＬＥＤランプ１は、凹部５の内底面に、リード６，７の間を絶縁するための底板４の一部が現れるだけでなく、リード６，７側方の底板４の一部も現れるため、これらの現れた底板４の一部の上面に被膜１０が形成された点において、実施例１と相違するものである。本実施例も、実施例１で述べた（ａ）〜（ｄ）と同様の作用効果を奏する。   In the LED lamp 1 of Example 4 shown in FIG. 7, not only a part of the bottom plate 4 for insulating between the leads 6 and 7 appears on the inner bottom surface of the recess 5, but also the bottom plate on the side of the leads 6 and 7. 4 also appears, and thus differs from the first embodiment in that the coating 10 is formed on the upper surface of a part of the bottom plate 4 that appears. This example also has the same operational effects as (a) to (d) described in the first example.

なお、本発明は前記実施例に限定されるものではなく、発明の趣旨から逸脱しない範囲で適宜変更して具体化することもできる。   In addition, this invention is not limited to the said Example, In the range which does not deviate from the meaning of invention, it can change suitably and can be actualized.

１ ＬＥＤランプ
２ ケース
３ 凹部形成枠
４ 底板
５ 凹部
６ 第１リード
７ 第２リード
８ ＬＥＤチップ
９ ボンディングワイヤ
１０ 被膜
１１ 封止材
１２ ダイボンディング剤 DESCRIPTION OF SYMBOLS 1 LED lamp 2 Case 3 Concave formation frame 4 Bottom plate 5 Concave part 6 1st lead 7 2nd lead 8 LED chip 9 Bonding wire 10 Film 11 Sealing material 12 Die bonding agent

Claims (4)

ケースの凹部形成枠と底板とが硬化前粘度が１０００ｍＰａＳ以下である封止樹脂に対する撥液性を有するケース用高分子材料で成形され、凹部形成枠の内側に凹部が形成されるとともに、ケースに第１リード及び第２リードが接合され、
凹部の内底面に現れた、底板の上面と、該底板の上面を挟む第１リードの上面の一部と第２リードの上面の一部とに、封止樹脂に対する接着性を有する硬化前粘度が１００００ｍＰａＳ以上である被膜用樹脂よりなる被膜が形成され、
凹部の内底面に現れた第１リードの上面に、ＬＥＤチップが実装され、
凹部に注入された液状の前記封止樹脂が凹部形成枠の撥液性により形状制御されて固化してなる封止材が、ＬＥＤチップを封止し、被膜を介して底板に接着されていることを特徴とするＬＥＤランプ。 The recess forming frame and the bottom plate of the case are molded with a case polymer material having liquid repellency with respect to the sealing resin having a viscosity before curing of 1000 mPaS or less, and a recess is formed inside the recess forming frame. The first lead and the second lead are joined,
The pre-curing viscosity having adhesiveness to the sealing resin on the top surface of the bottom plate, the part of the top surface of the first lead sandwiching the top surface of the bottom plate, and the part of the top surface of the second lead appearing on the inner bottom surface of the recess Is formed of a coating resin having a viscosity of 10,000 mPaS or more ,
An LED chip is mounted on the upper surface of the first lead that appears on the inner bottom surface of the recess,
Sealing material in which the liquid sealing resin injected into the recess formed by hardening it after shape control by liquid repellency of the recess forming frame, an LED chip is sealed and bonded to the bottom plate via a film An LED lamp characterized by that. 凹部形成枠と底板とがケース用高分子材料で一体成形されている請求項１記載のＬＥＤランプ。   The LED lamp according to claim 1, wherein the recess forming frame and the bottom plate are integrally formed of a case polymer material. ケース用高分子材料が、フッ素樹脂、フッ素ゴム又はフッ素エラストマ−である請求項１又は２記載のＬＥＤランプ。   3. The LED lamp according to claim 1, wherein the case polymer material is a fluororesin, a fluororubber, or a fluoroelastomer. ケースの凹部形成枠と底板とを硬化前粘度が１０００ｍＰａＳ以下である封止樹脂に対する撥液性を有するケース用高分子材料で成形し、凹部形成枠の内側に凹部を形成するとともに、ケースに第１リード及び第２リードを接合するステップと、
凹部の内底面に現れた、底板の上面と、該底板の上面を挟む第１リードの上面の一部と第２リードの上面の一部とに、封止樹脂に対する接着性を有する硬化前粘度が１００００ｍＰａＳ以上である被膜用樹脂で被膜を形成するステップと、
凹部の内底面に現れた第１リードの上面に、ＬＥＤチップを実装するステップと、
凹部に液状の前記封止樹脂を注入し、液状の封止樹脂を凹部形成枠の撥液性により形状制御するステップと、
液状の封止樹脂を固化させ、ＬＥＤチップを封止し、被膜を介して底板に接着されている封止材を得るステップとを含むことを特徴とするＬＥＤランプの製造方法。 With a viscosity before curing of the recess forming frame and the bottom plate of the case is formed of a polymeric material for casing having liquid repellency against the sealing resin is not more than 1000 mPas, forming a recess in the inner side of the recess forming frame, the case Joining one lead and a second lead ;
The pre-curing viscosity having adhesiveness to the sealing resin on the top surface of the bottom plate, the part of the top surface of the first lead sandwiching the top surface of the bottom plate, and the part of the top surface of the second lead appearing on the inner bottom surface of the recess Forming a film with a coating resin having a viscosity of 10,000 mPaS or more ;
Mounting an LED chip on the upper surface of the first lead that appears on the inner bottom surface of the recess;
Said liquid sealing resin is injected into the recess, a step of shape control by liquid repellency of the recess forming frame a liquid sealing resin,
Solidifying the liquid sealing resin, sealing the LED chip, and obtaining a sealing material bonded to the bottom plate through a coating film.
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