JP6094746B2 - ランプ装置および照明装置 - Google Patents
ランプ装置および照明装置 Download PDFInfo
- Publication number
- JP6094746B2 JP6094746B2 JP2013060247A JP2013060247A JP6094746B2 JP 6094746 B2 JP6094746 B2 JP 6094746B2 JP 2013060247 A JP2013060247 A JP 2013060247A JP 2013060247 A JP2013060247 A JP 2013060247A JP 6094746 B2 JP6094746 B2 JP 6094746B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lamp device
- information
- lamp
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 29
- 238000001514 detection method Methods 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 description 14
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- 230000037431 insertion Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
Description
11 ランプ装置
12 ソケット
20 筐体
21 発光モジュール
25 情報回路
32 放熱部
34 突出部
38 ピン
50 基板
51 発光部
64 給電部
72 温度検知部
73 ランプ特性出力部
76 接続手段
Claims (5)
- 光出射側である前側に対して反対の後側中央部に放熱部を有する突出部が突出された筐体と;
基板、およびこの基板の前側の面に形成された発光部を有し、前記発光部が前記筐体内の中心に配置されるとともに前記基板の後側の面が前記放熱部の前側に熱的に接続された発光モジュールと;
前記筐体内で前記発光部の周囲に配置され、前記発光モジュールに給電するための一対の給電部と;
前記筐体内であって前記発光部の周囲でかつ一対の前記給電部とは異なる位置に配置され、外部に情報を出力する情報回路と;
前記突出部の周りで前記筐体の後側周辺部に沿って間隔をあけて設けられた複数のピンと;
各前記給電部と各前記給電部の近傍に位置する前記ピンとを接続するとともに、前記情報回路とこの情報回路の近傍に位置する前記ピンとを接続する接続手段と;
を具備していることを特徴とするランプ装置。 - 前記情報回路は、温度を検知して温度情報を出力する温度検知部を有している
ことを特徴とする請求項1記載のランプ装置。 - 前記情報回路は、ランプ特性情報を出力するランプ特性出力部を有している
ことを特徴とする請求項1または2記載のランプ装置。 - 前記情報回路は、前記突出部の内側面に沿って配置され、前記放熱部側には温度を検知して温度情報を出力する温度検知部が配置され、前記放熱部側とは反対側にはランプ特性情報を出力するランプ特性出力部が配置されている
ことを特徴とする請求項1記載のランプ装置。 - 請求項1ないし4いずれか一記載のランプ装置と;
前記ランプ装置を装着するソケットと;
を具備していることを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013060247A JP6094746B2 (ja) | 2013-03-22 | 2013-03-22 | ランプ装置および照明装置 |
CN201310407861.7A CN104061462B (zh) | 2013-03-22 | 2013-09-09 | 灯装置及照明装置 |
EP13184493.8A EP2781820A1 (en) | 2013-03-22 | 2013-09-16 | Lamp device and luminaire |
US14/029,892 US20140286021A1 (en) | 2013-03-22 | 2013-09-18 | Lamp Device and Luminaire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013060247A JP6094746B2 (ja) | 2013-03-22 | 2013-03-22 | ランプ装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014186840A JP2014186840A (ja) | 2014-10-02 |
JP6094746B2 true JP6094746B2 (ja) | 2017-03-15 |
Family
ID=49182128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013060247A Expired - Fee Related JP6094746B2 (ja) | 2013-03-22 | 2013-03-22 | ランプ装置および照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140286021A1 (ja) |
EP (1) | EP2781820A1 (ja) |
JP (1) | JP6094746B2 (ja) |
CN (1) | CN104061462B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202016101026U1 (de) * | 2016-02-26 | 2017-05-29 | Tridonic Jennersdorf Gmbh | LED-Modul |
JP6730670B2 (ja) * | 2016-05-24 | 2020-07-29 | 東芝ライテック株式会社 | 照明装置 |
WO2018068735A1 (zh) * | 2016-10-11 | 2018-04-19 | 欧普照明股份有限公司 | 安装底座、连接基座、光源模组及照明设备 |
JP6975930B2 (ja) * | 2018-04-02 | 2021-12-01 | パナソニックIpマネジメント株式会社 | 光源装置及び照明器具 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2163808B1 (en) * | 2007-05-23 | 2014-04-23 | Sharp Kabushiki Kaisha | Lighting device |
JP5404380B2 (ja) * | 2009-12-29 | 2014-01-29 | 三菱電機株式会社 | 電源ユニット及び光源ユニット及び照明装置及び表示装置 |
US8814399B2 (en) * | 2010-07-05 | 2014-08-26 | Toshiba Lighting & Technology Corporation | Luminaire having radiator |
CN102510973B (zh) * | 2010-07-05 | 2013-11-13 | 东芝照明技术株式会社 | 附灯口的灯、灯座装置以及照明器具 |
US8348478B2 (en) * | 2010-08-27 | 2013-01-08 | Tyco Electronics Nederland B.V. | Light module |
JP2012174539A (ja) * | 2011-02-22 | 2012-09-10 | Ichikoh Ind Ltd | 車両用前照灯 |
JP5699753B2 (ja) * | 2011-03-31 | 2015-04-15 | 東芝ライテック株式会社 | ランプ装置および照明器具 |
US8690389B2 (en) * | 2011-05-16 | 2014-04-08 | Molex Incorporated | Illumination module |
US20130058087A1 (en) * | 2011-09-06 | 2013-03-07 | Chih-Yang Chang | Led module fixing strucutre |
JP5686200B2 (ja) * | 2011-09-27 | 2015-03-18 | 東芝ライテック株式会社 | ランプ装置および照明装置 |
US8878435B2 (en) * | 2012-01-26 | 2014-11-04 | Cree, Inc. | Remote thermal compensation assembly |
JP2014186839A (ja) * | 2013-03-22 | 2014-10-02 | Toshiba Lighting & Technology Corp | ランプ装置および照明装置 |
JP2014186838A (ja) * | 2013-03-22 | 2014-10-02 | Toshiba Lighting & Technology Corp | ランプ装置および照明装置 |
-
2013
- 2013-03-22 JP JP2013060247A patent/JP6094746B2/ja not_active Expired - Fee Related
- 2013-09-09 CN CN201310407861.7A patent/CN104061462B/zh active Active
- 2013-09-16 EP EP13184493.8A patent/EP2781820A1/en not_active Withdrawn
- 2013-09-18 US US14/029,892 patent/US20140286021A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN104061462B (zh) | 2017-05-03 |
US20140286021A1 (en) | 2014-09-25 |
JP2014186840A (ja) | 2014-10-02 |
EP2781820A1 (en) | 2014-09-24 |
CN104061462A (zh) | 2014-09-24 |
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