JP6090035B2 - 液処理装置 - Google Patents

液処理装置 Download PDF

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Publication number
JP6090035B2
JP6090035B2 JP2013154703A JP2013154703A JP6090035B2 JP 6090035 B2 JP6090035 B2 JP 6090035B2 JP 2013154703 A JP2013154703 A JP 2013154703A JP 2013154703 A JP2013154703 A JP 2013154703A JP 6090035 B2 JP6090035 B2 JP 6090035B2
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Japan
Prior art keywords
substrate
wafer
light
unit
light receiving
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JP2013154703A
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English (en)
Japanese (ja)
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JP2015026688A (ja
JP2015026688A5 (https=
Inventor
公平 森
公平 森
健人 久留巣
健人 久留巣
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013154703A 2013-07-25 2013-07-25 液処理装置 Active JP6090035B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013154703A JP6090035B2 (ja) 2013-07-25 2013-07-25 液処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013154703A JP6090035B2 (ja) 2013-07-25 2013-07-25 液処理装置

Publications (3)

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JP2015026688A JP2015026688A (ja) 2015-02-05
JP2015026688A5 JP2015026688A5 (https=) 2015-12-24
JP6090035B2 true JP6090035B2 (ja) 2017-03-08

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JP2013154703A Active JP6090035B2 (ja) 2013-07-25 2013-07-25 液処理装置

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7021877B2 (ja) * 2017-08-08 2022-02-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、位置合わせ装置および位置合わせ方法
JP6908474B2 (ja) * 2017-09-06 2021-07-28 株式会社ディスコ ウエーハ洗浄装置
KR102685189B1 (ko) * 2022-08-23 2024-07-16 엘에스이 주식회사 기판 세정 장치
KR102798182B1 (ko) * 2023-05-23 2025-04-22 엘에스이 주식회사 기판 세정 장치
KR102821310B1 (ko) * 2023-10-26 2025-06-17 엘에스이 주식회사 기판 세정 장치
KR102819139B1 (ko) * 2023-11-10 2025-06-11 엘에스이 주식회사 기판 세정 장치
KR102836608B1 (ko) * 2024-02-01 2025-07-22 엘에스이 주식회사 기판 세정 장치
KR102836609B1 (ko) * 2024-02-07 2025-07-22 엘에스이 주식회사 기판 세정 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853483A (en) * 1995-05-02 1998-12-29 Dainippon Screen Mfg. Co., Ltd. Substrate spin treating method and apparatus
JP3544747B2 (ja) * 1995-05-15 2004-07-21 大日本スクリーン製造株式会社 回転式基板処理装置
JP3640373B2 (ja) * 1999-08-27 2005-04-20 大日本スクリーン製造株式会社 基板載置台
JP2002319563A (ja) * 2001-04-20 2002-10-31 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP4439464B2 (ja) * 2005-12-06 2010-03-24 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
JP2009200063A (ja) * 2006-05-22 2009-09-03 Tokyo Electron Ltd 基板の変形検出機構，処理システム，基板の変形検出方法及び記録媒体
JP5009254B2 (ja) * 2008-08-14 2012-08-22 株式会社ディスコ 樹脂被覆装置
US9082802B2 (en) * 2011-11-28 2015-07-14 Macronix International Co., Ltd. Wafer centering hardware design and process

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Publication number Publication date
JP2015026688A (ja) 2015-02-05

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