JP6083150B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6083150B2 JP6083150B2 JP2012182304A JP2012182304A JP6083150B2 JP 6083150 B2 JP6083150 B2 JP 6083150B2 JP 2012182304 A JP2012182304 A JP 2012182304A JP 2012182304 A JP2012182304 A JP 2012182304A JP 6083150 B2 JP6083150 B2 JP 6083150B2
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- 229910052710 silicon Inorganic materials 0.000 claims description 97
- 239000010703 silicon Substances 0.000 claims description 97
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- 229910052799 carbon Inorganic materials 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 96
- 238000002513 implantation Methods 0.000 description 62
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- 238000001312 dry etching Methods 0.000 description 40
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- 229910052796 boron Inorganic materials 0.000 description 20
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- 239000001301 oxygen Substances 0.000 description 16
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- 229910052814 silicon oxide Inorganic materials 0.000 description 16
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 9
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
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- 238000005229 chemical vapour deposition Methods 0.000 description 6
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
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- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 5
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- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
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- 230000001590 oxidative effect Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 101000594506 Homo sapiens Acyl-coenzyme A diphosphatase NUDT19 Proteins 0.000 description 1
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 101001128051 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) 60S ribosomal protein L3 Proteins 0.000 description 1
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- 101000733875 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) 60S ribosomal protein L4-B Proteins 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 125000005843 halogen group Chemical group 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
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- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
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- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
- H01L21/2652—Through-implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823878—Complementary field-effect transistors, e.g. CMOS isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Drying Of Semiconductors (AREA)
- Element Separation (AREA)
Description
図3Bを参照する。図3Bは、図1Fに対応し、p型ウェル領域3pの形成のためのB注入と、p型チャネル領域4pの形成のためのGe注入、C注入、及びB注入とが行なわれた状態を示す。ウォーターマーク101を介したイオン注入に起因して、ウォーターマーク101がシリコン基板1中に打ち込まれて(ノックオンされて)、シリコン基板1の表層部に、酸化膜ライクな変質層102が形成される。
(付記1)
半導体基板上に保護膜を形成する工程と、
前記保護膜上に、第1のレジストパターンを形成する工程と、
前記第1のレジストパターンをマスクとして、前記半導体基板に、第1の不純物イオンを注入する工程と、
前記第1のレジストパターンを除去する工程と、
前記第1のレジストパターンを除去する工程の後に、前記半導体基板の表面に化学反応により前記半導体基板表面原子を取り込んだ化学反応膜を形成する工程と、
前記半導体基板の表面に化学反応膜を形成する工程の後に、前記半導体基板上に形成された化学反応膜を除去し、前記半導体基板の表層を除去する工程と
前記半導体基板の表層を除去する工程の後に、前記半導体基板表面に半導体層をエピタキシャル成長する工程と
を有する半導体装置の製造方法。
(付記2)
前記半導体基板の表層を除去する工程が、薬液処理によること、
を特徴とする付記1に記載の半導体装置の製造方法。
(付記3)
前記半導体基板の表層を除去する工程が、ドライエッチングによること、
を特徴とする付記1に記載の半導体装置の製造方法。
(付記4)
前記第1の不純物イオンを注入する工程において、ゲルマニウムまたはシリコンを注入し、その後カーボンを注入する工程を有する付記1乃至3のいずれか1つに記載の半導体装置の製造方法。
(付記5)
前記カーボンを注入する工程の後に、前記半導体基板にボロンを注入する工程をさらに有すること、
を特徴とする付記4に記載の半導体装置の製造方法。
(付記6)
前記化学反応として、熱処理工程と、
前記熱処理工程の後に、前記半導体基板の表面を酸化する工程と
を有し、
前記酸化工程により半導体基板上に形成された酸化膜を除去する工程と
を有する付記1乃至5のいずれか1つに記載の半導体装置の製造方法。
(付記7)
半導体基板上に保護膜を形成する工程と、
前記保護膜上に、第1のレジストパターンを形成する工程と、
前記第1のレジストパターンをマスクとして、前記半導体基板に、第1の不純物イオンを注入する工程と、
前記第1のレジストパターンを除去する工程と、
前記第1のレジストパターンを除去する工程の後に、第2のレジストパターンを形成する工程と、
前記第2のレジストパターンをマスクとして、前記半導体基板に、第2の不純物イオンを注入する工程と、
前記第2のレジストパターンを除去する工程と、
前記第2のレジストパターンを除去する工程の後に、前記半導体基板表面に半導体層をエピタキシャル成長する工程と
を有する半導体装置の製造方法。
(付記8)
前記第2のレジストパターンを除去する工程の後に、前記半導体基板上の酸化膜を除去し、前記半導体基板の表層を除去する工程をさらに有すること、
を特徴とする付記7に記載の半導体装置の製造方法。
(付記9)
前記第2のレジストパターンを除去する工程の後に、前記半導体基板の表面に化学反応により前記半導体基板表面原子を取り込んだ化学反応膜を形成する工程と、
前記半導体基板の表面に化学反応膜を形成する工程の後に、前記半導体基板上に形成された化学反応膜を除去し、前記半導体基板の表層を除去する工程と
をさらに有することを特徴とする付記7に記載の半導体装置の製造方法。
(付記10)
前記半導体基板の表層を除去する工程が、薬液処理によること、
を特徴とする付記9に記載の半導体装置の製造方法。
(付記11)
前記半導体基板の表層を除去する工程が、ドライエッチングによること、
を特徴とする付記9に記載の半導体装置の製造方法。
(付記12)
前記化学反応として、熱処理工程と、
前記熱処理工程の後に、前記半導体基板の表面を酸化する工程と
を有し、
前記酸化工程により半導体基板上に形成された酸化膜を除去する工程
を有する付記9乃至11のいずれか1つに記載の半導体装置の製造方法。
(付記13)
前記第1の不純物イオンが、ゲルマニウムまたはシリコンであることを特徴とする付記7乃至12のいずれか1つに記載の半導体装置の製造方法。
(付記14)
前記第2の不純物イオンが、カーボンであることを特徴とする付記7乃至13のいずれか1つに記載の半導体装置の製造方法。
(付記15)
前記第2の不純物イオンを注入する工程の後に、前記半導体基板にボロンを注入する工程をさらに有すること、
を特徴とする付記14に記載の半導体装置の製造方法。
(付記16)
半導体基板上に保護膜を形成する工程と、
前記保護膜上に、第1のレジストパターンを形成する工程と、
前記第1のレジストパターンをマスクとして、前記半導体基板に、第1の不純物イオンを注入する工程と、
前記第1のレジストパターンを除去する工程と、
前記第1のレジストパターンを除去する工程の後に、ドライエッチングにより、前記半導体基板上の酸化膜を除去し、前記半導体基板の表層を除去する工程と、
前記半導体基板の表層を除去する工程の後に、前記半導体基板表面に半導体層をエピタキシャル成長する工程と
を有する半導体装置の製造方法。
(付記17)
前記第1の不純物イオンを注入する工程において、ゲルマニウムまたはシリコンを注入し、その後カーボンを注入する工程を有する付記16に記載の半導体装置の製造方法。
(付記18)
前記カーボンを注入する工程の後に、前記半導体基板にボロンを注入する工程をさらに有すること、
を特徴とする付記17に記載の半導体装置の製造方法。
(付記19)
前記ドライエッチングにより、前記半導体基板上の酸化膜を除去し、前記半導体基板の表層を除去する工程は、ドライエッチング装置を運転する工程を含み、
前記ドライエッチング装置を運転する工程は、
酸素プラズマ処理を含む、チャンバのクリーニング工程と、
前記クリーニング工程の後に、前記チャンバを不活性ガスでパージする工程と、
前記チャンバを不活性ガスでパージする工程の後に、前記チャンバに前記半導体基板を搬入する工程と、
前記半導体基板上の酸化膜及び前記半導体基板の表層をドライエッチングで除去する工程と
を有する付記16乃至18のいずれか1つに記載の半導体装置の製造方法。
(付記20)
前記ドライエッチングで除去する工程において、前記半導体基板は、静電チャックにより保持され、さらに、
前記ドライエッチングで除去する工程の後、前記半導体基板を、不活性ガスプラズマを用いてデチャックする工程と、
前記チャンバから前記半導体基板を搬出する工程と
を有する付記19に記載の半導体装置の製造方法。
2、5、6、8、21、31 酸化シリコン膜
3n、3p ウェル領域
4n、4p チャネル領域
7 シリコン膜
9 窒化シリコン膜
10 素子分離溝
11 素子分離絶縁膜
12 ゲート絶縁膜
13 ゲート電極
14n、14p エクステンション領域
15 サイドウォール絶縁膜
16n、16p ソース/ドレイン領域
RP1、RP2、RP21、RP22 レジストパターン
Claims (4)
- 半導体基板上に第1の保護膜を形成する工程と、
前記第1の保護膜上に、第1のレジストパターンを形成する工程と、
前記第1のレジストパターンをマスクとして、前記半導体基板の第1領域に、ゲルマニウム又はシリコンを注入する工程と、
前記第1のレジストパターンを除去する工程と、
前記第1の保護膜を除去する工程と、
前記第1の保護膜を除去する工程の後に、前記半導体基板上に第2の保護膜を形成する工程と、
前記第2の保護膜上に、第2のレジストパターンを形成する工程と、
前記第2のレジストパターンをマスクとして、前記半導体基板の前記第1領域に、カーボンを注入する工程と、
前記第2のレジストパターンを除去する工程と、
前記第2の保護膜を除去する工程と、
前記第2の保護膜を除去する工程の後に、前記半導体基板の前記第1領域の表面に半導体層をエピタキシャル成長する工程と
を有する半導体装置の製造方法。 - 前記第2の保護膜を除去する工程の後に、前記半導体基板の前記第1領域の表面に化学反応により半導体基板表面原子を取り込んだ化学反応膜を形成する工程と、
前記化学反応膜を除去し、前記半導体基板の前記第1領域の表層を除去する工程と
をさらに有することを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記第1のレジストパターンをマスクとして、前記半導体基板の前記第1領域に、第3の不純物イオンを注入する工程と、
前記第2のレジストパターンをマスクとして、前記半導体基板の前記第1領域に、前記第3の不純物イオンと同じ導電型を有する第4の不純物イオンを注入する工程と
をさらに有することを特徴とする請求項1または2に記載の半導体装置の製造方法。 - 前記第3の不純物イオンを注入する工程において、前記第1領域にウェルが形成され、
前記第4の不純物イオンを注入する工程において、前記第1領域にチャネルが形成される、
ことを特徴とする請求項3に記載の半導体装置の製造方法。
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US6534409B1 (en) * | 1996-12-04 | 2003-03-18 | Micron Technology, Inc. | Silicon oxide co-deposition/etching process |
US6030862A (en) * | 1998-10-13 | 2000-02-29 | Advanced Micro Devices, Inc. | Dual gate oxide formation with minimal channel dopant diffusion |
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