JP6075145B2 - Ｐｚｔ系強誘電体薄膜形成用組成物の製造方法並びに該組成物を用いたｐｚｔ系強誘電体薄膜の形成方法 - Google Patents

Ｐｚｔ系強誘電体薄膜形成用組成物の製造方法並びに該組成物を用いたｐｚｔ系強誘電体薄膜の形成方法 Download PDF

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JP6075145B2
JP6075145B2 JP2013061938A JP2013061938A JP6075145B2 JP 6075145 B2 JP6075145 B2 JP 6075145B2 JP 2013061938 A JP2013061938 A JP 2013061938A JP 2013061938 A JP2013061938 A JP 2013061938A JP 6075145 B2 JP6075145 B2 JP 6075145B2
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pzt
thin film
composition
ferroelectric thin
mass
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JP2014187266A (ja
Inventor
土井　利浩
利浩 土井
桜井　英章
英章 桜井
曽山　信幸
信幸 曽山
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2013061938A priority Critical patent/JP6075145B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to EP14155517.7A priority patent/EP2784137B1/en
Priority to CN201410054324.3A priority patent/CN104072132B/zh
Priority to IN469DE2014 priority patent/IN2014DE00469A/en
Priority to KR1020140018261A priority patent/KR102019522B1/ko
Priority to US14/183,746 priority patent/US20140287251A1/en
Priority to TW103105484A priority patent/TWI591205B/zh
Publication of JP2014187266A publication Critical patent/JP2014187266A/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1254—Sol or sol-gel processing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229—Composition of the substrate
    • C23C18/1245—Inorganic substrates other than metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Semiconductor Memories (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
JP2013061938A 2013-03-25 2013-03-25 Ｐｚｔ系強誘電体薄膜形成用組成物の製造方法並びに該組成物を用いたｐｚｔ系強誘電体薄膜の形成方法 Active JP6075145B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013061938A JP6075145B2 (ja) 2013-03-25 2013-03-25 Ｐｚｔ系強誘電体薄膜形成用組成物の製造方法並びに該組成物を用いたｐｚｔ系強誘電体薄膜の形成方法
CN201410054324.3A CN104072132B (zh) 2013-03-25 2014-02-18 Pzt系铁电薄膜形成用组合物及其制法和pzt系铁电薄膜形成法
IN469DE2014 IN2014DE00469A (cg-RX-API-DMAC7.html) 2013-03-25 2014-02-18
KR1020140018261A KR102019522B1 (ko) 2013-03-25 2014-02-18 Pzt계 강유전체 박막 형성용 조성물 및 그 제조 방법 그리고 그 조성물을 사용한 pzt계 강유전체 박막의 형성 방법
EP14155517.7A EP2784137B1 (en) 2013-03-25 2014-02-18 PZT-based ferroelectric thin film-forming composition, method of preparing the same, and method of forming PZT-based ferroelectric thin film using the same
US14/183,746 US20140287251A1 (en) 2013-03-25 2014-02-19 Pzt-based ferroelectric thin film-forming composition, method of preparing the same, and method of forming pzt-based ferroelectric thin film using the same
TW103105484A TWI591205B (zh) 2013-03-25 2014-02-19 Ｐｚｔ系強介電體薄膜形成用組成物及其製造方法及使用該組成物之ｐｚｔ系強介電體薄膜之形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013061938A JP6075145B2 (ja) 2013-03-25 2013-03-25 Ｐｚｔ系強誘電体薄膜形成用組成物の製造方法並びに該組成物を用いたｐｚｔ系強誘電体薄膜の形成方法

Publications (2)

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JP2014187266A JP2014187266A (ja) 2014-10-02
JP6075145B2 true JP6075145B2 (ja) 2017-02-08

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JP2013061938A Active JP6075145B2 (ja) 2013-03-25 2013-03-25 Ｐｚｔ系強誘電体薄膜形成用組成物の製造方法並びに該組成物を用いたｐｚｔ系強誘電体薄膜の形成方法

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Country Link
US (1) US20140287251A1 (cg-RX-API-DMAC7.html)
EP (1) EP2784137B1 (cg-RX-API-DMAC7.html)
JP (1) JP6075145B2 (cg-RX-API-DMAC7.html)
KR (1) KR102019522B1 (cg-RX-API-DMAC7.html)
CN (1) CN104072132B (cg-RX-API-DMAC7.html)
IN (1) IN2014DE00469A (cg-RX-API-DMAC7.html)
TW (1) TWI591205B (cg-RX-API-DMAC7.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6237398B2 (ja) * 2014-03-27 2017-11-29 三菱マテリアル株式会社 ＣｅドープのＰＺＴ系圧電体膜形成用組成物
EP3125317B1 (en) * 2014-03-27 2022-04-27 Mitsubishi Materials Corporation Mn-doped pzt-based piezoelectric film formation composition and mn-doped pzt-based piezoelectric film
JP6550791B2 (ja) * 2015-02-26 2019-07-31 三菱マテリアル株式会社 ＰＮｂＺＴ膜形成用組成物の製造方法及びＰＮｂＺＴ圧電体膜の形成方法
EP3343654B1 (en) * 2015-08-28 2020-04-15 Japan Advanced Institute of Science and Technology Method for forming pzt ferroelectric film
JP6950404B2 (ja) * 2017-03-15 2021-10-13 三菱マテリアル株式会社 圧電体膜形成用液組成物の製造方法及びこの液組成物を用いて圧電体膜を形成する方法

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Publication number Priority date Publication date Assignee Title
WO1990013149A1 (en) * 1989-04-27 1990-11-01 Queen's University At Kingston SOL GEL PROCESS FOR PREPARING Pb(Zr,Ti)O3 THIN FILMS
US5384294A (en) * 1993-11-30 1995-01-24 The United States Of America As Represented By The Secretary Of The Air Force Sol-gel derived lead oxide containing ceramics
JP5370332B2 (ja) * 1995-09-19 2013-12-18 セイコーエプソン株式会社 圧電体素子およびインクジェット式記録ヘッド
US6203608B1 (en) * 1998-04-15 2001-03-20 Ramtron International Corporation Ferroelectric thin films and solutions: compositions
JP4122564B2 (ja) * 1998-04-24 2008-07-23 セイコーエプソン株式会社 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP2001261338A (ja) 2000-03-15 2001-09-26 Mitsubishi Materials Corp Ｔｉを含有する金属酸化物薄膜形成用原料溶液、Ｔｉを含有する金属酸化物薄膜の形成方法及びＴｉを含有する金属酸化物薄膜
JP4419332B2 (ja) * 2001-02-06 2010-02-24 三菱マテリアル株式会社 ペロブスカイト型酸化物膜の基板表面構造とその基板およびペロブスカイト型酸化物膜
US7229662B2 (en) * 2003-12-16 2007-06-12 National University Of Singapore Heterolayered ferroelectric thin films and methods of forming same
CN100481550C (zh) * 2004-07-13 2009-04-22 精工爱普生株式会社 用于形成铁电薄膜的组合物、铁电薄膜及其制造方法、液体喷射头
JP4217906B2 (ja) * 2004-09-17 2009-02-04 セイコーエプソン株式会社 前駆体溶液の製造方法
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JP5613910B2 (ja) * 2011-05-17 2014-10-29 三菱マテリアル株式会社 Ｐｚｔ強誘電体薄膜の製造方法

Also Published As

Publication number Publication date
CN104072132B (zh) 2017-06-23
TW201500580A (zh) 2015-01-01
KR20140116794A (ko) 2014-10-06
EP2784137A1 (en) 2014-10-01
JP2014187266A (ja) 2014-10-02
KR102019522B1 (ko) 2019-09-06
CN104072132A (zh) 2014-10-01
TWI591205B (zh) 2017-07-11
EP2784137B1 (en) 2016-09-21
IN2014DE00469A (cg-RX-API-DMAC7.html) 2015-06-19
US20140287251A1 (en) 2014-09-25

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