JP6073639B2 - 薄ガラス長尺体 - Google Patents
薄ガラス長尺体 Download PDFInfo
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- JP6073639B2 JP6073639B2 JP2012231999A JP2012231999A JP6073639B2 JP 6073639 B2 JP6073639 B2 JP 6073639B2 JP 2012231999 A JP2012231999 A JP 2012231999A JP 2012231999 A JP2012231999 A JP 2012231999A JP 6073639 B2 JP6073639 B2 JP 6073639B2
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- thin glass
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- 239000011521 glass Substances 0.000 title claims description 246
- 230000001681 protective effect Effects 0.000 claims description 85
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 238000004804 winding Methods 0.000 description 8
- 229920002799 BoPET Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006063 cullet Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
- B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H19/00—Changing the web roll
- B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
- B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
- B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
- B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
- H01L21/67343—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/46—Splicing
- B65H2301/462—Form of splice
- B65H2301/4621—Overlapping article or web portions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/46—Splicing
- B65H2301/463—Splicing splicing means, i.e. means by which a web end is bound to another web end
- B65H2301/4631—Adhesive tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/52—Auxiliary process performed during handling process for starting
- B65H2301/522—Threading web into machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2801/00—Application field
- B65H2801/61—Display device manufacture, e.g. liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/04—Annealing glass products in a continuous way
- C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B27/00—Tempering or quenching glass products
- C03B27/04—Tempering or quenching glass products using gas
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Packaging Frangible Articles (AREA)
- Surface Treatment Of Glass (AREA)
- Replacement Of Web Rolls (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Description
好ましい実施形態においては、上記保護フィルムが、上記薄ガラスの連結部側の最端部から上記薄ガラス長尺体の長さ方向の外側に向けて延出する延出部を有し、該延出部の長さが、該薄ガラスの幅に対して、300%以下である。
好ましい実施形態においては、上記保護フィルムの幅が、上記薄ガラスの幅に対して、100%〜120%である。
好ましい実施形態においては、本発明の薄ガラス長尺体は、別の保護フィルムをさらに備え、上記薄ガラス長尺体の靭性フィルム側の面において、該別の保護フィルムが該靱性フィルムの連結部側の最端部を覆うように積層されている。
好ましい実施形態においては、上記薄ガラスの厚みが、10μm〜150μmである。
好ましい実施形態においては、上記薄ガラスの幅が、300mm以上である。
好ましい実施形態においては、上記連結部の長さaと上記薄ガラスの幅bとの関係が、0.01b≦a≦bである。
図1に示すように、薄ガラス長尺体100は、薄ガラス10と靭性フィルム20、20’とが積層して形成される連結部A、A’を有し、薄ガラス10の連結部側の最端部1、1’は保護フィルム30、30’により覆われている。薄ガラスと靭性フィルムとは、任意の適切な粘着剤または接着剤を介して連結されていてもよく、薄ガラスおよび靭性フィルムのそれぞれの端部を任意の適切な粘着テープまたは両面テープにより固定して連結されていてもよい。保護フィルムは、任意の適切な粘着剤または接着剤を介して薄ガラスおよび靭性フィルムに貼着されていてもよく、任意の適切な粘着テープまたは両面テープにより貼着されていてもよい。また、任意の適切な粘着剤層または接着剤層を有する保護フィルムにより、薄ガラスと靭性フィルムとを連結してもよい。粘着剤層または接着剤層を有する保護フィルムを用いれば、段差の少ない薄ガラス長尺体を得ることができる。
上記薄ガラスは、板状のものであれば、任意の適切なものが採用され得る。上記薄ガラスは、組成による分類によれば、例えば、ソーダライムガラス、ホウ酸ガラス、アルミノ珪酸ガラス、石英ガラス等が挙げられる。また、アルカリ成分による分類によれば、無アルカリガラス、低アルカリガラスが挙げられる。好ましくは、無アルカリガラスが用いられる。強度および化学的耐久性に優れるからである。上記薄ガラス長尺体が複数の薄ガラスを備える場合、複数の薄ガラスは同分類の薄ガラスであってもよく、異なる分類の薄ガラスであってもよい。
上記靱性フィルムを構成する材料としては、本発明の効果が得られる限り、任意の適切な材料が選択され得る。靱性フィルムを構成する材料としては、薄ガラスよりも高靱性の材料が用いられ、例えば、樹脂、金属等が挙げられる。樹脂としては、ポリエチレンテレフタレート系樹脂、ポリイミド系樹脂、ポリアミド系樹脂、ポリエチレンナフタレート系樹脂、ポリカーボネート系樹脂、シクロオレフィン系樹脂等が挙げられる。なかでも、ポリエチレンテレフタレート系樹脂が好ましく用いられる。金属としては、アルミニウム、ステンレス、銅、鉄、鉛等が挙げられる。なかでも、アルミニウムまたはステンレスが好ましく用いられる。本発明の薄ガラス長尺体は複数の靱性フィルムを備えるが、複数の靱性フィルムは同じ材料から構成されていてもよく、異なる材料から構成されていてもよい。
長さ20m、幅300mmの薄ガラス(厚み:50μm)の両端に、靭性フィルムとして長さ20m、幅300mmのPETフィルム(厚み:100μm)を連結した。薄ガラスとPETフィルムとの連結部分においては、重なりが長さ100mmとなるようにして薄ガラスとPETフィルムとを粘着テープを介して貼り合わせた。さらに、保護フィルムおよび別の保護フィルムとして、長さ300mm、幅300mmの粘着剤層を備えるPETフィルム(総厚み:25μm)を用い、該保護フィルムおよび別の保護フィルムにより連結部の両面を覆った。該保護フィルムは、薄ガラスの連結部側の最端部から100mm延出するようにした。また、該別の保護フィルムは、靭性フィルムの連結部側の最端部から100mm延出するようにした。以上のようにして、保護フィルムおよび別の保護フィルムが、連結部および連結部近傍の薄ガラスおよび靭性フィルムを覆う薄ガラス長尺体を得た。
得られた薄ガラス長尺体を外径6インチの巻き芯に巻いて、繰り出しロールを得た。その後、該繰り出しロールから繰り出した薄ガラス長尺体を、3インチの径を有する加工ロールを備える処理装置に通紙し、再度、外径6インチの巻き芯に巻き取った。
このような処理工程の開始段階および終了段階において、薄ガラス長尺体はハンドリング性に優れていた。また、薄ガラスを破損させることなく、工程を完了することができた。
連結部を保護フィルムで覆わなかった以外は、実施例1と同様にして、薄ガラス長尺体を得た。得られた薄ガラス長尺体は、繰り出しロールを作製する際、外径6インチの巻き芯に巻き取る時点で、連結部において薄ガラスが割れた。
連結部を保護フィルムで覆わなかった以外は、実施例1と同様にして、薄ガラス長尺体を得た。得られた薄ガラス長尺体を外径6インチの巻き芯に巻いて、繰り出しロールを得た。このとき、連結部と連結部上部に巻かれる薄ガラスとの間にPETフィルム(厚み:25μm)を差し込んで薄ガラス長尺体を巻き取った。その後、該繰り出しロールから繰り出した薄ガラス長尺体を、3インチの径を有する加工ロールを備える処理装置に通紙した。該薄ガラス長尺体は、連結部が加工ロールを通過する際に薄ガラスが割れ、その後に通過する薄ガラスはカレットにより汚染された。
20、20’ 靭性フィルム
30、30’ 保護フィルム
40 別の保護フィルム
100、200 薄ガラス長尺体
Claims (7)
- 長尺状の薄ガラスから構成される本体部と、該薄ガラスの長さ方向両端に連結された靱性フィルムから構成されるハンドリング部とを備える薄ガラス長尺体であって、
該薄ガラスの長さ方向端部と該靭性フィルムの長さ方向の薄ガラス側の端部とが積層して連結部を形成し、
該薄ガラス長尺体の薄ガラス側の面において、該薄ガラスの連結部側の最端部が保護フィルムにより覆われ、
該保護フィルムにおけるヤング率と厚みとの積が、該薄ガラスにおけるヤング率と厚みとの積よりも、小さい、
薄ガラス長尺体。 - 前記保護フィルムが、前記薄ガラスの連結部側の最端部から前記薄ガラス長尺体の長さ方向の外側に向けて延出する延出部を有し、該延出部の長さが、該薄ガラスの幅に対して、300%以下である、請求項1に記載の薄ガラス長尺体。
- 前記保護フィルムの幅が、前記薄ガラスの幅に対して、100%〜120%である、請求項1または2に記載の薄ガラス長尺体。
- 別の保護フィルムをさらに備え、前記薄ガラス長尺体の靭性フィルム側の面において、該別の保護フィルムが前記靱性フィルムの連結部側の最端部を覆うように積層されている、請求項1から3のいずれかに記載の薄ガラス長尺体。
- 前記薄ガラスの厚みが、10μm〜150μmである、請求項1から4のいずれかに記載の薄ガラス長尺体。
- 前記薄ガラスの幅が、300mm以上である、請求項1から5のいずれかに記載の薄ガラス長尺体。
- 前記連結部の長さaと前記薄ガラスの幅bとの関係が、0.01b≦a≦bである、請求項1から6のいずれかに記載の薄ガラス長尺体。
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