JP6057138B2 - Power conversion device and method of manufacturing power conversion device - Google Patents

Description

  The embodiment of the disclosure relates to a power conversion device and a method for manufacturing the power conversion device.

  Patent Document 1 describes a control unit in which a heat sink to which a semiconductor element is attached is attached to a bottom plate of a case, and cooling air is circulated through cooling fins of the heat sink for cooling.

Japanese Patent Laid-Open No. 10-150284

  In the above prior art, when the control unit is downsized in the width direction, further optimization of the device configuration is desired.

  This invention is made | formed in view of such a problem, and it aims at providing the manufacturing method of the power converter device which can be reduced in the width direction, and a power converter device.

In order to solve the above-described problem, according to one aspect of the present invention, there is provided a power conversion device for converting power, a first substrate, a second substrate erected on the first substrate, and the second substrate. An electronic component that is disposed on one surface in the plate thickness direction of the substrate and forms a power conversion circuit and generates heat when energized, and along the second substrate on the one side in the plate thickness direction of the second substrate A power conversion device is applied that includes a heat sink that is disposed and that cools the electronic component disposed on the one surface .

According to another aspect of the present invention, a first substrate, a second substrate mounted on the first substrate, an electronic component that forms a power conversion circuit and generates heat when energized, and a heat sink that cools the electronic component A method of manufacturing a power conversion device comprising: fixing the electronic component to the heat sink, and arranging the electronic component on one surface in the plate thickness direction of the second substrate. The heat sink for cooling the electronic component disposed on the one side surface is disposed on the one side in the plate thickness direction of the second substrate, and the second substrate is erected on the first substrate. A method for manufacturing a power conversion device is provided.

  According to the power conversion device or the like of the present invention, the power conversion device can be downsized in the width direction.

It is a circuit block diagram showing an example of the circuit configuration of the power converter of one embodiment. It is a top view showing an example of the structure of a power converter device. It is a front view showing an example of the structure of a power converter device. It is a front view showing an example of the structure of the power converter device in the modification which thermally connects a 2nd board | substrate and a heat sink with a heat pipe.

  Hereinafter, an embodiment will be described with reference to the drawings. In the present specification and drawings, components having substantially the same function are represented by the same reference numerals in principle, and repeated description of these components will be omitted as appropriate. The directions of “front”, “rear”, “left”, “right”, “upper”, and “lower” noted in the drawings are “front”, “rear”, “left”, “right”, “right”, Each corresponds to the direction described as “up” or “down”. However, the positional relationship of each component of the power conversion device is not limited to the concept of “front”, “rear”, “left”, “right”, “upper”, and “lower”.

<1. Example of circuit configuration of power conversion device>
First, an example of the circuit configuration of the power conversion device of the present embodiment will be described with reference to FIG.

  As illustrated in FIG. 1, the power conversion device 1 converts power input from an external power source into predetermined power and outputs the power to a load. Specifically, the power converter 1 converts AC power input from the AC power supply 100 into another AC power, and generates eight AC motors M1, M2, M3, M4, M5, M6, M7, and M8 (hereinafter referred to as “AC power”). To "AC motor M") to control the operation. That is, the power conversion device 1 is a motor control device capable of 8-axis control.

  Note that the number of controllable axes of the power conversion apparatus 1, that is, the number of motors (AC motors M in the above example) is not limited to eight, and may be other numbers. Further, the external power source is not limited to the AC power source, and may be a DC power source. Further, the load is not limited to the AC motor, and may be a DC motor. Moreover, the power converter device 1 is not limited to the case where it is a motor control device, but only needs to be a device that converts power. That is, the load is not limited to the motor, and may be another electronic device.

  The power converter 1 includes a diode module DM, four capacitors C1, C2, C3, C4 (hereinafter collectively referred to as “capacitor C”), eight power modules PM1, PM2, PM3, PM4, PM5, PM6, PM7, It has a plurality of electronic components including PM8 (hereinafter collectively referred to as “power module PM”), a regenerative resistor R which is an example of a resistor, and a switch Q.

  The diode module DM includes a diode, rectifies AC power (for example, three-phase AC power) input from the AC power supply 100, and outputs DC power to the DC buses P and N.

  The capacitors C1 to C4 are connected across the DC buses P and N, and smooth the DC voltage rectified by the diode module DM.

  Each of the power modules PM1 to PM8 includes a plurality of switching elements SW (only one is shown in FIG. 1) configured by semiconductor elements such as IGBTs. Each of the power modules PM1 to PM8 converts DC power into predetermined AC power (for example, three-phase AC power) and outputs the AC power to the AC motors M1 to M8. The power modules PM1 to PM8 generate heat when energized.

  The diode of the diode module DM, the capacitors C1 to C4, and the switching element SW of the power modules PM1 to PM8 constitute a power conversion circuit 10.

  A series circuit of the regenerative resistor R and the switch Q is connected between the DC buses P and N. The switch Q includes a semiconductor element such as a MOSFET, for example. When the switch Q is turned on, for example, when the AC motor M is suddenly decelerated or stopped, the regenerative power input from the AC motor M to the DC buses P and N is regenerated. It is made to be consumed by the resistance R. The regenerative resistor R consumes regenerative power when the switch Q is turned on. The regenerative resistor R generates heat when energized.

  The circuit configuration of the power conversion device 1 described above is merely an example, and a circuit configuration other than the above may be used. For example, the number of power modules PM is not limited to eight, and may be another number. In addition, the present invention is not limited to the case where two power modules PM are connected in parallel to one capacitor C. One power module PM is connected to one capacitor C, or three or more power modules PM are connected in parallel. May be connected. Further, the number of capacitors C is not limited to four, and may be other numbers. A reactor may be installed instead of or in addition to the capacitor C. Further, instead of or in addition to the regenerative resistor R, another resistor such as a dynamic brake may be installed.

<2. Example of structure of power conversion device>
Next, an example of the structure of the power conversion device 1 will be described with reference to FIGS. 2 and 3. 2, illustration of the upper plate portion of the casing of the power conversion device 1 is omitted, and illustration of the front plate portion of the casing is omitted in FIG. 3. In FIGS. 2 and 3, illustration of configurations other than the main part of the present embodiment is omitted as appropriate.

  As shown in FIG. 2 and FIG. 3, the power conversion device 1 has a substantially rectangular parallelepiped casing 2 that forms the outline thereof, the plate portion 21 of the casing 2 being the upper side, the plate portion 22 being the lower side, The part 23 is installed on the front side, the plate part 24 on the rear side, the plate part 25 on the left side, and the plate part 26 on the right side. Hereinafter, the upper plate portion 21 of the housing 2 is the “upper plate portion 21”, the lower plate portion 22 is the “lower plate portion 22”, the front plate portion 23 is the “front plate portion 23”, and the rear plate portion 22 is the rear plate portion 22. The plate portion 24 is also referred to as “rear plate portion 24”, the left plate portion 25 is also referred to as “left plate portion 25”, and the right plate portion 26 is also referred to as “right plate portion 26”. Hereinafter, in the power conversion device 1, the left-right direction is also referred to as the “width direction”, the up-down direction is also referred to as the “height direction”, and the front-back direction is also referred to as the “depth direction”.

  In addition, the shape of the housing | casing 2 is not limited to a substantially rectangular parallelepiped shape, Other shapes may be sufficient. The power converter 1 is oriented such that the plate portion 21 of the housing 2 is on the upper side, the plate portion 22 is on the lower side, the plate portion 23 is on the front side, the plate portion 24 is on the rear side, the plate portion 25 is on the left side, and the plate portion 26 is on the left side. The direction is not limited to the right side, but may be another direction.

  In the housing 2, a first substrate 30, four second substrates 40A, 40B, 40C, and 40D (hereinafter collectively referred to as “second substrate 40”), the diode module DM, capacitors C1 to C4, A plurality of electronic components including power modules PM1 to PM8, regenerative resistor R, and switch Q, four heat sinks 50A, 50B, 50C, and 50D (hereinafter collectively referred to as “heat sink 50”) and two fans 60A and 60B. (Hereinafter collectively referred to as “fan 60”). A wind tunnel 70 is formed in the housing 2. 2 and 3, the diode module DM, the capacitors C1 to C4, the regenerative resistor R, and the switch Q that are arranged at appropriate positions in the housing 2 are not shown.

(2-1. Example of first substrate)
The first substrate 30 is a single-sided substrate in which components are arranged only on one side. That is, as for the 1st board | substrate 30, the one side surface is the component surface 30a in which components are arrange | positioned, and the other side surface is the solder surface 30b in which soldering is performed. The first substrate 30 has a substantially rectangular shape, and the dimension in the plate surface direction is substantially equal to the inner dimension in the surface direction perpendicular to the height direction of the housing 2. The first substrate 30 is fixed to the housing 2 at the lower portion of the housing 2 such that the plate surface direction is perpendicular to the height direction, the component surface 30a is the upper surface, and the solder surface 30b is the lower surface. Yes.

  The orientation and position of the first substrate 30 are limited to the orientation in which the plate surface direction is perpendicular to the height direction, the component surface 30a is the upper surface, the solder surface 30b is the lower surface, and the lower portion in the housing 2. Other orientations and other positions may be used. Moreover, the shape of the 1st board | substrate 30 is not limited to a substantially rectangular shape, Other shapes may be sufficient. The first substrate 30 is not limited to a single substrate, and may be composed of a plurality of substrates. Further, the dimension in the plate surface direction of the first substrate 30 is not limited to the case where it is substantially equal to the inner dimension in the surface direction perpendicular to the height direction of the housing 2, and may be smaller than the inner dimension. . The first substrate 30 is not limited to a single-sided substrate, and may be a double-sided substrate in which components are arranged on both sides, a multilayer substrate in which a plurality of substrates are stacked, or the like.

(2-2. Example of second substrate)
The second substrates 40 </ b> A to 40 </ b> D are erected on the component surface 30 a of the first substrate 30 along the plate surface direction of the first substrate 30. Specifically, the second substrates 40 </ b> A to 40 </ b> D are provided with four mounted portions (for example, connectors) (not shown) provided side by side along the plate surface direction of the first substrate 30 on the component surface 30 a of the first substrate 30. For example, each is mounted in a state where it stands vertically with respect to the first substrate 30.

  More specifically, each of the second substrates 40A to 40D has a substantially rectangular shape, and each dimension in the longitudinal direction is substantially equal to the inner dimension in the depth direction of the casing 2, and each dimension in the short direction is the casing. It is almost equal to half the inner dimension in the height direction of 2. The second substrates 40A to 40D are arranged such that each longitudinal direction is along the depth direction and each short direction is along the height direction, and the first substrate 30 is separated from each other with a predetermined gap in the width direction. Are arranged parallel to each other on the right side. That is, the second substrates 40 </ b> A to 40 </ b> D are arranged such that each standing direction is a height direction and each plate thickness direction is a width direction. At this time, each of the second substrates 40A, 40B, 40C, and 40D has a surface 41, 41, 41, 41 on one side as a right surface and a surface 42, 42, 42, 42 on the other side as a left surface. Have been placed. Hereinafter, the surface 41 of the second substrates 40A to 40D is also referred to as a “right surface 41”, and the surface 42 is also referred to as a “left surface 42”.

  The orientation of the second substrates 40A to 40D is limited to the orientation in which each longitudinal direction is along the depth direction, each transverse direction is along the height direction, each surface 41 is the right surface, and each surface 42 is the left surface. It may be in other orientations. The positions of the second substrates 40A to 40D are not limited to the right side of the first substrate 30 and may be other positions. Further, the second substrates 40A to 40D may not be erected in parallel. Further, the shapes of the second substrates 40A to 40D are not limited to a substantially rectangular shape, and may be other shapes. Moreover, the dimension of the longitudinal direction of 2nd board | substrate 40A-40D is not limited to when it is substantially equal to the internal dimension of the depth direction of the housing | casing 2, and may be smaller than the said internal dimension. Further, the dimension in the short direction of the second substrates 40A to 40D is not limited to the case where it is substantially equal to half of the inner dimension in the height direction of the housing 2, and may be smaller than half of the inner dimension. It can be big or big. In addition, the second substrates 40A to 40D are not limited to the case where the second substrates 40A to 40D are mounted in a standing state on the mounted portion, but may be fixed to the first substrate 30 while standing through an appropriate support member. Good. The second substrates 40 </ b> A to 40 </ b> D are not limited to be erected on the component surface 30 a of the first substrate 30, and may be erected on the solder surface 30 b of the first substrate 30. Further, the number of the second substrates 40 is not limited to four, and may be one or three or more.

(2-3. Examples of wind tunnels and fans)
The wind tunnel 70 is formed above the second substrates 40 </ b> A to 40 </ b> D in the housing 2, that is, near the upper right. Specifically, two partition plates 7 and 9 are arranged in the housing 2. The partition plate 7 has a substantially rectangular shape, the dimension in the longitudinal direction is substantially equal to the inner dimension in the depth direction of the casing 2, and the dimension in the short direction is more than half of the inner dimension in the width direction of the casing 2. large. The partition plate 7 is separated from the upper plate portion 21 with a predetermined gap in the height direction from the upper plate portion 21 while the longitudinal direction is along the depth direction and the short side direction is along the width direction. It arrange | positions between 2nd board | substrates 40A-40D. The partition plate 9 has a substantially rectangular shape, and its longitudinal dimension is substantially equal to the inner dimension in the depth direction of the casing 2, and its shorter dimension is half the inner dimension in the height direction of the casing 2. Is also a little small. The partition plate 9 has a longitudinal direction along the depth direction and a short side direction along the height direction, and is spaced apart from the right plate portion 26 with a predetermined gap in the width direction. Are disposed between the upper plate portion 21 and the partition plate 7. And the space 71 (FIG. 2) enclosed by the upper board part 21, the partition board 7, the front board part 23, the rear board part 24, the partition board 9, and the right board part 26 in the housing | casing 2. FIG. And a space surrounded by an alternate long and short dash line in FIG. 3) is formed as a wind tunnel 70.

  The wind tunnel 70 includes two ventilation openings 72 and 74. The ventilation opening 72 is formed between the upper plate portion 21 and the partition plate 7 in the height direction of the front plate portion 23 and between the partition plate 9 and the right plate portion 26 in the width direction, that is, closer to the upper right. ing. The vent hole 74 is formed between the upper plate portion 21 and the partition plate 7 in the height direction of the rear plate portion 24 and between the partition plate 9 and the right plate portion 26 in the width direction, that is, on the upper right side. ing. That is, the vent holes 72 and 74 are disposed to face each other in the depth direction, and the wind tunnel 70 is formed to extend in the depth direction.

  A plurality of ventilation openings may be formed in the front plate portion 23 and the rear plate portion 24. Further, instead of or in addition to at least one of the front plate portion 23 and the rear plate portion 24, a vent hole may be formed in another plate portion of the housing 2. Further, the position of the wind tunnel 70 in the housing 2 is not limited to the upper right side, and may be another position.

  The fans 60A and 60B are arranged inside the ventilation hole 74 and blow air to the wind tunnel 70 (space 71) including at least a part (details will be described later) of each of the heat sinks 50A to 50D. Specifically, the fans 60A and 60B are exhaust fans, and the air sucked into the wind tunnel 70 (inside the casing 2) from the air vent 72 with the air vent 72 as the air inlet and the air outlet 74 as the air outlet. The air is exhausted from the ventilation port 74 to the outside of the wind tunnel 70 (outside the casing 2). Therefore, when the fans 60 </ b> A and 60 </ b> B send air to the wind tunnel 70, the air mainly flows from the vent 72 to the vent 74 in the wind tunnel 70.

  Fans 60A and 60B are not limited to exhaust fans, and may be intake fans. Further, the fans 60 </ b> A and 60 </ b> B are not limited to being installed inside the ventilation opening 74, and may be installed outside the ventilation opening 74. Moreover, the number of fans installed in the ventilation opening is not limited to two, and may be other numbers. In addition, for example, when it is not necessary to perform forced cooling using a fan because the heat generation amount of a plurality of electronic components arranged on the second substrate 40 is not so large, the fan need not be installed.

(2-4. Examples of power module and heat sink)
In addition, two power modules PM and one heat sink 50 that cools the two power modules PM are disposed on each of the second substrates 40A to 40D. That is, the power module PM1 and PM2 and the heat sink 50A for cooling the power modules PM1 and PM2 are arranged on the second substrate 40A. Further, the power modules PM3 and PM4 and the heat sink 50B for cooling the power modules PM3 and PM4 are arranged on the second substrate 40B. Further, the power modules PM5 and PM6 and the heat sink 50C for cooling the power modules PM5 and PM6 are disposed on the second substrate 40C. Further, the power modules PM7 and PM8 and the heat sink 50D for cooling the power modules PM7 and PM8 are arranged on the second substrate 40D.

  The power modules PM1 and PM2 are arranged side by side along the plate surface direction of the first substrate 30, that is, the depth direction, on the same direction side surface of the second substrate 40A, that is, the right surface 41, and connected to the second substrate 40A. Yes. Similarly, the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8 are arranged along the depth direction on the right surface 41 of the second substrates 40B, 40C, and 40D, and the second substrates 40B, 40C, and Connected to 40D. That is, the power modules PM1 to PM8 correspond to an example of an electronic component that forms a power conversion circuit and generates heat when energized.

  Specifically, the power modules PM1 and PM2 are separated from the first substrate 30 with respect to the upper end 44 side that is the front end in the standing direction rather than the lower end 43 that is the base end in the standing direction of the second substrate 40A. Is arranged. More specifically, the power modules PM1 and PM2 are disposed near the upper end 44 of the second substrate 40A. Similarly, the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8 are disposed near the upper ends 44, 44, and 44 of the second substrates 40B, 40C, and 40D.

  In addition, arrangement | positioning of power module PM1-PM8 is not limited to the said arrangement | positioning, Other arrangement | positioning may be sufficient. For example, the power modules PM1 and PM2 are not limited to the case where the power modules PM1 and PM2 are disposed near the upper end 44 of the second substrate 40A, but are disposed at the center in the height direction of the second substrate 40A or near the lower end 43. (Power modules PM3 and PM4, power modules PM5 and PM6, and power modules PM7 and PM8 are also the same). Further, the power modules PM1 and PM2 are not limited to being arranged on the right surface 41 of the second substrate 40A, but may be arranged on the left surface 42 of the second substrate 40A (power modules PM3 and PM4, power The same applies to modules PM5 and PM6 and power modules PM7 and PM8). Moreover, the combination of the power modules PM arranged on the second substrates 40A to 40D is not limited to the above combination, and may be another combination. The number of power modules PM arranged on the second substrates 40A to 40D is not limited to two, and may be one or three or more.

  Moreover, the electronic component which comprises the power converter device arrange | positioned on 2nd board | substrates 40A-40D and generate | occur | produces heat | fever at the time of electricity supply is not limited to power module PM, Other electronic components may be sufficient.

  The heat sinks 50A to 50D are disposed along the second substrates 40A to 40D on the surface on which the power module PM of the second substrates 40A to 40D is disposed, that is, on the right surface 41 side, via support members (not shown). It is fixed to the housing 2. A part of each of the heat sinks 50A to 50D is disposed above the second substrates 40A to 40D. Specifically, each of the heat sinks 50A to 50D has one heat sink base and a plurality of fins. That is, the heat sink 50A has a heat sink base 51A and a plurality of fins 52A. The heat sink 50B has a heat sink base 51B and a plurality of fins 52B. The heat sink 50C includes a heat sink base 51C and a plurality of fins 52C. The heat sink 50D has a heat sink base 51D and a plurality of fins 52D. Hereinafter, the heat sink bases 51A to 51D are collectively referred to as “heat sink base 51”, and the fins 52A to 52D are collectively referred to as “fins 52”.

  The heat sink bases 51 </ b> A to 51 </ b> D have a substantially rectangular shape, and each dimension in the longitudinal direction is smaller than the dimension in the depth direction of the second substrates 40 </ b> A to 40 </ b> D, and each dimension in the short direction is the height direction of the partition plate 9. Is larger than the dimensions of The heat sink bases 51A to 51D are arranged on the right surface 41 side of the second substrates 40A to 40D so that the respective longitudinal directions are along the depth direction and the short sides are along the height direction. They are arranged in parallel.

  Specifically, the heat sink bases 51A, 51B, 51C and 51D are formed by arranging each of the four through holes 7a, 7b, 7c and 7d formed on the partition plate 7 along the plate surface direction of the partition plate 7. It extends in parallel with the height direction so as to penetrate. And heat sink base 51A-51D is arrange | positioned in the position where the lower part which is each extending direction one side overlaps with 2nd board | substrate 40A-40D in a height direction. The heat sink bases 51 </ b> A to 51 </ b> D are arranged such that the upper portion on the other side in the extending direction is above the second substrates 40 </ b> A to 40 </ b> D, that is, in the wind tunnel 70. At this time, the heat sink bases 51 </ b> A to 51 </ b> D are arranged so that the surface on the side where the fins 52 are disposed is the left surface, and the surface on the side where the fins 52 are not disposed is the right surface. Hereinafter, the surface on the side where the fins 52 of the heat sink bases 51 </ b> A to 51 </ b> D are disposed is also referred to as “left surface”, and the surface on which the fins 52 are not disposed is also referred to as “right surface”.

  As described above, the power modules PM1 and PM2 disposed near the upper end 44 of the second substrate 40A are installed on the lower side of the left surface of the heat sink base 51A, that is, the portion overlapping the second substrate 40A in the height direction. Yes. That is, the power modules PM1 and PM2 are disposed between the second substrate 40A and the heat sink base 51A in the width direction, and the heat sink base 51A thermally connects the heat sink 50A and the power modules PM1 and PM2. The plurality of fins 52 </ b> A are erected on the upper side of the heat sink base 51 </ b> A, i.e., in a portion disposed in the wind tunnel 70. The plurality of fins 52A protrude from the heat sink base 51A in the direction in which the power module PM is arranged with respect to the heat sink base 51A, that is, to the left. That is, the power modules PM1 and PM2 are disposed between a part of the heat sink 50A, that is, between the fins 52A and the first substrate 30. Specifically, the power modules PM1 and PM2 include a portion above the lower end 43 of the second substrate 40A, that is, a portion near the upper end 44, and a portion of the heat sink 50A, that is, a portion below the heat sink base 51A. They are arranged at overlapping positions in the height direction.

  Similarly, in the heat sink base 51B, the power modules PM3 and PM4 disposed near the upper end 44 of the second substrate 40B as described above are installed in a portion overlapping with the second substrate 40B on the left side in the height direction. Yes. That is, the power modules PM3 and PM4 are disposed between the second substrate 40B and the heat sink base 51B in the width direction, and the heat sink base 51B thermally connects the heat sink 50B and the power modules PM3 and PM4. Further, the plurality of fins 52 </ b> B protruding from the heat sink base 51 </ b> B toward the left are provided upright at a portion of the heat sink base 51 </ b> B disposed in the wind tunnel 70. That is, the power modules PM3 and PM4 are arranged at positions overlapping with the portion near the upper end 44 of the second substrate 40B and the lower portion of the heat sink base 51B in the height direction.

  Similarly, in the heat sink base 51C, the power modules PM5 and PM6 disposed near the upper end 44 of the second substrate 40C as described above are installed in a portion overlapping the second substrate 40C on the left side in the height direction. Yes. That is, the power modules PM5 and PM6 are disposed between the second substrate 40C and the heat sink base 51C in the width direction, and the heat sink base 51C thermally connects the heat sink 50C and the power modules PM5 and PM6. Further, the plurality of fins 52 </ b> C projecting leftward from the heat sink base 51 </ b> C are provided upright at a portion of the heat sink base 51 </ b> C disposed in the wind tunnel 70. That is, the power modules PM5 and PM6 are arranged at positions overlapping in the height direction with the portion near the upper end 44 of the second substrate 40C and the lower portion of the heat sink base 51C.

  Similarly, in the heat sink base 51D, the power modules PM7 and PM8 disposed near the upper end 44 of the second substrate 40D as described above are installed in a portion overlapping with the second substrate 40D on the left side in the height direction. Yes. That is, the power modules PM7 and PM8 are disposed between the second substrate 40D and the heat sink base 51D in the width direction, and the heat sink base 51D thermally connects the heat sink 50D and the power modules PM7 and PM8. In addition, the plurality of fins 52D projecting leftward from the heat sink base 51D are provided upright at a portion of the heat sink base 51D disposed in the wind tunnel 70. That is, the power modules PM7 and PM8 are arranged at positions overlapping in the height direction with the portion near the upper end 44 of the second substrate 40D and the lower portion of the heat sink base 51D.

  At this time, a heat pipe may be embedded in the heat sink bases 51A to 51D. When a heat pipe is embedded in the heat sink bases 51A to 51D, the heat of the power module PM can be efficiently diffused by the heat sinks 50A to 50D.

  In the present embodiment, the heat sink bases 51A to 51B correspond to an example of a heat conducting member.

  In addition, the shape and arrangement | positioning of heat sink 50A-50D are not limited to the said shape and arrangement | positioning, Other shapes and arrangement | positioning may be sufficient. For example, the fin 52A is not limited to the case where the fin 52A protrudes from the heat sink base 51A toward the heat sink base 51A in the direction in which the power module PM is disposed (leftward in the above example). For example, the fins 52A may protrude from the heat sink base 51A in the direction opposite to the direction in which the power module PM is disposed with respect to the heat sink base 51A (the same applies to the fins 52B to 52D). Further, the heat sink 50A is not limited to the case where a part of the heat sink 50A is disposed above the second substrate 40A, and the entire heat sink 50A may be disposed above the second substrate 40A (heat sinks 50B to 50B). The same applies to 50D). In this case, the power modules PM1, PM2 arranged on the right surface 41 of the second substrate 40A and the heat sink base of the heat sink 50A may be thermally connected by a heat conducting member such as a heat pipe. The heat sink 50A is not limited to the case where at least a part of the heat sink 50A is disposed above the second substrate 40A. The upper end of the heat sink 50A is equal to the upper end of the second substrate 40A in the height direction or the upper end. The heat sinks 50B to 50D may be disposed on the lower side. Further, the heat sinks 50A to 50D are not limited to the case where the heat sinks 50A to 50D are disposed on the surface (the right surface 41 in the above example) on which the power module PM of the second substrates 40A to 40D is disposed. The 40D power module PM may be disposed on the surface side where the power module PM is not disposed.

  The power modules PM1 and PM2 are not limited to the case where the power modules PM1 and PM2 are disposed between the second substrate 40A and the heat sink base 51A in the width direction. The power modules PM1 and PM2 are attached to the heat sink base 51A so as to sandwich the second substrate 40A therebetween. It may be installed (the same applies to the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8). In addition, the power modules PM1 and PM2 include a portion above the lower end 43 of the second substrate 40A (a portion closer to the upper end 44 in the above example) and a part of the heat sink 50A (in the above example, below the heat sink base 51A). It is not limited to the case where it is arranged at a position overlapping with the portion) in the height direction. For example, the power modules PM1 and PM2 are disposed at positions that do not overlap in the height direction with a portion above the lower end 43 of the second substrate 40A and a part of the heat sink 50A, that is, above the second substrate 40A in the height direction. (The same applies to the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8). Further, the power modules PM1 and PM2 are not limited to the case where they are arranged between a part of the heat sink 50A (fin 52A in the above example) and the first substrate 30, but the entire heat sink 50A (heat sink base) And fins) and the first substrate 30 (the power modules PM3 and PM4, power modules PM5 and PM6, and power modules PM7 and PM8 are also the same). The power modules PM1 and PM2 may not be disposed between the heat sink 50A and the first substrate 30 (the same applies to the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8).

  Further, the power modules PM1 to PM8 are not limited to the case where they are arranged outside the wind tunnel 70, and may be arranged in the wind tunnel. In this case, the wind tunnel may be formed so as to include the power modules PM1 to PM8 in the housing 2. Further, the number of sets of the second substrate 40, the power module PM, and the heat sink 50 that are erected on the first substrate 30 is not limited to four sets, but may be other numbers. Further, at least a part of the first substrate 30 and the second substrates 40A to 40D may be used as a member constituting the wind tunnel. In this case, since at least a part of the members (wind guide plate, partition plate, etc.) constituting the wind tunnel can be omitted, the power converter 1 can be reduced in size and the cost can be reduced.

<3. Example of power converter manufacturing method>
Next, an example of the manufacturing method of the power converter device 1 having the above structure will be described.

  In the manufacturing process (assembly process) of the power conversion device 1, the power modules PM1 and PM2 are arranged and fixed along the length direction of the heat sink base 51A in the lower part of the left surface of the heat sink base 51A of the heat sink 50A. Similarly, the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8 are fixed to the heat sinks 50B, 50C, and 50D. At this time, thermal grease or a thermal sheet having good thermal conductivity may be interposed between the heat sink 50 and the power module PM.

  Thereafter, the power modules PM1 and PM2 fixed to the heat sink 51A are placed near the upper end 44 of the left surface 41 of the second substrate 40A along the longitudinal direction of the second substrate 40A (the direction corresponding to the plate surface direction of the first substrate 30). Are arranged side by side and connected to the second substrate 40A. Similarly, power modules PM3 and PM4, power modules PM5 and PM6, and power modules PM7 and PM8 are arranged side by side along the longitudinal direction of the second substrates 40B, 40C, and 40D on the second substrates 40B, 40C, and 40D, Connect to the second substrates 40B, 40C, 40D.

  Then, the second substrates 40A to 40D to which the heat sinks 50A to 50D and the power module PM are attached are respectively erected vertically to the first substrate 30, for example, on each of the four non-mounting portions of the component surface 30a of the first substrate 30. Wear in the state.

  Further, although not specifically described here, components other than those described above arranged in the housing 2 are also arranged as appropriate. And the power converter device 1 is completed by arrange | positioning all the components arrange | positioned at the housing | casing 2. FIG.

  In addition, the content of the manufacturing method of the power converter device 1 demonstrated above is an example to the last, and may be content other than the above. For example, the manufacturing process according to the method for manufacturing the power conversion device 1 is not limited to the procedure described above, and the addition / deletion of the procedure, the change of the order, etc. are performed without departing from the spirit and technical idea. May be.

<4. Examples of effects according to this embodiment>
As described above, in the power conversion device 1 of the present embodiment, the electronic component (the power module PM in the above example) that configures the power conversion circuit 10 and generates heat when energized is erected on the first substrate 30. The heat sink 50 disposed on the second substrate 40 and cooling the power module PM is disposed along the second substrate 40 on the side of the second substrate 40 where the power module PM is disposed. Thereby, it is possible to shorten the dimension of the power converter device 1 in the width direction by partially disposing the heat sink 50 and the power module PM in the width direction. Therefore, the power converter 1 can be reduced in size in the width direction. In addition, since the power module PM can be disposed apart from the first substrate 30, the influence of heat on the mounted components and the like of the first substrate 30 can be reduced.

  In the present embodiment, in particular, the power module PM is disposed on each of the second substrates 40A to 40D provided side by side with the first substrate 30, and the heat sinks 50A to 50D are disposed on each of the second substrates 40A to 40D. Thereby, the dimension of the width direction of the power converter device 1 can be shortened compared with the case where several power modules PM are arrange | positioned along with the width direction (plate thickness direction of 2nd board | substrate 40A-40D), for example. Further, by storing the heat sinks 50A to 50D in one wind tunnel 70, the fans 60A and 60B can simultaneously and efficiently blow the air to the heat sinks 50A to 50D. Therefore, the power modules disposed on the second substrates 40A to 40D, respectively. PM can be simultaneously and efficiently cooled.

  In the present embodiment, in particular, a plurality of power modules PM are arranged side by side along the depth direction on the right surface 41 of the second substrate 40. Thereby, the number of power modules PM can be increased without enlarging the power converter device 1 in the width direction.

  In the present embodiment, in particular, the power module PM is disposed between a part of the heat sinks 50 </ b> A to 50 </ b> D and the first substrate 30. Accordingly, since the heat sinks 50A to 50D and the power module PM can be partially overlapped in the width direction, the interval between the second substrates 40 can be shortened and the dead space between the second substrates 40 can be reduced. be able to. Therefore, the power converter 1 can be further downsized in the width direction. In addition, since the wind escape path (the gap through which the wind with little contribution to cooling flows) can be reduced, the ventilation of the fans 60A and 60B can be used effectively, and the cooling efficiency of the power module PM can be improved.

  In the present embodiment, in particular, the heat sinks 50A to 50D are arranged so that a part thereof is on the upper side of the second substrates 40A to 40D, and the power module PM is arranged to be lower than the lower end 43 of the second substrates 40A to 40D. It arrange | positions in the position which overlaps with an upper part and some heat sinks 50A-50D in a height direction. Thereby, it is possible to reduce the influence of heat (such as a decrease in reliability) on the mounted components of the first substrate 30 due to the heat generated by the power module PM.

  Further, in the present embodiment, in particular, the heat sinks 50A to 50D extend along the second substrates 40A to 40D and thermally conductive members (heat sink bases 51A to 51D in the above example) that thermally connect the power module PM are used. Have. Thereby, while shortening the space | interval between the 2nd board | substrates 40, the heat | fever of power module PM can be efficiently spread | diffused to heat sink 50A-50D, and power module PM can be cooled efficiently.

  In the present embodiment, in particular, the power module PM is disposed between the second substrates 40A to 40D and the heat sink bases 51A to 51D in the width direction. Thus, the power module PM and the heat sink bases 51 </ b> A to 51 </ b> D can be directly contacted without interposing another member (second substrate 40 </ b> A to 40 </ b> D, etc.), so It can be efficiently diffused to 50A to 50D.

  In the present embodiment, in particular, the heat sink bases 51A to 51D of the heat sinks 50A to 50D are arranged along the second substrates 40A to 40D, and the plurality of fins 52A to 52D are connected to the heat sink base 51A from the heat sink bases 51A to 51D. It is made to protrude toward the direction (left in the above example) in which the power module PM is arranged with respect to ˜51D. Thereby, since the duplication area | region of heat sink 50A-50D and power module PM in the width direction can be increased, the space | interval between the 2nd board | substrates 40 can be shortened more, and the power converter device 1 can be further reduced in the width direction.

  In the present embodiment, in particular, when it is not necessary to separately prepare a heat conducting member having particularly good heat conductivity, the heat conducting members are heat sink bases 51A to 51D extending along the height direction. . Since the heat sink bases 51A to 51D are extended to thermally connect the power module PM and the heat sinks 50A to 50D, there is no need to prepare a separate member. Therefore, the power converter device 1 can be reduced in size and the cost can be reduced.

  In the present embodiment, in particular, the fans 60A and 60B send air to the heat sinks 50A to 50D. Thereby, since several power module PM arranged in parallel by the depth direction can be cooled simultaneously and efficiently, cooling efficiency can be improved.

  In the present embodiment, in particular, an electronic component that constitutes the power conversion circuit 10 and generates heat when energized is a power module PM that includes a switching element SW that constitutes the power conversion circuit 10. The power module PM is an electronic component that generates a relatively large amount of heat in the power conversion device 1. Since the power module PM can be disposed away from the first substrate 30 using the second substrates 40A to 40D, the plurality of power modules PM can be efficiently cooled while reducing the influence of heat on the first substrate 30. be able to.

<5. Modified example>
In addition, embodiment is not limited to the said content, A various deformation | transformation is possible within the range which does not deviate from the meaning and technical idea. Hereinafter, such modifications will be sequentially described. In the following modifications and the like, portions different from the above embodiment will be mainly described. In addition, components having substantially the same functions as those of the above-described embodiment are represented by the same reference numerals in principle, and repeated description of these components will be omitted as appropriate.

(5-1. When the second substrate and the heat sink are thermally connected by a heat pipe)
Hereinafter, with reference to FIG. 4, a difference from the above embodiment in the structure of the power conversion device of the present modification will be described.

  As shown in FIG. 4, the present modification is different from the above embodiment in that heat sinks 50A ′, 50B ′, 50C ′, 50D ′ are provided in place of the heat sinks 50A, 50B, 50C, 50D described above. . Hereinafter, the heat sinks 50A ′ to 50D ′ are collectively referred to as “heat sink 50 ′”.

  The heat sink 50A ′ is different from the heat sink 50A in that a heat sink base 51A ′ is provided instead of the heat sink base 51A, and a heat pipe 53A is newly provided. The heat sink 50B ′ differs from the heat sink 50B in that a heat sink base 51B ′ is provided instead of the heat sink base 51B, and a heat pipe 53B is newly provided. The heat sink 50C ′ is different from the heat sink 50C in that a heat sink base 51C ′ is provided instead of the heat sink base 51C, and a heat pipe 53C is newly provided. The heat sink 50D ′ is different from the heat sink 50D in that a heat sink base 51D ′ is provided instead of the heat sink base 51D, and a heat pipe 53D is newly provided. Hereinafter, the heat sink bases 51A ′ to 51D ′ are collectively referred to as “heat sink base 51 ′”, and the heat pipes 53A to 53D are collectively referred to as “heat pipe 53”.

  The heat sink bases 51A 'to 51D' are obtained by making the dimensions of the heat sink bases 51A to 51D shorter than the dimensions of the partition plate 9 in the height direction, and all of them are the second substrates 40A to 40D. It is arranged on the upper side, that is, in the aforementioned wind tunnel 70.

  For example, a plurality of the heat pipes 53A to 53D are installed on the right surface of the heat sink bases 51A ′ to 51D ′. The heat pipes 53A, 53B, 53C, 53D are respectively formed in the four through holes 7a ', 7b', 7c ', 7d' formed on the partition plate 7 'along the plate surface direction of the partition plate 7'. Is extended in parallel with the second substrates 40A, 40B, 40C, and 40D. And as for heat pipe 53A-53D, each lower part is arrange | positioned in the position which overlaps with 2nd board | substrate 40A-40D in a height direction, and each upper part is above 2nd board | substrate 40A-40D, That is, it is arranged in the wind tunnel 70.

  As described above, the power modules PM1 and PM2 disposed near the upper end 44 of the second substrate 40A are installed on the lower side of the left surface of the heat pipe 53A, that is, in the portion overlapping with the second substrate 40A in the height direction. Yes. That is, the power modules PM1 and PM2 are arranged between the second substrate 40A and the heat pipe 53A in the width direction, and the heat pipe 53A thermally connects the heat sink 50A ′ and the power modules PM1 and PM2. .

  Similarly, in the heat pipe 53B, the power modules PM3 and PM4 arranged near the upper end 44 of the second substrate 40B as described above are installed in a portion overlapping with the second substrate 40B on the left side in the height direction. Yes. That is, the power modules PM3 and PM4 are arranged between the second substrate 40B and the heat pipe 53B in the width direction, and the heat pipe 53B thermally connects the heat sink 50B ′ and the power modules PM3 and PM4. .

  Similarly, in the heat pipe 53C, the power modules PM5 and PM6 arranged near the upper end 44 of the second substrate 40C are installed in the portion overlapping the second substrate 40C on the left side in the height direction as described above. Yes. That is, the power modules PM5 and PM6 are arranged between the second substrate 40C and the heat pipe 53C in the width direction, and the heat pipe 53C thermally connects the heat sink 50C ′ and the power modules PM5 and PM6. .

  Similarly, in the heat pipe 53D, the power modules PM7 and PM8 disposed near the upper end 44 of the second substrate 40D as described above are installed in a portion overlapping the second substrate 40D on the left side in the height direction. Yes. That is, the power modules PM7 and PM8 are arranged between the second substrate 40D and the heat pipe 53D in the width direction, and the heat pipe 53D thermally connects the heat sink 50D ′ and the power modules PM7 and PM8. .

  Further, the plurality of fins 52A are erected on the heat sink base 51A ′. The plurality of fins 52A protrude from the heat sink base 51A ′ toward the heat pipe 53A in the direction in which the power module PM is arranged, that is, to the left. That is, the power modules PM1 and PM2 are arranged at positions overlapping in the height direction with a portion near the upper end 44 of the second substrate 40A and a portion of the heat sink 50A ′, that is, a lower portion of the heat pipe 53A. Yes.

  Similarly, the plurality of fins 52B projecting leftward from the heat sink base 51B ′ are erected on the heat sink base 51B ′. That is, the power modules PM3 and PM4 are arranged at positions overlapping in the height direction with the portion near the upper end 44 of the second substrate 40B and the lower portion of the heat pipe 53B.

  Similarly, the plurality of fins 52C projecting leftward from the heat sink base 51C ′ are erected on the heat sink base 51C ′. That is, the power modules PM5 and PM6 are arranged at positions overlapping in the height direction with the portion near the upper end 44 of the second substrate 40C and the lower portion of the heat pipe 53C.

  Similarly, the plurality of fins 52D projecting leftward from the heat sink base 51D 'are erected on the heat sink base 51D'. That is, the power modules PM7 and PM8 are arranged at positions overlapping in the height direction with the portion near the upper end 44 of the second substrate 40D and the lower portion of the heat pipe 53D.

  In this modification, the heat pipes 53A to 53D correspond to an example of a heat conducting member.

  Note that the shapes and arrangements of the heat sinks 50A ′ to 50D ′ are not limited to the above shapes and arrangements, and may be other shapes and arrangements. For example, the heat pipe 53A is not limited to being installed on the right side of the heat sink base 51A ′, but may be installed on the left side of the heat sink base 51A ′ or embedded in the heat sink base 51A ′ (heat The same applies to the pipes 53B to 53D). Further, the fin 52A is not limited to the case where the fin 52A protrudes from the heat sink base 51A ′ toward the heat pipe 53A in the direction in which the power module PM is disposed (leftward in the above example). For example, the fin 52A may protrude from the heat sink base 51A ′ in the direction opposite to the direction in which the power module PM is disposed with respect to the heat pipe 53A (the same applies to the fins 52B to 52D).

  The power modules PM1 and PM2 are not limited to the case where the power modules PM1 and PM2 are disposed between the second substrate 40A and the heat pipe 53A in the width direction. The power modules PM1 and PM2 are connected to the heat pipe 53A so as to sandwich the second substrate 40A. It may be installed (the same applies to the power modules PM3 and PM4, the power modules PM5 and PM6, and the power modules PM7 and PM8).

  Further, the heat conducting member is not limited to the heat pipe, and may be another member as long as it is a member that can thermally connect the power module.

  Also in this modified example described above, the same effect as in the above embodiment can be obtained.

  In addition to those already described above, the methods according to the above-described embodiment and its modifications may be used in appropriate combination.

  In addition, although not illustrated one by one, the above-described embodiment and its modified examples are implemented with various modifications within a range not departing from the gist thereof.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Power converter circuit 30 1st board | substrate 40A-D 2nd board | substrate 41 Right side (an example of the surface of the same direction side)
43 Lower end (an example of the base end in the standing direction)
44 Top (an example of the tip in the standing direction)
50A to D heat sink 50A 'to D' heat sink 51A to D heat sink base (an example of a heat conduction member)
51A ′ to D ′ Heat sink base 52A to D Fins 53A to D Heat pipe (an example of a heat conduction member)
60A, B Fan PM1-8 Power module (an example of an electronic component that forms a power conversion circuit and generates heat when energized)
SW switching element

Claims (12)

A power conversion device for converting power,
A first substrate;
A second substrate erected on the first substrate;
An electronic component that is disposed on one surface in the plate thickness direction of the second substrate , constitutes a power conversion circuit, and generates heat when energized;
A heat sink that is disposed along the second substrate on the one side in the plate thickness direction of the second substrate and that cools the electronic component disposed on the surface on the one side. Conversion device. The second substrate is
A plurality of the first substrates are erected along the plate surface direction of the first substrate,
The electronic component is
Arranged on each of the plurality of second substrates,
The heat sink is
2. The power conversion device according to claim 1, wherein the electronic component is disposed for each of the second substrates and cools the electronic component disposed for each of the second substrates. The electronic component is
The power converter according to claim 1, wherein a plurality of the second substrates are arranged side by side along the plate surface direction of the first substrate on the one surface of the second substrate. The electronic component is
4. The power conversion device according to claim 1, wherein the power conversion device is disposed between at least a part of the heat sink and the first substrate. 5. The heat sink is
The at least part of the second substrate is disposed closer to the front end side in the standing direction of the second substrate than the second substrate;
The electronic component is
5. The device according to claim 4, wherein the second substrate is disposed at a position overlapping with a portion of the distal end side with respect to a base end in a standing direction of the second substrate and a part of the heat sink in a standing direction of the second substrate. power conversion device. The heat sink is
6. The power conversion device according to claim 4, further comprising a heat conduction member that extends along the second substrate and thermally connects the electronic component. The electronic component is
Power converter according to claim 6, characterized in that disposed between the heat conductive member and the second substrate in the thickness direction of the second substrate. The heat sink is
A heat sink base disposed along the second substrate;
The power conversion device according to claim 7, further comprising: a plurality of fins protruding from the heat sink base in a direction in which the electronic component is disposed with respect to the heat conducting member. The heat conducting member is
The heat sink base is extended along the standing direction of the second substrate, the electronic component is installed on one side in the extending direction, and the plurality of fins are installed on the other side in the extending direction. The power conversion device according to claim 8. The power converter according to any one of claims 1 to 9, further comprising a fan for blowing air to the heat sink. The electronic component is
The power conversion device according to any one of claims 1 to 10, wherein the power conversion device is a power module including a switching element constituting the power conversion circuit. A method for manufacturing a power conversion device, comprising: a first substrate; a second substrate mounted on the first substrate; an electronic component that forms a power conversion circuit and generates heat when energized; and a heat sink that cools the electronic component. ,
Fixing the electronic component to the heat sink;
The heat sink for cooling the electronic component disposed on the one surface is disposed so that the electronic component is disposed on one surface in the thickness direction of the second substrate. Disposing on the one side in the direction ;
Mounting the second substrate upright on the first substrate;
The manufacturing method of the power converter device characterized by having.

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