CN205070761U - Power conversion device - Google Patents
Power conversion device Download PDFInfo
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- CN205070761U CN205070761U CN201520755285.XU CN201520755285U CN205070761U CN 205070761 U CN205070761 U CN 205070761U CN 201520755285 U CN201520755285 U CN 201520755285U CN 205070761 U CN205070761 U CN 205070761U
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Abstract
The utility model provides a power conversion device makes power conversion device miniaturized on width direction. Power conversion device (1) has: the 1st base plate (30), the 2nd base plate (40A-40D), they are erect and set up in the 1st base plate (30), power module (PM), it disposes in the 2nd base plate (40A-40D), constitutes power conversion circuit (10) and generates heat when the circular telegram, and radiator (50A-50D), they are along the 2nd base plate (40A-40D) and dispose in one side that disposes power module (PM) of the 2nd base plate (40A-40D), and (PM) cools off to the power module.
Description
Technical field
Disclosed execution mode relates to the manufacture method of power-converting device and power-converting device.
Background technology
Record a kind of control unit in patent documentation 1, the radiator being provided with semiconductor element is installed on the base plate of housing by this control unit, and the cold sink that cooling air flows through radiator is cooled.
Patent documentation 1: Japanese Unexamined Patent Publication 10-150284 publication
Utility model content
In the above prior art, when making control unit miniaturized in the direction of the width, the structure of further optimization device is expected.
The utility model is exactly complete in view of the above problems, and its object is to provide can the manufacture method of power-converting device miniaturized in the direction of the width and power-converting device.
In order to solve the problem, according to an aspect of the present utility model, apply a kind of power-converting device converted electric power, this power-converting device has: the 1st substrate; 2nd substrate, its setting is arranged at described 1st substrate; Electronic unit, it is configured at described 2nd substrate, forms power transformation circuit and the heating when being energized; And radiator, it is configured at the side being configured with described electronic unit of described 2nd substrate along described 2nd substrate, cool described electronic unit.
In addition, in above-mentioned power-converting device, it is characterized in that, on described 1st substrate, direction, plate face along the 1st substrate is erect side by side and is provided with multiple described 2nd substrate, multiple described 2nd substrate is configured with described electronic unit respectively, is configured with described radiator for each described 2nd substrate, described radiator cools the described electronic unit that each described 2nd substrate configures.
In addition, in above-mentioned power-converting device, it is characterized in that, on the face of the side, same direction of described 2nd substrate, the direction, plate face along described 1st substrate is configured with multiple described electronic unit side by side.
In addition, in above-mentioned power-converting device, it is characterized in that, described electronic unit is configured at least partially and between described 1st substrate of described radiator.
In addition, in above-mentioned power-converting device, it is characterized in that, described radiator described at least partially than described 2nd substrate by the setting setting direction end side of the 2nd substrate, described electronic unit is configured in the position of to erect setting direction cardinal extremity with the ratio of described 2nd substrate and leaning on a part for the part of described end side and described radiator overlapping in the setting setting direction of described 2nd substrate.
In addition, in above-mentioned power-converting device, it is characterized in that, described radiator has heat-conduction component, and described heat-conduction component is extended along described 2nd substrate, carries out hot link to described electronic unit.
In addition, in above-mentioned power-converting device, it is characterized in that, described electronic unit is configured between described 2nd substrate and described heat-conduction component on the thickness of slab direction of described 2nd substrate.
In addition, in above-mentioned power-converting device, it is characterized in that, described radiator has: radiator base, and it is along described 2nd substrate configuration; And multiple fin, they are outstanding from described radiator base towards the direction being configured with described electronic unit for described heat-conduction component.
In addition, in above-mentioned power-converting device, it is characterized in that, described heat-conduction component be extended along the setting setting direction of described 2nd substrate, side, extended direction is provided with described electronic unit and erects the described radiator base being provided with described multiple fin at extended direction opposite side.
In addition, in above-mentioned power-converting device, it is characterized in that, this power-converting device also has the fan for blowing to described radiator.
In addition, in above-mentioned power-converting device, it is characterized in that, described electronic unit is the power model with switch element, and described power model forms described power transformation circuit.
In addition, according to another aspect of the present utility model, apply a kind of manufacture method of power-converting device, this power-converting device having the 1st substrate, being installed on the 2nd substrate of described 1st substrate, forming power transformation circuit and the electronic unit generated heat when being energized and the radiator cooled described electronic unit, and this manufacture method comprises following steps: described electronic unit is fixed on described radiator; Described electronic unit is configured at described 2nd substrate; And described 2nd substrate is installed on described 1st substrate with the state erect.
According to power-converting device of the present utility model etc., power-converting device can be made miniaturized in the direction of the width.
Accompanying drawing explanation
Fig. 1 is the circuit structure diagram of an example of the circuit structure of the power-converting device representing an execution mode.
Fig. 2 is the vertical view of an example of the structure representing power-converting device.
Fig. 3 is the front view of an example of the structure representing power-converting device.
Fig. 4 represents the front view utilizing heat pipe the 2nd substrate and radiator to be carried out to an example of the structure of the power-converting device in hot linked variation.
Symbol description
1: power-converting device; 10: power transformation circuit; 30: the 1 substrates; 40A ~ D: the 2 substrate; 41: the right side (example in the face of side, same direction); 43: lower end (erectting an example of setting direction cardinal extremity); 44: upper end (erectting the adterminal example of setting party); 50A ~ D: radiator; 50A ' ~ D ': radiator; 51A ~ D: radiator base (example of heat-conduction component); 51A ' ~ D ': radiator base; 52A ~ D: fin; 53A ~ D: heat pipe (example of heat-conduction component); 60A, B: fan; PM1 ~ 8: power model (forming power transformation circuit and an example of the electronic unit of the heating when being energized); SW: switch element.
Embodiment
With reference to the accompanying drawings an execution mode is described.In addition, in the present description and drawings, represent the structural element in fact with identical function in principle with identical label, and suitably omit the repeat specification to these structural elements.In addition, " front " " afterwards " " left side " " right side " that mark in the accompanying drawings " on " direction of D score, correspond respectively in the explanation in this specification be described to " front " " afterwards " " left side " " right side " " on " direction of D score.But, the position relationship of each structure of power-converting device be not limited to " front " " afterwards " " left side " " right side " " on " concept of D score.
The example > of the circuit structure of < 1. power-converting device
First, be described with reference to the example of Fig. 1 to the circuit structure of the power-converting device of present embodiment.
As shown in Figure 1, the power converter inputted from external power source is become the electric power of regulation and exports to load by power-converting device 1.Specifically, the alternating electromotive force inputted from AC power 100 is transformed into other alternating electromotive force by power-converting device 1, output to 8 alternating current machines M1, M2, M3, M4, M5, M6, M7, M8 (being generically and collectively referred to as below " alternating current machine M "), action is controlled.That is, power-converting device 1 is the motor control assembly that can carry out 8 axle controls.
In addition, the quantity of the number of axle that power-converting device 1 can control and motor (being alternating current machine M in above-mentioned example) is not limited to 8, also can be other quantity.In addition, external power source is not limited to AC power, also can be DC power supply.In addition, load is not limited to alternating current machine, also can be direct current machine.In addition, power-converting device 1 is not limited to be the situation of motor control assembly, as long as the device converted electric power can.That is, load is not limited to motor, also can be other electronic equipment.
Power-converting device 1 has multiple electronic unit, comprising: diode (led) module DM, 4 capacitors C1, C2, C3, C4 (are generically and collectively referred to as " capacitor C " below.), 8 power models PM1, PM2, PM3, PM4, PM5, PM6, PM7, PM8 (are generically and collectively referred to as " power model PM " below.), as the regeneration resistance R of an example of resistor and switch Q.
Diode (led) module DM has diode, and diode (led) module DM carries out rectification to the alternating electromotive force inputted from AC power 100 (such as 3 cross streams electric power) and exports direct current power to DC bus P, N.
Capacitor C1 ~ C4, across being connected to DC bus P, N, makes the direct voltage by diode (led) module DM is rectified level and smooth.
Power model PM1 ~ PM8 has the multiple switch element SW (only illustrating 1 in FIG) be such as made up of semiconductor elements such as IGBT.And direct current power is transformed into the alternating electromotive force (such as 3 cross streams electric power) of regulation and outputs to alternating current machine M1 ~ M8 by power model PM1 ~ PM8 respectively.In addition, power model PM1 ~ PM8 heating when being energized.
The diode of above-mentioned diode (led) module DM, the switch element SW of capacitor C1 ~ C4 and power model PM1 ~ PM8 form power transformation circuit 10.
In addition, between DC bus P, N, be connected with the series circuit of above-mentioned regeneration resistance R and switch Q.Switch Q has the semiconductor elements such as such as MOSFET, such as when the emergency deceleration of alternating current machine M or emergent stopping time etc. conducting, make the regenerated electric power being input to DC bus P, N from alternating current machine M be reproduced resistance R thus and consume.Regeneration resistance R consumes regenerated electric power when switch Q conducting.In addition, resistance R heating when being energized is regenerated.
In addition, the circuit structure of the power-converting device 1 illustrated in foregoing is only an example, also can be the circuit structure beyond said structure.Such as, the quantity of power model PM is not limited to 8, also can be other quantity.In addition, being not limited to the situation that 1 capacitor C is connected in parallel to 2 power model PM, also can be that 1 capacitor C is connected with 1 power model PM or is connected in parallel to the power model PM of more than 3.In addition, the quantity of capacitor C is not limited to 4, also can be other quantity.In addition, also can replace capacitor C and reactor is set or except capacitor C, also reactor is set.In addition, also can replace regeneration resistance R and other resistors such as power brake are set or except regeneration resistance R, also other resistors such as power brake are set.
The example > of the structure of < 2. power-converting device
Then, be described with reference to the example of Fig. 2 and Fig. 3 to the structure of power-converting device 1.In addition, eliminate the diagram of the upper plate portion of the housing of power-converting device 1 in fig. 2, eliminate the diagram in the header board portion of housing in figure 3.In addition, in figs. 2 and 3, the diagram of the structure beyond the major part suitably eliminating present embodiment.
As shown in Figures 2 and 3, power-converting device 1 has the housing 2 of roughly rectangular shape forming its outline, and housing 2 is arranged in the mode that plate portion 21 is upside, plate portion 22 is downside, plate portion 23 is front side, plate portion 24 is rear side, plate portion 25 is left side, plate portion 26 is right side.Below, the plate portion 21 of the upside of housing 2 is called " upper plate portion 21 ", the plate portion 22 of downside is called " lower board unit 22 ", the plate portion 23 of front side is called " header board portion 23 ", the plate portion 24 of rear side is called " rear plate portion 24 ", the plate portion 25 in left side is called " left plate portion 25 ", the plate portion 26 on right side is called in " right panel portion 26 ".In addition, below, in power-converting device 1, left and right directions is called " Width ", above-below direction is called " short transverse ", fore-and-aft direction is called " depth direction ".
In addition, the shape of housing 2 is not limited to roughly rectangular shape, also can be other shape.In addition, power-converting device 1 towards be not limited to the plate portion 21 of housing 2 be upside, plate portion 22 is downside, plate portion 23 is front side, plate portion 24 is rear side, plate portion 25 is left side, plate portion 26 is right side towards, also can be other towards.
In housing 2, be configured with: the 1st substrate 30; 4 the 2nd substrates 40A, 40B, 40C, 40D (are generically and collectively referred to as " the 2nd substrate 40 " below.); Comprise multiple electronic units of above-mentioned diode (led) module DM, capacitor C1 ~ C4, power model PM1 ~ PM8, regeneration resistance R and switch Q; 4 radiators 50A, 50B, 50C, 50D (are generically and collectively referred to as " radiator 50 " below.); And 2 fans 60A, 60B (are generically and collectively referred to as " fan 60 " below.)。In addition, in housing 2, wind-tunnel 70 is formed with.In addition, the diagram of above-mentioned diode (led) module DM, the capacitor C1 ~ C4 of the appropriate position be configured in housing 2, regeneration resistance R and switch Q is eliminated in figs. 2 and 3.
(example of 2-1. the 1st substrate)
1st substrate 30 is the single substrate being only configured with parts at one side.That is, the face of the side of the 1st substrate 30 is the part side 30a being configured with parts, and the face of opposite side is the solder side 30b carrying out welding.In addition, the 1st substrate 30 is in roughly rectangle, and the size in its direction, plate face is roughly equal with the inside dimensions in the direction, face perpendicular to short transverse of housing 2.And the direction, plate face of the 1st substrate 30 is vertical with short transverse, the 1st substrate 30 with part side 30a be upper surface, solder side 30b is lower surface housing 2 is fixed in the bottom of mode in housing 2.
In addition, the 1st substrate 30 towards with position be not limited to direction, plate face perpendicular to short transverse, part side 30a be upper surface, solder side 30b be lower surface towards and be positioned at the bottom of housing 2, also can be other towards with other position.In addition, the shape of the 1st substrate 30 is not limited to roughly oblong-shaped, also can be other shape.In addition, the 1st substrate 30 is not limited to be the situation of 1 substrate, also can be made up of multiple substrate.In addition, the size in the direction, plate face of the 1st substrate 30 is not limited to the situation roughly equal with the inside dimensions in the direction, face perpendicular to short transverse of housing 2, also can be less than this inside dimensions.In addition, the 1st substrate 30 is not limited to be the situation of single substrate, also can be that two sides is configured with the two sides substrate of parts or is laminated with the multilager base plate etc. of multiple substrate.
(example of 2-2. the 2nd substrate)
2nd substrate 40A ~ 40D erect side by side along the direction, plate face of the 1st substrate 30 be arranged on the 1st substrate 30 part side 30a on.Specifically, 2nd substrate 40A ~ 40D is such as with the state erect perpendicular to the 1st substrate 30, be mounted respectively in not shown 4 attached portion (such as connector) places, these 4 attached portions are juxtaposed on the part side 30a of the 1st substrate 30 along the direction, plate face of the 1st substrate 30.
More particularly, 2nd substrate 40A ~ 40D has roughly oblong-shaped, the inside dimensions of the size of respective long side direction and the depth direction of housing 2 is roughly equal, and the half of the inside dimensions of the size of respective short side direction and the short transverse of housing 2 is roughly equal.And the 2nd substrate 40A ~ 40D vacates the space of regulation and the mode be separated from each other with respective long side direction in the direction of the width along depth direction, respective short side direction along short transverse, and the right side by the 1st substrate 30 configures in parallel with each other.That is, the 2nd substrate 40A ~ 40D is configured to that respective setting setting direction is short transverse, respective thickness of slab direction is Width.Now, the 2nd substrate 40A, 40B, 40C, 40D with the face 41,41,41,41 of respective side be the right side, the face of respective opposite side 42,42,42,42 is the left side mode configures.Below the face 41 of the 2nd substrate 40A ~ 40D is called " right side 41 ", face 42 is called on " left side 42 ".
In addition, the 2nd substrate 40A ~ 40D towards being not limited to that respective long side direction is the right side along depth direction, respective short side direction along short transverse, respective face 41, respective face 42 is the left side towards, also can be other towards.In addition, the position of the 2nd substrate 40A ~ 40D is not limited to the right side by the 1st substrate 30, also can be other position.In addition, the 2nd substrate 40A ~ 40D may not be and erects setting abreast.In addition, the shape of the 2nd substrate 40A ~ 40D is not limited to roughly oblong-shaped, also can be other shape.In addition, the size of the long side direction of the 2nd substrate 40A ~ 40D is not limited to the inside dimensions of the depth direction of housing 2 roughly equal, also can be less than this inside dimensions.In addition, the size of the short side direction of the 2nd substrate 40A ~ 40D is not limited to the half of the inside dimensions of the short transverse of housing 2 roughly equal, both can be less than the half of this inside dimensions, also can be more medium-sized than of this inside dimensions.In addition, the state that the 2nd substrate 40A ~ 40D is not limited to erect is installed on attached portion, also can be fixed on the 1st substrate 30 via suitable support component with the state erect.In addition, the 2nd substrate 40A ~ 40D is not limited to erect the part side 30a being arranged at the 1st substrate 30, also can erect the solder side 30b being arranged at the 1st substrate 30.In addition, the quantity of the 2nd substrate 40 is not limited to 4, also can be more than 1 or 3.
(example of 2-3. wind-tunnel, fan)
Wind-tunnel 70 is formed at the top of the 2nd substrate 40A ~ 40D in housing 2, top of namely keeping right.Specifically, in housing 2,2 dividing plates 7,9 are configured with.Dividing plate 7 has roughly oblong-shaped, and the inside dimensions of the size of its long side direction and the depth direction of housing 2 is roughly equal, and the size of its short side direction is than inside dimensions one medium-sized of the Width of housing 2.And dividing plate 7 vacates the space of regulation and the mode of separating with its long side direction in the height direction along depth direction, its short side direction along Width with upper plate portion 21, be configured between upper plate portion 21 and the 2nd substrate 40A ~ 40D.Dividing plate 9 has roughly oblong-shaped, and the inside dimensions of the size of its long side direction and the depth direction of housing 2 is roughly equal, and the size of its short side direction is slightly less than the half of the inside dimensions of the short transverse of housing 2.And dividing plate 9 vacates the space of regulation and the mode of separating with its long side direction in the direction of the width along depth direction, its short side direction along short transverse with right panel portion 26, be configured between upper plate portion 21 and dividing plate 7 at the left end of dividing plate 7.And, in housing 2 surrounded by upper plate portion 21, dividing plate 7, header board portion 23, rear plate portion 24, dividing plate 9 and right panel portion 26 space 71 (in Fig. 2 and Fig. 3 by single dotted broken line round space) be formed as wind-tunnel 70.
Wind-tunnel 70 has 2 ventilating openings 72,74.Ventilating opening 72 is formed in header board portion 23, in the height direction between upper plate portion 21 and dividing plate 7 and in the direction of the width between dividing plate 9 and right panel portion 26, and top of namely keeping right.Ventilating opening 74 is formed in rear plate portion 24, in the height direction between upper plate portion 21 and dividing plate 7 and in the direction of the width between dividing plate 9 and right panel portion 26, and top of namely keeping right.That is, ventilating opening 72,74 configures in opposite directions on depth direction, and wind-tunnel 70 is formed in the mode extended along depth direction.
In addition, also multiple ventilating opening can be formed with in header board portion 23 or rear plate portion 24.In addition, also can replace at least one party in header board portion 23 and rear plate portion 24 and be formed with ventilating opening in other plate portion of housing 2, or being formed with ventilating opening except other plate portion be formed with also at housing 2 except ventilating opening at least one party in header board portion 23 and rear plate portion 24.In addition, the position of the wind-tunnel 70 in housing 2 is not limited to top of keeping right, and also can be other position.
Fan 60A, 60B are configured at the inner side of ventilating opening 74, to wind-tunnel 70 (space 71) air-supply comprising above-mentioned radiator 50A ~ 50D (details is aftermentioned) at least partially separately.Specifically, fan 60A, 60B are scavenger fans, with ventilating opening 72 be air entry, ventilating opening 74 for exhaust outlet, the air being drawn into (in housing 2) in wind-tunnel 70 from ventilating opening 72 is discharged to (housing 2 is outward) wind-tunnel 70 from ventilating opening 74.Therefore, when fan 60A, 60B blow to wind-tunnel 70, in wind-tunnel 70, air mainly flows from ventilating opening 72 to ventilating opening 74.
In addition, fan 60A, 60B are not limited to scavenger fan, also can be drawing fans.In addition, fan 60A, 60B are not limited to the inner side being arranged at ventilating opening 74, also can be arranged at the outside of ventilating opening 74.In addition, the quantity being arranged at the fan of ventilating opening is not limited to 2, also can be other quantity.In addition, such as, when can not carry out the pressure cooling using fan in the not too large grade of the caloric value of the multiple electronic units owing to being configured at the 2nd substrate 40, also can not fan be set.
(example of 2-4. power model, radiator)
In addition, the 2nd substrate 40A ~ 40D separately on 1 radiator 50 being configured with 2 power model PM and these 2 power model PM are cooled.That is, the above-mentioned radiator 50A the 2nd substrate 40A being configured with above-mentioned power model PM1, PM2 and power model PM1, PM2 are cooled.In addition, the above-mentioned radiator 50B the 2nd substrate 40B being configured with above-mentioned power model PM3, PM4 and power model PM3, PM4 are cooled.In addition, the above-mentioned radiator 50C the 2nd substrate 40C being configured with above-mentioned power model PM5, PM6 and power model PM5, PM6 are cooled.In addition, the above-mentioned radiator 50D the 2nd substrate 40D being configured with above-mentioned power model PM7, PM8 and power model PM7, PM8 are cooled.
Power model PM1, PM2 along on the face that direction, plate face and the depth direction of the 1st substrate 30 is configured at the side, same direction of the 2nd substrate 40A side by side and the right side 41, and are connected with the 2nd substrate 40A.Power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are similarly configured at side by side on the right side 41 of the 2nd substrate 40B, 40C, 40D along depth direction, and are connected with the 2nd substrate 40B, 40C, 40D.That is, power model PM1 ~ PM8 is equivalent to form power transformation circuit and an example of the electronic unit of the heating when being energized.
Specifically, power model PM1, PM2 in the mode of separating with the 1st substrate 30, the ratio being configured in the 2nd substrate 40A as the lower end 43 of erectting setting direction cardinal extremity by as erect side, setting party adterminal upper end 44 namely on the upside of position.More particularly, power model PM1, PM2 configures near the upper end 44 of the 2nd substrate 40A.Power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 similarly configure near the upper end 44,44,44 of the 2nd substrate 40B, 40C, 40D.
In addition, the configuration of power model PM1 ~ PM8 is not limited to above-mentioned configuration, also can be other configuration.Such as, power model PM1, PM2 are not limited to be configured near the upper end 44 of the 2nd substrate 40A, also can be configured at the short transverse central portion of the 2nd substrate 40A or be configured (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same) near lower end 43.In addition, power model PM1, PM2 are not limited to the right side 41 being configured in the 2nd substrate 40A, also can be configured in the left side 42 (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same) of the 2nd substrate 40A.In addition, the combination of the power model PM of the upper configuration of the 2nd substrate 40A ~ 40D is not limited to combinations thereof, also can be other combination.In addition, the quantity being configured at the power model PM on the 2nd substrate 40A ~ 40D is not limited to 2, also can be more than 1 or 3.
In addition, being configured at formation power-converting device on the 2nd substrate 40A ~ 40D and the electronic unit of heating is not limited to power model PM when being energized, also can be other electronic unit.
Radiator 50A ~ 50D is configured at the face being configured with power model PM and the side, the right side 41 of the 2nd substrate 40A ~ 40D along the 2nd substrate 40A ~ 40D, and is fixed on housing 2 via support component (not shown).Radiator 50A ~ 50D part is separately than the 2nd top side of substrate 40A ~ 40D.Specifically, radiator 50A ~ 50D has 1 radiator base and multiple fin separately.That is, radiator 50A has radiator base 51A and multiple fin 52A.In addition, radiator 50B has radiator base 51B and multiple fin 52B.In addition, radiator 50C has radiator base 51C and multiple fin 52C.In addition, radiator 50D has radiator base 51D and multiple fin 52D.Below radiator base 51A ~ 51D is generically and collectively referred to as " radiator base 51 ", fin 52A ~ 52D is generically and collectively referred to as " fin 52 ".
Radiator base 51A ~ 51D is in roughly rectangle, and the size of respective long side direction is less than the size of the depth direction of the 2nd substrate 40A ~ 40D, and the size of respective short side direction is larger than the size of the short transverse of dividing plate 9.And radiator base 51A ~ 51D is configured at the side, the right side 41 of the 2nd substrate 40A ~ 40D abreast along depth direction, respective short side direction along the mode of short transverse and the 2nd substrate 40A ~ 40D with respective long side direction.
Specifically, radiator base 51A, 51B, 51C, 51D are to be applied in the mode of 4 through holes 7a, 7b, 7c, 7d that dividing plate 7 is formed side by side along the direction, plate face of this dividing plate 7 respectively, extended abreast with short transverse.And radiator base 51A ~ 51D is configured in respective side, the extended direction i.e. part of downside position overlapping with the 2nd substrate 40A ~ 40D in the height direction.In addition, the radiator base 51A ~ 51D extended direction opposite side separately i.e. part of upside, than the 2nd top side of substrate 40A ~ 40D, is namely configured in wind-tunnel 70.Now, radiator base 51A ~ 51D is the left side to be configured with the face of the side of fin 52, is not configured with the mode that the face of the side of fin 52 is the right side and is configured.Below the face being configured with the side of fin 52 of radiator base 51A ~ 51D is called " left side ", is called on " right side " in the face of the side not being configured with fin 52.
At the part place that the downside on the left side of radiator base 51A is namely overlapping with the 2nd substrate 40A in the height direction, be provided with as described above near power model PM1, PM2 of the configuration of the upper end 44 of the 2nd substrate 40A.That is, power model PM1, PM2 is configured between the 2nd substrate 40A and radiator base 51A in the direction of the width, and radiator base 51A carries out hot link to radiator 50A and power model PM1, PM2.In addition, be namely configured at part place in wind-tunnel 70 in the upside that is configured at of radiator base 51A, erect and be provided with above-mentioned multiple fin 52A.Multiple fin 52A gives prominence to from radiator base 51A towards the direction being configured with power model PM for this radiator base 51A and left.That is, power model PM1, PM2 be configured at radiator 50A a part and between fin 52A and the 1st substrate 30.Specifically, power model PM1, PM2 is configured in position overlapping with the part i.e. lower portion of the close part of upper end 44 and a part of radiator 50A and radiator base 51A of ratio lower end 43 near upside of the 2nd substrate 40A in the height direction.
Radiator base 51B is also same, part place overlapping with the 2nd substrate 40B on its left side in the height direction, is provided with as described above near power model PM3, PM4 of the configuration of the upper end 44 of the 2nd substrate 40B.That is, power model PM3, PM4 is configured between the 2nd substrate 40B and radiator base 51B in the direction of the width, and radiator base 51B carries out hot link to radiator 50B and power model PM3, PM4.In addition, at the part place be configured in wind-tunnel 70 of radiator base 51B, erect and be provided with the above-mentioned multiple fin 52Bs outstanding from this radiator base 51B towards left.That is, power model PM3, PM4 is configured in position overlapping with the part of the close upper end 44 of the 2nd substrate 40B and the lower portion of radiator base 51B in the height direction.
Radiator base 51C is also same, part place overlapping with the 2nd substrate 40C on its left side in the height direction, is provided with as described above near power model PM5, PM6 of the configuration of the upper end 44 of the 2nd substrate 40C.That is, power model PM5, PM6 is configured between the 2nd substrate 40C and radiator base 51C in the direction of the width, and radiator base 51C carries out hot link to radiator 50C and power model PM5, PM6.In addition, at the part place be configured in wind-tunnel 70 of radiator base 51C, erect and be provided with the above-mentioned multiple fin 52Cs outstanding from this radiator base 51C towards left.That is, power model PM5, PM6 is configured in position overlapping with the part of the close upper end 44 of the 2nd substrate 40C and the lower portion of radiator base 51C in the height direction.
Radiator base 51D is also same, part place overlapping with the 2nd substrate 40D on its left side in the height direction, is provided with as described above near power model PM7, PM8 of the configuration of the upper end 44 of the 2nd substrate 40D.That is, power model PM7, PM8 is configured between the 2nd substrate 40D and radiator base 51D in the direction of the width, and radiator base 51D carries out hot link to radiator 50D and power model PM7, PM8.In addition, at the part place be configured in wind-tunnel 70 of radiator base 51D, erect and be provided with the above-mentioned multiple fin 52Ds outstanding from this radiator base 51D towards left.That is, power model PM7, PM8 is configured in position overlapping with the part of the close upper end 44 of the 2nd substrate 40D and the lower portion of radiator base 51D in the height direction.
In addition, now also heat pipe can be imbedded in radiator base 51A ~ 51D.When imbedding heat pipe in radiator base 51A ~ 51D, can by the heat of the efficient delivered power module PM of radiator 50A ~ 50D.
In the present embodiment, radiator base 51A ~ 51B is equivalent to an example of heat-conduction component.
In addition, shape, the configuration of radiator 50A ~ 50D are not limited to above-mentioned shape, configuration, also can be other shape, configuration.Such as, fin 52A is not limited to outstanding from radiator base 51A towards the direction (being left above-mentioned example) being configured with power model PM for this radiator base 51A.Such as, fin 52A also can from radiator base 51A towards for this radiator base 51A, be configured with the side of power model PM in the opposite direction outstanding (fin 52B ~ 52D is also same).In addition, radiator 50A is not limited to the situation of its part than the 2nd substrate 40A top side configuration, also can be that it is all than the 2nd substrate 40A top side configuration (radiator 50B ~ 50D is also same).In this case, the radiator base of the heat-conduction components such as heat pipe to power model PM1, PM2 of being configured on the right side 41 of the 2nd substrate 40A and radiator 50A can be utilized to carry out hot link.In addition, radiator 50A is not limited to it at least partially than the situation of the 2nd substrate 40A top side configuration, also can be configured to its upper end and be in the position consistent with the upper end of the 2nd substrate 40A or than this upper end on the lower (radiator 50B ~ 50D is also same) in the height direction.In addition, radiator 50A ~ 50D is not limited to face (the being the right side 41 in the above example) side being configured with power model PM being configured at the 2nd substrate 40A ~ 40D, also can be configured at the side, face not being configured with power model PM of the 2nd substrate 40A ~ 40D.
In addition, power model PM1, PM2 are not limited to be configured in the direction of the width between the 2nd substrate 40A and radiator base 51A, also can be arranged at radiator base 51A (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same) in centre across the 2nd substrate 40A.In addition, power model PM1, PM2 is not limited to be configured in position overlapping with the part (being the part of top end 44 in above-mentioned example) of the top side, ratio lower end 43 of the 2nd substrate 40A and a part (being the lower portion of radiator base 51A in above-mentioned example) of radiator 50A in the height direction.Such as, power model PM1, PM2 also can be configured in the height direction with the part of top side, ratio lower end 43 and the nonoverlapping position of a part of radiator 50A of the 2nd substrate 40A, namely in the height direction than the 2nd top side of substrate 40A (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same).In addition, power model PM1, PM2 are not limited to be configured between a part (being fin 52A in above-mentioned example) of radiator 50A and the 1st substrate 30, also can be configured in (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same) between whole (radiator base and the fin) of whole radiator 50A and the 1st substrate 30.In addition, power model PM1, PM2 also can not be configured at (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same) between radiator 50A and the 1st substrate 30.
In addition, power model PM1 ~ PM8 is not limited to the outside being configured in wind-tunnel 70, also can be configured in wind-tunnel.In this case, in housing 2, wind-tunnel can be formed in the mode containing power model PM1 ~ PM8.In addition, the group number erectting the 2nd substrate 40, power model PM and the radiator 50 being arranged at the 1st substrate 30 is not limited to 4 groups, also can be other quantity.In addition, at least one portion of the 1st substrate 30, the 2nd substrate 40A ~ 40D also can use as the parts forming wind-tunnel.In this case because can omit form wind-tunnel parts (wind deflector, dividing plate etc.) at least partially, so power-converting device 1 miniaturization can be enable to reduce costs.
The example > of the manufacture method of < 3. power-converting device
Then, an example of the manufacture method of the power-converting device 1 of above-mentioned structure is described.
In manufacturing process's (assembling procedure) of power-converting device 1, in the office, following side on the left side of the radiator base 51A of radiator 50A, the length direction along radiator base 51A rigid power module PM1, PM2 arranged side by side.Radiator 50B, 50C, 50D are also similarly rigid power module PM3, PM4, power model PM5, PM6, power model PM7, PM8.In addition, now also can sandwiched heat conductivity is good between radiator 50 and power model PM heat-conducting cream or backing material.
Thereafter, in the position of the close upper end 44 on the right side 41 of the 2nd substrate 40A, power model PM1, PM2 of radiator 51A have been fixed in the configuration arranged side by side of long side direction (direction corresponding with the direction, plate face of the 1st substrate 30) along the 2nd substrate 40A, and are connected with the 2nd substrate 40A.2nd substrate 40B, 40C, 40D is also same, the allocating power module PM3 arranged side by side of the long side direction along the 2nd substrate 40B, 40C, 40D, PM4, power model PM5, PM6, power model PM7, PM8, and is connected with the 2nd substrate 40B, 40C, 40D.
Then, the 2nd substrate 40A ~ 40D being provided with radiator 50A ~ 50D and power model PM is installed on respectively 4 attached portions of the part side 30a of the 1st substrate 30 with the state erect perpendicular to the 1st substrate 30.
In addition, though in this non-specified otherwise, the parts beyond the above-mentioned parts being configured at housing 2 are also properly configured.Then, when be configured with whole be configured in the parts of housing 2 time, complete power-converting device 1.
In addition, the content of the manufacture method of power-converting device 1 described above is only an example, also can be the content beyond above-mentioned explanation.Such as, the manufacturing step that the manufacture method of power-converting device 1 relates to, is not limited to the order of above-mentioned explanation, can carry out adding/delete or the change etc. of order of step in the scope not departing from purport and technological thought.
The example > of the effect that < 4. present embodiment realizes
As mentioned above, in the power-converting device 1 of present embodiment, to power transformation circuit 10 be formed and the electronic unit (being power model PM in above-mentioned example) of heating is configured on the 1st substrate 30 and erects on the 2nd substrate 40 of setting when being energized, the radiator 50 cooled being configured at the side being configured with power model PM of the 2nd substrate 40 to power model PM along the 2nd substrate 40.Thus, by making radiator 50 and the overlapping part of power model PM be configured in the direction of the width, the size of the Width of power-converting device 1 can be shortened.Therefore, it is possible to make power-converting device 1 miniaturized in the direction of the width.In addition, be configured because power model PM can be made to separate with the 1st substrate 30, so the impact of heat on the installing component of the 1st substrate 30 etc. can be reduced.
In addition, in the present embodiment, particularly go up allocating power module PM separately at the 2nd substrate 40A ~ 40D being juxtaposed on the 1st substrate 30, and the 2nd substrate 40A ~ 40D separately on configure radiator 50A ~ 50D.Thus, such as, with configure the situation of multiple power model PM side by side along Width (the thickness of slab direction of the 2nd substrate 40A ~ 40D) compared with, the size of the Width of power-converting device 1 can be shortened.In addition, by radiator 50A ~ 50D is accommodated in 1 wind-tunnel 70, can utilize fan 60A, 60B simultaneously and blow to radiator 50A ~ 50D efficiently, thus can simultaneously and efficiently to the 2nd substrate 40A ~ 40D separately the upper power model PM configured cool.
In addition, in the present embodiment, particularly along depth direction, multiple power model PM is configured at side by side the right side 41 of the 2nd substrate 40.Thereby, it is possible to when power-converting device 1 can not be made to maximize in the direction of the width, increase the quantity of power model PM.
In addition, in the present embodiment, particularly power model PM is configured between a part of radiator 50A ~ 50D and the 1st substrate 30.Thus, because the overlapping part of radiator 50A ~ 50D and power model PM can be made in the direction of the width to be configured, so the interval between the 2nd substrate 40 can be shortened, and the dead band between the 2nd substrate 40 can be reduced.Therefore, it is possible to make power-converting device 1 miniaturized further in the direction of the width.In addition, because the route of becoming separated in flight (cooling being contributed to the gap of little wind flow) of wind can be reduced, so the air-supply of fan 60A, 60B can be effectively utilized, the cooling effectiveness of power model PM can be improved.
In addition, in the present embodiment, particularly radiator 50A ~ 50D is configured to its top side of part ratio the 2nd substrate 40A ~ 40D, power model PM is configured at position overlapping with the part of the top side, ratio lower end 43 of the 2nd substrate 40A ~ 40D and a part of radiator 50A ~ 50D in the height direction.Thereby, it is possible to the heat that the heating reducing power model PM causes is on the impact (the lower degradation of reliability) of the installing component of the 1st substrate 30 etc.
In addition, in the present embodiment, particularly radiator 50A ~ 50D has heat-conduction component (being radiator base 51A ~ 51D in the above example), and described heat-conduction component is arranged along the 2nd substrate 40A ~ 40D, carries out hot link to power model PM.Thereby, it is possible to shorten the interval between the 2nd substrate 40, and the heat of power model PM is made to be diffused into radiator 50A ~ 50D and can cooling power module PM effectively efficiently.
In addition, in the present embodiment, particularly power model PM is configured between the 2nd substrate 40A ~ 40D and radiator base 51A ~ 51D in the direction of the width.Thus, there is no other parts of sandwiched (the 2nd substrate 40A ~ 40D etc.) between power model PM and radiator base 51A ~ 51D but directly contact, so the heat of power model PM can be made to be diffused into radiator 50A ~ 50D efficiently.
In addition, in the present embodiment, particularly configure the radiator base 51A ~ 51D of radiator 50A ~ 50D along the 2nd substrate 40A ~ 40D, make multiple fin 52A ~ 52D outstanding from radiator base 51A ~ 51D towards the direction (being left above-mentioned example) being configured with power model PM for this radiator base 51A ~ 51D.Thereby, it is possible to the overlapping region of radiator 50A ~ 50D on increase Width and power model PM, so the interval between the 2nd substrate 40 can be shortened further, power-converting device 1 can be made miniaturized further in the direction of the width.
In addition, in the present embodiment, particularly when not needing to prepare separately the good especially heat-conduction component of heat conductivity, heat-conduction component is set as along the extended radiator base 51A ~ 51D of short transverse.Hot link is carried out to power model PM and radiator 50A ~ 50D, so do not need to prepare parts separately because of extending radiator base 51A ~ 51D.Therefore, it is possible to make power-converting device 1 miniaturized, can reduce costs.
In addition, in the present embodiment, particularly fan 60A, 60B blows to radiator 50A ~ 50D.Thereby, it is possible to simultaneously and cool, so can cooling effectiveness be improved the multiple power model PM be arranged side by side along depth direction efficiently.
In addition, in the present embodiment, particularly power transformation circuit 10 will be formed and the electronic unit of heating is set as forming the power model PM with switch element SW of power transformation circuit 10 when being energized.Power model PM is the electronic unit that caloric value is larger in power-converting device 1.Because the 2nd substrate 40A ~ 40D can be used, configure this power model PM dividually with the 1st substrate 30, effectively multiple power model PM is cooled so heat can be reduced on the impact of the 1st substrate 30.
The > such as < 5. variation
In addition, execution mode is not limited to foregoing, can carry out various distortion in the scope not departing from its purport and technological thought.Successively its variation is described below.In addition, in following variation etc., mainly part different from the embodiment described above is described.In addition, for above-mentioned execution mode, there is in fact the structural element of identical function, represent with identical label in principle, and suitably omit the repeat specification to these structural elements.
(5-1. utilizes heat pipe to carry out hot linked situation to the 2nd substrate and radiator)
Referring to Fig. 4, point different from the embodiment described above in the structure of the power-converting device of this variation etc. is described.
As shown in Figure 4, this variation is following aspect etc. with the difference of above-mentioned execution mode: substitute aforesaid radiator 50A, 50B, 50C, 50D and be provided with radiator 50A ', 50B ', 50C ', 50D '.Below radiator 50A ' ~ 50D ' is generically and collectively referred to as " radiator 50 ' ".
Radiator 50A ' substitutes aforesaid radiator base 51A and is provided with radiator base 51A ', and is newly provided with heat pipe 53A, and these aspects etc. are different from radiator 50A.Radiator 50B ' substitutes aforesaid radiator base 51B and is provided with radiator base 51B ', and is newly provided with heat pipe 53B, and these aspects etc. are different from radiator 50B.Radiator 50C ' substitutes aforesaid radiator base 51C and is provided with radiator base 51C ', and is newly provided with heat pipe 53C, and these aspects etc. are different from radiator 50C.Radiator 50D ' substitutes aforesaid radiator base 51D and is provided with radiator base 51D ', and is newly provided with heat pipe 53D, and these aspects etc. are different from radiator 50D.Below radiator base 51A ' ~ 51D ' is generically and collectively referred to as " radiator base 51 ' ", heat pipe 53A ~ 53D is generically and collectively referred to as " heat pipe 53 ".
Radiator base 51A ' ~ 51D ' is the pedestal making the size of the short side direction of radiator base 51A ~ 51D less than the size of the short transverse of aforesaid dividing plate 9, and the respective top side of whole ratios the 2nd substrate 40A ~ 40D, be namely configured in aforesaid wind-tunnel 70.
On the right side of radiator base 51A ' ~ 51D ', such as, be provided with multiple above-mentioned heat pipe 53A ~ 53D.Heat pipe 53A, 53B, 53C, 53D be applied in respectively dividing plate 7 ' is formed side by side along the direction, plate face of this dividing plate 7 ' 4 through hole 7a ', 7b ', 7c ', 7d ' mode, extended abreast with the 2nd substrate 40A, 40B, 40C, 40D.And heat pipe 53A ~ 53D lower portion is separately configured in position overlapping with the 2nd substrate 40A ~ 40D in the height direction, and respective upper portion is than the 2nd top side of substrate 40A ~ 40D, is namely configured in wind-tunnel 70.
At downside, namely overlapping with the 2nd substrate 40A in the height direction part place on the left side of heat pipe 53A, be provided with as described above near power model PM1, PM2 of the configuration of the upper end 44 of the 2nd substrate 40A.That is, power model PM1, PM2 is configured between the 2nd substrate 40A and heat pipe 53A in the direction of the width, and heat pipe 53A carries out hot link to radiator 50A ' and power model PM1, PM2.
Heat pipe 53B is also same, part place overlapping with the 2nd substrate 40B on its left side in the height direction, is provided with as described above near power model PM3, PM4 of the configuration of the upper end 44 of the 2nd substrate 40B.That is, power model PM3, PM4 is configured between the 2nd substrate 40B and heat pipe 53B in the direction of the width, and heat pipe 53B carries out hot link to radiator 50B ' and power model PM3, PM4.
Heat pipe 53C is also same, part place overlapping with the 2nd substrate 40C on its left side in the height direction, is provided with as described above near power model PM5, PM6 of the configuration of the upper end 44 of the 2nd substrate 40C.That is, power model PM5, PM6 is configured between the 2nd substrate 40C and heat pipe 53C in the direction of the width, and heat pipe 53C carries out hot link to radiator 50C ' and power model PM5, PM6.
Heat pipe 53D is also same, part place overlapping with the 2nd substrate 40D on its left side in the height direction, is provided with as described above near power model PM7, PM8 of the configuration of the upper end 44 of the 2nd substrate 40D.That is, power model PM7, PM8 is configured between the 2nd substrate 40D and heat pipe 53D in the direction of the width, and heat pipe 53D carries out hot link to radiator 50D ' and power model PM7, PM8.
In addition, the upper setting of radiator base 51A ' is provided with above-mentioned multiple fin 52A.Multiple fin 52A, from radiator base 51A ', gives prominence to towards the direction being configured with power model PM for heat pipe 53A and left.That is, power model PM1, PM2 is configured in position overlapping with the lower portion of the part of the close upper end 44 of the 2nd substrate 40A and a part of radiator 50A ' and heat pipe 53A in the height direction.
In addition, radiator base 51B ' similarly erects to be provided with from this radiator base 51B ' above-mentioned multiple fin 52B outstanding to the left.That is, power model PM3, PM4 is configured in position overlapping with the part of the close upper end 44 of the 2nd substrate 40B and the lower portion of heat pipe 53B in the height direction.
In addition, radiator base 51C ' similarly erects to be provided with from this radiator base 51C ' above-mentioned multiple fin 52C outstanding to the left.That is, power model PM5, PM6 is configured in position overlapping with the part of the close upper end 44 of the 2nd substrate 40C and the lower portion of heat pipe 53C in the height direction.
In addition, radiator base 51D ' similarly erects to be provided with from this radiator base 51D ' above-mentioned multiple fin 52D outstanding to the left.That is, power model PM7, PM8 is configured in position overlapping with the part of the close upper end 44 of the 2nd substrate 40D and the lower portion of heat pipe 53D in the height direction.
In this variation, heat pipe 53A ~ 53D is equivalent to an example of heat-conduction component.
In addition, shape, the configuration of radiator 50A ' ~ 50D ' are not limited to above-mentioned shape, configuration, also can be other shape, configuration.Such as, heat pipe 53A is not limited to the right side being arranged at radiator base 51A ', also can be arranged at the left side of radiator base 51A ', or imbeds radiator base 51A ' (heat pipe 53B ~ 53D is also same).In addition, fin 52A is not limited to outstanding from radiator base 51A ' towards the direction (being left above-mentioned example) being configured with power model PM for heat pipe 53A.Such as, fin 52A also can from radiator base 51A ' towards for heat pipe 53A be configured with the side of power model PM in the opposite direction outstanding (fin 52B ~ 52D is also same).
In addition, power model PM1, PM2 are not limited to be configured in the direction of the width between the 2nd substrate 40A and heat pipe 53A, also can be arranged at heat pipe 53A (power model PM3, PM4, power model PM5, PM6, power model PM7, PM8 are also same) in centre across the 2nd substrate 40A.
In addition, heat-conduction component is not limited to heat pipe, as long as can carry out hot linked parts to power model, also can be other parts.
Also the effect identical with above-mentioned execution mode can be obtained in described above variation.
In addition, except the content illustrated above, also can use the method for above-mentioned execution mode or its variation appropriately combinedly.
In addition, although do not illustrate one by one, above-mentioned execution mode and its variation can apply various change and implement in the scope not departing from its purport.
Claims (11)
1. a power-converting device, it converts electric power, it is characterized in that,
This power-converting device has:
1st substrate;
2nd substrate, its setting is arranged at described 1st substrate;
Electronic unit, it is configured at described 2nd substrate, forms power transformation circuit and the heating when being energized; And
Radiator, it is configured at the side being configured with described electronic unit of described 2nd substrate along described 2nd substrate, cool described electronic unit.
2. power-converting device according to claim 1, is characterized in that,
On described 1st substrate, the direction, plate face along the 1st substrate is erect side by side and is provided with multiple described 2nd substrate,
Multiple described 2nd substrate is configured with described electronic unit respectively,
Be configured with described radiator for each described 2nd substrate, described radiator cools the described electronic unit that each described 2nd substrate configures.
3. power-converting device according to claim 1 and 2, is characterized in that,
On the face of the side, same direction of described 2nd substrate, the direction, plate face along described 1st substrate is configured with multiple described electronic unit side by side.
4. power-converting device according to claim 1 and 2, is characterized in that,
Described electronic unit is configured at least partially and between described 1st substrate of described radiator.
5. power-converting device according to claim 4, is characterized in that,
The described setting setting direction end side leaning on the 2nd substrate at least partially than described 2nd substrate of described radiator,
Described electronic unit is configured in erect setting direction cardinal extremity by the part of described end side and the overlapping position of a part for described radiator in the setting setting direction of described 2nd substrate with the ratio of described 2nd substrate.
6. power-converting device according to claim 4, is characterized in that,
Described radiator has heat-conduction component, and described heat-conduction component is extended along described 2nd substrate, carries out hot link to described electronic unit.
7. power-converting device according to claim 6, is characterized in that,
Described electronic unit is configured between described 2nd substrate and described heat-conduction component on the thickness of slab direction of described 2nd substrate.
8. power-converting device according to claim 7, is characterized in that,
Described radiator has:
Radiator base, it is along described 2nd substrate configuration; And
Multiple fin, they are outstanding from described radiator base towards the direction being configured with described electronic unit for described heat-conduction component.
9. power-converting device according to claim 8, is characterized in that,
Described heat-conduction component be extended along the setting setting direction of described 2nd substrate, side, extended direction is provided with described electronic unit and erects the described radiator base being provided with described multiple fin at extended direction opposite side.
10. power-converting device according to claim 1 and 2, is characterized in that,
This power-converting device also has the fan for blowing to described radiator.
11. power-converting devices according to claim 1 and 2, is characterized in that,
Described electronic unit is the power model with switch element, and described power model forms described power transformation circuit.
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| JP2014205992A JP6057138B2 (en) | 2014-10-06 | 2014-10-06 | Power conversion device and method of manufacturing power conversion device |
| JP2014-205992 | 2014-10-06 |
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| CN205070761U true CN205070761U (en) | 2016-03-02 |
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| CN107896514A (en) * | 2016-06-30 | 2018-04-10 | 株式会社安川电机 | Motor control assembly and robot system |
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| JP2812014B2 (en) * | 1991-10-21 | 1998-10-15 | 株式会社日立製作所 | Semiconductor device |
| US5648892A (en) * | 1995-09-29 | 1997-07-15 | Allen-Bradley Company, Inc. | Wireless circuit board system for a motor controller |
| JP3694858B2 (en) * | 2000-09-27 | 2005-09-14 | 富士通アクセス株式会社 | Drive device with compensation circuit |
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| CN107896514A (en) * | 2016-06-30 | 2018-04-10 | 株式会社安川电机 | Motor control assembly and robot system |
| CN107896514B (en) * | 2016-06-30 | 2019-12-20 | 株式会社安川电机 | Motor control device and robot system |
| US11146150B2 (en) | 2016-06-30 | 2021-10-12 | Kabushiki Kaisha Yaskawa Denki | Motor control device and robot system |
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