JP6052434B2 - 圧電センサの製造方法 - Google Patents
圧電センサの製造方法 Download PDFInfo
- Publication number
- JP6052434B2 JP6052434B2 JP2015554818A JP2015554818A JP6052434B2 JP 6052434 B2 JP6052434 B2 JP 6052434B2 JP 2015554818 A JP2015554818 A JP 2015554818A JP 2015554818 A JP2015554818 A JP 2015554818A JP 6052434 B2 JP6052434 B2 JP 6052434B2
- Authority
- JP
- Japan
- Prior art keywords
- detection electrode
- piezoelectric
- piezoelectric film
- manufacturing
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 70
- 238000000034 method Methods 0.000 title claims description 35
- 238000001514 detection method Methods 0.000 claims description 177
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- 229920000747 poly(lactic acid) Polymers 0.000 claims description 19
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- 229920000642 polymer Polymers 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 111
- 239000000853 adhesive Substances 0.000 description 16
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- 238000006073 displacement reaction Methods 0.000 description 7
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013265457 | 2013-12-24 | ||
JP2013265457 | 2013-12-24 | ||
PCT/JP2014/083653 WO2015098723A1 (fr) | 2013-12-24 | 2014-12-19 | Procédé de production de capteur piézoélectrique |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6052434B2 true JP6052434B2 (ja) | 2016-12-27 |
JPWO2015098723A1 JPWO2015098723A1 (ja) | 2017-03-23 |
Family
ID=53478581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015554818A Active JP6052434B2 (ja) | 2013-12-24 | 2014-12-19 | 圧電センサの製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6052434B2 (fr) |
WO (1) | WO2015098723A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6776806B2 (ja) * | 2016-10-25 | 2020-10-28 | 株式会社リコー | センサ及び把持装置及びロボット及びセンサ初期化方法 |
CN111699563B (zh) * | 2019-01-11 | 2024-02-13 | 株式会社村田制作所 | 压电器件、振动构造体以及压电传感器 |
CN113432763B (zh) * | 2021-06-17 | 2023-07-21 | 中北大学 | 夹芯式pvdf压力计真空环境压制装置及方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0280930A (ja) * | 1988-09-19 | 1990-03-22 | Agency Of Ind Science & Technol | 分布型圧覚センサの製造方法 |
US20020036446A1 (en) * | 2000-03-28 | 2002-03-28 | Minoru Toda | Piezeoelectric transducer having protuberances for transmitting acoustic energy and method of making the same |
JP2008122215A (ja) * | 2006-11-13 | 2008-05-29 | Aisin Seiki Co Ltd | 圧電センサ及びその製造方法 |
JP2009053109A (ja) * | 2007-08-28 | 2009-03-12 | Aisin Seiki Co Ltd | 圧電フィルムセンサ |
JP2009080090A (ja) * | 2007-09-05 | 2009-04-16 | Erumekku Denshi Kogyo Kk | 圧電センサ |
WO2011138903A1 (fr) * | 2010-05-06 | 2011-11-10 | 株式会社村田製作所 | Écran tactile, appareil de saisie dactylographique et procédé de commande pour celui-ci |
-
2014
- 2014-12-19 WO PCT/JP2014/083653 patent/WO2015098723A1/fr active Application Filing
- 2014-12-19 JP JP2015554818A patent/JP6052434B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0280930A (ja) * | 1988-09-19 | 1990-03-22 | Agency Of Ind Science & Technol | 分布型圧覚センサの製造方法 |
US20020036446A1 (en) * | 2000-03-28 | 2002-03-28 | Minoru Toda | Piezeoelectric transducer having protuberances for transmitting acoustic energy and method of making the same |
JP2008122215A (ja) * | 2006-11-13 | 2008-05-29 | Aisin Seiki Co Ltd | 圧電センサ及びその製造方法 |
JP2009053109A (ja) * | 2007-08-28 | 2009-03-12 | Aisin Seiki Co Ltd | 圧電フィルムセンサ |
JP2009080090A (ja) * | 2007-09-05 | 2009-04-16 | Erumekku Denshi Kogyo Kk | 圧電センサ |
WO2011138903A1 (fr) * | 2010-05-06 | 2011-11-10 | 株式会社村田製作所 | Écran tactile, appareil de saisie dactylographique et procédé de commande pour celui-ci |
Also Published As
Publication number | Publication date |
---|---|
JPWO2015098723A1 (ja) | 2017-03-23 |
WO2015098723A1 (fr) | 2015-07-02 |
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