JP6052434B2 - 圧電センサの製造方法 - Google Patents

圧電センサの製造方法 Download PDF

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Publication number
JP6052434B2
JP6052434B2 JP2015554818A JP2015554818A JP6052434B2 JP 6052434 B2 JP6052434 B2 JP 6052434B2 JP 2015554818 A JP2015554818 A JP 2015554818A JP 2015554818 A JP2015554818 A JP 2015554818A JP 6052434 B2 JP6052434 B2 JP 6052434B2
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Japan
Prior art keywords
detection electrode
piezoelectric
piezoelectric film
manufacturing
sensor
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Active
Application number
JP2015554818A
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English (en)
Japanese (ja)
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JPWO2015098723A1 (ja
Inventor
河村 秀樹
秀樹 河村
博行 中路
博行 中路
山口 喜弘
喜弘 山口
遠藤 潤
潤 遠藤
斉藤 誠人
誠人 斉藤
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JP6052434B2 publication Critical patent/JP6052434B2/ja
Publication of JPWO2015098723A1 publication Critical patent/JPWO2015098723A1/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/16Measuring force or stress, in general using properties of piezoelectric devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/857Macromolecular compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2015554818A 2013-12-24 2014-12-19 圧電センサの製造方法 Active JP6052434B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013265457 2013-12-24
JP2013265457 2013-12-24
PCT/JP2014/083653 WO2015098723A1 (fr) 2013-12-24 2014-12-19 Procédé de production de capteur piézoélectrique

Publications (2)

Publication Number Publication Date
JP6052434B2 true JP6052434B2 (ja) 2016-12-27
JPWO2015098723A1 JPWO2015098723A1 (ja) 2017-03-23

Family

ID=53478581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015554818A Active JP6052434B2 (ja) 2013-12-24 2014-12-19 圧電センサの製造方法

Country Status (2)

Country Link
JP (1) JP6052434B2 (fr)
WO (1) WO2015098723A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6776806B2 (ja) * 2016-10-25 2020-10-28 株式会社リコー センサ及び把持装置及びロボット及びセンサ初期化方法
CN111699563B (zh) * 2019-01-11 2024-02-13 株式会社村田制作所 压电器件、振动构造体以及压电传感器
CN113432763B (zh) * 2021-06-17 2023-07-21 中北大学 夹芯式pvdf压力计真空环境压制装置及方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0280930A (ja) * 1988-09-19 1990-03-22 Agency Of Ind Science & Technol 分布型圧覚センサの製造方法
US20020036446A1 (en) * 2000-03-28 2002-03-28 Minoru Toda Piezeoelectric transducer having protuberances for transmitting acoustic energy and method of making the same
JP2008122215A (ja) * 2006-11-13 2008-05-29 Aisin Seiki Co Ltd 圧電センサ及びその製造方法
JP2009053109A (ja) * 2007-08-28 2009-03-12 Aisin Seiki Co Ltd 圧電フィルムセンサ
JP2009080090A (ja) * 2007-09-05 2009-04-16 Erumekku Denshi Kogyo Kk 圧電センサ
WO2011138903A1 (fr) * 2010-05-06 2011-11-10 株式会社村田製作所 Écran tactile, appareil de saisie dactylographique et procédé de commande pour celui-ci

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0280930A (ja) * 1988-09-19 1990-03-22 Agency Of Ind Science & Technol 分布型圧覚センサの製造方法
US20020036446A1 (en) * 2000-03-28 2002-03-28 Minoru Toda Piezeoelectric transducer having protuberances for transmitting acoustic energy and method of making the same
JP2008122215A (ja) * 2006-11-13 2008-05-29 Aisin Seiki Co Ltd 圧電センサ及びその製造方法
JP2009053109A (ja) * 2007-08-28 2009-03-12 Aisin Seiki Co Ltd 圧電フィルムセンサ
JP2009080090A (ja) * 2007-09-05 2009-04-16 Erumekku Denshi Kogyo Kk 圧電センサ
WO2011138903A1 (fr) * 2010-05-06 2011-11-10 株式会社村田製作所 Écran tactile, appareil de saisie dactylographique et procédé de commande pour celui-ci

Also Published As

Publication number Publication date
JPWO2015098723A1 (ja) 2017-03-23
WO2015098723A1 (fr) 2015-07-02

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