WO2015093356A1 - Procédé de fabrication de capteur piézoélectrique - Google Patents

Procédé de fabrication de capteur piézoélectrique Download PDF

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Publication number
WO2015093356A1
WO2015093356A1 PCT/JP2014/082623 JP2014082623W WO2015093356A1 WO 2015093356 A1 WO2015093356 A1 WO 2015093356A1 JP 2014082623 W JP2014082623 W JP 2014082623W WO 2015093356 A1 WO2015093356 A1 WO 2015093356A1
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Prior art keywords
piezoelectric
detection electrode
piezoelectric sensor
manufacturing
detection
Prior art date
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PCT/JP2014/082623
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English (en)
Japanese (ja)
Inventor
斉藤誠人
遠藤潤
河村秀樹
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株式会社村田製作所
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Priority to JP2015553495A priority Critical patent/JPWO2015093356A1/ja
Publication of WO2015093356A1 publication Critical patent/WO2015093356A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions

Definitions

  • the present invention relates to a method for manufacturing a piezoelectric sensor that detects that a pressure has been applied.
  • a piezoelectric sensor may be provided not only to detect a touch position on one main surface (operation surface) of the touch panel but also to detect a pressing amount on the operation surface.
  • Patent Document 1 discloses a plate-like piezoelectric sensor in which a first detection electrode and a second detection electrode are provided on both surfaces of a piezoelectric sheet (piezoelectric film).
  • the piezoelectric sensor is bonded to the other main surface opposite to the operation surface of the touch panel.
  • This piezoelectric sensor can detect the amount of pressing on the operation surface by detecting the voltage.
  • the inventor is a substrate portion on which the piezoelectric film and the first detection electrode and the second detection electrode are formed, the substrate portion sandwiching the piezoelectric film between the first detection electrode and the second detection electrode,
  • a piezoelectric sensor having a structure including a detection plate having one main surface bonded to a main surface opposite to the piezoelectric film of the substrate portion has been developed. In this structure, when the detection plate is pressed, the detection plate and the piezoelectric film bonded to the detection plate are bent in the thickness direction, and an output voltage is generated in the piezoelectric sensor.
  • An object of the present invention is to provide a method for manufacturing a piezoelectric sensor capable of suppressing variations in output voltage with respect to temperature changes.
  • the present invention relates to a method for manufacturing a piezoelectric sensor including a piezoelectric film, a substrate portion, and a detection plate.
  • This method for manufacturing a piezoelectric sensor has at least a production process and a heat treatment process.
  • the production process is performed by pasting the main surface of the substrate portion opposite to the piezoelectric film and the main surface of the detection plate that is bent in the thickness direction when pressed by a pressure-sensitive adhesive, and combining the substrate portion and the detection plate Create
  • the composite is heated.
  • the piezoelectric sensor manufactured by this manufacturing method is used in an environment with a temperature change, the output voltage of the piezoelectric sensor generated when the detection plate is pressed and the detection plate and the piezoelectric film are bent becomes the piezoelectric sensor. It is possible to suppress large variations for each individual.
  • the manufacturing method of this piezoelectric sensor includes an electrode formation step, a first pasting step, and a second pasting step.
  • the electrode formation step the first detection electrode and the second detection electrode are formed side by side on the same surface of the substrate portion.
  • a 1st sticking process sticks a piezoelectric film on the 1st detection electrode of a board
  • the second attaching step the substrate portion is folded, the second detection electrode is attached to the piezoelectric film, and the piezoelectric film is sandwiched between the first detection electrode and the second detection electrode.
  • a substrate portion on which a first detection electrode and a second detection electrode are formed, and a substrate portion with a piezoelectric film sandwiched between the first detection electrode and the second detection electrode is prepared.
  • the composite in the heat treatment step, is preferably heat-treated at a temperature of 70 ° C. or higher and 100 ° C. or lower.
  • the composite in the heat treatment step, is preferably heat-treated in an atmosphere at a pressure higher than atmospheric pressure.
  • the heating time can be shortened.
  • the composite in the heat treatment step, is preferably heat-treated for 0.5 hour or more.
  • the pressure-sensitive adhesive is preferably an acrylic pressure-sensitive adhesive.
  • the material of the detection plate is preferably glass or stainless steel.
  • the piezoelectric sensor preferably has a piezoelectric film formed of a chiral polymer.
  • the piezoelectric sensor can reliably detect the displacement of the piezoelectric film with high sensitivity.
  • the chiral polymer is preferably polylactic acid.
  • the piezoelectric sensor can reliably detect the displacement of the piezoelectric film with high sensitivity.
  • the polylactic acid is preferably L-type polylactic acid.
  • the piezoelectric sensor can reliably detect the displacement of the piezoelectric film with high sensitivity.
  • FIG. 2 is a cross-sectional view taken along line AA shown in FIG. It is a top view of the piezoelectric sensor 100 shown in FIG.
  • FIG. 4 is a cross-sectional view taken along line BB shown in FIG.
  • FIG. 4 is an exploded plan view of a sensor unit 16 of the piezoelectric sensor 100 shown in FIG. 3. It is sectional drawing at the time of the pressing force detection of the principal part of the display apparatus 10 shown in FIG. It is a flowchart which shows the manufacturing method of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG.
  • FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a back view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a side view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a figure which shows the relationship between the frequency
  • FIG. 1 is a plan view of a display device 10 including a piezoelectric sensor 100 according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line AA shown in FIG.
  • the display device 10 includes an operation plate 12, a spacer 14A, a spacer 14B, a detection plate 15, a plate-like sensor unit 16, a columnar pusher 17, and a columnar cushion 21.
  • the display device 10 includes a piezoelectric sensor 100 having a spacer 14 ⁇ / b> A and a spacer 14 ⁇ / b> B, a pusher 17, a cushion 21, a sensor unit 16, and a detection plate 15, which will be described in detail later. Further, the display device 10 includes a housing 11 having a size that is portable.
  • the display device 10 is, for example, a tablet or a smartphone.
  • the housing 11 has a rectangular parallelepiped shape with an open top. As shown in FIGS. 1 and 2, the casing 11 is fitted with an operation plate 12 so as to close the opening surface of the casing 11.
  • the operation plate 12 is a laminated body in which a liquid crystal panel, a touch panel, and a cover glass are laminated.
  • One main surface of the operation plate 12 (specifically, one main surface of the outermost cover glass) serves as the operation surface 101.
  • the operation plate 12 is made of a material having translucency.
  • the operation plate 12, the pusher 17, the sensor unit 16, the detection plate 15, and the cushion 21 are arranged in this order from the operation surface 101 side in the housing 11. .
  • the longitudinal direction of the operation surface 101 is referred to as the X direction
  • the short direction of the operation surface 101 is referred to as the Y direction
  • the direction perpendicular to the operation surface 101 that is, the thickness direction of the housing 11
  • the Z direction is referred to as the Z direction.
  • the spacer 14 ⁇ / b> A is disposed in the vicinity of the first side surface parallel to the X direction among the side surfaces of the housing 11.
  • the spacer 14 ⁇ / b> B is disposed in the vicinity of the second side surface (side surface facing the first side surface) of the housing 11.
  • the spacer 14 ⁇ / b> A and the spacer 14 ⁇ / b> B are disposed at a substantially central portion in the X direction of the housing 11.
  • the material of the spacer 14A and the spacer 14B is, for example, PET resin.
  • the material of the detection plate 15 is SUS (stainless steel).
  • the detection plate 15 is supported inside the housing 11 by spacers 14 ⁇ / b> A, 14 ⁇ / b> B, and a cushion 21 so that the main surface on the operation surface 101 side of the detection plate 15 is parallel to the operation surface 101 of the operation plate 12. .
  • the detection plate 15 is disposed at a substantially central portion in the X direction of the housing 11.
  • the longitudinal direction of the detection plate 15 is parallel to the Y direction.
  • the main surface opposite to the operation surface 101 of the sensor unit 16 is attached to the main surface of the detection plate 15 on the operation surface 101 side.
  • the sensor unit 16 is arranged inside the housing 11 so that the main surface on the operation surface 101 side of the sensor unit 16 is parallel to the operation surface 101 of the operation plate 12. Although details will be described later, the sensor unit 16 is attached to the detection plate 15 and constitutes a part of the piezoelectric sensor 100 (see FIG. 3 described later).
  • the pusher 17 is disposed between the operation plate 12 and the sensor unit 16 so as to contact the operation plate 12 and the sensor unit 16.
  • the pusher 17 is disposed at a substantially central portion of the detection plate 15 in the Y direction.
  • the pusher 17 transmits stress from the operation plate 12 to the detection plate 15 and the sensor unit 16.
  • the material of the pusher 17 is, for example, PET resin.
  • the cushion 21 is disposed between the bottom surface inside the housing 11 and the detection plate 15 so as to contact the bottom surface inside the housing 11 and the detection plate 15.
  • the cushion 21 is disposed at a substantially central portion of the detection plate 15 in the Y direction.
  • the cushion 21 is made of a material softer than the pusher 17.
  • the material of the cushion 21 is, for example, a foamable film.
  • the cushion 21 is disposed at substantially the same position as the pusher 17 when viewed from the Z direction (in plan view) and has substantially the same shape and size as the pusher 17. That is, the cushion 21 overlaps the pusher 17 when viewed from the Z direction (direction perpendicular to the main surface of the detection plate 15).
  • the cushion 21 supports the detection plate 15 and presses the detection plate 15 against the pusher 17 via the sensor unit 16. Thereby, even if the operation plate 12 is warped, the pressure applied to the pusher 12 can be reliably transmitted to the detection plate 15 without creating a gap between the operation plate 12 and the pusher 17.
  • FIG. 3 is a plan view of the piezoelectric sensor 100 shown in FIG. 4 is a cross-sectional view taken along line BB shown in FIG.
  • FIG. 5 is an exploded plan view of the sensor unit 16 of the piezoelectric sensor 100 shown in FIG.
  • FIG. 5A is a plan view of the piezoelectric film 31 of the sensor unit 16.
  • FIG. 5B is a plan view of the sensor unit 16 in a state where the substrate unit 36 and the substrate unit 37 are opened and the piezoelectric film 31 is removed.
  • the piezoelectric sensor 100 includes a spacer 14 ⁇ / b> A and a spacer 14 ⁇ / b> B, a detection plate 15, a sensor unit 16, a pusher 17, a cushion 21, a component mounting unit 38, and a circuit component 39. And disposed inside the housing 11.
  • the component mounting unit 38 is a part of the flexible printed circuit board 30.
  • the flexible printed circuit board 30 includes a substrate unit 36 and a substrate unit 37 that constitute a part of the sensor unit 16, and a component mounting unit 38.
  • the material of the flexible printed circuit board 30 is a resin such as polyimide.
  • the first terminal 32 and the second terminal 33 which are conductor patterns are formed on the front main surface of the component mounting portion 38. Further, a circuit component 39 is surface-mounted on the front main surface of the component mounting portion 38. The circuit component 39 is connected to the first detection electrode 34 and the second detection electrode 35 via the first terminal 32 and the second terminal 33.
  • the pusher 17 is pressed against the main surface on the operation surface 101 side in a part of the area of the sensor unit 16.
  • the main surface opposite to the operation surface 101 of the sensor unit 16 is attached to the main surface on the operation surface 101 side of the detection plate 15 with an adhesive layer 90 so that the longitudinal direction thereof is the Y direction.
  • the pressure-sensitive adhesive layer 90 is made of, for example, an epoxy adhesive.
  • the sensor unit 16 includes a piezoelectric film 31, an adhesive layer 91 and an adhesive layer 92, a first detection electrode 34, a second detection electrode 35, a substrate unit 36, and a substrate unit 37.
  • the flexible printed board 30 includes the board part 36 and the board part 37 that constitute a part of the sensor part 16 and the component mounting part 38.
  • the first detection electrode 34, the second detection electrode 35, the piezoelectric film 31, the substrate portion 36, and the substrate portion 37 each have a flat main surface and a back main surface that are flat and face each other in the thickness direction.
  • the upper side surface in FIG. 4 is referred to as a front main surface and the lower side surface is referred to as a back main surface.
  • the substrate portion 37, the second detection electrode 35, the adhesive layer 91, the piezoelectric film 31, the adhesive layer 92, the first detection electrode 34, and the substrate portion 36 are arranged in this order from the front main surface side. It is laminated over the back main surface side.
  • the second detection electrode 35 is laminated on the front main surface of the piezoelectric film 31 via the adhesive layer 91, and the substrate portion 37 is further laminated on the front main surface of the second detection electrode 35.
  • the first detection electrode 34 is laminated on the back main surface of the piezoelectric film 31 via the adhesive layer 92, and the substrate portion 36 is further laminated on the back main surface of the first detection electrode 34.
  • the second detection electrode 35, the first detection electrode 34, the piezoelectric film 31, the substrate portion 37, and the substrate portion 36 have a substantially rectangular outer shape in plan view.
  • the outer shapes of the substrate portion 37 and the substrate portion 36 are slightly larger than the outer shape of the piezoelectric film 31.
  • the substrate unit 36 and the substrate unit 37 are a part of the flexible printed circuit board 30.
  • a slit 18 ⁇ / b> A is provided at a position that partitions the substrate unit 37 and the substrate unit 36.
  • the slit 18A extends in parallel with the long side of the substrate part 37 (or the long side of the substrate part 36).
  • connecting portions 18B are provided on both sides of the slit 18A in the direction in which the slit 18A extends.
  • Each connecting portion 18 ⁇ / b> B connects the substrate portion 37 and the substrate portion 36. Note that the slit 18A and the two connecting portions 18B are not necessarily provided, and may have other shapes.
  • the second detection electrode 35 is formed on the back main surface of the substrate portion 37, and the first detection electrode 34 is formed on the front main surface of the substrate portion 36. That is, the first detection electrode 34 and the second detection electrode 35 are formed side by side on the same surface of the flexible printed circuit board 30.
  • the piezoelectric film 31 is stuck to the front main surface of the first detection electrode 34 with an adhesive layer 92.
  • the piezoelectric film 31 is attached to the back main surface of the second detection electrode 35 with an adhesive layer 91.
  • the pressure-sensitive adhesive layer 91 and the pressure-sensitive adhesive layer 92 are made of, for example, an acrylic pressure-sensitive adhesive.
  • one end of the first terminal 32 is connected to the first detection electrode 34.
  • the other end of the first terminal 32 is connected to the circuit component 39.
  • One end of the second terminal 33 is connected to the second detection electrode 35.
  • the other end of the second terminal 33 is connected to the circuit component 39.
  • the first detection electrode 34 and the second detection electrode 35 are electrically connected to the circuit component 39 via the first terminal 32 and the second terminal 33, respectively.
  • the piezoelectric film 31 is molecularly oriented in a direction 19 that forms about 45 ° with respect to the long and short sides.
  • the piezoelectric film 31 is a film mainly composed of L-type polylactic acid (PLLA).
  • PLLA is a chiral polymer whose main chain has a helical structure, and has a property of expressing piezoelectricity by being oriented in a predetermined axial direction.
  • This piezoelectricity is represented by a piezoelectric tensor component d 14 with the film thickness direction as the first axis and the PLLA molecule orientation direction as the third axis.
  • the piezoelectric film 31 having the piezoelectric tensor component d 14 is a direction intersecting the long sides and short sides in the front main surface and rear main surface, specifically about 45 ° direction with respect to the long sides and short sides, By setting the direction in which the PLLA molecules are oriented, the pressing force from the thickness direction can be detected.
  • the angle of the direction 19 in the piezoelectric film 31 is not limited to an accurate 45 ° with respect to the long side and the short side, and can be any angle close to 45 °. As the angle in the direction 19 is closer to 45 ° with respect to the long side and the short side, the pressing force from the thickness direction can be detected more efficiently.
  • approximately 45 ° in the present invention means an angle in a predetermined range centered on 45 °, for example, about 45 ° ⁇ 10 °. These specific angles may be appropriately determined according to the overall design based on the use of the displacement sensor, the characteristics of each part, and the like.
  • the piezoelectric film 31 is not limited to a film mainly composed of PLLA, and may be a film mainly composed of D-type polylactic acid (PDLA) or polyvinylidene fluoride (PVDF).
  • PDLA D-type polylactic acid
  • PVDF polyvinylidene fluoride
  • the piezoelectricity of the piezoelectric film 31 mainly composed of a chiral polymer such as PLLA or PDLA is not expressed by the polarization of ions like ferroelectrics such as PVDF and PZT, and is characteristic of molecules. It is derived from the spiral structure.
  • the chiral polymer does not need to exhibit piezoelectricity by poling treatment like other polymers such as PVDF and piezoelectric ceramics using a piezoelectric crystal thin film, and PVDF or the like has a piezoelectric constant over time. Although fluctuations are observed and in some cases the piezoelectric constant may be significantly reduced, the piezoelectric constant of the chiral polymer is very stable over time.
  • the piezoelectric film 31 mainly composed of a chiral polymer can obtain a detection voltage corresponding only to the pressing force without depending on the temperature at the detection position at the time of pressing detection.
  • chiral polymers are polymers and have flexibility, so they do not break with large displacements like piezoelectric ceramics. Therefore, the piezoelectric film 31 mainly composed of a chiral polymer is not damaged even if the displacement amount is large, and the displacement amount can be reliably detected.
  • FIG. 6 is a cross-sectional view when the pressing force of the main part of the display device 10 shown in FIG. 1 is detected.
  • FIG. 6 in order to demonstrate a mode that the operation board 12, the sensor part 16, and the detection board 15 bend, these bending is emphasized and shown.
  • the sensor unit 16 and the detection plate 15 of the piezoelectric sensor 100 are pressed in the thickness direction from the operation plate 12 via the pusher 17, and are bent in the thickness direction to generate charges in the piezoelectric film 31.
  • the detection voltage having a voltage value corresponding to the magnitude of the pressing force is a voltage polarity corresponding to the direction of the pressing force. It occurs in.
  • This detection voltage is input to the circuit component 39 via the first terminal 32 and the second terminal 33 as a press detection signal (see FIG. 3).
  • FIG. 7 is a flowchart showing a manufacturing method of the piezoelectric sensor 100 shown in FIG. 8 to 16 are plan views showing manufacturing steps of the piezoelectric sensor 100 shown in FIG.
  • a plurality of piezoelectric sensors 100 are manufactured in a lump.
  • a scene in which one piezoelectric sensor 100 is manufactured will be described in order to simplify the description.
  • a sheet-like flexible printed board 3 having a copper foil 50 attached to the entire surface of one main surface is prepared (S1).
  • the flexible printed circuit board 3 may be formed with copper foil on the entire main surface in order to provide the sensor unit 30 with a shield electrode layer that shields noise.
  • a conductor pattern is formed on one main surface of the flexible printed circuit board 3 by etching or the like (S2). Accordingly, the first detection electrode 34 connected to the first terminal 32 and the second detection electrode 35 connected to the second terminal 33 are formed side by side on the same surface of the flexible printed circuit board 3.
  • the flexible printed circuit board 3 is punched with a press die to form the flexible printed circuit board 30 having the shape shown in FIG. 10 (S3).
  • the flexible printed circuit board 30 on which the first terminal 32, the second terminal 33, the slit 18A, the connecting portion 18B, the first detection electrode 34, the second detection electrode 35, the substrate portion 36, and the substrate portion 37 are formed is prepared.
  • the main surface on the side opposite to the operation surface 101 of the main portion (the portion that becomes the sensor portion 16) of the flexible printed circuit board 30 is the first main surface on the operation surface 101 side of the detection plate 15. Affixed to the surface with an adhesive (S4).
  • the part used as the sensor part 16 is affixed on the detection board 15 with an adhesive agent, and the composite body of the sensor part 16 and the detection board 15 is created after the process of S7.
  • the circuit component 39 is surface-mounted on the front main surface of the component mounting portion 38 (S5). Accordingly, the first detection electrode 34 and the second detection electrode 35 are connected to the circuit component 39 via the first terminal 32 and the second terminal 33.
  • This pressure-sensitive adhesive may be a conductive pressure-sensitive adhesive.
  • the substrate portion 37 is folded, the second detection electrode 35 is attached to the piezoelectric film 31 with an adhesive, and the piezoelectric film 31 is interposed between the first detection electrode 34 and the second detection electrode 35. (S7).
  • This pressure-sensitive adhesive may be a conductive pressure-sensitive adhesive. Since the flexible printed board 30 is flexible and can be greatly deformed, the board portion 37 is easily folded back.
  • the flexible printed circuit board 30 on which the first detection electrode 34 and the second detection electrode 35 are formed by the steps S1 to S3 and S6 to S7 described above, and between the first detection electrode 34 and the second detection electrode 35.
  • a flexible printed circuit board 30 with a piezoelectric film 31 interposed therebetween is prepared.
  • spacers 14A and 14B are mounted on both surfaces of both ends of the detection plate 15 (S10).
  • the piezoelectric sensor 100 of the present embodiment can be manufactured through the above-described steps.
  • the piezoelectric sensor 100 including the composite body of the sensor unit 16 and the detection plate 15 is heat-treated with an autoclave (S11).
  • the piezoelectric sensor 100 is preferably heat-treated at a temperature of 70 ° C. or higher and 100 ° C. or lower for at least 0.5 hours, and more preferably 3 hours or longer.
  • the maximum value of the heating temperature is set according to the heat resistance of the piezoelectric film, and in this case, 100 ° C. or less is suitable.
  • the heating time can be shortened by heat-treating the piezoelectric sensor 100 in an atmosphere at a pressure higher than atmospheric pressure.
  • the inventor has confirmed that in the case of atmospheric pressure, which took 120 minutes at a heating temperature of 90 ° C., the pressure can be reduced to 50 minutes even at the same heating temperature if the atmospheric pressure is 10 atmospheres.
  • the piezoelectric sensor 100 manufactured by this manufacturing method is used in an environment with a temperature change, the output voltage of the piezoelectric sensor 100 generated when the detection plate 15 is pressed and the piezoelectric film 31 is bent becomes piezoelectric. It is possible to suppress a large variation for each individual sensor 100.
  • FIG. 17 is a diagram illustrating the relationship between the number of heat cycles and the output voltage in the piezoelectric sensor 100 that has not undergone the heat treatment process and the piezoelectric sensor 100 that has undergone the heat treatment process.
  • FIG. 17 shows that two piezoelectric sensors 100 that have not undergone a heat treatment process and two piezoelectric sensors 100 that have undergone a heat treatment process are prepared, and after four piezoelectric sensors 100 are exposed to a low temperature environment of ⁇ 40 degrees for 30 minutes.
  • times for 30 minutes is shown.
  • no. 2 is the piezoelectric sensor 100 that has not undergone the heat treatment process.
  • no. Reference numeral 4 denotes a piezoelectric sensor that has undergone a heat treatment process.
  • the output voltage of the piezoelectric sensor 100 generated when the detection plate 15 is pressed is different for each individual piezoelectric sensor 100.
  • the output voltage of the piezoelectric sensor 100 generated when the detection plate 15 is pressed is the piezoelectric sensor. It became clear that it was possible to suppress large variations for every 100 individuals.
  • planar shape of the piezoelectric film 31 is a rectangular shape, it is not restricted to this.
  • the planar shape of the piezoelectric film may be other planar shapes such as a square shape, a circular shape, a trapezoidal shape, a parallelogram shape, a polygonal shape of quadrilateral or more, an elliptical shape, an oval shape, or the like.
  • the material of the detection plate 15 is SUS (stainless steel), but is not limited thereto.
  • the material of the detection plate 15 may be a glass plate, for example.
  • the piezoelectric sensor 100 includes the pusher 17, the cushion 21, the spacer 14A, and the spacer 14B, but is not limited thereto. In implementation, the piezoelectric sensor 100 may not include the pusher 17, the cushion 21, the spacer 14A, and the spacer 14B.
  • the pusher 17 is disposed between the operation plate 12 and the sensor unit 16, but is not limited thereto. At the time of implementation, the operation plate 12 and the sensor unit 16 may be directly attached without arranging the pusher 17, the spacer 14A, and the spacer 14B.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

Selon l'invention, une carte de circuit imprimé souple (3) qui comporte une feuille de cuivre (50) appliquée sur l'intégralité d'une surface principale de celle-ci est préparée. Un motif conducteur est formé sur ladite surface principale. La carte de circuit imprimé souple (3) est soumise à un processus de poinçonnage, et la surface principale de la carte de circuit imprimé souple (30) résultante sur le côté opposé à une surface de manipulation (101) dans une partie principale est appliquée sur une première surface principale d'une plaque de détection (15) sur son côté tourné vers la surface de manipulation (101). Un adhésif sensible à la pression est utilisé pour appliquer un film piézoélectrique (31) à une première électrode de détection (34) sur une partie substrat (36). Une autre partie substrat (37) est repliée et une seconde électrode de détection (35) est appliquée sur le film piézoélectrique (31), prenant en sandwich ledit film piézoélectrique (31) entre la première électrode de détection (34) et la seconde électrode de détection (35). Un matériau composite constitué d'une unité de capteur (16) et de la plaque de détection (15) est traité thermiquement dans un autoclave.
PCT/JP2014/082623 2013-12-17 2014-12-10 Procédé de fabrication de capteur piézoélectrique WO2015093356A1 (fr)

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JP2015553495A JPWO2015093356A1 (ja) 2013-12-17 2014-12-10 圧電センサの製造方法

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JP2013259966 2013-12-17
JP2013-259966 2013-12-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112903147A (zh) * 2021-02-01 2021-06-04 河北工业大学 一种连续监测的柔性压力传感器及复合薄膜层生产方法
CN115448586A (zh) * 2022-10-27 2022-12-09 芜湖东信光电科技有限公司 一种可折叠玻璃及其制备方法

Citations (4)

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JP2001320101A (ja) * 1999-10-01 2001-11-16 Ngk Insulators Ltd 圧電／電歪デバイス及びその製造方法
JP2009053109A (ja) * 2007-08-28 2009-03-12 Aisin Seiki Co Ltd 圧電フィルムセンサ
JP2011221721A (ja) * 2010-04-07 2011-11-04 Daikin Ind Ltd 透明圧電シートをそれぞれ有するフレーム付透明圧電シート、タッチパネル、および電子装置
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