JP6040441B2 - Functional film coating apparatus and manufacturing method using the same - Google Patents

Description

  The present invention relates to a functional film coating apparatus and a manufacturing method using the same, and more particularly to a coating technique at the time of dropping a functional film material onto a substrate.

In an organic EL display panel, a TFT substrate, and the like, a functional film for exhibiting a specific function is used. Examples of the functional film include an organic light emitting layer in an organic EL display panel and an organic semiconductor layer in a TFT substrate.
At present, as panels and substrates have been increased in size, attempts have been made to apply ink containing a functional material by a wet process such as an inkjet method as a method for efficiently forming a functional film. In the wet process, the positional accuracy when the functional film is separately applied to a predetermined position basically does not depend on the substrate size, and there is a merit that the technical barrier to enlargement of the panel is relatively low.

In a wet process using a typical ink jet method, a substrate to be coated is placed on a work table, and an ink head is scanned relative to the substrate. Then, ink is landed from a nozzle of the ink head to a predetermined position on the substrate surface (for example, an opening provided in the substrate) (see Patent Document 1).
In this wet process, different types of functional films may be formed at the same time at adjacent positions on the substrate. In this case, first, a substrate having a first opening, a second opening, and a third opening arranged in parallel along the first direction on the surface is prepared. Next, using the nozzle of the ink head, the first functional material is applied to the first opening, and then the second functional material or the third functional material is applied to the second opening or the third opening. . When applying each functional material, a plurality of droplets are landed and applied in a second direction intersecting the first direction in order to secure a necessary amount of droplets. After the application is finished, each functional material is dried at once and each functional film is formed.

JP 2007-31448 A

  Here, when each functional film is formed on the substrate by a wet process, the second functional material is applied to the second opening adjacent to the liquid reservoir of the first functional material previously applied to the first opening. When the liquid droplets are landed, if the gap between the first and second openings is narrow, there is a problem that the liquid droplets of the second functional material come into contact with the liquid reservoir of the first functional material. Similar problems may occur when the first and third functional materials are applied to the first and third openings and then the second functional material is applied to the central second opening. If different types of functional materials come into contact, each functional film cannot be formed properly.

  As an example, in the manufacturing process of the organic EL display panel, each opening on the substrate is filled with an ink containing an organic light emitting material corresponding to each emission color of red (R), green (G), and blue (B) based on a wet process. The organic light emitting layer of each color is formed by applying and drying at the same time. When carrying out this wet process, it is necessary to properly coat each ink. However, when inks of different emission colors come into contact with each other, the organic emission layer of the desired emission color cannot be formed, and the image display performance of the organic EL display panel Cause a decline.

Here, in recent years, high definition of displays has progressed, and when ink droplets are landed on openings in an organic EL display panel, there is a problem that different types of ink come into contact with each other. Further, even when the same kind of ink is applied, there is a problem that the film thickness of the organic light emitting layer varies if ink droplets to be applied come into contact with different openings.
The present invention has been made in view of the above problems, and even when a plurality of functional films are formed on a substrate by a wet process, a coating apparatus capable of appropriately forming each functional film and the coating apparatus are provided. It aims at providing the manufacturing method of the used functional film.

  In the functional film coating apparatus according to one aspect of the present invention, the first, second, and third openings are spaced in the first, third, and second order along one direction. Along the one direction with respect to the substrate, the first functional material is formed in the first opening, the second functional material is formed in the second opening, and the third functional material is formed in the third opening. Each of the steps of applying the first functional material and the second functional material in the second opening portion when the step of applying the third functional material is performed. When the amount is smaller than the functional material, the center of gravity of the droplet of the third functional material is shifted to the second opening side from the center in the third opening, and the droplet of the third functional material is moved to the second opening. It shall be made to land in 3 openings.

In the functional film coating apparatus according to the above aspect of the present invention, the third opening is third in the third opening with respect to the position near the second opening away from the first opening where a relatively large amount of the functional material is applied. Land the functional material.
This prevents the droplet of the third functional material from coming into contact with the first and second functional materials when applying the third functional material, so even if each opening is fine. The functional materials can be appropriately applied to the first, second, and third openings.

  Moreover, the film thickness of the functional film formed can also be controlled appropriately by preventing the contact between the first, second and third functional materials. Thereby, when many functional films are formed on the substrate, each functional film can be formed satisfactorily.

1 is a block diagram showing a schematic configuration of an organic EL device 1 according to Embodiment 1. FIG. 1 is an external perspective view showing an example of an external appearance of a set including an organic EL device 1. FIG. FIG. 2 is a partial cross-sectional view and a front view of the display panel 10. 2 is a functional block diagram of the inkjet system 1000. FIG. 1 is a perspective view illustrating a configuration of an inkjet system 1000. FIG. 3 is a cross-sectional view showing a configuration of a head unit 301. 4 is a diagram showing a method for manufacturing the organic EL display panel 10. FIG. 4 is a cross-sectional view showing a method for manufacturing the organic EL display panel 10. FIG. It is a front view which shows the mode of the application | coating target board | substrate at the time of ink application. It is a figure for demonstrating the arrangement | positioning relationship with the head part 301 and an application | coating target substrate, and the method of calculating | requiring an ink volume. It is a fragmentary sectional view which shows the mode (after 1 color application | coating) of the application | coating target board | substrate at the time of ink application. It is a fragmentary sectional view which shows the mode (after 2 colors application | coating) of the application | coating target board | substrate at the time of ink application. It is a fragmentary sectional view which shows the mode (after 3 colors application | coating) of the application | coating target board | substrate at the time of ink application. It is a fragmentary sectional view which shows the mode (after 3 color application | coating) at the time of the ink application which concerns on a modification. FIG. 9 is a cross-sectional view showing a method for manufacturing a TFT substrate according to Embodiment 2. FIG. 9 is a cross-sectional view showing a method for manufacturing a TFT substrate according to Embodiment 2. FIG. 9 is a cross-sectional view showing a method for manufacturing a TFT substrate according to Embodiment 2.

<Aspect of the Invention>
In the coating apparatus according to one embodiment of the present invention, the first, second, and third openings are formed on the substrate formed in the first, third, and second intervals along the one direction. A coating apparatus that applies and applies a functional material to each opening, and discharges and applies the first functional material to the first opening along the one direction. A second discharge portion for discharging and applying a second functional material to the second opening, and a third discharge portion for discharging and applying a third functional material to the third opening, When the third functional material discharges the third functional material, if the second functional material in the second opening is less than the first functional material in the first opening, the three ejection units start from the center in the third opening. Also, the center of gravity of the droplet of the third functional material is shifted toward the second opening, and the droplet of the third functional material is placed in the third opening. It is assumed to be bullet.

The “opening” here refers to a recess formed with a reduced thickness on the surface of the substrate, or a recess formed by arranging another member on the substrate, and includes a through hole of the substrate. Make it not exist.
Here, as another aspect of the present invention, each of the first, second, and third discharge portions may include the functional material in any one of the corresponding first, second, and third openings. Position control for controlling the relative positions of the substrate and the first, second, and third discharge units. A portion.

  According to another aspect of the present invention, a partition is formed between the first, third, and second openings of the substrate, and the first discharge unit and the second discharge unit are configured as the first discharge unit. The first functional material and the second functional material are formed on the first partition between the first opening and the third opening and on the second partition between the third opening and the second opening. The first functional material is applied so as to run on each of the predetermined widths along the one direction, and the running width of the second functional material on the second partition wall is the first functionality on the first partition wall. The first functional material and the second functional material can each be discharged so as to be smaller than the running width on the material.

Further, as another aspect of the present invention, the third discharge portion is shifted to a position closer to the second opening than the center of the third opening, and the droplet of the third functional material is transferred to the third opening. It can land on 3 openings.
As another aspect of the present invention, the third discharge section drops the third functional material at a plurality of positions in one third opening, and the third discharge section includes The amount of droplets per droplet that is landed on a position close to the two openings can be made larger than the amount of droplets per droplet that are landed on other positions.

As another aspect of the present invention, the plurality of positions may include two or more positions along the one direction.
In the functional film coating apparatus according to one embodiment of the present invention, the first, second, and third openings are formed at intervals in the first, third, and second order along one direction. An application apparatus that applies and applies a functional material to each opening on the substrate, and discharges and applies the first functional material to the first opening along the one direction. A first discharge section; a second discharge section that discharges and applies the second functional material to the second opening; and a third discharge section that discharges and applies the third functional material to the third opening. When the third discharge portion discharges the third functional material, the second functional material is applied in the second opening and the third functional material is applied in the third opening. In the opening where the functional material is applied earlier than the center of the third opening, the second opening and the third opening. By shifting the center of gravity of the droplets of the serial third functional material, and droplets of the third functional material shall be landed on the third in the opening.

  In the method for manufacturing an organic EL panel according to one aspect of the present invention, a first step of forming a plurality of first electrodes above the substrate, and the first, second, and second above the first electrodes. A second step of forming partition walls at intervals in the first, third, and second order so that three openings exist along one direction, and the first step along the one direction. The step of applying the first functional material to the opening, the step of applying the second functional material to the second opening, and the step of applying the third functional material to the third opening are sequentially performed. And performing the step of applying the third functional material, including the third step of forming the functional layer and the fourth step of forming the second electrode above each functional layer, When the second functional material in the second opening is less than the first functional material in the first opening, The center of gravity of the droplet of the third functional material is shifted toward the second opening from the center in the third opening, and the droplet of the third functional material is landed in the third opening. To do.

Here, as another aspect of the present invention, when performing the step of applying the third functional material,
The first functional material applied on the first partition between the first opening and the third opening, and on the second partition between the third opening and the second opening, and the The second light-emitting material runs on the first partition with a predetermined width, and the width of the second functional material on the second partition is set to the first functional material on the first partition. It is also possible to make it smaller than the riding width.

As another aspect of the present invention, in the step of applying the third functional material, the first functional material is shifted along the one direction to a position closer to the second opening than the center of the third opening. The droplet of the third functional material can be landed on the third opening.
As another aspect of the present invention, in the step of applying the third functional material, the third functional material is dropped at a plurality of positions in the third opening, and the third functional material is in the third opening. It is also possible to make the amount of droplets per droplet landed at a position close to the two openings larger than the amount of droplets per droplet landed at other positions.

As another aspect of the present invention, the plurality of positions may include two or more positions along the one direction.
As another aspect of the present invention, the first, second, and third openings have an opening shape surrounded by a pair of long sides and a pair of short sides. It is also possible that the extending direction of the short side is present as the first direction.

Here, as another aspect of the present invention, the first, second, and third functional materials include materials of the same color, and in the applying step, the first, second, and third openings in the first, second, and third openings. The volumes of the first, second, and third functional materials can be made different from each other.
Alternatively, as another aspect of the present invention, the first, second, and third functional materials may include different colors.

  Here, the coating apparatus according to one embodiment of the present invention includes a substrate in which the first, second, and third openings are formed at intervals in the first, third, and second order along one direction. On the other hand, a coating apparatus that applies and applies a functional material to each opening, and the first functional material is discharged and applied to the first opening along the one direction. A discharge portion, a second discharge portion for discharging and applying a second functional material to the second opening, and a third discharge portion for discharging and applying a third functional material to the third opening, The amount of liquid droplets of the functional material discharged from the second discharge portion to the second opening portion is the amount of liquid droplets of the first functional material discharged from the first discharge portion to the first opening portion. Less than the center in the third opening, the center of gravity of the droplet of the third functional material is shifted toward the second opening, so that the third functionality The charge of the droplet is assumed to be landed on the third in the opening.

  The organic EL panel manufacturing method according to one aspect of the present invention includes a first step of forming a plurality of first electrodes above a substrate, a first step, a second step, and a second step above each first electrode. A second step of forming partition walls in order of the first, third, and second so that a third opening exists along one direction, and the second step along the one direction. A step of applying a first functional material to one opening, a step of applying a second functional material to the second opening, and a step of applying a third functional material to the third opening. A step of sequentially forming a functional layer and a fourth step of forming a second electrode above each functional layer, and applying the third functional material. When executing, the second functional material is applied in the second opening, and the third functional material is applied in the third opening. In the case where the functional material is applied, the liquid of the third functional material is applied to the opening in which the functional material is applied earlier than the center of the third opening. It is assumed that the droplet of the third functional material is landed in the third opening by shifting the center of gravity of the droplet.

  The thin film transistor manufacturing method according to one embodiment of the present invention includes a gate electrode formation step of forming a gate electrode above a substrate, a step of forming a gate insulating layer so as to face the gate electrode, and the gate insulation Forming a source electrode and a drain electrode above the layer; and forming a first opening, a second opening, and a third opening along the one direction above the source electrode and the drain electrode. , A step of forming partition walls in the order of the third and second intervals, a step of applying a first semiconductor material to the first opening along the one direction, and a second of the second opening. Semiconductor formation for forming a semiconductor layer electrically connected to the source electrode and the drain electrode by sequentially performing any one of a step of applying a semiconductor material and a step of applying a third semiconductor material to the third opening In the step of applying the third semiconductor material, when the second semiconductor material in the second opening is less than the first semiconductor material in the first opening, the center of the third opening Also, the center of gravity of the droplet of the third semiconductor material is shifted toward the second opening, and the droplet of the third semiconductor material is landed in the third opening.

  The thin film transistor manufacturing method according to one embodiment of the present invention includes a gate electrode formation step of forming a gate electrode above a substrate, a step of forming a gate insulating layer so as to face the gate electrode, and the gate insulation Forming a source electrode and a drain electrode above the layer; and forming a first opening, a second opening, and a third opening along the one direction above the source electrode and the drain electrode. , A step of forming partition walls in the order of the third and second intervals, a step of applying a first semiconductor material to the first opening along the one direction, and a second of the second opening. Semiconductor formation for forming a semiconductor layer electrically connected to the source electrode and the drain electrode by sequentially performing any one of a step of applying a semiconductor material and a step of applying a third semiconductor material to the third opening In the step of applying the third semiconductor material, the second semiconductor material is applied to the second opening, and the third semiconductor material is applied to the third opening. The center of gravity of the droplet of the third semiconductor material is shifted from the center of the third opening to the opening of the second opening and the third opening that has been coated with the semiconductor material. 3 droplets of semiconductor material are landed in the third opening.

The thin film transistor manufacturing method according to one embodiment of the present invention includes a gate electrode formation step of forming a gate electrode above a substrate, a step of forming a gate insulating layer so as to face the gate electrode, and the gate insulation Forming a source electrode and a drain electrode above the layer; and forming a first opening, a second opening, and a third opening along the one direction above the source electrode and the drain electrode. , A step of forming partition walls in the order of the third and second intervals, a step of applying a first semiconductor material to the first opening along the one direction, and a second of the second opening. Semiconductor formation for forming a semiconductor layer electrically connected to the source electrode and the drain electrode by sequentially performing any one of a step of applying a semiconductor material and a step of applying a third semiconductor material to the third opening In the step of applying the third semiconductor material, the amount of the functional material discharged from the second discharge portion to the second opening is determined by the first discharge portion by the first discharge portion. When the amount of droplets of the first functional material discharged to one opening is smaller than the center of the third opening, the center of gravity of the droplets of the third functional material is closer to the second opening than the center in the third opening. It is assumed that the liquid droplet of the third functional material is landed in the third opening by shifting.
<Embodiment 1>
(Organic EL device 1)
FIG. 1 is a block diagram showing a schematic configuration of an organic EL device 1 according to the first embodiment.

The organic EL device 1 includes an organic EL display panel 10 and a drive control unit 11 connected thereto.
In the organic EL display panel 10, a plurality of organic EL elements are arranged in a matrix in the X direction and the Y direction intersecting each other (in this case, orthogonal to each other).
As an example, the drive control unit 11 includes four drive circuits 12 to 15 and a control circuit 16. The number of drive circuits may be other than this.

As a usage form of the organic EL device 1, for example, as shown in FIG. 2, it can be a part of a television system combined with an audio device. The organic EL device 1 does not require a backlight unlike a liquid crystal display (LCD) and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design design.
(Organic EL display panel 10)
FIG. 3A is a partial cross-sectional view showing one pixel of the organic EL display panel 10. FIG. 3B is a partial front view showing one pixel of the organic EL display panel 10.

  In the organic EL display panel 10, red (R), blue (B), and green (G) light-emitting organic EL elements 100 </ b> R, 100 </ b> G, and 100 </ b> B are arranged in the X direction in each region partitioned by the bank 105. Are arranged along. In the organic EL display panel 10, each element 100R, 100G, 100B constitutes a subpixel. As shown in FIG. 3 (b), one pixel (pixel) is configured with three adjacent organic EL elements 100R, 100G, and 100B as one set. A bus bar region 100X is provided for each pixel along the X direction.

  As shown in FIG. 3A, the organic EL display panel 10 includes a TFT substrate 110 (hereinafter simply referred to as “substrate 110”), an anode 102 stacked on the upper surface in the same order, and an electrode coating layer. 103 and a hole injection layer 104. On the hole injection layer 104, any one of an organic light emitting layer 106R (first organic light emitting layer), 106G (second organic light emitting layer), 106B (third organic light emitting layer), A transport layer 107, a cathode 108, and a sealing layer 109 are included.

  The anode 102, the electrode coating layer 103, and the organic light emitting layers 106R, 106G, and 106B are individually formed for each of the organic EL elements 100R, 100G, and 100B. The hole injection layer 104, the electron transport layer 107, the cathode 108, and the sealing layer 109 are uniformly formed over the entire surface of the substrate 110. The organic EL elements 100R, 100G, and 100B are of a top emission type as an example.

An auxiliary electrode 102A and an electrode coating layer 103A are stacked in the same order in the bus bar region 100X.
Next, the coating apparatus 1000 used for the wet process for forming the organic light emitting layers 106R, 106G, and 106B will be described.
(Coating device 1000)
FIG. 4 is a functional block diagram of the coating apparatus 1000. The coating apparatus 1000 includes a work table 20, an ink discharge unit 30 (first ink discharge unit 30R, second ink discharge unit 30G, and third ink discharge unit 30B), a droplet observation device 40, and a control device (PC). 25.
[Control device 25]
The control device 25 includes a CPU 250, a storage unit 251 (including a large capacity storage unit such as an HDD), a display unit (display) 253, and an input unit 252. Specifically, the control device 25 is a personal computer (PC).

The storage unit 251 stores a work table 20 connected to the control device 25, a control program for driving the ink ejection unit 30, and the like. When the coating apparatus 1000 is driven, the CPU 250 performs predetermined control based on an instruction input by the operator through the input unit 252 and each control program stored in the storage unit 251.
Further, in the storage means 251, the nozzle movement deviated by the nozzle movement amount A from the nozzle standard position P ₀ based on the data (X _R , X _L ) relating to the width on the bank top when each color ink is used. _A control program for calculating the position PA (hereinafter referred to as “nozzle position control program”) is stored. The storage unit 251 stores information on the substrate to be coated (size, position, depth, number, etc. of the opening).
[Work Table 20]
FIG. 5 shows the configuration of the coating apparatus 1000 excluding the control apparatus 25.

The work table 20 shown in FIG. 5 is a so-called gantry type, and a base 20, stands 201 </ b> A, 201 </ b> B, 202 </ b> A, 202 </ b> B erected at the four corners of the upper surface of the base 20, and a substrate to be coated at the center of the base 20. And a stage ST for mounting.
A guide shaft 203A (203B) is pivotally supported in parallel along the longitudinal (Y) direction of the base 200 on the stands 201A and 201B (202A and 202B). The linear motor unit 204 (205) is inserted through the guide shaft 203A (203B). On the linear motor units 204 and 205, a gantry unit 210 is mounted so as to straddle the stage ST.

The linear motor units 204 and 205 are connected to the motor control unit 213 shown in FIG. 4 via the cable N ₁ . The motor control unit 213 drives and controls the linear motor units 204 and 205 and the servo motor 221. When the linear motor units 204 and 205 are driven in the same direction at a constant speed, the gantry unit 210 reciprocates freely along the longitudinal (X) direction of the guide shafts 203A and 203B.

  The gantry unit 210 is provided with a moving body (carriage) 220 made of an L-shaped pedestal. The moving body 220 is provided with a servo motor section (moving body motor) 221, and a gear (not shown) is disposed at the tip of the shaft of the servo motor section 221. The gear is fitted in a guide groove 211 formed along the longitudinal direction (Y direction) of the gantry unit 210. Inside the guide groove 211, a fine rack is formed along the longitudinal direction. Since the gear meshes with the rack, when the servo motor unit 221 is driven, the moving body 220 moves precisely reciprocally along the Y direction by a so-called pinion rack mechanism.

As shown in FIG. 4, the motor control unit 213 is connected to a CPU 250 in the control device 25. When driving the coating apparatus 1000, the CPU 250 drives and controls the linear motor units 204 and 205 via the motor control unit 213 based on the drive control program stored in the storage unit 251. As a result, the relative positions of the head portions 301R, 301G, and 301B of the ink discharge unit 30 and the application target substrate are controlled.
[Ink ejection unit 30]
The ink ejection units 30 (the first ink ejection unit 30R, the second ink ejection unit 30G, and the third ink ejection unit 30B) are arranged with the same configuration in the coating apparatus 1000 so as to correspond to each RGB color.

The first ink discharge unit 30R, the second ink discharge unit 30G, and the third ink discharge unit 30B include head units 301R, 301G, and 301B, and discharge control units 300R, 300G, and 300B connected thereto.
Hereinafter, the configuration of the first ink discharge unit 30R will be described as an example.
As shown in the sectional view of FIG. 6, the head portion 301R includes a piezoelectric element 3010R, a liquid chamber 3020R, a nozzle 3030R, and a diaphragm 3040R.

The piezoelectric element 3010R is a piezoelectric element, for example, a laminated body in which a plate-like piezoelectric body 3013 made of lead zirconate titanate or the like is sandwiched between a pair of electrodes 3011 and 3012. The piezoelectric element 3010R is stacked and disposed on the vibration plate 3040R.
The liquid chamber 3020R is a space for storing ink immediately before being ejected from the nozzle 3030R. The ink in the liquid chamber 3020R is supplied from the outside by an infusion tube L1 connected to the head portion 301R as shown in FIG.

The nozzle 3030R is an ultrafine nozzle, and is formed by subjecting the housing 3050R to electrical discharge machining together with the liquid chamber 3020R. The nozzle 3030R is formed to communicate with the liquid chamber 3020R on the upstream side.
The vibration plate 3040R is a thin plate made of stainless steel or nickel, and is disposed on the liquid chamber 3020R. By deforming together with the deformation of the piezoelectric element 3010R, the volume of the liquid chamber 3020R is adjusted to be reversibly reduced or restored.

The head portion 301R includes a plurality of ink discharge mechanism portions 304R including the components 3010R to 3040R described above. The ink discharge mechanism portions 304R are formed in a single row over a plurality (for example, several thousand) at regular intervals along the longitudinal direction of the head portion 301R.
The discharge controller 300R includes a drive circuit for individually driving each piezoelectric element 3010R. When the device 1000 is driven, the piezoelectric element 3010R is deformed by applying a waveform voltage having a frequency of, for example, several hundred Hz to each piezoelectric element 3010R. With this deformation, the diaphragm 3040R vibrates, and the volume of the liquid chamber 3020R is reduced or restored. When the volume of the liquid chamber 3020R decreases, ink is ejected (dropped) from the nozzle 3030R. As the voltage waveform, for example, a waveform including a rectangular pulse voltage can be used. The timing of voltage application from the discharge controller 300R to each piezoelectric element 3010R is adjusted by the CPU 250 instructing based on a predetermined control program stored in the storage unit 251. The CPU 250 specifies the position information of the opening on the substrate to be coated and the scanning speed of the head portion 301R, which are input in advance by the operator using the input unit 252 and stored in the storage unit 251, and the pulse voltage is determined at a predetermined timing. By applying to each piezoelectric element 3010R, ink droplets can be ejected from the nozzle 3030R and landed on the target position.

In the configuration example of FIG. 5, the three discharge control units 300 </ b> R, 300 </ b> G, and 300 </ b> B are housed in one housing and fixed to the moving body 220. The head portions 301R, 301G, and 301B are integrally formed as an example, and are suspended from the main body portion 302.
Further, by adjusting the angle of the head portion 301R with respect to the stage ST of the work table 20, the relative pitch of the nozzles 3030R with respect to the application target substrate can be adjusted.

Furthermore, the arrangement of the nozzles 3030R of the head portion 301R is not limited to the one row described above. For example, the nozzles 3030R can be formed over a plurality of rows, or the nozzles 3030R can be formed in a plurality of rows and in a staggered manner, and the pitch between the nozzles 3030R can be adjusted narrowly.
In general, ink droplets dropped from each nozzle 3030R when a constant voltage is applied are uniform. Usually, the amount of ink droplets is proportional to the size of the ink droplets.
[Droplet observation device 40]
The droplet observation apparatus 40 functionally includes a droplet observation camera 402 and a camera control unit 400.

  Specifically, as shown in FIG. 5, the droplet observation camera 402 is a known CCD camera, and is arranged with the objective lens 403 facing downward. A cable 404 extends from the rear end of the droplet observation camera 402 and is connected to the camera control unit 400. The camera control unit 400 is connected to the CPU 250. Although the droplet observation camera 402 is fixed to the fixing base 401, the fixing method is not limited to this, and the droplet observation camera 402 may be directly fixed to the base 200. The droplet observation camera 402 is connected to the camera control unit 400 via a cable 404, and the camera control unit 400 is connected to the CPU 250 as shown in FIG.

In the coating apparatus 1000, as shown in FIG. 5, the droplet observation camera 402 is directed to a position where the state of the ink droplets applied to the application target substrate can be imaged.
Thereby, at the time of imaging, image data of still images and moving images can be obtained continuously in synchronization with the strobe emission of the light emission light built in the droplet observation camera 402. The CPU 250 of the control device 25 stores the captured image data in the storage unit 251 and displays it on the display 153 based on a predetermined control program. Further, the CPU 250 calculates the width of the droplet that has landed on the top of the bank based on the area of the droplet indicated in the image data in accordance with the operator's selection.
(Overall manufacturing method of the organic EL display panel 10)
An example of a method for manufacturing display panel 10 according to Embodiment 1 will be described with reference to FIGS. Naturally, this manufacturing method is only an example, and the organic EL display panel 10 can be manufactured by other known methods other than the organic light emitting layer forming step using a wet process.

First, a substrate body is prepared (S1 in FIG. 7), and a wiring portion including a TFT (thin film transistor) is formed on the surface (S2 in FIG. 7). Then, a planarizing film is uniformly formed on the wiring portion while the contact hole is present at a position corresponding to the gate / drain electrode of the driving TFT in the wiring portion (S3 in FIG. 7). Thereby, the substrate 110 is obtained.
Next, the anode 102 and the transparent conductive film (electrode coating layer 103) are sequentially stacked on the upper surface of the substrate 110 in accordance with the respective formation planned areas for forming the organic EL elements 100R, 100B, 100G and the bus bar area 100X. . In addition, an auxiliary electrode 102A and an electrode covering layer 103A are stacked in the bus bar region 100X. (S4 and S5 in FIG. 7, FIG. 8A). At this time, the anode 102 and the SD electrode of the wiring part are electrically connected through the contact hole.

Next, the hole injection layer 104 is laminated so as to cover the entire substrate plane of the substrate 110 including the electrode coating layer 103 (S6 in FIG. 7).
Here, the anode 102 is formed by, for example, forming an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the Ag thin film using a photolithography method.

The electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode 102 using a sputtering method or the like and patterning the ITO thin film using a photolithography method or the like.
As a method for forming the hole injection layer 104, first, a metal film is formed on the surface of the substrate 110 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to obtain the hole injection layer 104.

Next, as shown in FIG. 8B, a bank material layer 1050 is formed so as to cover the hole injection layer 104 by using, for example, a spin coat method. The bank material layer 1050 can be formed using a photosensitive resist material such as an ultraviolet curable resin, an acrylic resin, a polyimide resin, or a novolac phenol resin.
Next, a mask 501 having an opening 502 having a predetermined pattern is disposed above the bank material layer 1050 at a location where a bank is to be formed. Here, the width D ₀ of the opening 502 is matched to the bank width, and S ₁ or S ₂ corresponding to the X direction gap (the X direction width of the light emitting region and the bus bar region) of the bank 105 where the X direction width of the mask is to be formed. It is set.

In this state, ultraviolet rays (UV) are irradiated through the openings 502 of the mask 501 to perform exposure processing. Thereafter, the bank 105 can be formed by performing predetermined development processing and baking processing (S7 in FIG. 7).
When an inorganic material is used as the material of the bank 105, a coating method or the like can be adopted as a method for forming the bank material layer 1050, as in the case of using an organic material. Patterning of the inorganic material is performed by etching using a predetermined etching solution (tetramethylammonium hydroxide (TMAH) solution or the like) based on a photoetching method.

Next, as shown in FIG. 8C, ink droplets containing an organic light emitting material are applied to the openings 101R, 101G, and 101B, which are openings separated by the bank 105, in the Y direction based on a predetermined wet process. A plurality of droplets are dropped along and applied. Here, FIG. 9 scans the head portion 301 of the apparatus 1000 in the X direction (the so-called lateral beating), the X direction with reference to each nozzle 3030G nozzle numbers _{n 1, n 4 ~n 11,} n 14 ~n 21 This shows a state in which ink droplets are dropped into each predetermined opening 101G arranged. In consideration of the Y direction pitch of the bank 105, the nozzles 3030G of the nozzle numbers n ₂ , n ₃ , n ₁₂ , n ₁₃ , and n ₂₂ are not used. The openings 101R, 101G, and 101B have shapes in which the Y direction is a long side and the X direction is a short side. Ink drops, the opening 101R, 101G, along each center line Y ₁ in the 101B to land ink droplets at a predetermined pitch.

  In the example of FIG. 9, an example is shown in which ink is dropped using a total of eight nozzles 3030G in one opening 101G, but the number of nozzles used may be other than this. FIG. 9 shows a case in which the ink discharge unit 30 (head unit 301) is scanned in the row (X) direction with respect to a long opening having a short side and a long side (so-called horizontal strike). Yes. In the drawing, D indicates the X-direction width of the top of the bank 105, and W indicates the X-direction width of the openings 101R, 101G, and 101B.

After all the ink is applied, the solvent is evaporated and dried in a baking process or at room temperature. Thereby, each organic light emitting layer 106R, 106G, 106B is appropriately formed (S8 in FIG. 7).
Next, an electron transport layer 107 and a cathode 108 are sequentially formed over the upper surfaces of the organic light emitting layers 106R, 106G, and 106B and the surface of the bank 105 based on a vacuum deposition method or the like (S9 and S10 in FIG. 7, and FIG. 8 (d). )).

Then, the organic EL display panel 10 is completed by forming the sealing layer 109 on the upper surface of the cathode 108 (S11 in FIG. 7).
(Formation of organic light emitting layers 106R, 106G, 106B by wet process)
Next, a wet process for forming the organic light emitting layers 106R, 106G, and 106B, which is one of the main features of the first embodiment, will be described in detail together with problems.
[Conventional problem]
FIG. 10A shows an arrangement relationship between the application target substrate 10X and the nozzle 3030G of the head portion 301G. The application target substrate 10X shows a cross section in the X direction.

When the nozzles 3030R, 3030G, and 3030B are made to correspond to the openings 101R, 101G, and 101B (openings provided in the bank 105) along the X direction, the CPU 250 and the discharge controllers 300R, 300G, and 300B usually opening 101R, 101G, is the X-direction central position of 101B (the passing through the center line Y ₁ of FIG. 9) and the reference position P ₀ for ink deposition. The ink droplets CPU 250, each nozzle 3030R, 3030G, is dropped at a predetermined timing aiming standard position P ₀ from 3030B.

Here, when ink is landed on the opening 101G, if ink reservoirs 1060R and 1060B already exist in the aperture 101R or 101B adjacent to the aperture 101G, the dropped ink droplets come into contact with the ink reservoirs 1060R and 1060B. As a result, problems such as bridging and color mixing may occur.
FIG. 13B is a cross-sectional view showing a configuration of a manufacturing process of a conventional organic EL display panel. In this figure, an anode 102 and a hole injection layer 104 are formed on the surface of a substrate 110, banks 105 having a constant width are formed at regular intervals, and an ink reservoir containing an organic light emitting material is formed in a light emitting region between adjacent banks 105. 1060R, 1060G, and 1060B are shown immediately after being applied with predetermined filling amounts, respectively.

  Immediately after ink application, the ink reservoirs 1060R, 1060G, and 1060B are undried, so that each liquid level rises from between the banks 105 and 105 and protrudes upward. Therefore, if the ink droplet to be dropped does not maintain a sufficient gap with each of the already applied ink reservoirs 1060R, 1060G, and 1060B, the ink droplets come into contact with any of the ink reservoirs 1060R, 1060G, and 1060B and color mixing occurs. Can't apply correctly. In this figure, as a result of dropping the green ink onto the substrate coated with the red ink reservoir 1060R, the green ink comes into contact with the red ink reservoir 1060 during the dropping, and finally the ink reservoirs 1060R and 1060G are placed on the top of the partition wall 105. It shows the state of color mixing when connected (occurrence of a bridge).

Such a problem becomes conspicuous with the miniaturization of the organic EL element 100 which is a sub-pixel.
[Wet process settings]
Here, when the problem due to the contact with the ink filled in the adjacent application region is considered, it is necessary to consider the landing position of the dropped ink droplet depending on the ink filling state in the adjacent application region. Therefore, in the wet process of the first embodiment, the CPU 250 of the control device 25 controls the work table 20 based on the nozzle position control program stored in the storage unit 251 to determine the ink landing position from the nozzle 3030G as follows. To control.
(Case A): When ink is applied only to one of the openings 101R and 101B adjacent to the opening 101G In this case, the position where the outer periphery of the ink reservoir filled in one of the adjacent openings does not contact It is necessary to land ink droplets on the ink. Therefore, according to the nozzle control program, the CPU 250 of the control device 25 moves the nozzle position by the predetermined movement amount A from the standard position P ₀ to the uncoated opening side through the discharge control unit 300G, and sets the dropping position. The movement position P _A1 is corrected (FIG. 11). As a result, the center of gravity of the ink droplet to be dropped is brought close to the uncoated opening side to prevent the ink droplet from coming into contact with the ink reservoir applied to the adjacent opening during dropping. Further, when the ink dropping position is always the standard position P ₀ , high accuracy is required so that the position where ink is actually dropped does not deviate from the standard position P ₀ . On the other hand, compared to the case where the standard position is P ₀ , by setting the dropping position to P _A1 , even if the actual dropping position of the ink is slightly shifted, it is difficult to contact the ink in the adjacent opening, A margin can be given to the application position control of the ink jet apparatus.
(Case B): In the case where there are ink reservoirs having different running widths X _R and X _L in both of the openings 101R and 101B adjacent to the opening 101G In this case, the ink reservoir filled in both the adjacent openings It is necessary to land at a position where the outer periphery of the battery does not contact. For this reason, the CPU 250 of the control device 25 follows the nozzle control program and supplies a predetermined _value from the standard position P ₀ to the smaller opening portion of the ink droplet landing widths X _R and X _L via the ejection control unit 300G. The nozzle position is moved by the movement amount A, and the dropping position is corrected to the movement position P _A2 (FIG. 12). As a result, the center of gravity of the ink droplet to be dropped is brought close to the opening having the smaller run width, thereby preventing the ink droplet from coming into contact with the ink reservoir applied to the adjacent opening during the dropping.

Here, there is no limitation on the cause of “difference in the width of rise” on the top of the bank of ink droplets. For example, it includes both cases where the filling amount is different and characteristics such as density and viscosity are different.
In addition, as the elapsed time since the ink is dropped, the width of the ride on the bank top tends to decrease.
(Variation 1 of Case B): When ink is applied to both of the openings 101R and 101B adjacent to the opening 101G, and the opening 101R is applied before the opening 101B. There is a tendency for the ink to be dried at the opening 101R having a long elapsed time of ink dripping, so that the width of the ink on the top of the bank is smaller than that of the opening 101B. For this reason, it is necessary to land the ink droplets at a position where the outer periphery of the ink reservoir filled in the opening 101B, which is delayed in drying, does not come into contact. Therefore, according to the nozzle control program, the CPU 250 moves the nozzle position by the predetermined movement amount A from the standard position P ₀ to the opening 101R side via the discharge control unit 300G, and corrects the dropping position to the movement position P _A1 . To do.

As a result, the center of gravity of the ink droplet to be dropped is brought close to the previously applied opening 101R side, and the ink droplet later contacts the ink reservoir applied to the opening 101B during the dropping. To prevent.
(Variation 2 of Case B): Ink was applied to both of the openings 101R and 101B adjacent to the opening 101G, and the amount of ink dropped on the opening 101B was larger than the amount of ink dropped on the opening 101R. In the case where the amount is large In this case, the width of the ink on the top of the bank tends to be smaller in the opening 101R where the amount of dropped ink is smaller than in the opening 101B. Therefore, in particular, it is necessary to land the ink droplet at a position where the outer periphery of the ink reservoir filled in the opening 101B does not contact. Therefore CPU250 in accordance with nozzle control program, via the discharge control unit 300G, the standard position P ₀ by a predetermined amount of movement A, move the nozzle position toward the opening 101R, the movement position of the dropping position P _A1 To correct.

As a result, the center of gravity of the ink droplet to be dropped on the opening 101G is brought close to the opening 101R, and the ink droplet is prevented from coming into contact with the ink reservoir applied to the opening 101B during the dropping.
(Case C): When ink is dropped from a plurality of nozzle positions along the X direction FIG. 14 shows a third modification of the first embodiment. This figure shows a case where ink is applied to the opening 101G using a head portion 301G ′ having two nozzles 3030GA and 3030GB arranged in parallel along the X direction. Even in this case, the CPU 250 of the control device 25 follows the nozzle control program and moves from the standard position P ₀ (in this case, between the nozzles 3030GA and 3030GB) to the moving position PA in the direction of the smaller riding width (right side of the drawing). _The wet process can be performed by shifting the head portion 301G ′ by ₃ .

  Further, the CPU 250 sets the droplet amount of the ink droplet dr1 dropped from the nozzle 3030GA adjacent to the smaller ink run-up width so as to be larger than the droplet amount of the ink droplet dr2 dropped from the nozzle 3030GB, Generation of color mixing during ink dropping can be effectively prevented. The ink droplet amount can be adjusted by the CPU 250 controlling the voltage applied to the piezoelectric element 3010G via the ejection control unit 300G based on a predetermined program stored in the storage unit 251 (FIG. 6).

  In this case C, the nozzles 3030GA and 3030GB are arranged in two rows in the X direction in the head portion 301G '. However, the nozzles may be arranged in three or more rows in the X direction. In this case, at least along the X direction, the discharge amount from the nozzle closest to the adjacent opening with the smaller bank running width of the ink droplet is set to be larger than the discharge amount from the other nozzles. do it.

Alternatively, by scanning the head portion 301 ′, two ink droplets are sequentially landed in the X direction from one ink nozzle (for example, 3030GA), and the ink liquid is dropped to a landing position closer to the smaller one of the rising widths. It is also possible to set the droplet amount of the droplet dr1 to be larger than the droplet amount of the ink droplet dr2 that is dropped to the landing position that is closer to the larger landing width.
(Case D): When neither of the openings 101R and 101B adjacent to the opening 101G is uncoated, and when there is an ink pool having the same running width in the openings 101R and 101B adjacent to the opening 101G. In this case, the CPU 250 adjusts the nozzle position to the standard position P ₀ as in the conventional case. By dropping ink droplets inside the bank top portions 105, it is possible to prevent the ink droplets from protruding at least in the adjacent openings.

There are several methods for shifting the center of gravity of the ink droplet, such as controlling the shape of the ink droplet by adjusting the drive waveform to the piezoelectric element 3010G via the ejection control unit 300G. It is considered that the method of shifting the landing position of the droplet is relatively easy and easy to implement.
The setting of each wet process based on (Case A), (Case B), (Modification 1 of Case B), (Modification 2 of Case B), and (Case C) is as follows. It can implement by performing the procedure of (iii) sequentially.

(I) First, the operator inputs the total amount of each ink applied to one opening of the application target substrate 10X to be used and information on the shape of the opening on the application target substrate from the input means 252, and the storage means 251. To store.
(Ii) Next, the CPU 250 calculates the running widths X _R and X _L of each ink pool onto the bank 105 based on the known total ink amount and the information of the known ink pool shape. Further, the nozzle movement amount A corresponding to the riding widths X _R and X _L is calculated, and each calculation result is associated and stored in the table column of the storage unit 251.

The procedures (i) and (ii) are performed for the three RGB colors.
Here, the CPU 250 can calculate the nozzle movement amount A by, for example, the following Equation 1, but is not limited to this method.
[Formula 1] A = (P ₀ −P _A ) = {(D−X _R ) + (D−X _L )} / 2
However, D is the width of the top of the bank in the X direction, and X _R and X _L are the width of the adjacent ink reservoirs on the top of the bank in the X direction (see FIG. 10A). (D-X _R ) and (D-X _L ) respectively indicate the widths at which the ink reservoirs are not running on the bank tops.

[Example of calculating ride widths X _R and X _L ]
The organic EL elements 100R, 100G, and 100B shown in FIG. 3B have a pair of long sides along the Y direction and a pair of short sides along the X direction (here, semicircular arcs). However, it is referred to as “side” for convenience). In this case, the CPU 250 can obtain the riding widths X _R and X _L as follows, for example.

FIG. 10B is a cross-sectional view taken along the line BB ′ in FIG. 9 after ink application (ink is not shown in FIG. 9, and ink in the adjacent application region is not shown in FIG. 10B). As shown in the figure, how to determine the running widths X _R and X _{L in} an ink reservoir in which both end portions in the longitudinal (Y) direction are substantially hemispherical in the front view is illustrated. In this case, the total droplet volume V _total is considered as the sum of the partial volumes V ₁ , V ₂ , V ₃ , and V ₄ (V _total = V ₁ + V ₂ + V ₃ + V ₄ ).

Here, when the ink contact angle with respect to the bank 105 is θ, the adjacent bank top gap is W, and X = (X _R + X _L ) / 2, the following relationship is approximately obtained as shown in FIG. Can lead.
[Formula 2]
Volume V _{1 of} the portion surrounded by the bank = bottom area of the opening × bank height [Formula 3]
When assuming a circle including the outer periphery of the ink run-up portion on an arc, the radius R of the circle R = (W + 2X) / (2 sin θ)
[Formula 4]
Semicircular area of XZ cross-sectional area Dc = the height h of the V ₂ - long sides 2 area of a right triangle of R = πR2 × {2θ / ( 2π)} - (W + 2X) · (Rcosθ) / 2
[Formula 5]
Volume V ₂ = Dc · L1
[Formula 6]
Total volume of hemispherical V ₃ and V ₄ = π / 6 · (R−R cos θ) · {(W−2X) ² + (R−R cos θ) ² }
When the above Expressions 2 to 6 are calculated, the following is the so-called Cardano formula [Expression 7]
A · X ³ + B · X ² + C · X = 0
(However, A, B, and C are bank dimensions, contact angle, ink filling amount, etc.)
The cubic equation can be derived. The solution of Equation 7 is the riding widths X _R and X _L , and the CPU 250 can obtain the riding widths X _R and X _L by calculation.

In consideration of parameters such as the viscosity, concentration, coating amount, and component of the ink to be dropped, the manner in which the ink pool protrudes from each of the openings 101R, 101G, and 101B is common to each color ink of RGB. Conceivable. Therefore, in the first embodiment, it is assumed that the ink droplets protrude in the openings 101R, 101G, and 101B arranged in the Y direction in common.
[Modified example of how to determine the riding widths X _R and X _L ]
The running widths X _R and X _L are not limited to the calculation method, and the method in which the CPU 250 calculates the known ink droplet volume and the shape of the opening as in (ii) above. For example, the following method can be mentioned.

(Iii) The operator operates the coating apparatus 1000 to apply ink to the opening on the coating target substrate (test coating).
(Iv) Subsequently, according to the nozzle control program, the CPU 250 uses the droplet volume measuring device 40 to drop the ink reservoir applied on the application target substrate via the camera control unit 400 from the vertical (Z) direction to the droplet observation camera 402. Shoot with. The CPU 250 stores the captured image data in the storage unit 251. The CPU 250 measures the riding widths X _R and X _L directly from the image data by superimposing the shape of the opening before application and the shape of the ink reservoir after application. The CPU 250 stores the measurement result in the storage unit 251.

Here, depending on the type of ink, there may be a large difference in the evaporation and drying speeds of the RGB colors. Even if an ink reservoir with a large volume (for example, 1060R) is formed, immediately before the ink reservoir (for example, 1060G) of the target color is dropped, the run-up width of the ink reservoir (1060R) is not necessarily positioned across the opening 101G. It is not always greater than the run-up width of the ink reservoir (1060B). In this case, as in the methods (iii) and (iv), if the ride widths X _R and X _L are measured in advance using image data taken by the droplet observation camera 402 immediately before applying the ink, the ink can be obtained. Accurate values of the riding widths X _R and X _L immediately before dropping (1060B) can be measured.

[Control example of wet process]
Next, examples of wet process control using the wet process setting method will be described in order. Here, the following flow of steps (1) → (2) → (3A) → (4A) and steps of (1) → (2) → (3B) → (4B) are illustrated.
(1) Preparation Step First, according to the procedure (i), the operator inputs information on the application target substrate and the total amount of each color ink of RGB into the coating apparatus 1000. Next, in accordance with the procedure (ii), the CPU 250 obtains the run-up widths X _R and X _L of the ink reservoirs of the respective inks, and stores them in the storage unit 251.

Alternatively, the operator may sequentially perform the steps (i) and (iii), and the CPU 250 may perform the step (iv).
This preparation step may be performed only at the beginning of mass production of the organic EL display panel.
(2) First Color Application Step Next, the CPU 250 adjusts the position of the nozzle 3030R by the discharge control unit 300R according to the nozzle control program. Thus, the first color ink is applied to the standard position P ₀ in each opening 101R (control of case C). In this way, when the first color ink is dropped, the application is performed in the same manner as in the past with the application target position as the standard position P ₀ .
(3A) Second color application step 1
Next, the CPU 250 executes the second color ink application according to the nozzle control program. Here, a case where the coating is applied to the opening 101G adjacent to the opening 101R will be described. The CPU 250 identifies information on the first color ink run width (X _R or X _L ) stored in the table field of the storage unit 251. The CPU 250 changes the landing position from the nozzle 3030B to the opening 101B through the discharge control unit 300G from the standard position P ₀ to the nozzle movement amount A = P ₀ −P _A1 = {(D−X _R ) + (D−X _L ). } / 2 to a position shifted by 2 (see FIG. 11). The CPU 250 drops ink of the second color from the nozzle 3030G to the correction position in the opening 101G via the ejection control unit 300R (execution of control of case A).

With this method, the CPU 250 scans the ink ejection unit 30G as shown in FIG. 9 and applies all the openings 101G to form the second color ink reservoir 1060G.
(4A) Third color application step 1
Next, the CPU 250 applies the ink of the third color to the opening 101B adjacent to the opening 101G by the same method as (3A). The CPU 250 drops the third color ink from the nozzle 3030B to the correction position in the opening 101B via the ejection control unit 300B (execution of control of case A).

By this method, the CPU 250 scans the ink discharge portion 30B and applies to all the openings 101B to form the third color ink reservoir 1060B.
This completes the wet process.
(3B) Second color application step 2
As an example of steps other than (3A), an example is given in which the application of the second color is performed first on the opening 101B by skipping the opening 101G. The CPU 250 adjusts the position of the nozzle 3030B via the discharge controller 300B. Similarly to the first color application step (2), the ink ejection unit 30B is scanned to apply to all the openings 101B to form the second color ink reservoir 1060B.
(4B) Third color application step 2
When the step (3B) is performed, the CPU 250 next specifies information on the run-up widths (X _R , X _L ) of the first and second color inks stored in the storage unit 251. In this case, the CPU 250 applies the third color ink to the opening 101G between the openings 101R and 101B in a state where the ink is applied to the openings 101R and 101B on both sides in the X direction (control of the case B). Execution).

That is, the CPU 250 adjusts the position of the nozzle 3030G via the discharge control unit 300G based on the nozzle position control program, and moves toward either X _R or X _L where the width of the ride on the top of the bank 105 is small. (X _R here), the landing position of the opening 101G is corrected from the standard position P ₀ to the movement position P _A2 . With such a control method, the CPU 250 applies the coating to all the openings 101G to form the third color ink reservoir 1060G.

This completes the wet process.
(effect)
In the above wet process control example, during the execution of each step (3A) and (4A), among the adjacent banks 105 on both sides, the average value of the width area at the top of the bank where no ink has run (P _A = {(D−X _R ) + (D−X _L )} / 2), the ink landing position is moved. Further, at the time of execution of the step (4B), only the average value of the width area at the top of the bank (P _A = {(D− X _R ) + (D−X _L )} / 2), the ink landing position is moved. As a result, ink can be properly applied to the openings 101R, 101G, and 101B, and ink color mixing can be effectively prevented.

Further, since the different color inks can be prevented from contacting each other when the ink is dropped, the thicknesses of the organic light emitting layers 106R, 106G, and 106B can be appropriately set, and the cavity design in the organic EL elements 100R, 100G, and 100B can be accurately performed. As a result, the organic EL display panel 10 having excellent image display performance can be realized.
Further, in the wet process of the first embodiment, since the landing accuracy does not have to be so strict as compared with the case where the landing is performed only at the standard position P ₀ , even the high-definition application target substrate 10X. There is also an advantage that the wet process can be carried out relatively easily.

In the above example, the riding width X _R, after having determined the X _L, riding width X _R, is performed the application control in consideration of the X _L, to calculate always riding width X _R, the X _L There is no need, and for example, an experimental means such as measurement of the riding width by image observation may be used.
The influence of volume shrinkage due to drying depends on the time interval of RGB application, the application amount, and the ink evaporation. However, instead of calculating and measuring the ride width, the application control may be performed by estimating the magnitude relationship of the ride width based simply on the order of ink application or the amount of ink ejected from the inkjet apparatus. .

For example, an opening in which a functional material is applied first among adjacent openings is presumed that the ink discharged earlier is more likely to dry the ink and have a smaller width when the ink is discharged. The center of gravity may be shifted to the portion, and the ink may be landed on the opening located in the center.
Further, ink is applied to both of the openings 101R and 101B adjacent to the opening 101G, and more ink is applied to the opening 101B than the amount of ink discharged from the ink discharge part to the opening 101R. When the amount of ink ejected by the ejection unit is large, it can be estimated that the riding width at 101B tends to be larger than the riding width at 101R. Based on this estimation, the CPU 250 of the control device 25 moves the nozzle position toward the opening 101R by a predetermined movement amount A from the standard position P ₀ toward the uncoated opening, and moves the dropping position to the movement position. You may perform application | coating control correct _| amended to PA1.
(Each component material of the organic EL display panel 10)
Next, specific materials of each component when the organic EL display panel 10 is manufactured will be exemplified.
[Material of Substrate 110]
The substrate 110 is a base portion of the organic EL display panel 10 and is configured by forming a TFT wiring portion (not shown) on the insulating substrate body 1011 shown in the second embodiment. For this reason, examples of the material of the substrate body 1011 include alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, and polyethylene. Insulating materials such as polyester, silicone resin, or alumina. On the other hand, the TFT wiring portion is formed so as to have wiring (wiring including a thin film transistor such as a driving TFT and a switching TFT, a power supply line, and a signal line) for driving the organic EL elements 100R, 100G, and 100B by an active matrix driving method. To do. For this reason, a metal material, an insulating material, or the like is used. Note that an interlayer insulating film (not shown) such as a planarization film is formed on the surface of the TFT wiring portion, but the interlayer insulating film can be formed using an insulating material.
[Material of anode 102]
Examples of the material of the anode 102 include at least one material selected from the group consisting of aluminum, silver, chromium, nickel, and alloys thereof, indium tin oxide (ITO), and indium zinc oxide (IZO).

A transparent conductive film can be provided on the surface of the anode 102 using a known transparent electrode material. Examples of the material for the transparent conductive film include indium tin oxide (ITO) and indium zinc oxide (IZO). Note that the same material can be used for the auxiliary electrode 102A.
[Material of electrode coating layer 103]
Examples of the material of the electrode coating layer 103 include ITO (indium tin oxide). Note that the same material can be used for the electrode coating layer 103A.
[Material of hole injection layer 104]
Examples of the material of the hole injection layer 104 include oxide materials such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), and iridium (Ir). Can be illustrated.

Examples of the material for the hole injection layer 104 include PEDOT (a mixture of polythiophene and polystyrene sulfonic acid).
A hole transport layer may be formed between the hole injection layer 104 and the organic light emitting layers 106R, 106G, and 106B.
[Material of bank 105]
The material of the bank 105 is not particularly limited, but an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolac type phenol resin, or the like) is preferable. Since an etching process, a baking process, etc. are performed at the time of manufacture, it is preferable that it is a highly resistant material which does not produce an excessive deformation | transformation and a quality change with respect to those processes. Moreover, in order to give the surface water repellency, fluorine treatment can also be performed.
[Materials of organic light emitting layers 106R, 106G, 106B]
Specific examples of the light-emitting organic material include, for example, oxinoid compounds, perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, pyrrolopyrrole compounds described in JP-A-5-163488, Naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, pyrene compounds, coronene compounds, quinolone compounds and azaquinolone compounds, pyrazoline derivatives and pyrazolone derivatives, rhodamine compounds, chrysene compounds, phenanthrene compounds, cyclopentadiene compounds, stilbene compounds, diphenyl Quinone compounds, styryl compounds, butadiene compounds, dicyanomethylenepyran compounds, dicyanomethylenethiopyran compounds, fluoresceins Compounds, pyrylium compounds, thiapyrylium compounds, serenapyrylium compounds, telluropyrylium compounds, aromatic ardadiene compounds, oligophenylene compounds, thioxanthene compounds, anthracene compounds, cyanine compounds, acridine compounds, 8-hydroxyquinoline compound metal complexes, 2- Fluorescent materials such as metal complexes of bipyridine compounds, complexes of Schiff salts with Group III metals, oxine metal complexes, and rare earth complexes can be given.
[Material of Electron Transport Layer 107]
As a material of the electron transport layer 107, a material having a function of efficiently transporting electrons injected from the cathode 108 to the organic light emitting layers 106R, 106G, and 106B is used. For example, it is preferable to form with barium, phthalocyanine, lithium fluoride, or a combination thereof.
[Material of cathode 108]
Examples of the material of the cathode (second electrode) 108 include ITO and IZO (indium zinc oxide). In the case of the top emission type organic EL display panel 10, a light transmissive material is preferable. About light transmittance, it is preferable that the transmittance | permeability shall be 80 [%] or more.
[Material of Sealing Layer 109]
As a material of the sealing layer 109, a material having a function of suppressing exposure of the organic light emitting layer 106 and the like to moisture and air is used. Examples thereof include materials such as SiN (silicon nitride) and SiON (silicon oxynitride). In the top emission type organic EL display panel 10, a light transmissive material is preferable.
<Embodiment 2>
Next, as a second embodiment of the present invention, a TFT manufacturing method (and a TFT substrate manufacturing method) will be illustrated with reference to FIGS. 4 and 15 to 17.

In the second embodiment, the coating apparatus 1000 is used to form an organic semiconductor layer in an organic TFT as a functional film. The substrate on which the organic TFT is formed is the same as the substrate TFT substrate 110.
(Manufacturing method of TFT substrate 110)
As shown in FIG. 15A, gate electrodes 1012a and 1012b are formed on the main surface of the substrate body 1011 (S21 in FIG. 7B). The formation of the gate electrodes 1012a and 1012b is the same as the formation method of the anode 102. Next, as shown in FIG. 15B, the gate electrodes 1012a and 1012b and the substrate body 1011 are covered. Then, the insulating layer 1013 is stacked (S22 in FIG. 7B).

Then, as shown in FIG. 15C, source electrodes 1014a and 1014b, drain electrodes 1014c and 1014d, and a connection wiring 1015 are formed on the main surface of the insulating layer 1013 (S23 in FIG. 7B).
Next, as shown in FIG. 16A, source electrodes 1014a and 1014b, drain electrodes 1014c and 1014d, connection wiring 1015, lyophilic layers 1019a and 1019b (not shown in FIG. 16A), and further insulation A photosensitive resist material film 10160 for forming the partition wall 1016 is deposited so as to cover the exposed portions 1013a and 1013b of the layer 1013 (S24 in FIG. 7B).

  Then, as shown in FIG. 16B, a mask 501 is disposed on the deposited photosensitive resist material film 10160 based on the photolithography method, and mask exposure and patterning are performed (FIG. 7B). S25). In the mask 501, windows 501 a, 501 b, 501 c, and 501 d are opened in portions where the partition wall 1016 is to be formed. Although not shown in FIG. 16B, the mask 501 is provided with a window portion in a portion where the partition wall 1016 is formed in addition to a region where the window portions 501a, 501b, 501c, and 501d are opened.

  Through the above process, the partition wall 1016 shown in FIG. 16C can be formed (S26 in FIG. 7B). The partition wall 1016 defines a plurality of openings including the openings 1016a, 1016b, and 1016c. The opening 1016a surrounds the connection wiring 1016, the opening 1016b surrounds the source electrode 1014a and the drain electrode 1014c and the lyophilic layer 1019a, and the opening 1016c surrounds the source electrode 1014b and the drain electrode 1014d and the parent electrode. A liquid layer 1019b is surrounded. In each of the openings 1016b and 1016c, the source electrodes 1014a and 1014b and the drain electrodes 1014c and 1014d are arranged with a predetermined positional relationship, respectively.

Next, as shown in FIG. 17A using the coating apparatus 1000, after forming the partition 1016, the organic semiconductor layers 1017a and 1017b are formed in the openings (openings 1016b and 1016c) defined by the partition 1016. Organic semiconductor inks 10170a and 10170b for forming are applied (S27 in FIG. 7B).
In this case, conventionally, the opening 1016b, a central position in the X direction in 1016c as a standard position P _0, and applying the ink droplets. However, there is a case where the previously applied ink droplets are on the top of the partition wall 1016, and there is a possibility that the ink droplets being dropped are in contact with each other.

Therefore, in the second embodiment, as in the control of (Case A) of the first embodiment, the CPU 250 considers the ink running width X _L with respect to the X-direction width D of the top of the partition wall 1016 based on the nozzle position control program. Thus, the ink landing position is adjusted by shifting from the standard position P ₀ to the movement position P _A4 .
Here in the example of FIG. 17 (a), the organic semiconductor ink 10170a applied to the opening 1016b earlier, a portion of which rides in width X _L rides on top of the partition wall 1016. Therefore, when the organic semiconductor ink 10170b is applied to the opening 1016a, the ink landing position in the opening 1016a is adjusted by shifting from the standard position P ₀ to the predetermined movement position P _A4 . The details of this control can be performed as in the first embodiment.

Thereby, as shown in FIG. 13A, the contact of each ink droplet can be prevented. By drying the organic semiconductor inks 10170a and 10170b (S28 in FIG. 7B), the organic semiconductor layers 1017a and 1017b can be appropriately formed in the openings 1016b and 1016c, respectively (FIG. 7B). ) S29).
Finally, as shown in FIG. 17B, when a passivation film 1018 is formed so as to cover the whole except for the contact region including the opening 1016a (S30 in FIG. 7B), the TFT substrate 110 is completed.

In the configuration example described above, the two adjacent openings are the openings 1016b and 1016c. However, similar to the first embodiment, three adjacent areas or more areas may be used. In this case, when the coating process is performed on the regions on both sides in the X direction and the semiconductor material is coated on the central opening, the same control as in (Case B) of the first embodiment is performed, and the same effect can be expected. .
<Other matters>
When the method for producing a functional film of the present invention is applied to a method for producing an organic EL display panel, it is a matter of course that not only the production of an organic light emitting layer but also a material such as a hole injection layer or a hole transport layer is used in a wet process. The present invention can also be applied to the production of other functional layers having a coating process.

  In the display panel 10, the anode 102 is disposed below the organic light emitting layers 106R, 106G, and 106B, and the cathode 108 is disposed above the organic light emitting layers 106R, 106G, and 106B. However, the present invention is not limited to this configuration. For example, the positions of the anode 102 and the cathode 108 can be reversed. In the case of a top emission type in which the positions of the anode 102 and the cathode 108 are reversed, it is necessary to use the cathode 108 as a reflective electrode layer and the anode 102 as a transparent electrode layer.

In the first embodiment, the organic light emitting layers 106R, 106G, and 106B corresponding to the respective RGB emission colors are formed. However, on the display panel, each combination color other than RGB or an organic light emitting layer for only one color is formed. May be.
In the first embodiment, the method of adjusting the head unit 301 by shifting from the standard position P ₀ to the moving position P _A has been described. However, when the XY turntable is used as the work table 20, the position of the head unit 301 is set to the standard position P. _0, and a method of moving the stage (coating target substrate) in the XY turntable to move the position P _a can be employed.

In Embodiment 1, the bank 105 has a pixel bank structure. However, the present invention is not limited to this, and the bank may have a line bank structure. In this case, the same effect as described above can be expected by applying the present invention.
In the first and second embodiments, an example in which the ink ejection unit 30 is scanned in the X direction, that is, so-called horizontal hitting is shown, but vertical hitting in which the ink discharge unit 30 is scanned in the Y direction may be performed. The same effect can be expected by this.

  The present invention can be suitably used for, for example, a method of manufacturing an organic EL display panel used as a home or public facility, or various display devices for business use, television devices, displays for portable electronic devices, and the like.

A Nozzle movement amount D ₀ Opening width D Bank top width P _A , P _{A1 to} P _A4 Nozzle movement position P ₀ Nozzle standard position IP ink pan ST Work stage W Bank top distance 1 Organic EL device 10 Display panel (Organic EL) Display panel)
10X, 10X ′ Application target substrate 20 Work table 25 Control unit 30 Ink ejection unit 40 Droplet observation device 100R, 100G, 100B Organic EL element 100X Busbar region 101R, 101G, 101B Opening 102 Anode (first electrode)
102B Auxiliary electrode (Bus bar)
103, 103B Electrode coating layer 104 Hole injection layer 105 Bank (partition)
106R, 106G, 106B Organic light emitting layer 107 Electron injection layer 108 Cathode (second electrode)
109 Sealing layer 110 Substrate (TFT substrate)
203A, 203B Guide shaft 204, 205 Linear motor part 210 Gantry part 211 Guide groove 213 Motor control part 220 Moving body 221 Servo motor part 250 CPU
251 Storage unit 252 Input unit 300R, 300G, 300B Discharge control unit 301R, 301G, 301B, 301G ′ Head unit 400 Camera control unit 402 Droplet observation camera 1000 Coating apparatus (inkjet apparatus)
1050 Bank material layer 1060R, 1060G, 1060B Ink reservoir (ink containing organic light emitting material)
3010R Piezoelectric element 3030R, 3030G, 3030B, 3030GA, 3030GB Nozzle

Claims (14)

The functional material is landed on each of the openings on the substrate in which the first, second, and third openings are formed at intervals in the first, third, and second order along one direction. An application device for applying
A first discharge part that discharges and applies a first functional material to the first opening along the one direction, and a second discharge that discharges and applies a second functional material to the second opening. A third discharge part for discharging and applying a third functional material to the third opening,
When the third ejection part ejects the third functional material, the second functional material is applied in the second opening, and the third functional material is applied in the third opening. The center of gravity of the droplet of the third functional material is shifted to the opening where the functional material is applied earlier than the center of the third opening, the second opening and the third opening, A coating apparatus for causing droplets of the third functional material to land in the third opening. The functional material is landed on each of the openings on the substrate in which the first, second, and third openings are formed at intervals in the first, third, and second order along one direction. An application device for applying
A first discharge part that discharges and applies a first functional material to the first opening along the one direction, and a second discharge that discharges and applies a second functional material to the second opening. A third discharge part for discharging and applying a third functional material to the third opening,
The amount of liquid droplets of the functional material discharged from the second discharge portion to the second opening portion is the amount of liquid droplets of the first functional material discharged from the first discharge portion to the first opening portion. Less than the center in the third opening, the center of gravity of the droplet of the third functional material is shifted toward the second opening, and the droplet of the third functional material is removed from the third opening. A coating device that lands in the club. A first step of forming a plurality of first electrodes above the substrate;
A partition is formed in the order of the first, third, and second so that the first, second, and third openings exist along one direction above the first electrodes. A second step;
A step of applying a first functional material to the first opening along the one direction, a step of applying a second functional material to the second opening, and a third functionality of the third opening. A step of applying the material in any one of the steps to form a functional layer;
A fourth step of forming a second electrode above each functional layer;
When performing the step of applying the third functional material, when the second functional material in the second opening is less than the first functional material in the first opening, the center in the third opening And a method of manufacturing an organic EL panel in which the third functional material droplet is landed in the third opening by shifting the center of gravity of the third functional material droplet toward the second opening. When performing the step of applying the third functional material,
The first functional material applied on the first partition between the first opening and the third opening, and on the second partition between the third opening and the second opening, and the The second light-emitting material rides on the one direction with a predetermined width;
The method for manufacturing an organic EL panel according to claim 3 , wherein a running width of the second functional material on the second partition is smaller than a running width of the second functional material on the first partition. . In the step of applying the third functional material,
Along said one direction, according to claim 3 to land the droplets of the third than said center of the opening by shifting the position close to the second opening third functional material to said third opening Or the manufacturing method of the organic electroluminescent panel of 4 . In the step of applying the third functional material,
Dropping the third functional material at a plurality of positions in the third opening;
Within said third opening, the liquid droplet amount per one drop to land at a position close to the second opening, according to claim 4 to be greater than the liquid droplet amount per one drop to land on other locations 6. A method for producing an organic EL panel according to any one of 5 above. The method for manufacturing an organic EL panel according to claim 6 , wherein the plurality of positions include two or more positions along the one direction. The first, second and third openings have an opening shape surrounded by a pair of long sides and a pair of short sides,
In the substrate manufacturing method of the organic EL panel according to the extending direction of the pair of short sides to one of claims 3-7 is present as the first direction. The first, second, and third functional materials include materials having the same color,
In the applying step,
The first, the first in the second and third in the opening, a second method of manufacturing an organic EL panel according to any one of the third functional claims 3 to be different from each other the volume of the material 8. Said first, second, third method of manufacturing an organic EL panel according to any one of claims 3-8 functional materials together include materials different color. A first step of forming a plurality of first electrodes above the substrate;
A partition is formed in the order of the first, third, and second so that the first, second, and third openings exist along one direction above the first electrodes. A second step;
A step of applying a first functional material to the first opening along the one direction, a step of applying a second functional material to the second opening, and a third functionality of the third opening. A third step of forming the functional layer by performing the step of applying the material in any order; and
A fourth step of forming a second electrode above each of the functional layers,
When executing the step of applying the third functional material, the second functional material is applied in the second opening, and the third functional material is applied in the third opening. The center of gravity of the droplet of the third functional material is shifted to the opening of the second opening and the third opening where the functional material is applied earlier than the center of the opening of the second opening. A method for manufacturing an organic EL panel, wherein droplets of a trifunctional material are landed in the third opening. A gate electrode forming step of forming a gate electrode above the substrate;
Forming a gate insulating layer to face the gate electrode;
Forming a source electrode and a drain electrode above the gate insulating layer;
A partition is formed in the order of the first, third, and second so that the first, second, and third openings exist along one direction above the source electrode and the drain electrode. And a process of
A step of applying a first semiconductor material to the first opening along the one direction, a step of applying a second semiconductor material to the second opening, and applying a third semiconductor material to the third opening A semiconductor forming step of forming a semiconductor layer electrically connected to the source electrode and the drain electrode by performing any one of the steps in order
In the step of applying the third semiconductor material, when the second semiconductor material in the second opening is less than the first semiconductor material in the first opening, the second opening is more than the center in the third opening. A method of manufacturing a thin film transistor, wherein the center of gravity of the droplet of the third semiconductor material is shifted to the side and the droplet of the third semiconductor material is landed in the third opening. A gate electrode forming step of forming a gate electrode above the substrate;
Forming a gate insulating layer to face the gate electrode;
Forming a source electrode and a drain electrode above the gate insulating layer;
A partition is formed in the order of the first, third, and second so that the first, second, and third openings exist along one direction above the source electrode and the drain electrode. And a process of
A step of applying a first semiconductor material to the first opening along the one direction, a step of applying a second semiconductor material to the second opening, and applying a third semiconductor material to the third opening A semiconductor forming step of forming a semiconductor layer electrically connected to the source electrode and the drain electrode by performing any one of the steps in order
In the step of applying the third semiconductor material, the second semiconductor material is applied to the second opening, and the third semiconductor material is applied to the third opening. The liquid crystal of the third semiconductor material is displaced by shifting the center of gravity of the droplet of the third semiconductor material to the opening in which the semiconductor material is applied earlier than the center. A method of manufacturing a thin film transistor, wherein a droplet is landed in the third opening. A gate electrode forming step of forming a gate electrode above the substrate;
Forming a gate insulating layer to face the gate electrode;
Forming a source electrode and a drain electrode above the gate insulating layer;
A partition is formed in the order of the first, third, and second so that the first, second, and third openings exist along one direction above the source electrode and the drain electrode. And a process of
A step of applying a first semiconductor material to the first opening along the one direction, a step of applying a second semiconductor material to the second opening, and applying a third semiconductor material to the third opening A semiconductor forming step of forming a semiconductor layer electrically connected to the source electrode and the drain electrode by performing any one of the steps in order
In the step of applying the third semiconductor material, the amount of liquid droplets of the functional material discharged from the second discharge unit to the second opening is determined by the first discharge unit from the first opening. When the amount of the discharged droplets of the first functional material is smaller than the center of the third opening, the center of gravity of the droplets of the third functional material is shifted to the second opening side to move the third functional material. A method of manufacturing a thin film transistor, wherein a droplet of a functional material is landed in the third opening.

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