JP2019014089A - Nozzle plate, ink jet print head, ink jet device and method for manufacture of nozzle plate - Google Patents

Abstract

To remove unnecessary ink adhered to an ink ejection face of an ink jet head.SOLUTION: An ink jet device having: an ink jet head; a wiper blade; and a move part which moves the wiper blade so that the wiper blade relatively moves in a direction parallel to an ejection face in the state that a tip of the wiper blade and the ejection face contact each other. The ink jet head comprises: a nozzle plate which comprises a plate-like body on which plural nozzle holes are opened in a row form and which contains a metal as a main component, and in which when one surface of the plate-like body is a principal plane, a surface of a circumferential part of the nozzle holes in the principal plane of the plate-like body projects with respect to a surface other than the circumferential part of the nozzle holes; a substrate which is so provided as to face a rear face of the nozzle plate; plural partition walls which partition a space between the nozzle plate and the substrate for each nozzle hole and form a cavity corresponding to each nozzle hole; and a driving element which is provided on each cavity, and individually makes a pressure in each cavity variable.SELECTED DRAWING: Figure 3

Description

  The present disclosure relates to a nozzle plate, an ink jet print head, an ink jet apparatus, and a method for manufacturing a nozzle plate, and in particular, relates to an ink jet print head, an ink jet apparatus used for manufacturing an organic EL element, a nozzle plate used therefor, and a method for manufacturing a nozzle plate. .

In recent years, organic EL display panels in which organic EL elements are arranged on a substrate as a display device are becoming widespread. The organic EL display panel has characteristics such as high visibility because it uses an organic EL element that performs self-emission, and excellent impact resistance because it is a complete solid element.
The organic EL element is a current-driven light-emitting element and is configured by laminating an organic light-emitting layer or the like that performs an electroluminescence phenomenon by recombination of carriers between an anode and a cathode electrode pair. In the organic EL display panel, the organic EL element corresponding to each color of red (R), green (G), and blue (B) is a subpixel, and the combination of three subpixels of R, G, and B is 1. It corresponds to a pixel (one pixel).

  As such an organic EL display panel, one in which an organic light emitting layer of an organic EL element is formed by a wet process (application process) such as an ink jet method is known (for example, Patent Document 1). In the ink jet method, the ink jet head is scanned with respect to openings (corresponding to the organic light emitting layer forming region) provided in a matrix in the partition layer on the substrate. And the droplet of the ink containing the organic material and solvent which comprise an organic light emitting layer with respect to each opening part is discharged from the nozzle hole of the some nozzle with which an inkjet head is equipped.

  At this time, unnecessary ink may adhere around the nozzle holes on the ink ejection surface of the inkjet head. When such unnecessary ink adheres to the periphery of the nozzle hole, the ink ejection direction is bent, the ink landing position deviates from the target position, or an amount of ink different from the desired amount is ejected. This may cause unauthorized discharge. In addition, if the ink is left as it is, the ink that has finally adhered will dry and clog the nozzle holes, which may cause non-ejection of ink where no ink is ejected. When nozzles in which such improper ejection or non-ejection has occurred (hereinafter referred to as “non-ejection nozzles”) are present in the inkjet head, the openings where ink is not applied at all and the amount of ink applied are significantly different from other openings. Different openings will result. As a result, a portion of the display image that is missing or has a significantly different color density occurs, resulting in poor image quality.

  On the other hand, for example, Patent Document 2 discloses a configuration in which ink adhering to the periphery of a nozzle hole is removed by a cleaning unit having a cleaning liquid application unit, a wiping unit, a liquid absorption unit, and a suction unit.

JP 2006-223594 A JP 2005-1327 A

  However, as in Patent Document 2, when the ink discharge surface of the inkjet head is rubbed along the nozzle hole array with a wiper such as a rubber blade, unnecessary ink attached around the upstream nozzle hole array is downstream. There is a problem that the ink moves to the ink ejection surface near the nozzle hole on the side and reattaches. On the other hand, a liquid-repellent resin film may be formed on the ink discharge surface to make it difficult for unnecessary ink to adhere to the ink discharge surface. However, the resin film is relatively soft and is scratched. Cheap. When fine scratches occur, the ink tends to adhere to the scratches, so that the above-described problem is more likely to occur.

  The present disclosure has been made in view of the above problems, and an inkjet printhead capable of removing unnecessary ink adhering to the ink ejection surface without causing unnecessary ink to adhere to the ink ejection surface of the inkjet head, An object is to provide an inkjet apparatus, a nozzle plate used therefor, and a method for manufacturing the nozzle plate.

  An ink jet device according to an aspect of the present disclosure is formed of a plate-shaped body mainly composed of a metal in which a plurality of nozzle holes are formed in a row, and when one surface of the plate-shaped body is a main surface, The surface of the peripheral portion of the nozzle hole in the main surface of the plate-like body has a nozzle plate protruding with respect to the surface other than the peripheral portion of the nozzle hole, a diaphragm disposed to face the back surface of the nozzle plate, and the nozzle A plurality of partition walls that divide the gap between the plate and the diaphragm for each nozzle hole and form a cavity corresponding to each nozzle hole, and a drive element that is provided in each cavity and individually varies the pressure in each cavity. In the state where the inkjet head, the rubber wiper blade, the tip of the wiper blade and the discharge surface are in contact with each other, the wiper blade is aligned in a direction parallel to the discharge surface. Manner to move, and having a moving unit for moving at least one of the wiper blades and the ink jet head.

  In the ink jet apparatus according to one aspect of the present disclosure, when the ink discharge surface of the ink jet head is rubbed along the nozzle hole array with a wiper such as a rubber blade, unnecessary ink does not adhere to the ink discharge surface of the ink jet head. Unnecessary ink adhering to the ink ejection surface can be removed.

It is a figure which shows the main structures of the inkjet apparatus 1000 which concerns on embodiment. It is a functional block diagram of an inkjet apparatus. 2 is a partially enlarged cross-sectional view illustrating a schematic configuration of a nozzle in an inkjet head 301 of the inkjet apparatus. FIG. It is a figure which shows the procedure of the wiping operation | movement of the inkjet head 301 in the inkjet apparatus 1000, Comprising: (a) is a model side view which shows the state before the discharge surface and wiper blade of an inkjet head contact, (b) These are a schematic side view which shows the state which the discharge surface and the wiper blade contacted, (c) is a schematic sectional side view which shows the state in the middle of wiping operation | movement. (A) to (c) is a schematic cross-sectional view cut at the same position as FIG. 3 showing the state in each step in the manufacture of the nozzle plate 301i. (A) to (c) is a schematic cross-sectional view cut at the same position as FIG. 3 showing the state in each step in the manufacture of the nozzle plate 301i. (A) to (c) is a schematic cross-sectional view cut at the same position as FIG. 3 showing the state in each step in the manufacture of the nozzle plate 301i. (A) to (c) is a schematic plan view showing a state in each step in manufacturing the nozzle plate 301i, (a) is a top view of FIG. 5 (c), and (b) is FIG. 7 (a). Fig. 7C is a bottom view of Fig. 7C. (A) and (b) are the electron micrographs which imaged the nozzle hole 3031 periphery in the ink discharge surface 301a of the nozzle plate 301i. FIGS. 3A to 3C are schematic side cross-sectional views illustrating a state during the wiping operation in the inkjet head 301. FIG. (A) to (c) is a schematic side sectional view showing a state during the wiping operation in a comparative example of an inkjet head. 3 is a schematic block diagram illustrating a configuration of a display device according to an embodiment of the present disclosure. FIG. It is a schematic cross section which shows the structure of the display panel in a display apparatus. It is a schematic cross section which shows a part of manufacturing process of a display panel. (A) is a schematic cross section which shows the state in which the TFT layer and the electric power feeding electrode were formed in the board | substrate. (B) is a schematic cross section which shows the state by which the insulating layer was formed on it. (C) is a schematic cross-sectional view showing a state in which a pixel electrode and a hole injection layer are formed thereon. (D) is a schematic cross section which shows the state in which the partition layer was formed on it. (E) is a schematic cross-sectional view showing a state in which droplets of hole transport layer ink are ejected to a region defined by the partition wall layer. (A) is a schematic cross section which shows the state in which the positive hole transport layer was formed. (B) is a schematic cross-sectional view showing a state where ink droplets for an organic light emitting layer are ejected from above the hole transport layer into the region defined by the partition layer. (C) is a schematic cross section which shows the state in which the organic light emitting layer was formed. (D) is a schematic cross section which shows the state in which the electron carrying layer, the electron injection layer, and the counter electrode were formed on it. FIG. 11 is a schematic plan view showing a step of applying a light emitting layer forming ink to a moat-shaped opening 117 between adjacent partition walls 107 on a substrate in the method of manufacturing the organic EL display panel 100. It is a partially expanded sectional view which shows schematic structure of the nozzle in the inkjet head 301A which concerns on a modification. (A)-(c) is the schematic cross section cut | disconnected in the same position as FIG. 17 which shows the state in each process in manufacture of the inkjet head 301A.

<< Outline of Embodiment for Implementing the Present Invention >>
The nozzle plate according to one aspect of the present disclosure is composed of a plate-shaped body mainly composed of metal in which a plurality of nozzle holes are formed in a row, and when one surface of the plate-shaped body is a main surface, The surface of the peripheral portion of the nozzle hole on the main surface of the plate-like body is characterized by protruding relative to the surface other than the peripheral portion of the nozzle hole. An inkjet head according to an aspect of the present disclosure includes a nozzle plate according to any one of the above aspects, a diaphragm disposed to face the back surface of the nozzle plate, and a gap between the nozzle plate and the diaphragm. And a plurality of partition walls that form cavities corresponding to the respective nozzle holes, and drive elements that are provided in the respective cavities and individually change the pressure in each of the cavities.

With this configuration, when the ink discharge surface of the ink jet head is rubbed along a nozzle hole array with a wiper such as a rubber blade, unnecessary ink does not adhere to the ink discharge surface of the ink jet head, and the ink discharge surface is unnecessary. Ink can be removed.
In another aspect, in any one of the above aspects, when the surface having the nozzle holes in the main surface of the plate-like body is a nozzle surface, the surface surrounding the nozzle holes in the main surface of the plate-like body The amount of protrusion of the nozzle surface may be the maximum on the nozzle surface, and may continuously increase as it approaches the periphery of the nozzle surface. In another aspect, in any one of the above aspects, the inclination angle of the surface around the nozzle hole on the main surface of the plate-like body with respect to the surface other than the portion is from the outer peripheral edge of the nozzle surface to the nozzle. It is good also as a structure which is increasing continuously as it approaches the periphery of a surface.

With such a configuration, the ink droplets can be easily moved from the nozzle surface to the inclined surface, and the moved ink droplets can further easily move on the inclined surface toward the edge of the inclined surface.
In another aspect, in any one of the aspects described above, the surface portion included in the nozzle hole surrounding portion in a plan view of the back surface opposite to the main surface of the plate-like body is a surface other than the portion. It is good also as a structure which is depressed, and the amount of depressions is increasing continuously as it approaches the said nozzle hole. In another aspect, in any one of the aspects described above, an inclination angle of a surface portion included in a portion around the nozzle hole in a plan view of the back surface of the plate-like body with respect to a surface portion other than the portion is the nozzle. It is good also as a structure which is increasing continuously as it approaches a hole.

With this configuration, when ink is ejected, the resistance between the ink and the back surface can be reduced to increase the ink ejection efficiency and improve the landing accuracy.
In another embodiment, in any of the above embodiments, the metal is selected from metals such as nickel, chromium, iron, aluminum, silver, gold, cobalt, copper, palladium, tin, and zinc, or alloys thereof. It is good also as composition which is one or more done.

With such a configuration, it is possible to realize a configuration in which unnecessary ink attached to the ink ejection surface can be easily removed without attaching unnecessary ink to the ink ejection surface using various metals.
In another aspect, in any of the aspects described above, the plate-like body may include polytetrafluoroethylene (PTFE) in a range of a predetermined depth from the surface of the main surface.

With such a configuration, unnecessary ink splashes adhering to the nozzle surface can be easily moved onto the inclined surface due to surface tension. Furthermore, the ink splash that has moved becomes easy to move on the inclined surface toward the edge of the inclined surface. As a result, it is possible to prevent ink splashes from moving to the nozzle surface near the downstream nozzle hole and causing an incorrect ink discharge.
In addition, an inkjet apparatus according to an aspect of the present disclosure includes the inkjet head according to any one of the aspects described above, a wiper blade made of rubber, and the wiper blade in a state where the tip of the wiper blade and the discharge surface are in contact with each other. And a moving unit that moves at least one of the wiper blade and the ink jet head so that the nozzle moves relatively in a direction parallel to the ejection surface. In another aspect, in any one of the aspects described above, the wiper blade may be configured to be pressed against the main surface when moved by the moving unit.

With this configuration, it is possible to realize an ink jet apparatus that removes unnecessary ink adhering to the ink discharge surface without causing unnecessary ink to adhere to the ink discharge surface of the ink jet head.
An organic EL element manufacturing apparatus according to an aspect of the present disclosure is an organic EL element manufacturing apparatus having a plurality of functional layers including an organic light emitting layer between an anode and a cathode, wherein the ink includes the ink It includes a functional material for forming a functional layer, and has an ink jet device according to any one of the above aspects. In addition, in a method for manufacturing an organic EL element according to one embodiment of the present disclosure, a thin film of the functional substance is formed by discharging ink formed by dissolving a functional substance in a solvent onto a base substrate and drying the solvent. A step of discharging the ink by the organic EL element manufacturing apparatus according to any one of the above aspects.

In the inkjet apparatus, it is possible to provide an organic EL element in which the organic functional layer is normally applied by preventing the occurrence of non-ejection nozzles. Further, an organic EL display panel having such an organic EL element and having good image quality with no omission and no significant difference in color density, and an organic EL display device having such an organic EL display panel Can be provided.
In addition, a method for manufacturing a nozzle plate according to one aspect of the present disclosure includes a step of preparing a mother die made of a conductive material and having a flat upper surface, and a step of applying an insulating photoresist on the upper surface of the mother die. The photoresist is exposed to light through a mask and developed to form a photoresist layer including a region larger than the region for forming the nozzle hole by a predetermined dimension, and the photoresist layer on the upper surface of the mother die Forming an adhesion layer having a first portion corresponding to the photoresist layer opened by applying strike metal plating to the absence region, and applying a voltage to the matrix to form the adhesion layer on the first layer and the first layer. A step of laminating electric field metal plating on the photoresist layer in the vicinity of the periphery of the part to form a mold layer having an opening of a second part smaller than the first part; Forming a metal oxide layer, applying a voltage to the matrix and laminating electric field metal plating on the oxide layer and on the photoresist layer in the vicinity of the periphery of the second portion, Forming a nozzle plate having a third portion smaller than the second portion on which a metal field plating on the photoresist layer is not formed as a nozzle hole, and the nozzle plate below the oxide layer at the interface with the oxide layer And removing the nozzle plate from the layer. In another embodiment, in any of the above embodiments, the metal is selected from metals such as nickel, chromium, iron, aluminum, silver, gold, cobalt, copper, palladium, tin, and zinc, or alloys thereof. It is good also as composition which is one or more done.

  With such a configuration, an electric field metal plating is formed on the photoresist layer by applying a voltage to the matrix and laminating the electric field metal plating on the oxide layer and on the photoresist layer near the periphery of the second portion. Nozzle holes are formed in a range corresponding to the third portion that has not been performed, and due to the thickness of the mold layer, the surface of the ink discharge surface surrounding the nozzle holes (nozzle surface 301f and inclined surface 301h) A nozzle plate protruding from the surface other than the peripheral portion of the nozzle hole can be formed.

In another aspect, in any one of the above aspects, the step of forming the nozzle plate may include a step of laminating the eutectoid electroplating of the metal and polytetrafluoroethylene (PTFE). .
With such a configuration, unnecessary ink splashes adhering to the nozzle surface can be easily moved onto the inclined surface due to surface tension. Furthermore, the ink splash that has moved becomes easy to move on the inclined surface toward the edge of the inclined surface.

<< Embodiment >>
1. Configuration of Inkjet Device First, an inkjet device that uses the droplet discharge method of the present embodiment will be described.
In addition, the scale of the member in each drawing is not necessarily the same as an actual thing. In the present application, the sign “˜” used to indicate a numerical range includes numerical values at both ends. In addition, the materials, numerical values, and the like described in this embodiment are merely preferable examples, and are not limited thereto. In addition, changes can be made as appropriate without departing from the scope of the technical idea of the present disclosure. Further, some combinations of configurations with other embodiments are possible within a range where no contradiction occurs.

1.1 Overall Configuration FIG. 1 is a diagram illustrating a main configuration of an inkjet apparatus 1000 according to an embodiment. FIG. 2 is a functional block diagram of the ink jet apparatus 1000.
As shown in FIG. 13, the ink jet apparatus 1000 includes an ink jet table 200, a head unit 300, and a control device 15 (not shown in FIG. 1). The ink jet table 200 includes a moving unit 230 for moving the head unit 300 with respect to the application target substrate fixed to the fixed stage ST. The moving unit 230 includes linear motors 204 and 205, a servo motor 221, and a control unit 213.

  As shown in FIG. 2, the control device 15 includes a CPU 150, a storage unit 151 (including a large-capacity storage unit such as an HDD), a display unit (display) 153, and an input unit 152. Specifically, the control device 15 can be a personal computer (PC). The storage unit 151 stores a control program for driving the inkjet table 200 and the head unit 300 connected to the control device 15. When the ink jet apparatus 1000 is driven, the CPU 150 performs predetermined control based on an instruction input by the operator through the input unit 152 and each control program stored in the storage unit 151.

1.2 Inkjet Table As shown in FIG. 1, the inkjet table 200 is a so-called gantry-type operation table, and is arranged on a base table so that a gantry section (moving stand) can move along a pair of guide shafts. Has been.
As a specific configuration, columnar stands 202A, 202B, 203A, and 203B are disposed at four corners of the upper surface of the plate-like base 201. In the inner region surrounded by the stands 202A, 202B, 203A, and 203B, the ejection characteristics are stabilized by ejecting ink immediately before the application and the stationary stage ST for placing the substrate to be applied. For this purpose, an ink pan (dish container) IP is provided.

  Further, guide shafts 204A and 204B are supported in parallel on the stands 202A, 202B, 203A, and 203B along the longitudinal (Y) direction of the base 201. Linear motors 205 and 206 are inserted through the guide shafts 204A and 204B, and a gantry unit 210 is mounted so as to bridge the guide shafts 204A and 204B with respect to the linear motors 205 and 206. With this configuration, when the inkjet apparatus 1000 is driven, the pair of linear motors 205 and 206 are driven, so that the gantry unit 210 reciprocates freely along the longitudinal direction (Y-axis direction) of the guide shafts 204A and 204B. Exercise.

  The gantry unit 210 is provided with a moving body (carriage) 220 made of an L-shaped pedestal. The moving body 220 is provided with a servo motor (moving body motor) 221, and a gear (not shown) is disposed at the tip of the shaft of each motor. The gear is fitted in a guide groove 211 formed along the longitudinal direction (X direction) of the gantry unit 210. Inside the guide groove 211, a fine rack is formed along the longitudinal direction. Since the gear meshes with the rack, when the servo motor 221 is driven, the moving body 220 moves precisely and reciprocally along the X-axis direction by a so-called pinion rack mechanism.

  Here, since the moving body 220 is equipped with the head unit 300, the gantry unit 210 is moved along the longitudinal direction of the guide shafts 204A and 204B while the moving body 220 is fixed to the gantry unit 210. In addition, by moving the moving body 220 along the longitudinal direction of the gantry unit 210 while the gantry unit 210 is stopped, the head unit 300 can be scanned with respect to the application target substrate. The main scanning direction of the head unit 300 is the row (Y-axis) direction, and the sub-scanning direction is the column (X-axis) direction.

  The linear motors 205 and 206 and the servo motor 221 are each connected to a control unit 213 for directly controlling driving, and the control unit 213 is connected to the CPU 150 in the control device 15. When the ink jet apparatus 1000 is driven, the CPU 150 that reads the control program controls each drive of the linear motors 205 and 206 and the servo motor 221 via the control unit 213 (see FIG. 2).

1.3 Inkjet Head The head unit 300 employs a known piezo method and includes an inkjet head 301 and a main body 302. The ink jet head 301 is fixed to the moving body 220 via the main body 302. The main body 302 has a built-in servo motor 304 (see FIG. 2). By rotating the servo motor 304, the angle formed by the longitudinal direction of the inkjet head 301 and the X axis of the fixed stage ST is adjusted. The servo motor 304 moves the inkjet head 301 in the vertical direction (Z-axis direction).

  FIG. 3 is a cross-sectional view illustrating a schematic configuration of the nozzle 3030 of the inkjet head 301. As shown in FIG. 3, the inkjet head 301 includes a nozzle plate 301 i having a plurality of nozzle holes 3031 through which droplets D are discharged, a partition wall 301 d that defines a cavity 301 e through which the plurality of nozzle holes 3031 communicate with each other, A diaphragm 301b having a driving element 3010 as driving means corresponding to the cavity 301e is laminated and joined in order.

The diaphragm 301b is formed by integrally forming a driving element 3010, which is a driving element that changes the pressure of the cavity 301e, on a semiconductor wafer by a semiconductor manufacturing process, and cutting the semiconductor wafer into a predetermined shape.
The drive element 3010 is a piezoelectric element in which a piezo element body 3013 is sandwiched between a pair of electrodes 3011 and 3012. When a drive voltage pulse (drive signal) is applied to the pair of electrodes 3011 and 3012 from the outside, the bonded diaphragm 301b is deformed. As a result, the volume of the cavity 301e partitioned by the partition wall 301d is reduced, and the ink filled in the cavity 301e is pressurized so that the ink can be ejected as droplets D from the nozzle holes 3031. When the application of the drive voltage pulse is completed, the diaphragm 301b returns to its original state, and the volume of the cavity 301e is restored, so that ink is sucked into the cavity 301e from a reservoir (not shown). By controlling the drive voltage pulse applied to the drive element 3010, it is possible to perform ejection control such as the amount of ink ejected from each nozzle 3030 and the ejection timing. As a result, in the inkjet head 301, the pressure of the cavity 301e is varied by the drive element 3010 which is a drive element, and the ink droplets which are the liquid held in the cavity 301e are ejected from the nozzle hole 3031 and attached to the print target. It is made like that.

  The partition wall 301d is formed of photosensitive resin, and is formed by exposure and development processes using a photomask after being applied to the vibration plate 301b by various application methods such as spin coating, bar coating, and curtain coating. In this process, the partition wall 301d is completely cured in an assembly process of the inkjet head 301 described later after the nozzle plate 301i is arranged in a semi-cured state.

  The nozzle plate 301i is made of a metal plate-like body in which a plurality of nozzle holes 3031 are opened in a row, for example, a metal such as nickel, chromium, iron, aluminum, silver, gold, titanium, or an alloy thereof. , Created by electroforming. A method for manufacturing the nozzle plate 301i will be described later. The wall thickness t of the nozzle plate 301i is several μm to several tens of μm, and in this example, for example, is about 5 μm, and the diameter of the nozzle hole 3031 may be, for example, 10 μm or more and 15 μm or less. The plate 301i holds the nozzle plate 301i on the end face of the partition wall 301d on the 301h side, and holds the nozzle plate 301i in close contact with the end face of the partition wall 301d.

  The nozzle plate 301i has a surface facing downward in FIG. 3A as an ink ejection surface 301a. In the nozzle plate 301i, the surface (301h, 301f) of the nozzle hole surrounding portion 301g on the ink discharge surface 301a protrudes from the surface 301k other than the nozzle hole surrounding portion. When the surface having the nozzle holes 3031 on the ink discharge surface 301a of the plate-like body is the nozzle surface 301f and the surrounding inclined surface is 301h, the inclined surface 301h and the nozzle surface 301f correspond to the nozzle hole surrounding portion 301g. In order for the ink droplets 41 wiped from the nozzle hole peripheral portion 301g to naturally return to the nozzle hole 3031 or to be efficiently removed by the blade, the length of the nozzle hole peripheral portion 301g in the direction of the ink ejection surface 301a is determined as follows. The diameter of 3031 is preferably from 0.5 times to 1.5 times, and more preferably from 0.7 times to 1.2 times. In this embodiment, for example, the thickness is 9 μm or more and 15 μm or less. Further, in order to prevent the deformation of the nozzle hole due to the blade, the length of the peripheral portion of the nozzle hole is required to be 3 μm or more, more preferably 5 μm or more. The protrusion amount δh of the surface of the nozzle hole peripheral portion 301g on the ink discharge surface 301a of the nozzle plate 301i is the maximum at the nozzle surface 301f, and continuously increases as the inclined surface is closer to the periphery of the nozzle surface 301f at 301h. It is good also as composition which has. In this example, the maximum value of the protrusion amount δ is about 2 to 4 μm. In addition, the inclination angle of the nozzle hole surrounding portion surface 301g on the ink discharge surface 301a with respect to the surface 301k other than the portion may be continuously increased as it approaches the nozzle surface 301f.

  Further, the surface portion included in the nozzle hole peripheral portion 301g in the plan view of the back surface 301m facing away from the ink discharge surface 301a of the nozzle plate 301i is depressed with respect to the surface 301l other than the portion. At this time, the amount of depression of the front surface portion included in the nozzle hole surrounding portion 301g on the back surface 301m of the nozzle plate 301i may be configured to continuously increase as the nozzle hole 3031 is approached. Further, the inclination angle of the surface portion included in the nozzle hole surrounding portion 301g of the back surface 301m of the nozzle plate 301i with respect to the surface 301l other than the surface portion may continuously increase as the nozzle hole 3031 is approached. .

  The assembly process of the inkjet head 301 is performed by heating the whole to a predetermined temperature while pressing the back surface of the nozzle plate 301i against the diaphragm 301b formed with the partition wall 301d while holding the nozzle plate 301i on the base. The partition wall 301d is completely cured, and the back surface of the nozzle plate 301i and the end surface of the partition wall 301d are bonded during the curing. After curing, the base is removed.

In FIG. 3, a portion surrounded by a broken line is one nozzle 3030. That is, the cavity 301e and the partition wall 301d forming the cavity 301e, the vibration plate 301b, the nozzle plate 301i, the drive element 3010, and the nozzle hole 3031 constitute a nozzle 3030.
The inkjet head 301 is provided with a plurality of nozzles 3030 on the surface (ejection surface) facing the fixed stage ST, and these nozzles 3030 are arranged in a row along the longitudinal direction of the inkjet head 301. Ink (ink) supplied to the inkjet head 301 is ejected from each nozzle 3030 as droplets onto the application target substrate.

  As described above, the droplet discharge operation at each nozzle 3030 is controlled by the drive voltage applied to the piezo element (piezoelectric element) 3010 provided in each nozzle 3030. The ejection control unit 303 controls the drive signal given to each drive element 3010 to cause each nozzle 3030 to eject droplets. Specifically, as shown in FIG. 2, the CPU 150 reads a predetermined control program from the storage unit 151 and instructs the ejection control unit 303 to apply a predetermined voltage to the target drive element 3010.

1.4 Cleaning Unit As illustrated in FIG. 1, the inkjet apparatus 1000 includes a cleaning unit 400. The cleaning unit 400 includes a plate-like wiper blade 410 (hereinafter referred to as “blade”) made of an elastic body such as a rubber blade, a support member 420 that supports the blade 410, and a base 430 to which the support member 420 is fixed. . The support member 420 is connected to one surface of the plate-like blade 410 and supports the blade 410 with the edge 411 of the blade 410 facing upward. That is, the blade 410 and the support member 420 are fixed to the base 201 via the base 430. The support member 420 needs to be strong enough not to be bent when the blade 410 is brought into contact with the discharge surface and to be non-uniform in contact with the discharge surface.

The length of the blade 410 in the column vertical direction (the length in the Y direction) can be appropriately determined in accordance with the width of the inkjet head 301 in the column vertical direction, and for example, about 10 to 30 mm is appropriate.
Using the inkjet apparatus 1000 having the above-described configuration, a coating process using an inkjet method is performed.

Next, an ink wiping operation performed in the droplet discharge method of the present embodiment will be described.
2. Inkjet Head Wiping Operation FIG. 4 is a diagram showing a procedure of the wiping operation of the inkjet head 301 in the inkjet apparatus 1000, wherein (a) shows a state before the ejection surface of the inkjet head and the wiper blade come into contact with each other. It is a schematic side view, (b) is a schematic side view showing a state in which the ejection surface and the wiper blade are in contact, and (c) is a schematic side sectional view showing a state during the wiping operation. 4A, the inkjet head 301 is moved so that the blade 410 is positioned on the ejection direction side of the ink ejection surface 301a of the inkjet head 301. At this time, the inkjet head 301 and the blade 410 are arranged to face each other in a manner in which the direction parallel to the ridgeline of the edge 411 of the blade 410 and the column vertical direction of the inkjet head 301 coincide. The ink jet head 301 is moved by the moving unit 230 (see FIG. 2).

Next, the ink discharge surface 301a of the inkjet head 301 is moved in a direction approaching the blade 410 (in this case, vertically downward), and the ink discharge surface 301a is brought into contact with the blade 410 as shown in FIG. . At this time, the edge 411 of the blade 410 is brought into contact with the ink ejection surface 301a so as to be lightly pressed.
Then, in a state where the ink ejection surface 301a and the blade 410 are in contact, the inkjet head 301 is moved in the direction of the white arrow shown in FIGS. 4 (b) and 4 (c). Then, unnecessary adhering ink 10 on the ink discharge surface 301a is wiped and removed from the ink discharge surface 301a by the edge 411 of the blade 410.

At this time, the blade 410 is supported to such an extent that the edge 411 of the blade 410 is brought into contact with the ink ejection surface 301a so that the ink ejection surface 301a is lightly pressed, so that the edge 411 does not damage the ink ejection surface 301a. The ink 10 attached to the ink discharge surface 301a can be removed.
3. Method for Manufacturing Nozzle Plate 301i Next, a method for manufacturing the nozzle plate 301i will be described with reference to the drawings. FIGS. 5A to 5C, FIGS. 6A to 6C, and FIGS. 7A to 7C are diagrams showing states in respective steps in manufacturing the nozzle plate 301i. 3 is a schematic cross-sectional view cut at the same position as FIG. FIGS. 8A to 8C are schematic plan views showing states in each process in manufacturing the nozzle plate 301i, FIG. 8A is a top view of FIG. 5C, and FIG. FIG. 7A is a top view of FIG. 7C and FIG. 7C is a bottom view of FIG.

  A substrate made of metal is prepared as a matrix 800, and the surface 801a is polished (FIG. 5A). The mother die 800 may be any member having conductivity, and is formed of a metal material with good release of the nozzle plate, such as stainless steel, aluminum, nickel, nickel-iron alloy, brass or the like. Preferably, it is stainless steel. Next, a photoresist layer 810 made of a photosensitive insulating material is applied to the surface 801a of the matrix 800 using a wet film forming process such as a printing method, a spin coating method, or an ink jet method (FIG. 5B), and then a nozzle A photomask provided with an opening corresponding to a range including the hole 3031 and larger than the nozzle hole 3031 by a predetermined dimension is overlaid, and the photoresist layer 810 is exposed by irradiating ultraviolet rays from the photomask. The pattern having it is transferred. Thereafter, a photoresist layer 810 patterned so as to include a region for forming the nozzle hole larger than the region for forming the nozzle hole 3031 by a predetermined dimension is formed by development (FIG. 5C). The region from which the photoresist layer 810 has been removed is referred to as a non-existing region 810a of the photoresist layer. When the mother die 800 is viewed in plan, as shown in FIG. 8A, a photoresist layer 810 composed of a plurality of regions including a region where the nozzle hole 3031 is formed is formed.

  Next, a strike nickel plating process is performed using a metal, for example, a nickel chloride bath (FIG. 6A). Thereby, strike nickel plating is attached to the non-existing region 810a of the photoresist layer 810 on the upper surface of the mother die 800 to form an adhesion layer 820 in which the first portion 820a corresponding to the photoresist layer 810 is opened. As a result, the passive film on the surface 801a of the matrix 800 can be removed to form the adhesion layer 820 by active strike nickel plating, and the adhesion to the upper layer can be improved. Here, in addition to nickel constituting the strike nickel plating, the metal constituting the plating may be any metal that can form a film by electroforming, for example, chromium, iron, aluminum, silver, gold, cobalt, copper, It is good also as a structure using metals, such as palladium, tin, zinc, or those alloys.

  Next, electrolytic nickel plating is performed using the matrix 800 as a negative electrode (FIG. 6B). The mold layer 830 made of electrolytic nickel plating is isotropically stacked on the adhesion layer 820 from the non-existing region 810a in the non-existing region 810a of the insulating photoresist layer 810. That is, as shown in FIG. 6B, in the electric field nickel plating process, the mold layer 830 is formed from the surface of the adhesion layer 820 made of strike nickel plating having conductivity in the non-existing region 810a from the surface of the photoresist layer 810. It is deposited isotropically depending on the strength of the electric field in an arbitrary cross section passing through the center. Therefore, a fan-shaped intrusion portion 830a having the peripheral edge 810b as the center of the arc is formed in an arbitrary cross section passing through the center of the photoresist layer 810 inward of the peripheral edge 810b of the photoresist layer 810. As a result, a voltage is applied to the mother die 800 to deposit a field nickel plating on the adhesion layer 820 and on the photoresist layer 810 in the vicinity of the periphery of the first portion 820a, whereby the first portion 820a is placed in the first portion 820a. A mold layer 830 having an opening in the smaller second portion 830b is formed. Here, the maximum thickness of the mold layer 830 is preferably about 2 to 3 μm. The thickness of the mold layer 830 corresponds to the protrusion amount δh (FIG. 3) of the surface of the nozzle hole surrounding portion 301g on the ink discharge surface 301a of the nozzle plate 301i to be formed.

  Next, a baking process is performed on the formed mold layer 830 to oxidize the surface to form an oxide layer 831 (FIG. 6C). That is, after the mold layer 830 is formed, an oxidation treatment is performed in a firing step under a predetermined condition (a step of firing in the atmosphere under a heating temperature of 200 ° C. to 600 ° C. and a heating time of 5 minutes to 120 minutes). By interposing the oxide layer 831 between the mold layer 830 and the upper layer, the adhesion with the upper layer can be lowered and the peelability to the upper layer can be improved. In order to obtain sufficient peelability, the thickness of the oxide layer 831 is preferably about 0.5 μm.

  Next, electrolytic nickel plating is performed using the matrix 800 as a negative electrode (FIG. 7A). Again, the nozzle plate layer 301iX made of electrolytic nickel plating is isotropically stacked on the oxide layer 831 from the non-existing region 810a in the non-existing region 810a of the insulating photoresist layer 810. That is, as shown in FIG. 7A, the nozzle plate layer 301iX has an electric field within an arbitrary cross section passing through the center of the photoresist layer 810 from the surface of the adhesion layer 820 made of strike nickel plating in the absence region 810a. Isotropically deposited according to strength. Accordingly, a hollow fan-shaped intrusion portion 301iXa having the peripheral edge 810b as the center of the arc is formed in an arbitrary cross section passing through the center of the photoresist layer 810 inward of the peripheral edge 810b of the photoresist layer 810. As a result, by applying a voltage to the master block 800 and depositing electrolytic nickel plating on the oxide layer 831 and on the photoresist layer 810 in the vicinity of the periphery 830c of the second portion 830b, electrolytic nickel on the photoresist layer 810 is obtained. A nozzle plate layer 301iX is formed with the third portion 301iXb on which no plating is formed as the nozzle hole 3031 (FIG. 8B). The opening diameter of the third portion 301iXb is smaller than the second portion 830b by a distance corresponding to twice the thickness of the nozzle plate layer 301iX. The thickness of the nozzle plate layer 301iX corresponds to the thickness t (FIG. 3) of the nozzle plate layer 301iX to be formed, and is several μm to several tens of μm. In this example, for example, it is about 5 μm. In addition, the metal which comprises plating should just be what can form a film | membrane by an electroforming process, for example, metals, such as nickel, chromium, iron, aluminum, silver, gold | metal | money, cobalt, copper, palladium, tin, zinc, or It is good also as a structure using those alloys.

  Next, the deposited nozzle plate layer 301iX is peeled off from the oxide layer 831 and lower layers at the interface with the oxide layer 831 (FIG. 7B), and the nozzle plate layer 301iX is taken out to complete the nozzle plate 301i. (FIG. 7C). In the completed nozzle plate 301i, as shown in FIG. 7C, the nozzle hole 3031 is formed in a range corresponding to the third portion 301iXb on the photoresist layer 810 where the electro nickel plating was not formed. In addition, due to the thickness of the mold layer 830, the surface (nozzle surface 301f and the inclined surface 301h) of the nozzle hole surrounding portion 301g on the ink discharge surface 301a protrudes from the surface 301k other than the nozzle hole surrounding portion. Further, when the surface having the nozzle holes 3031 on the ink discharge surface 301a of the nozzle plate 301i is defined as the nozzle surface 301f, the protrusion amount δh of the surface of the nozzle hole surrounding portion 301g on the ink discharge surface 301a of the nozzle plate 301i is the nozzle surface 301f. It is the largest, and continuously increases as it approaches the nozzle surface 301f so as to follow the shape of the upper edge of the mold layer 830.

4). Example The surface state of the ink ejection surface 301a was observed for an example of the nozzle plate 301i.
FIGS. 9A and 9B are electron micrographs showing the periphery of the nozzle hole 3031 in the ink ejection surface 301a of the completed nozzle plate 301i. FIG. 9A is a normal direction perpendicular to the ink ejection surface 301a. (B) is an image taken from a direction inclined by 20 ° from the normal line of the ink discharge surface 301a. It can be seen that the nozzle surface 301f having the nozzle hole 3031 and the surrounding inclined surface 301h constituting the nozzle hole peripheral portion 301g with respect to the nozzle hole 3031 protrude from the surface 301k other than the nozzle hole peripheral portion 301g. . Further, it can be seen that the protrusion amount δh on the surface of the nozzle hole surrounding portion 301g is the maximum at the nozzle surface 301f, and continuously increases as the inclined surface is closer to the nozzle surface 301f at 301h.

5. Effect Confirmation Test An ink jet head was prepared using the example and comparative example of the nozzle plate 301i, and an ink wiping test was performed.
FIGS. 10A to 10C are schematic cross-sectional side views showing a state during the wiping operation in the inkjet head 301. FIGS. 11A to 11C are schematic side sectional views showing a state during the wiping operation in the comparative example of the ink jet head. In the comparative example, the ink ejection surface of the nozzle plate 301iX having a flat ink ejection surface 301aX is rubbed along the nozzle hole row with the same blade 410 as in the embodiment.

  As shown in FIGS. 11A to 11C, in the comparative example, unnecessary ink droplets 41 attached to the periphery of the upstream nozzle hole 3031a move to the ink discharge surface near the downstream nozzle hole 3031b. There was a problem to do. In this case, in a state where the ink droplets 41 are attached in the middle of the nozzle hole row, as described above, the ink ejection direction is bent, the ink landing position is deviated from the target position, or the amount of ink different from the desired amount is used. Cause the ink to be illegally ejected. Therefore, in order to prevent improper ejection of ink, it is necessary to move the ink splash 41 to the most downstream side of the nozzle hole row.

  On the other hand, in the embodiment, as shown in FIGS. 10A to 10C, unnecessary ink splashes 41 adhering to the nozzle surface 301f having the upstream nozzle hole 3031a are scraped off by the blade 410. It moves on the inclined surface 301h by surface tension. On the ink ejection surface 301a of the nozzle plate 301i, the protrusion amount δh of the surface of the nozzle hole surrounding portion 301g is the largest at the nozzle surface 301f, and continuously increases as the inclined surface is closer to the nozzle surface 301f at 301h. Therefore, the problem that the ink splash 41 moved on the inclined surface 301h is separated from the edge 411 of the blade 410 and the ink splash 41 moves to the nozzle surface 301f near the downstream nozzle hole 3031b is improved. As a result, it is possible to surely remove the ink splashes 41 adhering to the nozzle surface 301f, which cause the illegal ejection of ink.

6). 6. Application of Inkjet Device 6.1 Overall Configuration of Display Device Next, the configuration and manufacturing method of an organic EL display panel (hereinafter simply referred to as “display panel”) 100 manufactured using the inkjet device 1000, and the display panel. A configuration of the display device 1 including 100 will be described.

  FIG. 12 is a block diagram illustrating a configuration of the display device 1 including an organic EL element manufactured by a manufacturing method including a droplet discharge method according to an embodiment of the present disclosure. As shown in FIG. 12, the display device 1 includes a display panel 100 and a drive control unit 20 connected thereto. The display panel 100 is a panel using an electroluminescence phenomenon of an organic material, and a plurality of organic EL elements are arranged in a matrix, for example. The drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.

In the actual display device 1, the arrangement of the drive control unit 20 with respect to the display panel 100 is not limited to this.
6.2 Configuration of Display Panel (1) Configuration of Each Layer The configuration of the display panel 100 will be described with reference to FIG.

  FIG. 13 is a partial cross-sectional view of the configuration of the display panel 100. The display panel 100 is a so-called top emission type in which the upper side of FIG. As shown in FIG. 13, the display panel 100 is formed with a substrate 101 as a base. On the substrate 101, a TFT (thin film transistor) layer 102 and a feeding electrode (wiring portion) 103 are formed, and an interlayer insulating film 104 is laminated so as to cover it.

A pixel electrode 106 is formed on the interlayer insulating film 104 which is an insulating layer, and a hole injection layer 109 is stacked so as to cover the pixel electrode 106.
On the hole injection layer 109, a partition layer 107 is provided in which a plurality of openings 117 (see FIG. 4), which are regions where the organic light emitting layer 111 is formed, are formed. A hole transport layer 110 and an organic light emitting layer 111 are sequentially stacked in the opening 117.

An electron transport layer 112, an electron injection layer 113, a counter electrode 114, and a sealing layer 118 are sequentially stacked on the organic light emitting layer 111 and the partition wall layer 107.
A substrate 101 is a rear substrate in the display panel 100, and a TFT layer 102 including a TFT (thin film transistor) for driving the display panel 100 by an active matrix method is formed on the surface thereof. The TFT layer 102 includes a power supply electrode 103 that is a wiring portion for supplying electric power to each TFT from the outside. In the present embodiment, another reference numeral is assigned to make the description easy to understand. To explain. In the present embodiment, the power supply electrode 103 is formed using molybdenum (Mo).

The interlayer insulating film 104 is provided in order to adjust the level difference generated by the TFT layer 102 and the power supply electrode 103 to be flat, and is made of an organic material having excellent insulating properties.
The contact hole (contact part) 105 is provided to electrically connect the power supply electrode 103 and the pixel electrode 106, and is formed from the front surface to the back surface of the interlayer insulating film 104. The contact holes 105 are formed so as to be positioned between the openings 117 (see FIG. 4) arranged in the column direction, and are configured to be covered with the partition wall layer 107. When the contact hole 105 is not covered with the partition wall layer 107, the presence of the contact hole 105 causes the organic light emitting layer 111 not to be a flat layer and causes uneven light emission. In order to avoid this, the above configuration is adopted.

  The pixel electrode 106 is an anode and is formed for each organic light emitting layer 111 formed in the opening 117. Since the display panel 100 is a top emission type, a light reflective material is selected as the material of the pixel electrode 106. The light reflective material is, for example, a laminated film of a metal film made of a metal mainly composed of aluminum (Al) and a nickel (Ni) film.

The hole injection layer 109 is provided for the purpose of promoting the injection of holes from the pixel electrode 106 to the organic light emitting layer 111.
When the organic light emitting layer 111 is formed, the partition layer 107 is mixed with an organic light emitting layer material corresponding to each color of red (R), green (G), and blue (B) and an ink (ink) containing a solvent. Fulfills the function of preventing.

The partition layer 107 provided so as to cover the contact hole 105 has a trapezoidal cross section along the XZ plane or the YZ plane as a whole, but the position corresponding to the contact hole 105 Then, the shape of the partition wall layer material is contracted and depressed.
The hole transport layer 110 has a function of transporting holes injected from the pixel electrode 106 to the organic light emitting layer 111.

  The organic light emitting layer 111 is a portion that emits light by recombination of carriers (holes and electrons), and is configured to include an organic material corresponding to any of R, G, and B colors. Is formed. In a display panel using organic EL elements, the organic EL elements corresponding to the colors R, G, and B are subpixels, and the combination of the three subpixels R, G, and B is one pixel (one pixel). It corresponds to.

In addition, all the organic light emitting layers 111 formed in each opening part 117 can also be made into the organic light emitting layer of the same color.
The electron transport layer 112 has a function of transporting electrons injected from the counter electrode 114 to the organic light emitting layer 111.
The electron injection layer 113 has a function of promoting the injection of electrons from the counter electrode 114 to the organic light emitting layer 111.

The counter electrode 114 is a cathode. Since the display panel 100 is a top emission type, a light transmissive material is selected as the material of the counter electrode 114.
A sealing layer is provided on the counter electrode 114 for the purpose of preventing the organic light emitting layer 111 from being deteriorated by contact with moisture or air. Since the display panel 100 is a top emission type, a light transmissive material such as SiN (silicon nitride) or SiON (silicon oxynitride) is selected as the material of the sealing layer.

Although not shown in FIG. 13, a color filter or an upper substrate may be placed on the sealing layer 118 and bonded. By placing and bonding the upper substrate, the organic layers (the hole transport layer 110, the organic light emitting layer 111, and the electron transport layer 112) are protected from moisture and air.
(2) Material of each layer Next, the material of each layer demonstrated above is illustrated. Needless to say, each layer can be formed using materials other than those described below.

Substrate 101: alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, borate glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin, alumina, etc. Interlayer insulating film 104: polyimide resin, acrylic resin Pixel electrode 106: Ag (silver), Al (aluminum), an alloy of silver, palladium and copper, an alloy of silver, rubidium and gold, an aluminum alloy , Mo (molybdenum), MoCr (alloy of molybdenum and chromium), MoW (alloy of molybdenum and tungsten), NiCr (alloy of nickel and chromium)
Note that a known transparent conductive film may be provided on the surface of the pixel electrode 106. As a material of the transparent conductive film, for example, indium tin oxide (ITO) or indium zinc oxide (IZO) can be used.

Partition layer 107: acrylic resin, polyimide resin, novolak type phenol resin Organic light emitting layer 111: oxinoid compound, perylene compound, coumarin compound, azacoumarin compound, oxazole compound, oxadiazole compound, perinone compound, pyrrolopyrrole compound, naphthalene compound , Anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone compound , Styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound Product, fluorescein compound, pyrylium compound, thiapyrylium compound, serenapyrylium compound, telluropyrylium compound, aromatic ardadiene compound, oligophenylene compound, thioxanthene compound, cyanine compound, acridine compound, metal complex of 8-hydroxyquinoline compound, 2-bipyridine Fluorescent substances such as compound metal complexes, Schiff salts and group III metal complexes, oxine metal complexes, rare earth complexes (all described in JP-A-5-163488)
Hole injection layer 109: triazole derivative, oxadiazole derivative, imidazole derivative, polyarylalkane derivative, pyrazoline derivative and pyrazolone derivative, phenylenediamine derivative, arylamine derivative, amino-substituted chalcone derivative, oxazole derivative, styrylanthracene derivative, fluorenone derivative , Hydrazone derivatives, stilbene derivatives, porphyrin compounds, aromatic tertiary amine compounds, styrylamine compounds, butadiene compounds, polystyrene derivatives, hydrazone derivatives, triphenylmethane derivatives, tetraphenylbenzine derivatives (all disclosed in JP-A-5-163488) Metal such as MoOx (molybdenum oxide), WOx (tungsten oxide) or MoxWyOz (molybdenum-tungsten oxide). Hole transport layer 110: triazole derivative, oxadiazole derivative, imidazole derivative, polyarylalkane derivative, pyrazoline derivative and pyrazolone derivative, phenylenediamine derivative, arylamine derivative, amino-substituted chalcone derivative , Oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, porphyrin compounds, aromatic tertiary amine compounds, styrylamine compounds, butadiene compounds, polystyrene derivatives, hydrazone derivatives, triphenylmethane derivatives, tetraphenylbenzine derivatives (All are described in JP-A-5-163488)
Electron transport layer 112: nitro-substituted fluorenone derivative, thiopyrandioxide derivative, difequinone derivative, perylenetetracarboxyl derivative, anthraquinodimethane derivative, fluorenylidenemethane derivative, anthrone derivative, oxadiazole derivative, perinone derivative, quinoline complex derivative (All described in JP-A-5-163488), phosphorus oxide derivatives, triazole derivatives, todiazine derivatives, silole derivatives, dimesityl boron derivatives, triaryl boron derivatives Electron injection layer 113: lithium, barium, calcium, potassium, cesium, sodium Low work function metals such as rubidium, low work function metal salts such as lithium fluoride, and low work function metal oxides such as barium oxide Counter electrode 114: ITO (indium oxide) 'S), IZO (indium zinc oxide)
The configuration of the display panel 100 has been described above. Next, a method for manufacturing the display panel 100 is illustrated.

6.3 Method for Manufacturing Display Panel Here, a method for manufacturing the display panel 100 according to the embodiment will be described with reference to FIGS. 14 (a) to 14 (e) and FIGS. 15 (a) to 15 (d). 14A to 14E and 15A to 15D are partially enlarged cross-sectional views schematically showing the manufacturing process of the display panel 100. FIG.
First, the substrate 101 on which the TFT layer 102 and the feeding electrode 103 are formed is prepared (FIG. 14A).

  Thereafter, an interlayer insulating film 104 having a thickness of about 4 [μm] is formed on the TFT layer 102 and the feeding electrode 103 using an organic material having excellent insulating properties based on a photoresist method. At this time, the contact holes 105 are formed in accordance with the positions between the openings 117 adjacent in the column direction (FIG. 14B). At this time, by performing a photoresist method using a desired pattern mask, the interlayer insulating film 104 and the contact hole 105 can be formed at the same time. Of course, the method of forming the contact hole 105 is not limited to this. For example, after the interlayer insulating film 104 is uniformly formed, the interlayer insulating film 104 at a predetermined position can be removed to form the contact hole 105.

Subsequently, the pixel electrode 106 made of a metal material having a thickness of about 150 [nm] is formed for each subpixel while being electrically connected to the power supply electrode 103 based on a vacuum deposition method or a sputtering method. Subsequently, the hole injection layer 109 is formed based on the reactive sputtering method (FIG. 14C).
Next, the partition layer 107 is formed based on a photolithography method. First, as the partition layer material, a pasty partition layer material containing a photosensitive resist is prepared. This partition wall layer material is uniformly applied on the hole injection layer 109. A mask formed in the pattern of the opening 117 is overlaid thereon. Subsequently, exposure is performed on the mask to form a partition wall layer pattern. Thereafter, excess partition wall layer material is washed out with an aqueous or non-aqueous etching solution (developer). Thereby, patterning of the partition wall layer material is completed. Thus, the opening 117 serving as the organic light emitting layer forming region is defined, and the partition wall layer 107 whose surface is at least water-repellent is completed (FIG. 14D).

In the step of forming the partition layer 107, the surface of the partition layer 107 is further subjected to a predetermined surface in order to adjust the contact angle of the partition layer 107 with respect to the ink applied to the opening 117 or to impart water repellency to the surface. Surface treatment may be performed with an alkaline solution, water, an organic solvent, or the like, or plasma treatment may be performed.
Next, an organic material constituting the hole transport layer 110 and a solvent are mixed at a predetermined ratio to prepare a hole transport layer ink. This ink is supplied to each inkjet head 301, and droplets 18 made of hole transport layer ink are ejected from the nozzle 3030 corresponding to each opening 117 based on the coating process (FIG. 14E). Thereafter, the solvent contained in the ink is evaporated and dried, and heated and fired as necessary to form the hole transport layer 110 (FIG. 15A).

  Next, an organic material constituting the organic light emitting layer 111 and a solvent are mixed at a predetermined ratio to prepare an organic light emitting layer ink. This ink is supplied to the inkjet head 301, and droplets 19 made of the organic light emitting layer ink are ejected from the nozzle 3030 corresponding to the opening 117 based on the coating process (FIG. 15B). Thereafter, the solvent contained in the ink is evaporated and dried, and the organic light emitting layer 111 is formed by heating and baking as necessary (FIG. 15C).

  Next, details of a method of applying the ink of the organic light emitting layer 111 in the opening 117 using the ink jet method will be described. FIG. 16 is a diagram illustrating a process of applying the light emitting layer forming ink to the substrate, and uniformly applying the light emitting layer forming ink to the moat-shaped opening 117 between the adjacent partition walls 107. It is a schematic plan view which shows a process. At the time of forming the organic light emitting layer 111, the red organic light emitting layer 111 and the green subpixel opening are formed in the red subpixel opening 117 </ b> R using ink that is a solution for forming the organic light emitting layer 111. The organic light emitting layer 111 for green is formed in 117G, and the organic light emitting layer 111 for blue is formed in the opening 117B for blue subpixels in each region between a plurality of line banks.

  In order to simplify the description, here, the amount of ink ejected from the nozzle is set to the first condition, the ink is applied to the plurality of first color gaps on the substrate, and then the ink ejected from the nozzle Is set to the second condition, ink is applied to the plurality of second color gaps on the substrate, and then the amount of ink ejected from the nozzle is set to the third condition to set the amount of ink on the substrate. Ink is sequentially applied to all three color gaps by a method of applying ink to a plurality of third color gaps. When application of ink to the gap of the first color is finished on the substrate 101, ink is then applied to the gap of the second color of the substrate, and then ink is applied to the gap of the third color of the substrate. This process is repeated, and the inks for the three colors are sequentially applied.

In the above, when the application of the ink to the gaps of the first color is finished on the plurality of substrates, the ink is then applied to the gaps of the second color on the plurality of substrates, and then The step of applying the ink to the gaps of the third color may be repeated to sequentially apply the inks for the gaps of the three colors.
On the other hand, after the amount of ink ejected from the nozzle is set to the first condition and ink is applied to the gap of the first color on one substrate, the amount of ink is changed to the second condition and adjacent. Ink is applied to the gap of the second color, and the amount of ink is changed to the third condition, ink is applied to the gap of the adjacent third color, and the amount of ink is returned to the first condition to be adjacent. Alternatively, ink may be applied to the first color gap, and this operation may be repeated to continuously apply ink to all three color gaps on one substrate.

(Method of uniformly applying to openings 117 between partition walls 107)
Next, a method of applying ink (for example, ink for red gap) in one color gap will be described.
The organic light emitting layer 111 is continuously extended not only to the light emitting region but also to the adjacent non-self light emitting region. In this way, when the organic light emitting layer 111 is formed, the ink applied to the light emitting region can flow in the column direction through the ink applied to the non-self light emitting region, and the ink drying process according to this embodiment described later is performed. By implementing, the film thickness of the organic light emitting layer 111 can be leveled between the pixels in the column direction. However, in the non-self-luminous region, the flow of ink is moderately suppressed by the low partition extending in the X direction. Therefore, large film thickness unevenness in the column direction is less likely to occur, and brightness unevenness and lifetime reduction for each pixel are improved.

  In this coating method, as shown in FIG. 16, the substrate 101 is placed on the operation table of the droplet discharge device with the partition layer 107 along the Y direction, and a plurality of nozzle holes 3031 along the Y direction. While the inkjet head 301 arranged in a line is scanned in the X direction, ink is landed by aiming at a landing target set in the opening 117 between the partition wall layers 107 from each nozzle hole 3031.

In addition, the area | region which apply | coats the ink of the organic light emitting layer 111 with the same application | coating amount is one of the three area | regions lined up adjacent to ax direction.
The method for forming the organic light emitting layer 111 is not limited to this, and the ink is dropped by a known method such as a dispenser method, a nozzle coating method, a spin coating method, an intaglio printing, a relief printing, or the like, other than the inkjet method or the gravure printing method. -It may be applied.

  Next, a material constituting the electron transport layer 112 is formed on the surface of the organic light emitting layer 111 based on a vacuum deposition method. Thereby, the electron transport layer 112 is formed. Subsequently, the material for forming the electron injection layer 113 is formed by a method such as a vapor deposition method, a spin coating method, or a casting method, whereby the electron injection layer 113 is formed. Then, using a material such as ITO or IZO, a film is formed by vacuum deposition, sputtering, or the like. Thereby, the counter electrode 114 is formed (FIG. 15D).

Although not shown, a sealing layer is formed on the surface of the counter electrode 114 by forming a light transmissive material such as SiN or SiON by a sputtering method, a CVD method, or the like.
The display panel 100 is completed through the above steps. Then, before and after the step of ejecting ink droplets from the nozzle 3030 of the inkjet head 301 shown in FIGS. 14 (e) and 15 (b), the wiping and removing operation of the adhered ink shown in FIGS. 4 (a) to 4 (c). I do.

7). Summary As described above, the inkjet apparatus 1000 according to the present embodiment is composed of a plate-shaped body mainly composed of a metal in which a plurality of nozzle holes 3031 are formed in a row, and one surface of the plate-shaped body is inked. When the ejection surface 301a is used, the surface of the nozzle hole surrounding portion 301g on the ink ejection surface 301a of the plate-like body has a nozzle plate 301i protruding from the surface 301k other than the nozzle hole surrounding portion 301g, and the back surface of the nozzle plate 301i. A plurality of partition walls 301d that divide a gap between the diaphragm 301b facing the nozzle 301m, the nozzle plate 301i and the diaphragm 301b for each nozzle hole 3031 and form a cavity 301e corresponding to each nozzle hole 3031; Drive element that is provided in the cavity 301e and individually varies the pressure in each cavity 301e 3010 is employed.

  With this configuration, when the ink discharge surface of the ink jet head is rubbed along a nozzle hole array with a wiper such as a rubber blade, unnecessary ink does not adhere to the ink discharge surface of the ink jet head, and the ink discharge surface is unnecessary. Ink can be removed. Specifically, in the cleaning operation, when the ink discharge surface of the ink jet head is rubbed along the nozzle hole row with a wiper such as a rubber blade, the unnecessary nozzle surface 3031a attached to the nozzle surface 301f with the upstream nozzle hole is unnecessary. The ink splash 41 is scraped off by the blade 410 and moves to a surface other than the nozzle surface 301f by surface tension. In the ink jet head 301, the surface of the nozzle hole surrounding portion 301g on the ink discharge surface 301a uses the nozzle plate 301i that protrudes from the surface 301k other than the nozzle hole surrounding portion 301g. The moved ink splash 41 is separated from the edge 411 of the blade 410, and the problem that the ink splash 41 moves to the nozzle surface 301f near the nozzle hole 3031b on the downstream side is improved. As a result, it is possible to surely remove the ink splashes 41 adhering to the nozzle surface 301f, which cause the illegal ejection of ink.

Further, the wiper blade 410 made of rubber, the wiper blade 410 so that the wiper blade 410 relatively moves in a direction parallel to the ink discharge surface 301a in a state where the tip 411 of the wiper blade 410 and the ink discharge surface 301a are in contact with each other. A configuration having a moving unit 230 that moves at least one of the blade 410 and the inkjet head 301 is employed.
With this configuration, it is possible to realize the ink jet apparatus 1000 that removes unnecessary ink attached to the ink discharge surface without causing unnecessary ink to adhere to the ink discharge surface of the ink jet head. The inkjet apparatus 1000 can provide an organic EL element in which the organic functional layer is normally applied by preventing the occurrence of non-ejection nozzles. Further, an organic EL display panel having such an organic EL element and having good image quality with no omission and no significant difference in color density, and an organic EL display device having such an organic EL display panel Can be provided.

  Further, in the nozzle plate 301i, when the surface having the nozzle holes 3031 on the ink ejection surface 301a of the plate-like body is the nozzle surface 301f, the protrusion amount δh of the surface of the nozzle hole surrounding portion 301g on the ink ejection surface 301a of the plate-like body is The nozzle surface 301f may be the largest and continuously increase as it approaches the periphery of the nozzle surface 301f.

Further, in the nozzle plate 301i, the inclination angle of the surface of the nozzle hole surrounding portion 301g on the ink ejection surface 301a of the plate-like body with respect to the surface 301k other than the portion approaches the periphery of the nozzle surface 301f from the outer periphery of the nozzle surface 301f. Therefore, it is good also as a structure which is increasing continuously.
With this configuration, when the ink discharge surface of the inkjet head is rubbed along the nozzle hole array with a wiper such as a rubber blade in the cleaning operation, unnecessary ink splashes adhering to the ink discharge surface near the nozzle holes of the inkjet head are nozzles. It can be easily removed from the ink ejection surface near the hole. Specifically, unnecessary ink droplets 41 adhering to the nozzle surface 301f having the upstream nozzle hole 3031a are scraped by the blade 410 and move onto the inclined surface 301h by surface tension. At this time, the ink droplet 41 can easily move from the nozzle surface 301f to the inclined surface 301h, and the moved ink droplet 41 can easily move on the inclined surface 301h toward the edge of the inclined surface 301h. Become. As a result, the ink splash 41 moved to the edge of the inclined surface 301h is surely separated from the edge 411 of the blade 410, and the ink splash 41 moves to the nozzle surface 301f near the nozzle hole 3031b on the downstream side. It is further improved.

Alternatively, in the nozzle plate 301i, the surface portion included in the nozzle hole peripheral portion 301g in a plan view of the back surface 301m facing the plate-shaped ink ejection surface 301a is depressed with respect to the surface 301l other than the portion. The amount of depression may be continuously increased as the nozzle hole 3031 is approached.
In addition, the inclination angle of the surface portion 301j included in the nozzle hole peripheral portion 301g in the plan view of the back surface 301m of the plate-like body with respect to the surface portion 301l other than the portion increases continuously as the nozzle hole 3031 is approached. It is good also as a structure.

With such a configuration, when ink is ejected, the resistance between the ink and the back surface 301 m can be reduced to increase the ink ejection efficiency and improve the landing accuracy.
Further, the metal may be configured to be one or more selected from metals such as nickel, chromium, iron, aluminum, silver, gold, cobalt, copper, palladium, tin, and zinc, or alloys thereof.

With such a configuration, it is possible to realize a configuration in which unnecessary ink attached to the ink ejection surface can be easily removed without attaching unnecessary ink to the ink ejection surface using various metals.
Further, the manufacturing method of the nozzle plate 301i of the present embodiment includes a step of preparing a mother die made of a conductive material and having a flat top surface, a step of applying an insulating photoresist on the upper surface of the mother die 800, and a photo The resist is exposed through a mask and then developed to form a photoresist layer 810 that includes a region that is larger than the region where the nozzle hole 3031 is formed, and includes the photoresist layer 810 on the upper surface 800a of the mother die 800. Forming a contact metal layer 820 having a first portion 820a corresponding to the photoresist layer 810 opened by applying strike metal plating to the non-existing region 810a, and applying a voltage to the mother die 800 to Electroless nickel plating is laminated on the photoresist layer 810 in the vicinity of the periphery of the first portion 820a, and is smaller than the first portion 820a. A step of forming a mold layer 830 having an opening in two portions 830b; a step of performing heat treatment to form a metal oxide layer 831 on the surface of the mold layer 830; In addition, the electrolytic nickel plating is laminated on the photoresist layer 810 near the periphery of the second portion 830b, and the third portion 301iXb smaller than the second portion 830b on which the electrolytic nickel plating is not formed on the photoresist layer 810 is formed with the nozzle hole 3031. The nozzle plate 301i may be formed, and the nozzle plate 301i may be separated from the oxide layer 831 and lower layers at the interface with the oxide layer 831 to take out the nozzle plate 301i.

  With such a configuration, it is possible to manufacture the nozzle plate 301i used in the inkjet head 301 that can realize a configuration in which unnecessary ink attached to the ink ejection surface can be easily removed without causing unnecessary ink to adhere to the ink ejection surface. Specifically, in the above manufacturing method, an electric field metal plating is laminated on the oxide layer 831 and the photoresist layer 810 in the vicinity of the periphery 830c of the second portion 830b by applying a voltage to the matrix 800. Thus, the nozzle plate layer 301iX made of electric field metal plating has a strong electric field in an arbitrary cross section passing through the center of the photoresist layer 810 from the surface of the adhesion layer 820 in the absence region 810a of the insulating photoresist layer 810. Isotropically deposited accordingly. Accordingly, a hollow fan-shaped intrusion portion 301iXa having the peripheral edge 810b as the center of the arc is formed in an arbitrary cross section passing through the center of the photoresist layer 810 inward of the peripheral edge 810b of the photoresist layer 810. As a result, the nozzle hole 3031 is formed in a range corresponding to the third portion 301 iXb on the photoresist layer 810 where the electric field metal plating is not formed, and the ink ejection is caused by the thickness of the mold layer 830. A nozzle plate 301i that protrudes from the surface 301k other than the nozzle hole peripheral portion is formed on the surface (nozzle surface 301f and inclined surface 301h) of the nozzle hole peripheral portion 301g on the surface 301a.

<< Modification 1 >>
Although the inkjet apparatus 1000, the inkjet head 301, and the nozzle plate 301i according to the embodiments have been described, the present disclosure is not limited to the above embodiments except for the essential characteristic components. For example, embodiments obtained by subjecting the embodiments to various modifications conceived by those skilled in the art, and embodiments realized by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention Are also included in this disclosure. Below, a modification is demonstrated as an example of such a form.

(1) Configuration In the inkjet head 301A according to the first modification, the nozzle plate 301iA includes a plate-like body including polytetrafluoroethylene (PTFE) in a predetermined depth range from the surface of the ink ejection surface 301aA. Thus, unlike the inkjet head 301 according to the embodiment, the other configurations are the same as those of the inkjet head 301, and thus the description thereof is omitted.

  FIG. 17 is a partially enlarged cross-sectional view illustrating a schematic configuration of nozzles in the inkjet head 301A according to the first modification. In the inkjet head 301A, like the nozzle plate 301i, the nozzle plate 301iA is made of a metal plate body in which a plurality of nozzle holes 3031 are opened in a row. For example, nickel, chromium, iron, aluminum, silver, gold, cobalt, It consists of metals such as copper, palladium, tin, and zinc, and is made by electroforming. In this example, nickel is used. Further, the nozzle plate 301iA contains polytetrafluoroethylene in a range of a predetermined depth from the surface of the ink ejection surface 301aA. That is, as shown in FIG. 17, it has the structure provided with the polytetrafluoroethylene containing layer 301iA1 on the nozzle plate base layer 301iA2.

(2) Manufacturing Method A manufacturing method of the inkjet head 301A will be described. 18A to 18C are schematic cross-sectional views cut at the same positions as those in FIG. 17 showing the states in the respective steps in manufacturing the inkjet head 301A. The manufacturing process before the stage shown in FIG. 18A is the same as the manufacturing method in each process of the inkjet head 301 shown in FIGS. 5A to 5C and FIGS. 6A to 6C.

  As with the ink jet head 301 shown in FIG. 6C, in order to improve the peelability from the upper layer, a baking process is performed on the formed mold layer 830 to oxidize the surface to form an oxide layer 831. After that, nickel / polytetrafluoroethylene eutectoid electroplating with nickel as the mother die 800 is performed (FIG. 7A). Here, similarly to the inkjet head 301, the polytetrafluoroethylene-containing layer 301iA1 made of nickel / polytetrafluoroethylene eutectoid electrolytic nickel plating is formed in the oxide layer 831 in the absence region 810a of the insulating photoresist layer 810. Isotropically stacked from the nonexistent region 810a.

  Next, electrolytic nickel plating is performed using the matrix 800 as a negative electrode (FIG. 7A). Here again, the nozzle plate base layer 301iA2 made of electrolytic nickel plating is isotropically stacked on the polytetrafluoroethylene-containing layer 301iA1 from the absence region 810a in the absence region 810a of the insulating photoresist layer 810. That is, each of the polytetrafluoroethylene-containing layer 301iA1 and the nozzle plate base layer 301iA2 can be passed through the center of the photoresist layer 810 from the surface of the adhesion layer 820 made of conductive strike nickel plating in the non-existing region 810a. In the cross section, it isotropically deposited according to the strength of the electric field. Therefore, in the polytetrafluoroethylene-containing layer 301iA1 and the nozzle plate base layer 301iA2, the peripheral edge 810b is defined as the center of the arc in an arbitrary cross section passing through the center of the photoresist layer 810, inward of the peripheral edge 810b of the photoresist layer 810. A hollow fan-shaped intrusion portion 301iAa is formed.

Next, the deposited polytetrafluoroethylene-containing layer 301iA1 and nozzle plate base layer 301iA2 are peeled off from the oxide layer 831 and below at the interface with the oxide layer 831 to complete the nozzle plate 301iA (FIG. 18). (C)).
In the completed nozzle plate 301iA, as shown in FIG. 18C, in the same manner as the ink-jet head 301, the nozzle is placed in a range corresponding to the third portion 301iXb on the photoresist layer 810 where the electric field nickel plating was not formed. In addition to the formation of the hole 3031, due to the thickness of the mold layer 830, the nozzle hole surrounding portion 301 g (the nozzle surface 301 f and the inclined surface 301 h) on the ink discharge surface 301 a is formed on the surface 301 k other than the nozzle hole surrounding portion. It protrudes. Further, when the surface having the nozzle holes 3031 on the ink discharge surface 301a of the plate-like body is defined as the nozzle surface 301f, the protrusion amount δh of the surface of the nozzle hole surrounding portion 301g on the ink discharge surface 301a of the nozzle plate 301i is the nozzle surface 301f. It is the largest, and continuously increases as it approaches the nozzle surface 301f so as to follow the shape of the upper edge of the mold layer 830.

As described above, the nozzle plate 301iA according to the first modification employs a configuration including polytetrafluoroethylene in the range 301iA1 having a predetermined depth from the surface of the ink ejection surface 301a.
With this configuration, it is possible to improve the liquid repellency with respect to the ink discharge surface 301aA of the nozzle plate 301iA and the ink. As a result, in the inkjet head 301A, in the freening operation, as in the case shown in FIGS. 10A to 10C, the unnecessary ink splashes 41 attached to the nozzle surface 301f having the upstream nozzle hole 3031a are removed. When the ink droplet 41 is scraped off by the blade 410 and moves on the inclined surface 301h due to surface tension, the ink droplet 41 easily moves on the polytetrafluoroethylene-containing layer 301iA1, and the ink droplet 41 easily moves on the inclined surface 301h. Become. Furthermore, the ink splash 41 that has moved becomes easy to move on the inclined surface 301h toward the edge of the inclined surface 301h. As a result, the ink splash 41 that has moved to the edge of the inclined surface 301h is surely separated from the edge 411 of the blade 410, and the ink splash 41 moves to the nozzle surface 301f near the nozzle hole 3031b on the downstream side, causing incorrect ink ejection. Can be prevented.

Moreover, the nozzle plate 301iA can be manufactured by including the process of laminating | stacking the eutectoid electroplating of a metal and polytetrafluoroethylene in a manufacturing process.
≪Other variations≫
The specific configuration of the present disclosure has been described above using the embodiment as an example, but the present disclosure is not limited to the configuration of the embodiment. Further, for example, the following modifications can be considered.

  (1) In the above embodiment, nickel is used as the metal constituting the nozzle plate 301i. However, the metal constituting the nozzle plate 301i may be any metal that can form a film by electroforming, such as nickel, chromium, iron, aluminum, silver, gold, cobalt, copper, palladium, tin, zinc, and the like. It is good also as a structure using a metal or those alloys.

  (2) In the above embodiment, the nozzle plate 301i has a structure in which a plurality of nozzle holes 3031 are arranged in a line. However, the nozzle plate 301i only needs to have a configuration having a plurality of nozzle holes 3031 arranged in a row, for example, a configuration in which a plurality of nozzle holes 3031 are arranged in a plurality of rows, such as two rows, a plurality of The nozzle holes 3031 included in each row may have a so-called staggered arrangement in which the phases of the nozzle holes 3031 are shifted from each other.

  (3) In the inkjet head 301 according to the above-described embodiment, the droplet discharge operation at each nozzle 3030 is controlled by a drive voltage applied to a drive element (piezoelectric element) 3010 provided in each nozzle 3030. However, it goes without saying that the drive element 3010 is not limited to a piezoelectric element, and other elements capable of varying the ink pressure in the cavity 301e, such as a heating element, can be used.

  (4) The inkjet head 301 according to the above embodiment includes a nozzle plate 301i, a vibration plate 301b disposed to face the back surface 301m of the nozzle plate 301i, and a gap between the nozzle plate 301i and the vibration plate 301b. Each of the partitions 301d is divided into a plurality of partition walls 301d that form cavities 301e corresponding to the respective nozzle holes 3031 and drive elements 3010 that are provided in the cavities 301e and individually change the pressure in the cavities 301e. . However, the configuration is not limited to the configuration in which the nozzle plate 301i and the diaphragm 301b are arranged to face each other, and the positional relationship between the nozzle plate 301i and the diaphragm 301b may be changed as appropriate. For example, the respective planes of the nozzle plate 301i and the vibration plate 301b may be arranged to intersect perpendicularly.

  (5) In the above embodiment, the case where the inkjet head 301 moves without moving the blade 410 has been described, but the present invention is not limited to this. The blade 410 may be moved without moving the inkjet head 301 when wiping off the ink adhering to the ink ejection surface 301a. In that case, the moving unit moves the blade 410 or the entire cleaning unit 400 relative to the inkjet head 301. Alternatively, both the inkjet head 301 and the blade 410 may be moved. That is, any configuration may be used as long as the blade 410 moves relative to the ink ejection surface 301a in a state where the ink ejection surface 301a and the blade 410 are in contact with each other.

(6) Although not shown in FIG. 13, color filters corresponding to the respective colors may be disposed above the counter electrode 114 in accordance with the position of each organic light emitting layer 111. The color filter is a transparent layer provided to transmit visible light having wavelengths corresponding to R, G, and B.
Specifically, the color filter is a step of applying an ink containing a color filter material and a solvent to a substrate for forming a color filter provided with a partition layer in which a plurality of openings are formed in a matrix in pixel units. It is formed by. The present disclosure can also be applied to a coating process when forming the color filter.

As a color filter material, for example, a color resist manufactured by JSR Corporation can be used.
(7) FIG. 13 shows a configuration in which the layers of the TFT layer 102 to the counter electrode 114 are stacked on the substrate 101. In the present disclosure, any one of the layers may be omitted, or another layer such as a transparent conductive layer may be further included.

(8) In the above embodiment, the linear motors 205 and 206 and the servo motor 221 are merely examples of moving means for the gantry unit 210 and the moving body 220, respectively, and their use is not essential. For example, at least one of the gantry unit and the moving body may be moved by using a timing belt mechanism or a ball screw mechanism.
(9) In the above embodiment, the method of scanning the head portion side with respect to the application target substrate has been described, but the present disclosure is not limited to this. The application target substrate side may be moved with respect to the head portion in which a plurality of nozzles are arranged.

  (10) In the embodiment, the blade 410 and the ink ejection surface 301 a are brought into contact with each other in such a direction that the axial direction of the blade 410 coincides with the short direction of the inkjet head 301, and the blade 410 is relative to the longitudinal direction of the inkjet head 301. However, this is not a limitation. For example, the blade 410 and the ink discharge surface 301 a may be brought into contact with each other in a direction in which the longitudinal direction of the inkjet head and the axis of the blade 410 coincide with each other, and the blade 410 may be relatively moved in the short direction of the inkjet head 301. Furthermore, the blade 410 may be moved relative to the longitudinal direction of the inkjet head 301 in an oblique manner.

<Supplement>
Each of the embodiments described above shows a preferred specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, order of steps, and the like shown in the embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the embodiment, steps that are not described in the independent claims indicating the highest concept of the present invention are described as arbitrary constituent elements constituting a more preferable form.

In addition, the order in which the above steps are performed is for illustration in order to specifically describe the present invention, and may be in an order other than the above. Moreover, a part of said process may be performed simultaneously with another process (parallel).
Further, for easy understanding of the invention, the scales of the components shown in the above-described embodiments may be different from actual ones. The present invention is not limited by the description of each of the above embodiments, and can be appropriately changed without departing from the gist of the present invention.

Moreover, you may combine at least one part among the functions of each embodiment and its modification.
Furthermore, various modifications in which the present embodiment is modified within the range conceivable by those skilled in the art are also included in the present invention.

  The ink jet apparatus and the like of the present disclosure can be suitably used for an ink jet image forming apparatus used for information recording or industrial printing. Further, it can be suitably used for manufacturing an organic EL display panel used as an electronic device such as a home or public facility, various display devices for business use, a television device, a display for a portable electronic device, or the like.

DESCRIPTION OF SYMBOLS 1 Display apparatus 100 Organic electroluminescent display panel 230 Moving part 301 Inkjet head 301a Ink discharge surface (main surface)
301b Diaphragm 301a Discharge surface 301d Partition wall 301e Cavity 301f Nozzle surface 301g Nozzle hole surrounding portion 301h Inclined surface 301i Nozzle plate 301j Back surface 301k Surface other than nozzle hole surrounding portion 301m Back surface 400 Cleaning unit 410 Wiper blade 800 Master mold 810 Photoresist Layer 810a Photoresist layer absent region 810b Photoresist layer 810 peripheral edge 820 Adhesion layer 820a First part 830 Mold layer 830a Intrusion part 830b Second part 830c Periphery of second part 830c 831 Oxide layer 301iX Nozzle plate layer 301iXa Intrusion Part 301iXb Third part 1000 Inkjet device 3030 Nozzle 3031 Nozzle hole

Claims (15)

It consists of a plate-shaped body whose main component is a metal with a plurality of nozzle holes opened in a row,
When one surface of the plate-like body is a main surface,
The surface of the nozzle hole surrounding part in the main surface of the plate-like body protrudes from the surface other than the nozzle hole surrounding part. When the surface where the nozzle hole is present in the main surface of the plate-like body is a nozzle surface,
2. The nozzle plate according to claim 1, wherein the protrusion amount of the peripheral surface of the nozzle hole on the main surface of the plate-like body is the maximum on the nozzle surface and continuously increases as the peripheral edge of the nozzle surface is approached. . The inclination angle of the peripheral surface of the nozzle hole on the main surface of the plate-like body with respect to the surface other than the portion continuously increases from the outer periphery of the nozzle surface toward the periphery of the nozzle surface. 2. The nozzle plate according to 2. The surface portion included in the portion around the nozzle hole in a plan view of the main surface and the back surface facing away from the plate-like body is depressed with respect to the surface other than the portion, and the amount of depression is close to the nozzle hole. The nozzle plate according to claim 1, wherein the nozzle plate continuously increases accordingly. The inclination angle of the surface portion included in the peripheral portion of the nozzle hole in the plan view of the back surface of the plate-like body with respect to the surface portion other than the portion is continuously increased as the nozzle hole approaches the nozzle hole. The described nozzle plate. The said metal is 1 or more selected from metals, such as nickel, chromium, iron, aluminum, silver, gold | metal | money, cobalt, copper, palladium, tin, zinc, or those alloys, The any one of Claim 1-5 The nozzle plate described in 1. The nozzle plate according to claim 6, wherein the plate-like body includes polytetrafluoroethylene (PTFE) in a range of a predetermined depth from the surface of the main surface. A nozzle plate according to claim 1;
A diaphragm disposed to face the back surface of the nozzle plate;
A plurality of partition walls that divide a gap between the nozzle plate and the diaphragm for each nozzle hole and form a cavity corresponding to each nozzle hole;
An ink-jet head comprising: a drive element provided in each cavity and capable of individually varying the pressure in each cavity. An inkjet head according to claim 8;
A wiper blade made of rubber,
A moving unit that moves at least one of the wiper blade and the inkjet head so that the wiper blade relatively moves in a direction parallel to the discharge surface in a state where the tip of the wiper blade and the discharge surface are in contact with each other. An inkjet apparatus. The inkjet device according to claim 9, wherein the wiper blade is pressed against the main surface during movement by the moving unit. An organic EL device manufacturing apparatus having a plurality of functional layers including an organic light emitting layer between an anode and a cathode,
The ink includes a functional material for forming the functional layer,
The manufacturing apparatus of the organic EL element which has the inkjet apparatus of Claim 9 or 10. Discharging the ink in which the functional substance is dissolved in the solvent onto the base substrate, and drying the solvent to form a thin film of the functional substance;
The method for producing an organic EL element, wherein the ink is discharged by the organic EL element production apparatus according to claim 11. A step of preparing a matrix made of a conductive material and having a flat upper surface;
Applying an insulating photoresist to the upper surface of the matrix;
Developing after exposing the photoresist through a mask and forming a photoresist layer including the region larger than a region for forming the nozzle hole by a predetermined dimension;
A step of attaching strike metal plating to a non-existing region of the photoresist layer on the upper surface of the matrix to form an adhesion layer having an opening corresponding to the photoresist layer;
A mold layer in which a voltage is applied to the mother die to deposit electric field metal plating on the adhesion layer and on the photoresist layer near the periphery of the first portion, and a second portion smaller than the first portion is opened. Forming a step;
Applying heat treatment to form an oxide layer of the metal on the mold layer surface;
A voltage is applied to the matrix to deposit electric field metal plating on the oxide layer and the photoresist layer in the vicinity of the periphery of the second portion, and the electric field metal plating on the photoresist layer is not formed Forming a nozzle plate having a third portion smaller than the second portion as a nozzle hole;
A step of peeling the nozzle plate from the layer below the oxide layer at the interface with the oxide layer and taking out the nozzle plate. The method for producing a nozzle plate according to claim 13, wherein the step of forming the nozzle plate includes a step of laminating eutectoid electroplating of the metal and polytetrafluoroethylene (PTFE). The nozzle plate according to claim 13 or 14, wherein the metal is one or more selected from metals such as nickel, chromium, iron, aluminum, silver, gold, cobalt, copper, palladium, tin, and zinc, or alloys thereof. Manufacturing method.