JP6038048B2 - センサチップを試験する装置を有するセンサチップの製造方法 - Google Patents

センサチップを試験する装置を有するセンサチップの製造方法 Download PDF

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JP6038048B2
JP6038048B2 JP2013550722A JP2013550722A JP6038048B2 JP 6038048 B2 JP6038048 B2 JP 6038048B2 JP 2013550722 A JP2013550722 A JP 2013550722A JP 2013550722 A JP2013550722 A JP 2013550722A JP 6038048 B2 JP6038048 B2 JP 6038048B2
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wafer
substrate
chuck
spacer
sensor chip
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JP2014508288A5 (enExample
JP2014508288A (ja
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グラーフ マークス
グラーフ マークス
シュトライフ マティアス
シュトライフ マティアス
フンツィカー ヴェアナー
フンツィカー ヴェアナー
シャンツ クリストフ
シャンツ クリストフ
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センシリオン アクチエンゲゼルシャフト
センシリオン アクチエンゲゼルシャフト
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G1/00—Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators; General aspects or details, e.g. selection emphasis on particular characters, dashed line or dotted line generation; Preprocessing of data
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Pressure Sensors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measuring Fluid Pressure (AREA)
JP2013550722A 2011-01-27 2012-01-26 センサチップを試験する装置を有するセンサチップの製造方法 Active JP6038048B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11000640.0A EP2481703B1 (en) 2011-01-27 2011-01-27 Sensor protection
EP11000640.0 2011-01-27
PCT/CH2012/000020 WO2012100361A2 (en) 2011-01-27 2012-01-26 Sensor protection

Publications (3)

Publication Number Publication Date
JP2014508288A JP2014508288A (ja) 2014-04-03
JP2014508288A5 JP2014508288A5 (enExample) 2015-03-12
JP6038048B2 true JP6038048B2 (ja) 2016-12-07

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JP2013550722A Active JP6038048B2 (ja) 2011-01-27 2012-01-26 センサチップを試験する装置を有するセンサチップの製造方法

Country Status (5)

Country Link
US (1) US9366720B2 (enExample)
EP (3) EP2481703B1 (enExample)
JP (1) JP6038048B2 (enExample)
KR (1) KR101944128B1 (enExample)
WO (3) WO2012100362A1 (enExample)

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EP2762870A1 (en) * 2013-01-31 2014-08-06 Sensirion AG Sensor arrangement and portable electronic device with such a sensor arrangement
EP2763381B1 (en) 2013-01-31 2017-04-05 Sensirion AG Portable electronic device with chemical sensor
EP2762865A1 (en) * 2013-01-31 2014-08-06 Sensirion Holding AG Chemical sensor and method for manufacturing such a chemical sensor
EP2762882B1 (en) 2013-01-31 2020-11-25 Sensirion AG Portable electronic device with ketone sensor
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EP2801819A1 (en) 2013-05-08 2014-11-12 Sensirion AG Metal oxide chemical sensor for portable device
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Also Published As

Publication number Publication date
EP2481703A1 (en) 2012-08-01
WO2012100362A1 (en) 2012-08-02
WO2012100361A2 (en) 2012-08-02
KR20140006908A (ko) 2014-01-16
KR101944128B1 (ko) 2019-01-30
EP2481703B1 (en) 2020-07-01
US20140028340A1 (en) 2014-01-30
US9366720B2 (en) 2016-06-14
JP2014508288A (ja) 2014-04-03
EP2668130A1 (en) 2013-12-04
EP2668131A2 (en) 2013-12-04
WO2012100360A1 (en) 2012-08-02
WO2012100361A3 (en) 2012-11-15

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