JP6030905B2 - 発光半導体を相互接続するためのオーバーレイ回路構造 - Google Patents

発光半導体を相互接続するためのオーバーレイ回路構造 Download PDF

Info

Publication number
JP6030905B2
JP6030905B2 JP2012215555A JP2012215555A JP6030905B2 JP 6030905 B2 JP6030905 B2 JP 6030905B2 JP 2012215555 A JP2012215555 A JP 2012215555A JP 2012215555 A JP2012215555 A JP 2012215555A JP 6030905 B2 JP6030905 B2 JP 6030905B2
Authority
JP
Japan
Prior art keywords
les
chip
flexible
interconnect structure
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012215555A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014072271A5 (OSRAM
JP2014072271A (ja
Inventor
アルン・ヴィルパスカ・ゴウダ
ドナルド・ポール・カニングハム
シャクティ・シン・チュウハン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to JP2012215555A priority Critical patent/JP6030905B2/ja
Publication of JP2014072271A publication Critical patent/JP2014072271A/ja
Publication of JP2014072271A5 publication Critical patent/JP2014072271A5/ja
Application granted granted Critical
Publication of JP6030905B2 publication Critical patent/JP6030905B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2012215555A 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造 Active JP6030905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012215555A JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012215555A JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016151633A Division JP6541629B2 (ja) 2016-08-02 2016-08-02 発光半導体を相互接続するためのオーバーレイ回路構造

Publications (3)

Publication Number Publication Date
JP2014072271A JP2014072271A (ja) 2014-04-21
JP2014072271A5 JP2014072271A5 (OSRAM) 2015-11-05
JP6030905B2 true JP6030905B2 (ja) 2016-11-24

Family

ID=50747248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012215555A Active JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Country Status (1)

Country Link
JP (1) JP6030905B2 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526829B2 (en) 2001-10-18 2016-12-27 Bayer Healthcare Llc Flow based pressure isolation and fluid delivery system including flow based pressure isolation and flow initiating mechanism
US9782576B2 (en) 2004-10-22 2017-10-10 Carefusion 303, Inc. Fluid control device with valve and methods of use

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922176C2 (de) * 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
KR100880812B1 (ko) * 2004-03-29 2009-01-30 아티큘레이티드 테크놀러지스 엘엘씨 롤-투-롤 제조된 광 시트 및 캡슐화된 반도체 회로디바이스들
JP5162979B2 (ja) * 2007-06-28 2013-03-13 日亜化学工業株式会社 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526829B2 (en) 2001-10-18 2016-12-27 Bayer Healthcare Llc Flow based pressure isolation and fluid delivery system including flow based pressure isolation and flow initiating mechanism
US9782576B2 (en) 2004-10-22 2017-10-10 Carefusion 303, Inc. Fluid control device with valve and methods of use

Also Published As

Publication number Publication date
JP2014072271A (ja) 2014-04-21

Similar Documents

Publication Publication Date Title
US7679099B2 (en) Low thermal resistance high power LED
US9698563B2 (en) Flexible LED device and method of making
US20050116235A1 (en) Illumination assembly
US20130250585A1 (en) Led packages for an led bulb
EP2139051B1 (en) Power surface mount light emitting die package
WO2006038543A2 (ja) 発光装置及びそれを用いた照明器具または液晶表示装置
JP4910220B1 (ja) Ｌｅｄモジュール装置及びその製造方法
JP2013522893A (ja) Ｌｅｄで使用するためのフィルムシステム
TW201228489A (en) Flexible LED device for thermal management and method of making
KR20070089167A (ko) 조명기 및 이를 제조하는 방법
WO2010050067A1 (ja) 発光素子パッケージ用基板及び発光素子パッケージ
TWM498387U (zh) 熱電分離的發光二極體封裝模組及電連接模組
US10957832B2 (en) Electronics package for light emitting semiconductor devices and method of manufacturing thereof
KR100863612B1 (ko) 발광소자
US20100084673A1 (en) Light-emitting semiconductor packaging structure without wire bonding
KR101051488B1 (ko) 발광 다이오드 유닛의 제조 방법과, 이 방법에 의하여 제조된 발광 다이오드 유닛
US10070531B2 (en) Overlay circuit structure for interconnecting light emitting semiconductors
JP2008300542A (ja) 発光素子パッケージ用基板及び発光素子パッケージ
JP2014072271A (ja) 発光半導体を相互接続するためのオーバーレイ回路構造
JP2007300111A (ja) 発光装置
CN103715330B (zh) 用于互连发光半导体的覆盖式电路结构
JP6541629B2 (ja) 発光半導体を相互接続するためのオーバーレイ回路構造
KR102085649B1 (ko) 발광 반도체를 상호 접속하기 위한 오버레이 회로 구조체
EP2713396B1 (en) Overlay circuit structure for interconnecting semiconductor light emitting devices and method of manufacturing the same
KR101995538B1 (ko) 발광 반도체를 상호 접속하기 위한 오버레이 회로 구조체

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150915

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150915

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160420

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160426

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160525

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160712

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20161004

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20161021

R150 Certificate of patent or registration of utility model

Ref document number: 6030905

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250