JP6029269B2 - ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 - Google Patents

ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 Download PDF

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JP6029269B2
JP6029269B2 JP2011208268A JP2011208268A JP6029269B2 JP 6029269 B2 JP6029269 B2 JP 6029269B2 JP 2011208268 A JP2011208268 A JP 2011208268A JP 2011208268 A JP2011208268 A JP 2011208268A JP 6029269 B2 JP6029269 B2 JP 6029269B2
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bonding
wire
forming
wire bond
control value
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JP2012074699A5 (OSRAM
JP2012074699A (ja
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キン、ウェイ
ダブリュー． ブルンナー、ジョン
ダブリュー． ブルンナー、ジョン
エイ． リード、ポール
エイ． リード、ポール
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クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2011208268A 2010-09-27 2011-09-24 ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 Active JP6029269B2 (ja)

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US38670110P 2010-09-27 2010-09-27
US61/386,701 2010-09-27

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JP2012074699A JP2012074699A (ja) 2012-04-12
JP2012074699A5 JP2012074699A5 (OSRAM) 2014-11-06
JP6029269B2 true JP6029269B2 (ja) 2016-11-24

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US (1) US20120074206A1 (OSRAM)
JP (1) JP6029269B2 (OSRAM)
KR (1) KR101254218B1 (OSRAM)
CN (1) CN102420150B (OSRAM)
SG (1) SG179389A1 (OSRAM)
TW (1) TWI489568B (OSRAM)

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TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9257403B2 (en) * 2013-11-26 2016-02-09 Freescale Semiconductor, Inc. Copper ball bond interface structure and formation
US20150194395A1 (en) * 2014-01-03 2015-07-09 Sohrab Safai Bond pad having a trench and method for forming
US9889521B2 (en) * 2014-12-02 2018-02-13 Asm Technology Singapore Pte Ltd Method and system for pull testing of wire bonds
JP6445943B2 (ja) * 2015-08-24 2018-12-26 東芝メモリ株式会社 半導体装置の測定方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN105760591B (zh) * 2016-02-04 2019-01-25 广州兴森快捷电路科技有限公司 封装基板键合引线的邦定方法
US10325878B2 (en) 2016-06-30 2019-06-18 Kulicke And Soffa Industries, Inc. Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
CN110391129B (zh) * 2018-04-20 2020-10-02 岛津分析技术研发（上海）有限公司 离子化装置、质谱仪、离子迁移谱仪及离子化方法
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
TWI895537B (zh) 2020-11-05 2025-09-01 美商庫利克和索夫工業公司 引線接合機的操作方法，包括監視引線接合機上的接合力的精確度的方法，以及其相關方法
WO2023158625A1 (en) 2022-02-15 2023-08-24 Kulicke And Soffa Industries, Inc. Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece

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CN102420150B (zh) 2016-12-07
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JP2012074699A (ja) 2012-04-12
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