JP6023351B2 - Baw部品及びbaw部品の製造方法 - Google Patents
Baw部品及びbaw部品の製造方法 Download PDFInfo
- Publication number
- JP6023351B2 JP6023351B2 JP2015548231A JP2015548231A JP6023351B2 JP 6023351 B2 JP6023351 B2 JP 6023351B2 JP 2015548231 A JP2015548231 A JP 2015548231A JP 2015548231 A JP2015548231 A JP 2015548231A JP 6023351 B2 JP6023351 B2 JP 6023351B2
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- JP
- Japan
- Prior art keywords
- piezoelectric
- piezoelectric material
- piezoelectric layer
- layer
- baw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 66
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 33
- 238000010030 laminating Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 230000005684 electric field Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 3
- 229910052706 scandium Inorganic materials 0.000 description 3
- 230000009022 nonlinear effect Effects 0.000 description 2
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000009021 linear effect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
下部電極(BE)を用意する工程と、
AlN(窒化アルミニウム)より大きい圧電定数cを有する第1圧電材料を、前記下部電極(BE)の上または上方に積層する工程と、
前記第1圧電材料の上または上方に、上部電極(TE)を形成する工程と
を備える。
前記第1圧電材料を積層する前に、前記下部電極の上または上方に、第2圧電材料を積層する工程
を更に備える。
BAWC BAW部品
BE 下部電極
CS 支持基板
PL1 第1圧電層
PL2 第2圧電層
PL3 第3圧電層
TE 上部電極
Claims (5)
- 下部電極(BE)、上部電極(TE)、前記下部電極(BE)と前記上部電極(TE)との間に設けられた第1圧電層(PL1)、及び前記下部電極(BE)と前記第1圧電層(PL1)との間に配置された第2圧電層(PL2)を備え、
前記第1圧電層(PL1)は、窒化アルミニウムより大きい圧電定数cを有した第1圧電材料のスカンジウムドープ窒化アルミニウムからなり、
前記第2圧電層(PL2)は、前記第1圧電層(PL1)の前記第1圧電材料とは異なる第2圧電材料からなり、
前記第1圧電層(PL1)の前記第1圧電材料と、前記第2圧電層(PL2)の前記第2圧電材料との格子定数の不整合率は10%未満である
ことを特徴とするBAW部品。 - 前記第2圧電層(PL2)は、前記第1圧電層(PL1)との境界面に(002)結晶面を有することを特徴とする請求項1に記載のBAW部品。
- 前記第1圧電層(PL1)と前記上部電極(TE)との間に配置された圧電材料の第3圧電層(PL3)を更に備えることを特徴とする請求項1または2に記載のBAW部品。
- BAW部品(BAWC)の製造方法であって、
下部電極(BE)を用意する工程と、
窒化アルミニウムより大きい圧電定数cを有する第1圧電材料を、前記下部電極(BE)の上または上方に積層する工程と、
前記第1圧電材料の上または上方に、上部電極(TE)を形成する工程とを備え、
前記第1圧電材料を積層する前に、前記下部電極(BE)の上または上方に、前記第1圧電材料とは異なる第2圧電材料を積層する工程を更に備え、
前記第1圧電材料は、窒化アルミニウムより大きい圧電定数cを有したスカンジウムドープ窒化アルミニウムからなり、
前記第1圧電材料と前記第2圧電材料との格子定数の不整合率は10%未満である
ことを特徴とする製造方法。 - 前記第1圧電材料を、5μm/h〜15μm/hの速さ(R)で、50℃〜400℃の温度(T)にて堆積させて積層する
ことを特徴とする請求項4に記載の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2012/076710 WO2014094883A1 (en) | 2012-12-21 | 2012-12-21 | Baw component and method for manufacturing a baw component |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016502363A JP2016502363A (ja) | 2016-01-21 |
JP6023351B2 true JP6023351B2 (ja) | 2016-11-09 |
Family
ID=47603550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015548231A Expired - Fee Related JP6023351B2 (ja) | 2012-12-21 | 2012-12-21 | Baw部品及びbaw部品の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10079334B2 (ja) |
JP (1) | JP6023351B2 (ja) |
DE (1) | DE112012007245T5 (ja) |
WO (1) | WO2014094883A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014094884A1 (en) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Baw component, lamination for a baw component, and method for manufacturing a baw component, said baw component comprising two stacked piezoelectric materials that differ |
GB2532106B (en) * | 2014-11-04 | 2017-06-28 | Xaar Technology Ltd | A piezoelectric thin film element |
KR102066960B1 (ko) | 2016-08-03 | 2020-01-16 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 이를 포함하는 필터 |
KR102460752B1 (ko) | 2016-08-03 | 2022-10-31 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 이를 포함하는 필터 |
US11736088B2 (en) | 2016-11-15 | 2023-08-22 | Global Communication Semiconductors, Llc | Film bulk acoustic resonator with spurious resonance suppression |
US10727809B2 (en) * | 2016-12-15 | 2020-07-28 | Qorvo Us, Inc. | Bulk acoustic wave resonator with multilayer piezoelectric structure |
WO2018135178A1 (ja) * | 2017-01-19 | 2018-07-26 | 株式会社村田製作所 | 圧電素子、及び圧電素子を用いた共振子 |
DE102018105290B4 (de) * | 2018-03-07 | 2022-11-17 | RF360 Europe GmbH | Schichtsystem, Herstellungsverfahren und auf dem Schichtsystem ausgebildetet SAW-Bauelement |
US11764750B2 (en) | 2018-07-20 | 2023-09-19 | Global Communication Semiconductors, Llc | Support structure for bulk acoustic wave resonator |
DE102019104423B4 (de) * | 2019-02-21 | 2022-03-03 | RF360 Europe GmbH | BAW-Resonator mit einer verbesserten Kristallqualität, HF-Filter, Muliplexer und Herstellungsverfahren |
US11817839B2 (en) | 2019-03-28 | 2023-11-14 | Global Communication Semiconductors, Llc | Single-crystal bulk acoustic wave resonator and method of making thereof |
US11979134B2 (en) | 2019-10-15 | 2024-05-07 | Global Communication Semiconductors, Llc | Composite piezoelectric film and bulk acoustic resonator incorporating same |
US11942919B2 (en) | 2021-01-11 | 2024-03-26 | Raytheon Company | Strain compensated rare earth group III-nitride heterostructures |
CN112953448A (zh) * | 2021-02-10 | 2021-06-11 | 武汉大学 | 新结构薄膜体声波谐振器及其制备方法 |
Family Cites Families (19)
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US5929555A (en) * | 1996-04-16 | 1999-07-27 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric resonator and method for fabricating the same |
JP3514224B2 (ja) * | 1999-11-11 | 2004-03-31 | 株式会社村田製作所 | 圧電共振子、フィルタ及び電子機器 |
US6441539B1 (en) | 1999-11-11 | 2002-08-27 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator |
US6874211B2 (en) | 2001-03-05 | 2005-04-05 | Agilent Technologies, Inc. | Method for producing thin film bulk acoustic resonators (FBARs) with different frequencies on the same substrate by subtracting method and apparatus embodying the method |
US6472954B1 (en) | 2001-04-23 | 2002-10-29 | Agilent Technologies, Inc. | Controlled effective coupling coefficients for film bulk acoustic resonators |
DE10149542A1 (de) * | 2001-10-08 | 2003-04-17 | Infineon Technologies Ag | BAW-Resonator |
US7868522B2 (en) * | 2005-09-09 | 2011-01-11 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Adjusted frequency temperature coefficient resonator |
JP5007528B2 (ja) * | 2006-06-12 | 2012-08-22 | セイコーエプソン株式会社 | 圧電素子の製造方法 |
US20080024563A1 (en) | 2006-07-25 | 2008-01-31 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric thin film element, ink jet head, and ink jet type recording apparatus |
JP2008041921A (ja) * | 2006-08-07 | 2008-02-21 | Matsushita Electric Ind Co Ltd | 圧電薄膜素子およびその製造方法、ならびにインクジェットヘッドおよびインクジェット式記録装置 |
US7758979B2 (en) * | 2007-05-31 | 2010-07-20 | National Institute Of Advanced Industrial Science And Technology | Piezoelectric thin film, piezoelectric material, and fabrication method of piezoelectric thin film and piezoelectric material, and piezoelectric resonator, actuator element, and physical sensor using piezoelectric thin film |
JP5190841B2 (ja) * | 2007-05-31 | 2013-04-24 | 独立行政法人産業技術総合研究所 | 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー |
JP2009201101A (ja) * | 2008-01-21 | 2009-09-03 | Panasonic Electric Works Co Ltd | Baw共振装置およびその製造方法 |
JP5598948B2 (ja) | 2009-07-01 | 2014-10-01 | 独立行政法人産業技術総合研究所 | 圧電体薄膜の製造方法および当該製造方法により製造される圧電体薄膜 |
JP5643056B2 (ja) | 2010-11-01 | 2014-12-17 | 太陽誘電株式会社 | 弾性波デバイス |
US20120293278A1 (en) * | 2011-05-20 | 2012-11-22 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator comprising distributed bragg reflector |
JP2012253497A (ja) | 2011-06-01 | 2012-12-20 | Taiyo Yuden Co Ltd | 電子回路及び電子モジュール |
JP5817673B2 (ja) | 2011-11-18 | 2015-11-18 | 株式会社村田製作所 | 圧電薄膜共振子及び圧電薄膜の製造方法 |
JP2014030136A (ja) | 2012-07-31 | 2014-02-13 | Taiyo Yuden Co Ltd | 弾性波デバイス |
-
2012
- 2012-12-21 WO PCT/EP2012/076710 patent/WO2014094883A1/en active Application Filing
- 2012-12-21 US US14/654,480 patent/US10079334B2/en active Active
- 2012-12-21 DE DE112012007245.6T patent/DE112012007245T5/de not_active Withdrawn
- 2012-12-21 JP JP2015548231A patent/JP6023351B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE112012007245T5 (de) | 2015-11-19 |
US10079334B2 (en) | 2018-09-18 |
JP2016502363A (ja) | 2016-01-21 |
WO2014094883A1 (en) | 2014-06-26 |
US20150333249A1 (en) | 2015-11-19 |
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