JP6010387B2 - 半導体装置を形成するための方法 - Google Patents
半導体装置を形成するための方法 Download PDFInfo
- Publication number
- JP6010387B2 JP6010387B2 JP2012182159A JP2012182159A JP6010387B2 JP 6010387 B2 JP6010387 B2 JP 6010387B2 JP 2012182159 A JP2012182159 A JP 2012182159A JP 2012182159 A JP2012182159 A JP 2012182159A JP 6010387 B2 JP6010387 B2 JP 6010387B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate
- plasma
- process gas
- carbon film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 131
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 239000007789 gas Substances 0.000 claims description 157
- 239000000758 substrate Substances 0.000 claims description 63
- 229910003481 amorphous carbon Inorganic materials 0.000 claims description 41
- 239000004215 Carbon black (E152) Substances 0.000 claims description 27
- 229930195733 hydrocarbon Natural products 0.000 claims description 27
- 150000002430 hydrocarbons Chemical class 0.000 claims description 25
- 230000000630 rising effect Effects 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 19
- 239000001301 oxygen Substances 0.000 claims description 19
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 18
- XNMQEEKYCVKGBD-UHFFFAOYSA-N 2-butyne Chemical compound CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052786 argon Inorganic materials 0.000 claims description 10
- KDKYADYSIPSCCQ-UHFFFAOYSA-N but-1-yne Chemical compound CCC#C KDKYADYSIPSCCQ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052734 helium Inorganic materials 0.000 claims description 10
- 239000001307 helium Substances 0.000 claims description 9
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 6
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 5
- 230000005284 excitation Effects 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910001882 dioxygen Inorganic materials 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 23
- 229910052799 carbon Inorganic materials 0.000 description 23
- 230000008021 deposition Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 101100023111 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mfc1 gene Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02115—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02527—Carbon, e.g. diamond-like carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02592—Microstructure amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Description
当業者には、前記教示に照らして多くの修正、変更が可能であるということが理解されるであろう。当業者は、図に示される種々の部品について、種々の均等な組合せ、置換物を認識するであろう。従って、本発明の範囲は開示された詳細な説明に限定されるものではなく、添付の特許請求の範囲で限定されるものである、ということが意図される。
Claims (17)
- 半導体装置を形成するための方法であり、:
プロセスチャンバ内の基板ホルダ上に基板を準備するステップであって、前記基板が、上部表面と側壁表面とを持つ立ち上がり構造を含むステップと;
前記プロセスチャンバ内にプロセスガスを流すステップであって、前記プロセスガスが、1−ブチン又は2−ブチン又はそれらの組合せを含む炭化水素ガスであって、これらの炭素−炭素三重結合は、プラズマ励起では開裂されない炭化水素ガス、及び酸素含有ガスを含み、且つ、前記プロセスガスが、前記酸素含有ガスの連続フロー、及び前記炭化水素ガスの連続パルスを含む前記炭化水素ガスのフローを含むステップと;
前記プロセスチャンバ内のプロセスガス圧力を少なくとも1トールに維持するステップと;
マイクロ波プラズマ源を用いて前記プロセスガスからプラズマを形成するステップと;
前記立ち上がり構造の表面上に共形アモルファスカーボンフィルムを堆積させため、前記基板を前記プラズマに曝露するステップであって、前記上部表面上の前記共形アモルファスカーボンフィルムの厚さと、前記側壁表面上の前記共形アモルファスカーボンフィルムの厚さとの比が、2未満であるステップと;
を含む方法。 - 請求項1に記載の方法であり、さらに、前記曝露の際に、高周波数(RF)バイアス電力を前記基板に適用する、方法。
- 請求項1に記載の方法であり、前記プロセスチャンバ内の前記プロセスガスのプロセスガス圧力が、1トールと5トールとの間である、方法。
- 請求項1に記載の方法であり、さらに、基板ホルダの温度を200℃未満に維持する、方法。
- 請求項1に記載の方法であり、前記プラズマを形成するステップが、前記基板に面するラジアルラインスロットアンテナ(RLSA)を含む前記マイクロ波プラズマ源により前記プロセスガスを励起することを含む、方法。
- 請求項1に記載の方法であり、前記酸素含有ガスが、O2、H2O又はO2とH2Oの両方を含む、方法。
- 請求項1に記載の方法であり、前記プロセスガスが、1−ブチン又は2−ブチン又はそれらの組合せ、及びO2を含む、方法。
- 請求項1に記載の方法であり、前記比が1.4未満である、方法。
- 請求項1に記載の方法であり、さらに:前記共形アモルファスカーボンフィルムをエッチングしてパターン化ハードマスクを形成する、方法。
- 半導体装置を形成するための方法であり、:
プロセスチャンバ内の基板ホルダ上に基板を準備するステップであって、前記基板が、上部表面と側壁表面とを持つ立ち上がり構造を含むステップと;
前記プロセスチャンバ内にプロセスガスを流すステップであって、前記プロセスガスが酸素含有ガスの連続フロー、及び炭化水素ガスの連続パルスを含む前記炭化水素ガスのフローを含むステップと;
前記プロセスチャンバ内のプロセスガスの圧力を少なくとも1トールに維持するステップと;
前記基板に面するラジアルラインスロットアンテナ(RLSA)を含むマイクロ波プラズマ源を用いて前記プロセスガスからプラズマを形成するステップであって、前記炭化水素ガスが、1−ブチン又は2−ブチン又はそれらの組合せを含み、これらの炭素−炭素三重結合は、プラズマ励起では開裂されないステップと;
前記立ち上がり構造の表面上に共形アモルファスカーボンフィルムを堆積させため、前記基板を前記プラズマに曝露するステップであって、前記上部表面上の前記共形アモルファスカーボンフィルムの厚さと、前記側壁表面上の前記共形アモルファスカーボンフィルムの厚さとの比が、2未満であるステップと;
を含む方法。 - 請求項10に記載の方法であり、さらに、前記曝露の際に前記基板ホルダへ高周波数(RF)バイアス電力を適用する、方法。
- 請求項10に記載の方法であり、前記プロセスチャンバ内のプロセスガスのプロセスガス圧力が1トールと5トールとの間である、方法。
- 請求項10に記載の方法であり、さらに、基板ホルダの温度を200℃未満に維持することを含む、方法。
- 請求項10に記載の方法であり、前記酸素含有ガスが、O2、H2O又はO2及びH2Oの両方を含む、方法。
- 請求項10に記載の方法であり、前記プロセスガスが、1−ブチン又は2−ブチン又はそれらの組合せ、及びO2を含む、方法。
- 請求項10に記載の方法であり、前記比が1.4未満である、方法。
- 請求項1に記載の方法であり、前記プロセスガスがアルゴン、ヘリウム、又はアルゴンとヘリウムの両方をさらに含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/217,813 | 2011-08-25 | ||
US13/217,813 US8399366B1 (en) | 2011-08-25 | 2011-08-25 | Method of depositing highly conformal amorphous carbon films over raised features |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013046070A JP2013046070A (ja) | 2013-03-04 |
JP2013046070A5 JP2013046070A5 (ja) | 2015-10-08 |
JP6010387B2 true JP6010387B2 (ja) | 2016-10-19 |
Family
ID=47744307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012182159A Expired - Fee Related JP6010387B2 (ja) | 2011-08-25 | 2012-08-21 | 半導体装置を形成するための方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8399366B1 (ja) |
JP (1) | JP6010387B2 (ja) |
KR (1) | KR101921336B1 (ja) |
CN (1) | CN102956473B (ja) |
TW (1) | TWI496193B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107437547B (zh) * | 2016-05-26 | 2020-03-10 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件的制作方法 |
WO2019212592A1 (en) * | 2018-05-03 | 2019-11-07 | Applied Materials, Inc. | Pulsed plasma (dc/rf) deposition of high quality c films for patterning |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
CN108735570B (zh) * | 2018-05-25 | 2019-06-18 | 中国科学院微电子研究所 | 用于SiC等离子体氧化的微波等离子体发生装置 |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
JP7451540B2 (ja) | 2019-01-22 | 2024-03-18 | アプライド マテリアルズ インコーポレイテッド | パルス状電圧波形を制御するためのフィードバックループ |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
US11848176B2 (en) | 2020-07-31 | 2023-12-19 | Applied Materials, Inc. | Plasma processing using pulsed-voltage and radio-frequency power |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
US20230129550A1 (en) * | 2021-10-22 | 2023-04-27 | Applied Materials, Inc. | Carbon gap fill processes |
US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7294580B2 (en) * | 2003-04-09 | 2007-11-13 | Lam Research Corporation | Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition |
US7638440B2 (en) | 2004-03-12 | 2009-12-29 | Applied Materials, Inc. | Method of depositing an amorphous carbon film for etch hardmask application |
JP2007224383A (ja) * | 2006-02-24 | 2007-09-06 | Tokyo Electron Ltd | アモルファスカーボン膜の成膜方法、それを用いた半導体装置の製造方法、およびコンピュータ読取可能な記憶媒体 |
US20070286954A1 (en) * | 2006-06-13 | 2007-12-13 | Applied Materials, Inc. | Methods for low temperature deposition of an amorphous carbon layer |
US20080153311A1 (en) * | 2006-06-28 | 2008-06-26 | Deenesh Padhi | Method for depositing an amorphous carbon film with improved density and step coverage |
US8377818B2 (en) | 2006-07-05 | 2013-02-19 | Tokyo Electron Limited | Aftertreatment method for amorphous carbon film |
JP5200371B2 (ja) | 2006-12-01 | 2013-06-05 | 東京エレクトロン株式会社 | 成膜方法、半導体装置及び記憶媒体 |
WO2008105321A1 (ja) * | 2007-02-28 | 2008-09-04 | Tokyo Electron Limited | アモルファスカーボン膜の形成方法、アモルファスカーボン膜、多層レジスト膜、半導体装置の製造方法およびコンピュータ可読記憶媒体 |
JP5297885B2 (ja) * | 2008-06-18 | 2013-09-25 | 東京エレクトロン株式会社 | マイクロ波プラズマ処理装置 |
US7842622B1 (en) * | 2009-05-15 | 2010-11-30 | Asm Japan K.K. | Method of forming highly conformal amorphous carbon layer |
WO2010151337A1 (en) * | 2009-06-26 | 2010-12-29 | Tokyo Electron Limited | Improving the adhesiveness of fluorocarbon(cfx) film by doping of amorphous carbon |
-
2011
- 2011-08-25 US US13/217,813 patent/US8399366B1/en not_active Expired - Fee Related
-
2012
- 2012-08-21 JP JP2012182159A patent/JP6010387B2/ja not_active Expired - Fee Related
- 2012-08-22 KR KR1020120091781A patent/KR101921336B1/ko active IP Right Grant
- 2012-08-23 TW TW101130665A patent/TWI496193B/zh not_active IP Right Cessation
- 2012-08-27 CN CN201210315731.6A patent/CN102956473B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8399366B1 (en) | 2013-03-19 |
JP2013046070A (ja) | 2013-03-04 |
KR101921336B1 (ko) | 2018-11-22 |
KR20130022378A (ko) | 2013-03-06 |
CN102956473A (zh) | 2013-03-06 |
TWI496193B (zh) | 2015-08-11 |
US20130052808A1 (en) | 2013-02-28 |
TW201316380A (zh) | 2013-04-16 |
CN102956473B (zh) | 2015-07-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6010387B2 (ja) | 半導体装置を形成するための方法 | |
TWI764008B (zh) | 高品質間隙填充的高偏壓沉積 | |
TWI728456B (zh) | 相對於基板的薄膜沉積方法 | |
KR100554116B1 (ko) | 멀티슬롯 안테나를 이용한 표면파 플라즈마 처리장치 | |
US20190228970A1 (en) | Diamond like carbon layer formed by an electron beam plasma process | |
US9406523B2 (en) | Highly selective doped oxide removal method | |
KR102439785B1 (ko) | 무-할로겐 기상 실리콘 에칭 | |
US9165786B1 (en) | Integrated oxide and nitride recess for better channel contact in 3D architectures | |
KR20190095142A (ko) | 실리콘 산화물막에 대한 증착후 처리 방법 | |
US6870123B2 (en) | Microwave applicator, plasma processing apparatus having same, and plasma processing method | |
US9362107B2 (en) | Flowable low-k dielectric gapfill treatment | |
TWI705154B (zh) | 調控一或更多圖案化膜的局部應力與覆蓋誤差的方法及用於沉積該一或更多圖案化膜的腔室 | |
TW202045771A (zh) | 形成電子裝置結構之方法、用於施行其之系統及根據其所形成之結構 | |
KR20210040264A (ko) | 주기적 플라즈마 강화 증착 공정에 의해 토포그래피 선택적인 실리콘 산화물 막을 형성하는 방법 | |
TWI576914B (zh) | Pattern forming method and substrate processing system | |
US20150371865A1 (en) | High selectivity gas phase silicon nitride removal | |
US20160042968A1 (en) | Integrated oxide and si etch for 3d cell channel mobility improvements | |
US11043375B2 (en) | Plasma deposition of carbon hardmask | |
JP2016119344A (ja) | プラズマ処理方法 | |
TW202015131A (zh) | 碳間隙填充膜 | |
TW201712731A (zh) | 以uv輔助方式將材料注入多孔膜 | |
JP6424249B2 (ja) | シリコン及びゲルマニウムを含む基板におけるシリコンの優先的酸化のための方法 | |
JP4478352B2 (ja) | プラズマ処理装置及びプラズマ処理方法並びに構造体の製造方法 | |
KR20000029408A (ko) | 마이크로파 인가기, 이를 구비한 플라즈마 처리 장치, 및플라즈마 처리 방법 | |
JPH06333842A (ja) | マイクロ波プラズマ処理装置およびマイクロ波プラズマ処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150819 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150819 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160419 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160426 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160624 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160830 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160916 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6010387 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |