JP6007011B2 - レジスト組成物、レジストパターン形成方法及び化合物 - Google Patents
レジスト組成物、レジストパターン形成方法及び化合物 Download PDFInfo
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- JP6007011B2 JP6007011B2 JP2012160049A JP2012160049A JP6007011B2 JP 6007011 B2 JP6007011 B2 JP 6007011B2 JP 2012160049 A JP2012160049 A JP 2012160049A JP 2012160049 A JP2012160049 A JP 2012160049A JP 6007011 B2 JP6007011 B2 JP 6007011B2
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- 0 C*C(C1C2)C(C3)COC1C3S2(=O)=O Chemical compound C*C(C1C2)C(C3)COC1C3S2(=O)=O 0.000 description 18
- UPTJQQDWJARDPY-UHFFFAOYSA-N CC(C(C1)C2)C(C3)C1C2S3(=O)=O Chemical compound CC(C(C1)C2)C(C3)C1C2S3(=O)=O UPTJQQDWJARDPY-UHFFFAOYSA-N 0.000 description 1
- BPLWYASEYVJFSS-UHFFFAOYSA-N CC(C)(C)c(cc1)ccc1S(C(F)(F)F)c1ccc(C(C)(C)C)cc1 Chemical compound CC(C)(C)c(cc1)ccc1S(C(F)(F)F)c1ccc(C(C)(C)C)cc1 BPLWYASEYVJFSS-UHFFFAOYSA-N 0.000 description 1
- JYUDOMSPXHSDIA-UHFFFAOYSA-N CC(C)(C1(C)CC2)C2(C(OC)=O)OC1=O Chemical compound CC(C)(C1(C)CC2)C2(C(OC)=O)OC1=O JYUDOMSPXHSDIA-UHFFFAOYSA-N 0.000 description 1
- KRVYFISLMCNPRO-UHFFFAOYSA-N CC(C)(C1(C)CC2)C2(C(OCCN=O)=O)OC1=O Chemical compound CC(C)(C1(C)CC2)C2(C(OCCN=O)=O)OC1=O KRVYFISLMCNPRO-UHFFFAOYSA-N 0.000 description 1
- BFFRJRLRIZUBLU-UHFFFAOYSA-N CC(COC(C)=O)Oc(c(C)c1)c(C)cc1S(C1=CC=CCC1)c1ccccc1 Chemical compound CC(COC(C)=O)Oc(c(C)c1)c(C)cc1S(C1=CC=CCC1)c1ccccc1 BFFRJRLRIZUBLU-UHFFFAOYSA-N 0.000 description 1
- QLDSIHJQJIIZJJ-UHFFFAOYSA-N CC1(C2CC(C3)CC1CC3C2)OC(C1(CCCC1)S1CCCCC1)=O Chemical compound CC1(C2CC(C3)CC1CC3C2)OC(C1(CCCC1)S1CCCCC1)=O QLDSIHJQJIIZJJ-UHFFFAOYSA-N 0.000 description 1
- CHLDGIYBTJMLLL-UHFFFAOYSA-N CC1(C2CC(C3)CC1CC3C2)OC(COC(COc(c(C)c1)c(C)cc1S(c1ccccc1)c1ccccc1)=O)=O Chemical compound CC1(C2CC(C3)CC1CC3C2)OC(COC(COc(c(C)c1)c(C)cc1S(c1ccccc1)c1ccccc1)=O)=O CHLDGIYBTJMLLL-UHFFFAOYSA-N 0.000 description 1
- GCDGELKSEODROA-UHFFFAOYSA-N CC1(C2CC(C3)CC1CC3C2)OC(COc(c(C)c1)c(C)cc1-[n]1c2ccccc2c2c1cccc2)=O Chemical compound CC1(C2CC(C3)CC1CC3C2)OC(COc(c(C)c1)c(C)cc1-[n]1c2ccccc2c2c1cccc2)=O GCDGELKSEODROA-UHFFFAOYSA-N 0.000 description 1
- YQWRVRQQYIDFJD-UHFFFAOYSA-N CCC(OC(C1CC2C3C1)C3OS2(=C1CS(CC(OC(C)(C)C)=O)CCC1)=O)=O Chemical compound CCC(OC(C1CC2C3C1)C3OS2(=C1CS(CC(OC(C)(C)C)=O)CCC1)=O)=O YQWRVRQQYIDFJD-UHFFFAOYSA-N 0.000 description 1
- LSHVFTOLHTUNNP-UHFFFAOYSA-N CCC(OC1(C)C2CC34C1CC3CC4C2)=O Chemical compound CCC(OC1(C)C2CC34C1CC3CC4C2)=O LSHVFTOLHTUNNP-UHFFFAOYSA-N 0.000 description 1
- BYXDVJHBYBNQAL-UHFFFAOYSA-N CCCCCCOc(c(C)c1)c(C)cc1-[n]1c2ccccc2c2c1cccc2 Chemical compound CCCCCCOc(c(C)c1)c(C)cc1-[n]1c2ccccc2c2c1cccc2 BYXDVJHBYBNQAL-UHFFFAOYSA-N 0.000 description 1
- JUPMDXYUMLXCSK-UHFFFAOYSA-N Cc(cc(cc1C)N(c2ccccc2)c2ccccc2)c1OC(C1(CC(C2)C3)CC3CC2C1)=O Chemical compound Cc(cc(cc1C)N(c2ccccc2)c2ccccc2)c1OC(C1(CC(C2)C3)CC3CC2C1)=O JUPMDXYUMLXCSK-UHFFFAOYSA-N 0.000 description 1
- ZTNWIECHXHYYID-UHFFFAOYSA-N Cc(cc(cc1C)[S+](C(F)(F)F)c2ccccc2)c1OC Chemical compound Cc(cc(cc1C)[S+](C(F)(F)F)c2ccccc2)c1OC ZTNWIECHXHYYID-UHFFFAOYSA-N 0.000 description 1
- YBYQFPPPKXZBEA-UHFFFAOYSA-N Cc1cc(S(C(F)(F)F)c2ccccc2)cc(C)c1OC Chemical compound Cc1cc(S(C(F)(F)F)c2ccccc2)cc(C)c1OC YBYQFPPPKXZBEA-UHFFFAOYSA-N 0.000 description 1
- WFLABHMIKIQJLA-UHFFFAOYSA-N Cc1cc([S+](c2ccccc2)c2ccccc2)cc(C)c1OCC(OC)=O Chemical compound Cc1cc([S+](c2ccccc2)c2ccccc2)cc(C)c1OCC(OC)=O WFLABHMIKIQJLA-UHFFFAOYSA-N 0.000 description 1
- ZUAYDQHEETUWBY-UHFFFAOYSA-N Cc1cc([S+](c2ccccc2)c2ccccc2)cc(C)c1OCC(OC1(CC(C2)C3)CC3CC2C1)=O Chemical compound Cc1cc([S+](c2ccccc2)c2ccccc2)cc(C)c1OCC(OC1(CC(C2)C3)CC3CC2C1)=O ZUAYDQHEETUWBY-UHFFFAOYSA-N 0.000 description 1
- FLAGTOZHVVNRHE-UHFFFAOYSA-N FC(F)(F)S(c1ccccc1)c1ccccc1 Chemical compound FC(F)(F)S(c1ccccc1)c1ccccc1 FLAGTOZHVVNRHE-UHFFFAOYSA-N 0.000 description 1
- MFBFZXUSFVXOQA-UHFFFAOYSA-N NC(CO1)OC1=O Chemical compound NC(CO1)OC1=O MFBFZXUSFVXOQA-UHFFFAOYSA-N 0.000 description 1
- OUVJXUZSMOJPOG-UHFFFAOYSA-N NCC(CC1)(C2O3)SC1C2OC3=O Chemical compound NCC(CC1)(C2O3)SC1C2OC3=O OUVJXUZSMOJPOG-UHFFFAOYSA-N 0.000 description 1
- TXLRZWSSXIZVGD-UHFFFAOYSA-N NCC(CO1)OC1=O Chemical compound NCC(CO1)OC1=O TXLRZWSSXIZVGD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012160049A JP6007011B2 (ja) | 2012-07-18 | 2012-07-18 | レジスト組成物、レジストパターン形成方法及び化合物 |
KR1020130084712A KR102049120B1 (ko) | 2012-07-18 | 2013-07-18 | 레지스트 조성물, 레지스트 패턴 형성 방법 및 화합물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012160049A JP6007011B2 (ja) | 2012-07-18 | 2012-07-18 | レジスト組成物、レジストパターン形成方法及び化合物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014021286A JP2014021286A (ja) | 2014-02-03 |
JP6007011B2 true JP6007011B2 (ja) | 2016-10-12 |
Family
ID=50143601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012160049A Active JP6007011B2 (ja) | 2012-07-18 | 2012-07-18 | レジスト組成物、レジストパターン形成方法及び化合物 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6007011B2 (ko) |
KR (1) | KR102049120B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6202000B2 (ja) * | 2012-09-21 | 2017-09-27 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3895224B2 (ja) | 2001-12-03 | 2007-03-22 | 東京応化工業株式会社 | ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法 |
JP2009025723A (ja) | 2007-07-23 | 2009-02-05 | Fujifilm Corp | ネガ型現像用レジスト組成物及びこれを用いたパターン形成方法 |
TWI417274B (zh) | 2008-12-04 | 2013-12-01 | Shinetsu Chemical Co | 鹽、酸發生劑及使用其之抗蝕劑材料、空白光罩,及圖案形成方法 |
JP5436174B2 (ja) * | 2009-12-02 | 2014-03-05 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法 |
JP5557657B2 (ja) * | 2010-09-02 | 2014-07-23 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、新規な化合物及び酸発生剤 |
JP5940455B2 (ja) * | 2010-10-15 | 2016-06-29 | Jsr株式会社 | レジストパターン形成方法 |
WO2012053527A1 (ja) * | 2010-10-22 | 2012-04-26 | Jsr株式会社 | パターン形成方法及び感放射線性組成物 |
JP5564402B2 (ja) * | 2010-10-29 | 2014-07-30 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、新規な化合物、酸発生剤 |
JP5961363B2 (ja) * | 2010-11-15 | 2016-08-02 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | ラクトン光酸発生剤、これを含む樹脂およびフォトレジスト |
JP5846889B2 (ja) * | 2011-12-14 | 2016-01-20 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、化合物 |
JP5783111B2 (ja) * | 2012-03-29 | 2015-09-24 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
-
2012
- 2012-07-18 JP JP2012160049A patent/JP6007011B2/ja active Active
-
2013
- 2013-07-18 KR KR1020130084712A patent/KR102049120B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20140011293A (ko) | 2014-01-28 |
KR102049120B1 (ko) | 2019-11-26 |
JP2014021286A (ja) | 2014-02-03 |
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