JP6000960B2 - 化学機械研磨消耗品のばらつきを補償する装置及び方法 - Google Patents

化学機械研磨消耗品のばらつきを補償する装置及び方法 Download PDF

Info

Publication number
JP6000960B2
JP6000960B2 JP2013534908A JP2013534908A JP6000960B2 JP 6000960 B2 JP6000960 B2 JP 6000960B2 JP 2013534908 A JP2013534908 A JP 2013534908A JP 2013534908 A JP2013534908 A JP 2013534908A JP 6000960 B2 JP6000960 B2 JP 6000960B2
Authority
JP
Japan
Prior art keywords
polishing
conditioner
sensor
coupled
metric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013534908A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013540369A (ja
Inventor
シヴァクマール ダンダパーニ，
シヴァクマール ダンダパーニ，
アシェシュ シェイン，
アシェシュ シェイン，
チャールズ シー． ギャレットソン，
チャールズ シー． ギャレットソン，
グレゴリー イー． メンク，
グレゴリー イー． メンク，
スタン， ディー． ツァイ，
スタン， ディー． ツァイ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2013540369A publication Critical patent/JP2013540369A/ja
Application granted granted Critical
Publication of JP6000960B2 publication Critical patent/JP6000960B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
JP2013534908A 2010-10-21 2011-09-12 化学機械研磨消耗品のばらつきを補償する装置及び方法 Active JP6000960B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US40564010P 2010-10-21 2010-10-21
US61/405,640 2010-10-21
US13/178,126 US8758085B2 (en) 2010-10-21 2011-07-07 Method for compensation of variability in chemical mechanical polishing consumables
US13/178,126 2011-07-07
PCT/US2011/051251 WO2012054149A2 (fr) 2010-10-21 2011-09-12 Appareil et procédé permettant la compensation de la variabilité des consommables de polissage chimico-mécanique

Publications (2)

Publication Number Publication Date
JP2013540369A JP2013540369A (ja) 2013-10-31
JP6000960B2 true JP6000960B2 (ja) 2016-10-05

Family

ID=45973415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013534908A Active JP6000960B2 (ja) 2010-10-21 2011-09-12 化学機械研磨消耗品のばらつきを補償する装置及び方法

Country Status (6)

Country Link
US (1) US8758085B2 (fr)
JP (1) JP6000960B2 (fr)
KR (1) KR101526845B1 (fr)
CN (1) CN102725832B (fr)
TW (1) TWI483807B (fr)
WO (1) WO2012054149A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011109B2 (en) 2016-05-23 2018-07-03 Fuji Xerox Co., Ltd. Image forming apparatus, non-transitory computer readable medium, and image forming method

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
US20130196572A1 (en) * 2012-01-27 2013-08-01 Sen-Hou Ko Conditioning a pad in a cleaning module
JP5973883B2 (ja) * 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
US9089949B2 (en) * 2012-12-04 2015-07-28 General Electric Company Automated polishing systems and methods
US9673113B2 (en) 2014-06-05 2017-06-06 Applied Materials, Inc. Method and system for real-time polishing recipe control
KR102333209B1 (ko) 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法
SG10201600301SA (en) * 2016-01-14 2017-08-30 3M Innovative Properties Co CMP Pad Conditioner, Pad Conditioning System And Method
JP6357260B2 (ja) 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
US10571069B2 (en) * 2017-09-14 2020-02-25 Applied Materials, Inc. Gimbal assembly for heater pedestal
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP6970601B2 (ja) * 2017-12-06 2021-11-24 株式会社荏原製作所 半導体製造装置の設計方法
US11806833B2 (en) * 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same
US20200130136A1 (en) * 2018-10-29 2020-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP2001079752A (ja) * 1999-09-08 2001-03-27 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7094695B2 (en) * 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
JP2004142083A (ja) 2002-10-28 2004-05-20 Elpida Memory Inc ウエハ研磨装置およびウエハ研磨方法
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
JP2005131732A (ja) * 2003-10-30 2005-05-26 Ebara Corp 研磨装置
US6953382B1 (en) 2004-06-24 2005-10-11 Novellus Systems, Inc. Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
JP2008258510A (ja) * 2007-04-07 2008-10-23 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨条件管理装置及び研磨条件管理方法
JP4658182B2 (ja) * 2007-11-28 2011-03-23 株式会社荏原製作所 研磨パッドのプロファイル測定方法
US8870625B2 (en) * 2007-11-28 2014-10-28 Ebara Corporation Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
TW201006609A (en) * 2008-06-09 2010-02-16 Applied Materials Inc CMP pad identification and layer ratio modeling
US8337279B2 (en) * 2008-06-23 2012-12-25 Applied Materials, Inc. Closed-loop control for effective pad conditioning
US8096852B2 (en) * 2008-08-07 2012-01-17 Applied Materials, Inc. In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
WO2011139501A2 (fr) * 2010-04-30 2011-11-10 Applied Materials, Inc. Modélisation de couple de balayage de conditionnement de tampon pour parvenir à un taux d'élimination constant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011109B2 (en) 2016-05-23 2018-07-03 Fuji Xerox Co., Ltd. Image forming apparatus, non-transitory computer readable medium, and image forming method

Also Published As

Publication number Publication date
JP2013540369A (ja) 2013-10-31
US20120100779A1 (en) 2012-04-26
WO2012054149A3 (fr) 2012-06-14
KR101526845B1 (ko) 2015-06-08
US8758085B2 (en) 2014-06-24
TWI483807B (zh) 2015-05-11
KR20130122513A (ko) 2013-11-07
TW201242717A (en) 2012-11-01
CN102725832B (zh) 2016-02-24
WO2012054149A2 (fr) 2012-04-26
CN102725832A (zh) 2012-10-10

Similar Documents

Publication Publication Date Title
JP6000960B2 (ja) 化学機械研磨消耗品のばらつきを補償する装置及び方法
KR102181464B1 (ko) 드레싱 프로세스의 감시 방법 및 연마 장치
TWI568534B (zh) 墊片狀態化掃略力矩模式化以達成恆定移除率
US20170252889A1 (en) Polishing apparatus
US8096852B2 (en) In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
US8337279B2 (en) Closed-loop control for effective pad conditioning
JP7287977B2 (ja) パッドコンディショナカット速度監視
US6953382B1 (en) Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140910

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151203

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151215

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160314

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160802

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160831

R150 Certificate of patent or registration of utility model

Ref document number: 6000960

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250