JP5994539B2 - Liquid ejection device and wiring connection structure - Google Patents

Description

  The present invention relates to a liquid ejection device that ejects liquid from a nozzle, and a wiring connection structure in which a substrate and a wiring member are used, which are used in a liquid ejection device and the like.

  In Patent Document 1, a distal end portion of a flexible printed circuit board on which a plurality of wirings is formed is provided with a comb tooth portion that is separated for each wiring and from which the wiring is exposed. And it is described that the side edge part is covered with the coverlay film. Moreover, in patent document 1, the part which is not covered with the coverlay film among the parts exposed in the comb-tooth part of the wiring of a flexible printed circuit board, and the electrode land provided in the printed circuit board are connected by solder. Yes. By providing the coverlay film, it is possible to prevent the solder from flowing and short-circuiting the wires at the time of connection.

JP-A-9-232706

  Here, in Patent Document 1, in order to prevent the wires from being short-circuited by solder, as described above, it is necessary to cover the base end portion and the side end portion of the comb teeth portion with a coverlay film. When the wirings are arranged with high density, the process of covering only a part of the comb teeth portion with the coverlay film becomes complicated.

  An object of the present invention is to provide a liquid ejection device and a wiring connection structure that can prevent a short circuit between wirings and that are easy to manufacture.

A liquid ejection apparatus according to a first aspect of the present invention includes a liquid ejection head that ejects liquid from a plurality of nozzles, and a substrate that is provided for the liquid ejection head and has a path for transmitting signals to the liquid ejection head. And a wiring member for connecting the substrate to the outside, the substrate including a plurality of lands for connecting to the wiring member, the wiring member including a base material, and the base material A plurality of wirings formed on the substrate, and the base material is separated for each of the plurality of wirings, and the exposed portions where the plurality of wirings are exposed, and in the length direction of the plurality of wirings, And a covering portion that covers the plurality of wires together, and each of the plurality of lands is disposed to face a portion exposed at the exposed portion of the corresponding wiring. And by solder A first portion connected to the wiring, and a second portion connected to the first portion in an orthogonal direction parallel to the surface direction of the base material and orthogonal to the length direction of the plurality of wirings. And the distance between the first portion and the covering portion is greater than the distance between the second portion and the covering portion in the length direction of the plurality of wirings , The distance between the first portion and the covering portion in the length direction of the wiring increases as the land is arranged along the orthogonal direction and is located inward in the orthogonal direction. .
A liquid ejection apparatus according to a second aspect of the present invention is a substrate having a liquid ejection head that ejects liquid from a plurality of nozzles, and a path that is provided for the liquid ejection head and that transmits a signal to the liquid ejection head. And a wiring member for connecting the substrate to the outside, the substrate including a plurality of lands for connecting to the wiring member, the wiring member including a base material, and the base material A plurality of wirings formed on the substrate, and the base material is separated for each of the plurality of wirings, and the exposed portions where the plurality of wirings are exposed, and in the length direction of the plurality of wirings, And a covering portion that covers the plurality of wires together, and each of the plurality of lands is disposed to face a portion exposed at the exposed portion of the corresponding wiring. And by solder A first portion connected to the wiring, and a second portion connected to the first portion in an orthogonal direction parallel to the surface direction of the base material and orthogonal to the length direction of the plurality of wirings. The distance between the first portion and the covering portion is longer than the distance between the second portion and the covering portion in the length direction of the plurality of wirings, The lands are arranged along the orthogonal direction, and the distance between the second portion and the wiring increases as the land is located on the inner side in the orthogonal direction.

A wiring contact structure according to a fourth invention includes a substrate and a wiring member for connecting the substrate to the outside, and the substrate includes a plurality of lands for connection with the wiring member, The wiring member includes a base material disposed opposite to the substrate, and a plurality of wirings formed on the base material, and the base material is separated for each of the plurality of wirings, An exposed portion where the plurality of wirings are exposed; and a covering portion that is continuous with the exposed portion in a length direction of the plurality of wirings and covers the plurality of wirings together. The first portion connected to the wiring by the solder and disposed in the exposed portion of the corresponding wiring, and the orthogonal direction orthogonal to the length direction of the plurality of wirings. In the second portion connected to the first portion Minutes, with a, in the length direction of the plurality of wires, the distance between the said first portion covering part, wherein is larger than the distance between the second portion and the cover portion, the plurality of The lands are arranged along the orthogonal direction, and the distance between the first portion and the covering portion in the length direction of the wiring increases as the land is located inward in the orthogonal direction. It is characterized by.
A wiring contact structure according to a fifth invention includes a substrate and a wiring member for connecting the substrate to the outside, and the substrate includes a plurality of lands for connecting to the wiring member, The wiring member includes a base material disposed opposite to the substrate, and a plurality of wirings formed on the base material, and the base material is separated for each of the plurality of wirings, An exposed portion where the plurality of wirings are exposed; and a covering portion that is continuous with the exposed portion in a length direction of the plurality of wirings and covers the plurality of wirings together. The first portion connected to the wiring by the solder and disposed in the exposed portion of the corresponding wiring, and the orthogonal direction orthogonal to the length direction of the plurality of wirings. In the second portion connected to the first portion A distance between the first portion and the covering portion is larger than a distance between the second portion and the covering portion in the length direction of the plurality of wirings, The lands are arranged along the orthogonal direction, and the distance between the second portion and the wiring is increased as the land is located on the inner side in the orthogonal direction.

  When joining the wiring exposed on the exposed part of the base material and the land with solder, if the amount of solder is large, the solder flows along the wiring to the covering part, and further passes through the covering part of the base material and is adjacent. May flow to the wiring to be connected, and the wiring may be short-circuited. On the other hand, it is generally difficult to control the amount of solder. On the other hand, in these inventions, since the distance between the first portion of the land and the covering portion in the length direction of the wiring is long, even if the solder flows from the land to the wiring, it is difficult to reach the covering portion. Thereby, a short circuit between wirings can be prevented.

  Further, if the distance between the entire land and the covering portion in the length direction of the wiring is long, the area of the land becomes small, and the bonding force between the land and the wiring becomes weak. On the other hand, in these inventions, the area of the land can be secured for the second portion by shortening the distance from the covering portion, and the decrease in the bonding force between the wiring and the land can be suppressed. it can.

  Further, the solder may be configured such that the solder that has flowed from the land to the wiring does not easily reach the covering portion only by providing the land with the first portion and the second portion having different distances from the covering portion in the length direction of the wiring. This makes it possible to easily manufacture the device.

  In the board and the wiring member, the inner part in the orthogonal direction, the heat at the time of bonding is less likely to escape to the outside, and the solder flows from the land to the wiring, and the wiring is likely to short-circuit. On the other hand, in the present invention, the inner land in the orthogonal direction has a longer distance from the covering portion of the first portion, so that it is possible to reliably prevent a short circuit between the wires due to the solder.

  In the board or wiring member, the heat at the time of connection is less likely to escape to the outside at the inner part in the orthogonal direction, so the solder flows from the second part to the wiring across the gap between the second part and the wiring. It is easy to end up. On the other hand, in the present invention, since the distance between the inner land in the orthogonal direction and the wiring of the second part in the orthogonal direction is larger, the solder is prevented from flowing from the second part to the wiring. can do.

A liquid ejection apparatus according to the third invention, in the liquid discharge apparatus according to the first or second invention, the plurality of wires, for transmitting the driving signal for driving the liquid discharging head toward the substrate A plurality of signal wires and a plurality of power wires connected to a power source are provided, and the signal wires are connected to the lands on the inner side in the orthogonal direction with respect to the power wires.

As the inner land in the orthogonal direction becomes smaller, the area of the first portion becomes smaller, so that the wiring easily peels from the land. On the other hand, when the wiring is peeled off from the land, if the wiring is a signal wiring, liquid discharge abnormality occurs when the liquid discharge inspection from the nozzle is performed. On the other hand, in the case of a power supply wiring, since power is supplied from another power supply wiring, it cannot be detected that the wiring is separated from the land. In the present invention, since the signal wiring is connected to the inner land in the direction orthogonal to the power supply wiring, it is determined whether or not the signal wiring is peeled off from the land depending on whether the result of the discharge inspection is normal. In addition, when the result of the ejection inspection is normal, it can be estimated that the power supply wiring that is less likely to be peeled off from the land than the signal wiring is not peeled off from the land.
A liquid ejection apparatus according to a sixth aspect of the present invention is a substrate having a liquid ejection head that ejects liquid from a plurality of nozzles, and a path that is provided for the liquid ejection head and that transmits a signal to the liquid ejection head. And a wiring member for connecting the substrate to the outside, the substrate including a plurality of lands for connecting to the wiring member, the wiring member including a base material, and the base material A plurality of wirings formed on the substrate, and the base material is separated for each of the plurality of wirings, and the exposed portions where the plurality of wirings are exposed, and in the length direction of the plurality of wirings, And a covering portion that covers the plurality of wirings together, and each of the plurality of lands is disposed to face a portion of the corresponding wiring that is exposed at the exposed portion. And by solder A first portion connected to the wiring, and a second portion connected to the first portion in an orthogonal direction parallel to the surface direction of the base material and orthogonal to the length direction of the plurality of wirings. The length of the first portion in the orthogonal direction is larger than the length of the wiring in the orthogonal direction, and the distance between the first portion and the covering portion in the length direction of the plurality of wirings, The distance between the second portion and the covering portion is greater.
A wiring connection structure according to a seventh invention includes a substrate and a wiring member for connecting the substrate to the outside, and the substrate includes a plurality of lands for connecting to the wiring member, The wiring member includes a base material disposed opposite to the substrate, and a plurality of wirings formed on the base material, and the base material is separated for each of the plurality of wirings, An exposed portion where the plurality of wirings are exposed; and a covering portion that is continuous with the exposed portion in a length direction of the plurality of wirings and covers the plurality of wirings together. The first portion connected to the wiring by the solder and disposed in the exposed portion of the corresponding wiring, and the orthogonal direction orthogonal to the length direction of the plurality of wirings. And the first portion is connected to the first portion. A length of the first portion in the orthogonal direction is greater than a length of the wiring in the orthogonal direction, and in the length direction of the plurality of wirings, the first portion and the covering portion The distance is larger than the distance between the second portion and the covering portion.

  According to the present invention, since the distance between the first portion of the land and the covering portion in the length direction of the wiring is long, even if solder flows from the land to the wiring, it is difficult to reach the covering portion. Thereby, a short circuit between wirings can be prevented. On the other hand, about the 2nd part, the area of a land can be ensured by shortening the distance with a coating | coated part, and the fall of the joining force of wiring and a land can be suppressed. Further, the solder may be configured such that the solder that has flowed from the land to the wiring does not easily reach the covering portion only by providing the land with the first portion and the second portion having different distances from the covering portion in the length direction of the wiring. This makes it possible to easily manufacture the device.

1 is a schematic configuration diagram of a printer according to a first embodiment. It is the figure which looked at the inkjet head of FIG. 1 from the direction of arrow II. It is the figure which looked at FIG. 2 from the direction of arrow III. FIG. 4 is a partially enlarged view of an R region in FIG. 3. It is a figure which shows the comparative example for performing a comparison with FIG. FIG. 6 is a view corresponding to FIG. 4 of Modification 1; FIG. 10 is a diagram corresponding to FIG. FIG. 6 is a diagram corresponding to FIG.

  Hereinafter, preferred embodiments of the present invention will be described.

  As shown in FIG. 1, the printer 1 (liquid ejection apparatus) according to the present embodiment includes a carriage 2, an inkjet head 3 (liquid ejection head), a paper transport roller 4, and the like. The carriage 2 reciprocates in the scanning direction along the two guide rails 6.

  The inkjet head 3 is mounted on the carriage 2 and ejects ink from a plurality of nozzles 10 formed on the lower surface thereof. The ink jet head 3 is connected to an ink cartridge (not shown) via a tube (not shown), and ink is supplied from the ink cartridge. The paper transport roller 4 transports the recording paper P in the transport direction orthogonal to the scanning direction.

  In the printer 1, the recording paper P is transported in the transport direction by the paper transport roller 4, and ink is ejected onto the recording paper P from the inkjet head 3 that reciprocates in the scanning direction together with the carriage 2. Print. Further, the recording paper P for which printing has been completed is discharged in the transport direction by the paper transport roller 4.

  Next, the inkjet head 3 and the configuration for driving the inkjet head 3 will be described. As shown in FIG. 2, the inkjet head 3 includes a flow path unit 11 and a piezoelectric actuator 12. In the flow path unit 11, ink flow paths such as a plurality of nozzles 10 and a plurality of pressure chambers (not shown) communicating with the plurality of nozzles 10 are formed. The piezoelectric actuator 12 is disposed on the upper surface of the flow path unit 11, and discharges ink from the nozzle 10 communicating with the pressure chamber by applying pressure to the ink in the pressure chamber (not shown). In addition, since the structure of the flow path unit 11 and the piezoelectric actuator 12 is the same as that of the past, detailed description is abbreviate | omitted here.

  As shown in FIGS. 2 and 3, a COF (Chip On Film) 21 is electrically connected to the upper surface of the piezoelectric actuator 12. The COF 21 is drawn upward from the connection portion with the piezoelectric actuator 12, and the upper end portions thereof are electrically connected to the terminal portions 31 of the head substrate 22 disposed above the inkjet head 3, respectively. A driver IC 13 that drives the piezoelectric actuator 12 is mounted in the middle of the COF 21.

  As shown in FIGS. 3 and 4, the head substrate 22 is electrically connected to a control device 24 (external) that controls the operation of the entire printer 1 via an FFC (Flexible Flat Cable) 23 (wiring member). ing. In the printer 1, a signal for controlling the driver IC 13 is transmitted from the control device 24 via the FFC 23, and the head substrate 22 relays the signal transmitted from the control device 24 and transmits the signal via the COF 21. Transmit to IC13. The driver IC 13 drives the piezoelectric actuator 12 according to the signal transmitted from the control device 24 in this way. In the present embodiment, the combination of the head substrate 22 and the FFC 23 corresponds to the wiring connection structure according to the present invention.

  Next, the configuration of the head substrate 22 and the FFC 23 will be described. As shown in FIGS. 2 to 4, the above-described terminal portion 31 that is electrically connected to the COF 21 is provided on the upper surface of the head substrate 22 at the end on the left side in the scanning direction. A plurality of lands 32 for electrical connection with the FFC 23 are provided on the upper surface of the head substrate 22 at a portion on the right side in the scanning direction with respect to the terminal portion 31. The plurality of lands 32 are arranged in the paper feeding direction. Furthermore, a plurality of wirings 26 that electrically connect the terminal portions 31 and the lands 32 are formed on the upper surface of the head substrate 22.

  The FFC 23 has a plurality of wirings 42 formed in a film-like base material 41 made of a flexible material such as a synthetic resin, and one end portion of the FFC 23 has a plurality of lands 32 of the head substrate 22. And the other end is electrically connected to the control device 24. The plurality of wirings 42 extend in the scanning direction and are arranged in the paper feed direction in a continuous portion including a portion facing the head substrate 22.

  The base member 41 is provided with an exposed portion 43 where a plurality of wirings 42 are exposed on the lower surface at the end portion on the head substrate 22 side. The exposed portion 43 is formed with a substantially rectangular through-hole 41a having a scanning direction as a longitudinal direction at a portion located between adjacent wirings 42 in the paper feeding direction. The wirings 42 are separated. The exposed portion of the wiring 42 of the FFC 23 is connected to the land 32 via the solder 50. In FIG. 4, the wiring 42 that should be drawn with a broken line is drawn with a solid line for easy understanding of the drawing.

  Further, a portion of the base material 41 that is continuous with the exposed portion 43 on the control device 24 side is a covering portion 44 that covers a plurality of wires 42 together. On the other hand, the portion of the base material 41 that is further on the tip side than the exposed portion 43 is a connecting portion 45 that connects the exposed portions 43 separated for each wiring 42 to each other. Note that the wiring 42 does not extend to the connecting portion 45.

  Here, the land 32 and the wiring 42 will be described in more detail. The land 32 has a substantially rectangular planar shape whose longitudinal direction is the scanning direction, and is continuous with the first portion 33 located at the substantially central portion in the paper feeding direction and both sides of the first portion 33 in the paper feeding direction. The second portion 34 is included. The first portion 33 faces the exposed portion of the exposed portion 43 of the corresponding wiring 42. Further, a cutout 35 is formed in the first portion 33 at the end on the right side in the scanning direction facing the covering portion 44. Accordingly, in the scanning direction (the length direction of the wiring 42), the distances D1 to D4 between the first portion 33 and the covering portion 44 are larger than the distance D0 between the second portion 34 and the covering portion 44.

  Further, in the plurality of lands 32, the length of the cutout 35 in the scanning direction is longer as the land 32 is located inside the paper feeding direction (orthogonal direction). As a result, the distance between the first portion 33 and the covering portion 44 in the scanning direction becomes larger as the land 32 is located on the inner side in the paper feeding direction (D1 <D2 <D3 <D4 in FIG. 4). ).

  Further, in the plurality of lands 32, the length of the notch 35 in the paper feeding direction is longer as the land 32 is located on the inner side in the paper feeding direction. As a result, the distance between the second portion 34 and the wiring 42 in the paper feeding direction is larger in the land 32 positioned on the inner side in the paper feeding direction (E1 <E2 <E3 <E4 in FIG. 4). )

  Of the plurality of wirings 42 arranged in the paper feeding direction, a clock for driving the driver IC 13 is transmitted to the wiring 42a arranged on the innermost side in the paper feeding direction. Further, a signal for instructing which nozzle 10 out of the plurality of nozzles 10 is to eject ink is transmitted to the wiring 42b immediately outside the wiring 42a in the paper feeding direction. In addition, a signal indicating the ejection timing of the ink from the nozzle 10 is transmitted to the wiring 42c just outside the wiring 42b in the paper feed direction. In addition, the outermost wiring 42d in the paper feeding direction, which is located immediately outside the wiring 42c in the paper feeding direction, is connected to a power source (not shown) and serves as a wiring for supplying power to the driver IC 13. In the present embodiment, the combination of the wirings 42a to 42c corresponds to the signal wiring according to the present invention, and the wiring 42d corresponds to the power supply wiring according to the present invention.

  Here, in the present embodiment, the first portion 33 of the land 32 and the portion exposed at the exposed portion 43 of the wiring 42 are connected by the solder 50. At this time, for example, the solder 50 is formed on the land 32 and the FFC 23 is disposed above the head substrate 22, and the heater H is covered with the exposed portion 43 as shown by a two-dot chain line in FIG. The lands 32 and the wiring 42 are electrically connected to each other by the solder 50 by heating the FFC 23 while pressing the FFC 23 from above with the heater H. However, at this time, the heater H does not straddle the connecting portion 45.

  At this time, in general, it is difficult to accurately control the amount of the solder 50 formed in advance on the land 32. On the other hand, when the amount of the solder 50 formed in advance is large, as indicated by an arrow A in FIG. 4, the solder 50 flows along the wiring 42 to the covering portion 44 side. At this time, unlike the present embodiment, assuming that the notch 35 is not formed in the land 32 as shown in FIG. 5, the portion facing the wiring 42 of the land 32 in the scanning direction, and the covering The distance from the portion 44 is small (for example, the distance D0), and as indicated by the arrow B, the solder 50 that has flowed out from the land 32 to the wiring 42 easily reaches the covering portion 44. When the solder 50 reaches the covering portion 44, the solder 50 further flows to a neighboring wiring 42 through a portion located between the neighboring wirings 42 of the base material 41 as indicated by an arrow C. As a result, the wirings 42 may be short-circuited. Such a problem is more likely to occur as the wirings 42 are formed in the FFC 23 with higher density and the distance between the wirings 42 is smaller.

  In contrast, in the present embodiment, as described above, the notch 35 is formed in the first portion 33 of the land 32, and the distance between the first portion 33 and the covering portion 44 is increased in the scanning direction. Therefore, even if the solder 50 flows out from the first portion 33 to the wiring 42, it is difficult to reach the covering portion 44. Thereby, a short circuit between the wirings 42 by the solder 50 can be prevented.

  In the present embodiment, a notch 35 is formed in the first portion, and the distance between the first portion 33 and the covering portion 44 in the scanning direction is greater than the distance between the second portion 34 and the covering portion 44. By simply forming the long land 32, it is possible to make a structure in which the solder 50 flowing from the land 32 to the wiring 42 does not easily reach the covering portion 44. This simplifies the manufacture of the device.

  Here, unlike the present embodiment, it is conceivable to increase the distance between the land 32 and the covering portion 44 in the scanning direction by shortening the entire length of the land 32 in the scanning direction. However, in this case, the area of the land 32 where the solder 50 is disposed becomes too small, and the bonding force between the land 32 and the wiring 42 by the solder 50 may be weakened.

  On the other hand, in the present embodiment, the land 32 has a large distance from the covering portion 44 in the scanning direction only in the first portion 33 facing the wiring 42, and in the second portion 34, the scanning is performed. Since the distance to the covering portion 44 in the direction is small, the decrease in the area of the land 32, that is, the decrease in the bonding force between the land 32 and the wiring 42 due to the solder 50 can be suppressed as much as possible.

  Further, as described above, when the heater H is pressed against the FFC 23 to heat the FFC 23, the heat applied from the heater H is less likely to escape to the outside in the head substrate 22 and the FFC 23 toward the inner side in the paper feeding direction. Therefore, the temperature of the solder 50 increases as the land 32 on the inner side in the paper feeding direction becomes higher, and easily flows through the wiring 42 to the covering portion 44.

  On the other hand, in the present embodiment, as described above, the distance between the land 32 on the inner side in the paper feeding direction and the covering portion 44 in the scanning direction is larger, so that the current flows from the land 32 to the wiring 42. It is possible to reliably prevent the solder 50 from reaching the covering portion 44.

  Further, as described above, when the FFC 23 is heated by the heater H, the temperature of the solder 50 becomes higher in the inner land 32 in the paper feeding direction. On the other hand, when the temperature of the solder 50 becomes high, as indicated by an arrow F, the solder 50 extends from the land 32 to the wiring 42 across the gap between the second portion 34 of the exposed portion 43 and the wiring 42. There is a risk of flowing. In this case, since the distance between the second portion 34 and the covering portion 44 is smaller than the distance between the first portion 33 and the covering portion 44 in the paper feeding direction, the solder 50 that has flowed through the wiring 42 is It is easy to reach the covering portion 44 through the wiring 42.

  On the other hand, in the present embodiment, as described above, the distance between the second portion 34 and the wiring 42 in the paper feed direction is larger in the inner land 32 in the paper feed direction. Thus, it is possible to reliably prevent the second portion 34 from flowing into the wiring 42.

  Here, after the ink jet printer 1 is manufactured, test printing (discharge inspection) such as printing a predetermined test pattern is usually performed for operation confirmation. If the result of the test printing is abnormal, one of the wirings for transmitting signals is peeled off from the land 32, or all the wirings for supplying power are not peeled off from the land 32. I understand. In this case, the connection between the wiring 42 and the land 32 by the solder 50 is performed again.

  On the other hand, if the result of the test printing is normal, the wiring for transmitting the signal is not peeled off from the land 32, and at least one wiring among the wirings for supplying a plurality of power supplies is from the land 32. You can see that it is not peeled off. However, even if the result of the test printing is normal, it is not known that all the wiring for supplying power is not peeled off from the land 32. That is, even if some of the plurality of wirings for supplying power are peeled off from the land 32, the power is supplied from other wirings, so that the test printing result is normal. However, when some of the plurality of wirings for supplying power are peeled off from the land 32, the operation of the inkjet head 3 may become unstable.

  In contrast, in the present embodiment, the wirings 42a, 42b, and 42c for transmitting signals are arranged on the inner side in the paper feeding direction than the wiring 42d for supplying power. Therefore, when the result of the test printing is normal, it can be seen that the wirings 42a, 42b, and 42c are not peeled off from the land 32, and the wiring 42d that is more difficult to peel off from the land 32 than the wirings 42a, 42b, and 42c is also used. It can be estimated that it is not peeled off. Therefore, whether or not any of the wirings 42 is peeled off from the land 32 can be accurately determined based on whether or not the printing is normally performed in the test printing.

  Contrary to this embodiment, if the wiring for supplying power is arranged inside the paper feed direction with respect to the wiring for transmitting signals, the power for supplying power is assumed. Even if it is understood that the result of the test printing is normal and the wiring for transmitting the signal is not peeled off from the land 32 because the wiring is more easily peeled off from the land 32 than the wiring for transmitting the signal. Therefore, it cannot be estimated that the wiring for supplying power is not peeled off from the land 32.

  Next, modified examples in which various changes are made to the present embodiment will be described. However, description of components having the same configuration as in this embodiment will be omitted as appropriate.

  In the above-described embodiment, the inner land 32 in the paper feeding direction has a smaller area, whereas the outermost wiring 42d in the paper feeding direction is used as a wiring for supplying power. Although the wirings 42a, 42b, and 42c positioned inside the paper feeding direction from the wiring 42d are used as wirings for transmitting signals, the present invention is not limited to this. Any of the wirings 42a to 42d may be used as a wiring for transmitting a signal, and any wiring may be used as a wiring for supplying power.

  In the above-described embodiment, the distance between the first portion 33 and the covering portion 44 in the scanning direction is larger in the inner land 32 in the paper feeding direction (D1 <D2 <D3 <D4. ) And the distance between the second portion 34 and the wiring 42 in the paper feed direction is large (E1 <E2 <E3 <E4), but is not limited thereto. For example, in all the lands 32, the distance between the first portion 33 and the covering portion 44 in the scanning direction may be constant. Further, in all lands 32, the distance between the second portion 34 and the wiring 42 in the paper feeding direction may be constant.

  In the above-described embodiment, the substantially central portion of the land 32 in the paper feed direction is opposed to the wiring 42, but the present invention is not limited to this. In one modified example (Modified Example 1), as shown in FIG. 6, the land 62 is opposed to the wiring 42 in a first portion 63 that forms a substantially lower half in the drawing in the paper feeding direction. The notch 65 is formed at one end of the first portion 63 facing the covering portion 44, whereby the first portion 63 and the covering portion 44 in the scanning direction (the length direction of the wiring 42). The distance D5 is larger than the distance D6 between the second portion 64 that forms the substantially upper half of the land 62 in FIG.

  Even in this case, it is possible to prevent the solder 50 from reaching the covering portion 44 when the solder 50 (see FIG. 2) flows from the land 62 through the wiring 42 to the covering portion 44 side. In the first modification, the distance between the first portion 63 and the covering portion 44 in the scanning direction and the distance between the second portion 64 and the wiring 42 in the paper feeding direction are constant in all the lands 62. This is not a limitation. That is, as in the above-described embodiment, the distance between the inner land 62 in the paper feeding direction and the covering portion 44 of the first portion 63 in the scanning direction may be increased. Similarly to the above-described embodiment, the distance between the inner land 62 in the paper feeding direction and the wiring 42 of the second portion 64 in the paper feeding direction may be increased.

  In the above-described embodiment, the FFC 23 is connected to the head substrate 22 only at one end, but the present invention is not limited to this. In another modification (Modification 2), as shown in FIGS. 7 and 8, the FFC 23 is connected to the two head substrates 22a and 22b. The case where the FFC 23 is connected to the two head substrates 22a and 22b includes, for example, an inkjet head that ejects black ink and an inkjet head that ejects color ink onto the carriage 2 (see FIG. 1). This is the case where the head substrates 22a and 22b are individually provided for these two inkjet heads.

  As shown in FIGS. 7 and 8, the base material 41 of the FFC 23 is provided with an exposed portion 43 a similar to that of the above-described embodiment at the tip portion, and also in the middle portion, the exposed portion. 43b is provided, and exposed portions of the exposed portions 43a and 43b of the wiring 42 are at least one of a land 72a provided on the head substrate 22a and a land 72b provided on the head substrate 22b, respectively. It is connected. Specifically, for example, among the wirings 42, the wirings 42 common to the plurality of nozzles 10, such as wirings for transmitting a signal indicating a clock and ink ejection timing, and wirings for supplying power, The individual wires 42 connected to both the lands 72a and 72b and for transmitting a signal instructing from which nozzle 10 the ink is to be ejected are connected to the lands 72a and 72b. Only one of them is connected. In this case, the portion between the exposed portion 43a and the exposed portion 43b of the base material 41 and the portion connected to the control device 24 side of the exposed portion 43b collectively cover the plurality of wirings 42, respectively. It becomes the coating | coated part 44a and the coating | coated part 44b.

  Similarly to the above-described embodiment, the land 72a is opposed to the wiring 42 in the first portion 73a that forms a substantially central portion in the paper feeding direction, and covers the first portion 73a in the scanning direction (length direction of the wiring 42). A notch 75a is formed at one end facing the portion 44a. Accordingly, a distance D7 between the first portion 73a and the covering portion 44a in the scanning direction is longer than a distance D8 between the second portion 74a and the covering portion 44a that form both ends of the land 72a in the paper feeding direction. .

  The land 72b is opposed to the wiring 42 in a first portion 73b that forms a substantially central portion in the paper feed direction, and is notched 75b at both ends in the scanning direction of the first portion 72b facing the covering portions 44a and 44b, respectively. Is formed. Thereby, in the scanning direction, the distance D9 between the first portion 73b and the covering portion 44a is longer than the distance D10 between the second portion 74b that forms both ends of the land 72b in the paper feeding direction and the covering portion 44a. It has become. In the scanning direction, the distance D11 between the first portion 72b and the covering portion 44b is longer than the distance D12 between the second portion 74b and the covering portion 44b.

  In the second modification, when the land 72a and the wiring 42 are connected by the solder 50 (see FIG. 2), the heater H is connected to the exposed portion 43a and the covering portion 44a as shown in FIG. It arrange | positions so that it may straddle and may not straddle the connection part 45. FIG. On the other hand, when the land 72b and the wiring 42 are connected by the solder 50 (see FIG. 2), the heater H is disposed so as to straddle the exposed portion 43b and the covering portions 44a and 44b.

  Even in this case, when the solder 50 (see FIG. 2) flows from the lands 72a and 72b to the covering portions 44a and 44b through the wiring 42, the solder 50 is prevented from reaching the covering portions 44a and 44b. can do.

  In the above example, by forming a notch in the land, the distance between the first portion and the covering portion in the length direction of the wiring 42 of the FFC 23 is longer than the distance between the second portion and the covering portion. However, the distance between the first portion and the covering portion in the length direction of the wiring 42 of the FFC 23 is made longer than the distance between the second portion and the covering portion by a configuration other than forming a notch in the land. Also good.

  In the above, an example in which the present invention is applied to a printer including an inkjet head that discharges ink from nozzles has been described. However, the present invention is not limited to this. The present invention can also be applied to a liquid ejecting apparatus that ejects a liquid other than ink. Furthermore, it is possible to apply the present invention to an apparatus other than a liquid ejection apparatus having a wiring connection structure in which a flexible wiring member is connected to a substrate.

1 Printer 10 Nozzle 22 Head substrate 23 FFC
32 Land 33 First part 34 Second part 35 Notch 41 Base 42 Wiring 43 Exposed part 44 Covering part 50 Solder 62 Land 63 First part 64 Second part 65 Notch 72a, 72b Land 73a, 73b First part 74a 74b Second part 75a, 75b Notch

Claims (7)

A liquid discharge head for discharging liquid from a plurality of nozzles;
A substrate provided for the liquid ejection head and having a path for transmitting a signal to the liquid ejection head;
A wiring member for connecting the substrate to the outside,
The substrate includes a plurality of lands for connection with the wiring member,
The wiring member is
A substrate;
A plurality of wires formed on the base material,
The substrate is
The plurality of wirings are separated for each, and the exposed portions where the plurality of wirings are exposed;
A continuous portion that is continuous with the exposed portion in the length direction of the plurality of wires, and covers the plurality of wires together;
Each of the plurality of lands is
A first portion of the corresponding wiring that is disposed to face the exposed portion of the exposed portion and connected to the wiring by solder;
A second portion that is parallel to the surface direction of the base material and that is continuous with the first portion in an orthogonal direction perpendicular to the length direction of the plurality of wirings;
In the length direction of the plurality of wirings, the distance between the first portion and the covering portion is larger than the distance between the second portion and the covering portion ,
The plurality of lands are arranged along the orthogonal direction;
The liquid ejecting apparatus according to claim 1, wherein the distance between the first portion and the covering portion in the length direction of the wiring increases as the land is located inward in the orthogonal direction . A liquid discharge head for discharging liquid from a plurality of nozzles;
  A substrate provided for the liquid ejection head and having a path for transmitting a signal to the liquid ejection head;
  A wiring member for connecting the substrate to the outside,
  The substrate includes a plurality of lands for connection with the wiring member,
  The wiring member is
  A substrate;
  A plurality of wires formed on the base material,
  The substrate is
  The plurality of wirings are separated for each, and the exposed portions where the plurality of wirings are exposed;
  A continuous portion that is continuous with the exposed portion in the length direction of the plurality of wires, and covers the plurality of wires together;
  Each of the plurality of lands is
  A first portion of the corresponding wiring that is disposed to face the exposed portion of the exposed portion and connected to the wiring by solder;
  A second portion that is parallel to the surface direction of the base material and that is continuous with the first portion in an orthogonal direction perpendicular to the length direction of the plurality of wirings;
  In the length direction of the plurality of wirings, the distance between the first portion and the covering portion is larger than the distance between the second portion and the covering portion,
  The plurality of lands are arranged along the orthogonal direction,
  In the orthogonal direction, the distance between the land located on the inner side and the wiring of the second portion is larger. The plurality of wirings are
A plurality of signal wirings for transmitting a drive signal for driving the liquid ejection head toward the substrate;
A plurality of power supply wires connected to the power supply,
The signal wiring, than the power wiring, the liquid ejecting apparatus according to claim 1 or 2, characterized in that it is connected to the inside of the land in the perpendicular direction. A substrate,
A wiring member for connecting the substrate to the outside,
The substrate includes a plurality of lands for connection with the wiring member,
The wiring member is
A base material disposed opposite the substrate;
A plurality of wires formed on the base material,
The substrate is
The plurality of wirings are separated for each, and the exposed portions where the plurality of wirings are exposed;
A continuous portion that is continuous with the exposed portion in the length direction of the plurality of wires, and covers the plurality of wires together;
Each of the plurality of lands is
A first portion that is disposed opposite to the exposed portion of the corresponding exposed portion of the wiring and connected to the wiring by solder;
A second portion connected to the first portion in an orthogonal direction orthogonal to a length direction of the plurality of wirings,
In the length direction of the plurality of wirings, the distance between the first portion and the covering portion is larger than the distance between the second portion and the covering portion ,
The plurality of lands are arranged along the orthogonal direction;
The wire connection structure according to claim 1, wherein a distance between the first portion and the covering portion in the length direction of the wiring is increased as the land is located inward in the orthogonal direction .   A substrate,
  A wiring member for connecting the substrate to the outside,
  The substrate includes a plurality of lands for connection with the wiring member,
  The wiring member is
  A base material disposed opposite the substrate;
  A plurality of wires formed on the base material,
  The substrate is
  The plurality of wirings are separated for each, and the exposed portions where the plurality of wirings are exposed;
  A continuous portion that is continuous with the exposed portion in the length direction of the plurality of wires, and covers the plurality of wires together;
  Each of the plurality of lands is
  A first portion that is disposed opposite to the exposed portion of the corresponding exposed portion of the wiring and connected to the wiring by solder;
  A second portion connected to the first portion in an orthogonal direction orthogonal to a length direction of the plurality of wirings,
  In the length direction of the plurality of wirings, the distance between the first portion and the covering portion is larger than the distance between the second portion and the covering portion,
  The plurality of lands are arranged along the orthogonal direction,
  In the orthogonal direction, the distance between the land located on the inner side and the wiring of the second portion is larger. A liquid discharge head for discharging liquid from a plurality of nozzles;
A substrate provided for the liquid ejection head and having a path for transmitting a signal to the liquid ejection head;
A wiring member for connecting the substrate to the outside,
The substrate includes a plurality of lands for connection with the wiring member,
The wiring member is
A substrate;
A plurality of wires formed on the base material,
The substrate is
The plurality of wirings are separated for each, and the exposed portions where the plurality of wirings are exposed;
A continuous portion that is continuous with the exposed portion in the length direction of the plurality of wires, and covers the plurality of wires together;
Each of the plurality of lands is
A first portion of the corresponding wiring that is disposed to face the exposed portion of the exposed portion and connected to the wiring by solder;
A second portion that is parallel to the surface direction of the base material and that is continuous with the first portion in an orthogonal direction perpendicular to the length direction of the plurality of wirings;
The length of the first portion in the orthogonal direction is greater than the length of the wiring in the orthogonal direction,
The liquid ejection apparatus according to claim 1, wherein a distance between the first portion and the covering portion is greater than a distance between the second portion and the covering portion in a length direction of the plurality of wirings. A substrate,
A wiring member for connecting the substrate to the outside,
The substrate includes a plurality of lands for connection with the wiring member,
The wiring member is
A base material disposed opposite the substrate;
A plurality of wires formed on the base material,
The substrate is
The plurality of wirings are separated for each, and the exposed portions where the plurality of wirings are exposed;
A continuous portion that is continuous with the exposed portion in the length direction of the plurality of wires, and covers the plurality of wires together;
Each of the plurality of lands is
A first portion that is disposed opposite to the exposed portion of the corresponding exposed portion of the wiring and connected to the wiring by solder;
A second portion connected to the first portion in an orthogonal direction orthogonal to a length direction of the plurality of wirings,
The length of the first portion in the orthogonal direction is greater than the length of the wiring in the orthogonal direction,
The wiring connection structure, wherein a distance between the first portion and the covering portion is longer than a distance between the second portion and the covering portion in a length direction of the plurality of wirings.

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