JP2009234087A - Wiring structure, joining method, method of manufacturing liquid discharge head and liquid discharge head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring structure, enabling electric connection to piezoelectric elements disposed with high density without a complicated structure and with high reliability; a bonding method; a method of manufacturing a liquid discharge head and a liquid discharge head. <P>SOLUTION: A FPC 100 is bonded to a piezoelectric element disposition surface 50A of the head 50. The FPC 100 is provided with a cover part 108 surrounding the periphery of the piezoelectric elements 58, and the cover part 108 has a function of securing upper space not to inhibit movement of the piezoelectric elements 58, a function of intercepting the piezoelectric elements 58 from an external environment by the space to prevent deterioration of the piezoelectric elements 58, and a function (an opening 112) as an ink injection passage. A complicated rugged shape is formed on the FPC 100 side, thereby bonding the head 40 and the FPC 100 to each other in a flat surface. According to a preferred mode, a filter structure is provided instead of the opening 112. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wiring structure, a bonding method, a method of manufacturing a liquid discharge head, and a liquid discharge head, and more particularly to the shape and function of a wiring structure in which a wiring for supplying a drive signal to a piezoelectric element is formed.

  In general, as a general-purpose image forming apparatus, an ink jet recording apparatus that forms a desired image by ejecting ink droplets from a large number of nozzles provided in an ink jet head onto a recording medium is widely used. An ink jet head used in an ink jet recording apparatus has a pressure generating element such as a piezoelectric element disposed in a pressure chamber communicating with each nozzle, and applies a predetermined drive signal to the pressure generating element to operate the pressure generating element. Ink in each pressure chamber is ejected from the nozzle.

  In this way, high-density electrical connection in a head having a large number of piezoelectric elements makes electrical connection to a surface having a high-density uneven shape, so that the structure and shape of the electrical connection part are complicated, The manufacture of the electrical connection part and the electrical connection process are difficult, and there is a concern that reliability and yield may be reduced.

The micro-caulking structure for high-density electrical connection described in Patent Document 1 is such that a protrusion provided on a piezoelectric element is inserted into a through-hole provided on a wiring of a flexible substrate, so that the flexible substrate and the piezoelectric substrate are piezoelectric. The piezoelectric element is securely fixed to the flexible substrate by adopting a structure in which the element is mechanically connected and the tip of the protruding portion protruding by insertion into the through hole is used.
JP 2007-36009 A

  However, the electrical connection method of the liquid discharge head described in Patent Document 1 is a groove portion of a reservoir forming substrate having a function of a sealing member for sealing the piezoelectric element by blocking the piezoelectric element from the external environment (Patent Document) 3), the electrical connection is difficult to achieve highly reliable electrical connection on the surface having the concavo-convex shape, as described above. It is extremely difficult to cope with such miniaturization.

  The present invention has been made in view of such circumstances, and without having a complicated structure with respect to piezoelectric elements arranged at high density, and a wiring structure that enables highly reliable electrical connection and It is an object to provide a bonding method, a method for manufacturing a liquid discharge head, and a liquid discharge head.

  In order to achieve the above object, a wiring structure according to the present invention is a wiring structure that is bonded to a piezoelectric element disposition surface on which a piezoelectric element that pressurizes the liquid of a liquid ejection head that ejects liquid is disposed. A wiring pattern that transmits a driving signal applied to the piezoelectric element; and an electrical connection portion that is electrically connected to the wiring pattern and is joined to an electrode of the piezoelectric element; and a structure that surrounds the periphery of the piezoelectric element. And a cover portion that forms a sealed space between the piezoelectric element and the piezoelectric element.

  According to the present invention, the wiring structure bonded to the piezoelectric element mounting surface of the liquid discharge head secures a space that does not hinder the movement of the piezoelectric element, and the piezoelectric element is blocked from the external environment by the space. In addition, since the cover portion that prevents the deterioration of the piezoelectric element is provided, the wiring structure and the liquid discharge head can be joined on a flat surface, facilitating manufacturing, facilitating high-density electrical connection, and simplifying the process. Will be realized and the yield will be improved.

  There is an aspect in which an electrode of a piezoelectric element includes an individual electrode (address electrode) and a common electrode (ground electrode). For example, an individual electrode is provided on one surface and a common electrode is provided on the other surface with a piezoelectric material interposed therebetween. . A common electrode may be provided on the surface on which the piezoelectric element is provided, and an individual electrode may be provided on the surface opposite to the surface on which the piezoelectric element is provided.

  The electrical connection portion is provided separately to be joined to the individual electrode and to the common electrode. In the aspect including a plurality of piezoelectric elements, the electrical connection portion joined to the common electrode may be shared by the plurality of piezoelectric elements.

  In addition to the piezoelectric element, a driving circuit block for the piezoelectric element and a peripheral circuit block for the driving circuit may be mounted on the piezoelectric element mounting surface. In addition, an extraction electrode or a wiring pattern that is electrically connected to the electrode of the piezoelectric element may be provided.

  The wiring structure according to the present invention is formed on a substrate in the order of a wiring pattern, an electrical connection portion, and a cover portion.

  A second aspect of the present invention relates to an aspect of the wiring structure according to the first aspect, wherein the cover portion has a thickness exceeding the thickness of the piezoelectric element.

  According to the second aspect of the present invention, the cover provided on the wiring structure forms a sealing bank for sealing the piezoelectric element from the external environment, so that a sealed space is formed around the piezoelectric element. Is done.

  According to a third aspect of the present invention, there is provided the wiring structure according to the first or second aspect, further comprising a protective layer for protecting the wiring pattern.

  According to the third aspect of the present invention, contact between the piezoelectric element and the wiring pattern can be prevented, and damage to the piezoelectric element is prevented.

  The protective layer may be patterned according to the wiring pattern, or may be provided over the entire surface on which the wiring pattern is formed.

  According to a fourth aspect of the present invention, there is provided the wiring structure according to the first, second, or third aspect, and an adhesive layer is provided on a surface of the cover portion to be bonded to the piezoelectric element disposition surface. It is characterized by that.

  According to the invention described in claim 4, the inside of the cover part is reliably sealed by the adhesive layer, and a liquid sealing structure for sealing the piezoelectric element from the external environment is realized.

  A conductive bonding member (for example, an anisotropic adhesive) is suitably used for bonding the electrode of the piezoelectric element and the electrical connection portion.

  According to a fifth aspect of the present invention, there is provided the wiring structure according to any one of the first to fourth aspects, wherein the wiring structure is provided at a position corresponding to a liquid inlet that introduces liquid into the liquid discharge head. An opening is provided.

  According to the fifth aspect of the present invention, the wiring structure can be disposed at a position where the liquid inlet of the liquid discharge head is blocked, and the joining position of the wiring structure is not limited.

  A mode in which a part of the cover functioning as a cover of the piezoelectric element is formed in accordance with the position and shape of the liquid inlet is also preferable. For example, if the cover portion includes an opening corresponding to the liquid inlet, the opening functions as a liquid introduction path.

  A sixth aspect of the present invention relates to an embodiment of the wiring structure according to any one of the first to fifth aspects, wherein a filter structure is provided at a position corresponding to the liquid inlet. To do.

  According to the sixth aspect of the present invention, foreign matter and bubbles do not enter the head through the ink inlet. Instead of the opening described in claim 5, the filter described in claim 6 may be provided, or the opening described in claim 5 and the filter described in claim 6 may be used in combination.

  A seventh aspect of the present invention relates to an aspect of the wiring structure according to the sixth aspect, wherein the filter structure includes a plurality of holes.

  According to the seventh aspect of the invention, the filter structure of the ink inlet can be realized by a simple method.

  The invention according to an eighth aspect relates to an aspect of the wiring structure according to any one of the first to seventh aspects, wherein the wiring structure includes a flexible printed board.

  A flexible printed board is a structure in which a conductive wiring pattern or the like is formed on a base material made of a flexible insulating material.

  In order to achieve the above object, a joining method according to an embodiment of the present invention is a joining method of a liquid ejection head that discharges a liquid and a wiring structure, wherein the wiring structure includes the liquid ejection A wiring pattern for transmitting a driving signal applied to a piezoelectric element provided on a piezoelectric element-providing surface of the head; an electrical connection portion that is electrically connected to the wiring pattern and is joined to an electrode of the piezoelectric element; and A cover portion having a structure surrounding the periphery and forming a sealed space between the piezoelectric element and the piezoelectric element disposed on the piezoelectric element disposition surface of the liquid discharge head and the wiring structure The position of the piezoelectric element and the position of the electrical connection portion of the wiring structure are aligned, the piezoelectric element disposition surface and the cover part are joined, and the piezoelectric element electrode The electricity Characterized by joining the connection part.

  An adhesive is preferably applied to the piezoelectric element mounting surface and the cover portion, and a conductive bonding member is preferably applied to the electrode and the electrical connection portion.

  In order to achieve the above object, a method of manufacturing a liquid discharge head according to the invention described in claim 10 is a method of manufacturing a liquid discharge head that discharges liquid, and a piezoelectric material of the liquid discharge head is formed on a substrate. Surrounding the periphery of the piezoelectric element, a wiring pattern for transmitting a driving signal applied to the piezoelectric element provided on the element arrangement surface, an electrical connection portion that is electrically connected to the wiring pattern and is joined to the electrode of the piezoelectric element A step of forming a wiring structure by forming a cover part having a structure and forming a sealed space between the piezoelectric element, a nozzle for discharging liquid, a pressure chamber communicating with the nozzle, Forming a piezoelectric element that pressurizes the liquid in the pressure chamber, aligning the position of the piezoelectric element and the cover portion of the wiring structure, and the electrodes of the piezoelectric element and the wiring Structure An alignment step of aligning the position of the electrical connection portion, a bonding step of bonding the piezoelectric element disposition surface on which the piezoelectric element is disposed and the cover portion, and joining the electrode of the piezoelectric element and the electric connection portion; , Including.

  When the piezoelectric element arrangement surface and the cover portion are joined, and the electrode and the electrical connection portion are joined, an adhesive is applied to the cover portion, and a conductive joining member is applied to the electric joint portion, and then the piezoelectric element arrangement surface is provided. And the cover part, and the electrode and the electrical connection part may be joined.

  In order to achieve the above object, a liquid discharge head according to an eleventh aspect of the present invention includes a nozzle that discharges a liquid, a pressure chamber that communicates with the nozzle, and a piezoelectric element that pressurizes the liquid in the pressure chamber. And a wiring pattern that is bonded to a piezoelectric element mounting surface on which the piezoelectric element is disposed, transmits a drive signal applied to the piezoelectric element, and is electrically connected to the wiring pattern, and is bonded to an electrode of the piezoelectric element. And a wiring structure including a cover portion that forms a sealed space between the piezoelectric element and the piezoelectric element.

  The liquid discharge head includes an ink jet head that discharges liquid from a nozzle by an ink jet method.

  According to the present invention, the wiring structure bonded to the piezoelectric element mounting surface of the liquid discharge head secures a space that does not hinder the movement of the piezoelectric element, and the piezoelectric element is blocked from the external environment by the space. In addition, since the cover portion that prevents the deterioration of the piezoelectric element is provided, the wiring structure and the liquid discharge head can be joined on a flat surface, facilitating manufacturing, facilitating high-density electrical connection, and simplifying the process. Will be realized and the yield will be improved.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Overall configuration of the device]
First, an overall configuration of an ink jet recording apparatus (image forming apparatus) that forms a desired color image with color ink discharged onto a recording medium will be described as an example of a liquid discharge apparatus according to the present invention. FIG. 1 is an overall configuration diagram of an ink jet recording apparatus according to an embodiment of the present invention.

  As shown in the figure, the ink jet recording apparatus 10 includes a plurality of ink jet heads (hereinafter referred to as “ink jet heads”) corresponding to black (K), cyan (C), magenta (M), and yellow (Y) inks. (Referred to as a head) 12K, 12C, 12M, 12Y printing unit 12, an ink storage / loading unit 14 for storing ink to be supplied to each head 12K, 12C, 12M, 12Y, and recording paper 16 as a recording medium Is disposed opposite to the ink discharge surfaces (nozzle formation surfaces) of the heads 12K, 12C, 12M, and 12Y. The suction belt conveyance unit 22 conveys the recording paper 16 while maintaining the 16 flatness, and the paper discharge unit 26 discharges the recorded recording paper (printed matter) to the outside.

  The ink storage / loading unit 14 has an ink supply tank that stores inks of colors corresponding to the heads 12K, 12C, 12M, and 12Y, and the inks of the respective colors pass through the required ink flow paths 15 to the heads 12K, 12C. , 12M, 12Y.

  Further, the ink storage / loading unit 14 includes notifying means (display means, warning sound generating means) for notifying when the ink remaining amount is low, and has a mechanism for preventing erroneous loading between colors. ing. Details of the ink supply system including the ink storage / loading unit 14 shown in FIG. 1 will be described later.

  In FIG. 1, a magazine for rolled paper (continuous paper) is shown as an example of the paper supply unit 18, but a plurality of magazines having different paper widths, paper quality, and the like may be provided side by side. Further, instead of the roll paper magazine or in combination therewith, the paper may be supplied by a cassette in which cut papers are stacked and loaded.

  When multiple types of recording paper are used, an information recording body such as a barcode or wireless tag that records paper type information is attached to the magazine, and the information on the information recording body is read by a predetermined reader. Thus, it is preferable to automatically determine the type of recording medium (media type) to be used and perform ink ejection control so as to realize appropriate ink ejection according to the media type.

  The recording paper 16 delivered from the paper supply unit 18 retains curl due to having been loaded in the magazine. In order to remove this curl, heat is applied to the recording paper 16 by the heating drum 30 in the direction opposite to the curl direction of the magazine in the decurling unit 20. At this time, it is more preferable to control the heating temperature so that the printed surface is slightly curled outward.

  In the case of an apparatus configuration that uses roll paper, a cutter (first cutter) 28 is provided as shown in FIG. 1, and the roll paper is cut into a desired size by the cutter 28. The cutter 28 includes a fixed blade 28A having a length equal to or greater than the conveyance path width of the recording paper 16, and a round blade 28B that moves along the fixed blade 28A. The fixed blade 28A is provided on the back side of the print. The round blade 28B is disposed on the printing surface side with the conveyance path interposed therebetween. Note that the cutter 28 is not necessary when cut paper is used.

  After the decurling process, the cut recording paper 16 is sent to the suction belt conveyance unit 22. The suction belt conveyance unit 22 has a structure in which an endless belt 33 is wound between rollers 31 and 32, and at least a portion facing the nozzle surface of the printing unit 12 forms a horizontal surface (flat surface). Has been.

  The belt 33 has a width that is wider than the width of the recording paper 16, and a plurality of suction holes (not shown) are formed on the belt surface. As shown in FIG. 1, a suction chamber 34 is provided at a position facing the nozzle surface of the printing unit 12 inside the belt 33 spanned between the rollers 31 and 32, and the suction chamber 34 is connected to the fan 35. The recording paper 16 is sucked and held on the belt 33 by suctioning to negative pressure.

  The power of the motor (not shown in FIG. 1 and indicated by reference numeral 88 in FIG. 6) is transmitted to at least one of the rollers 31 and 32 around which the belt 33 is wound, so that the belt 33 rotates clockwise in FIG. , And the recording paper 16 held on the belt 33 is conveyed from left to right in FIG.

  Since ink adheres to the belt 33 when a borderless print or the like is printed, the belt cleaning unit 36 is provided at a predetermined position outside the belt 33 (an appropriate position other than the print area). Although details of the configuration of the belt cleaning unit 36 are not shown, for example, there are a method of niping a brush roll, a water absorbing roll, etc., an air blow method of blowing clean air, or a combination thereof. In the case where the cleaning roll is nipped, the cleaning effect is great if the belt linear velocity and the roller linear velocity are changed.

  Although a mode using a roller / nip conveyance mechanism instead of the suction belt conveyance unit 22 is also conceivable, if the roller / nip conveyance is performed in the print area, the roller is brought into contact with the print surface of the sheet immediately after printing, so that the image is easily stained. There is a problem. Therefore, as in this example, suction belt conveyance that does not bring the image surface into contact with each other in the print region is preferable.

  A heating fan 40 is provided on the upstream side of the printing unit 12 on the paper conveyance path formed by the suction belt conveyance unit 22. The heating fan 40 heats the recording paper 16 by blowing heated air onto the recording paper 16 before printing. Heating the recording paper 16 immediately before printing makes it easier for the ink to dry after landing.

  Each of the heads 12K, 12C, 12M, and 12Y of the printing unit 12 has a length corresponding to the maximum paper width of the recording paper 16 targeted by the inkjet recording apparatus 10, and the nozzle surface has a recording medium of the maximum size. This is a full-line type head in which a plurality of nozzles for ink discharge are arranged over a length exceeding at least one side (full width of the drawable range) (see FIG. 2).

  The heads 12K, 12C, 12M, and 12Y are arranged in the order of black (K), cyan (C), magenta (M), and yellow (Y) from the upstream side in the recording paper 16 feed direction. 12K, 12C, 12M, and 12Y are fixedly installed so as to extend in the conveyance direction (paper feeding direction) of the recording paper 16.

  A color image can be formed on the recording paper 16 by discharging different color inks from the heads 12K, 12C, 12M, and 12Y while transporting the recording paper 16 by the suction belt transporting section 22.

  As described above, according to the configuration in which the full-line heads 12K, 12C, 12M, and 12Y having the nozzle rows covering the entire width of the paper are provided for each color, the recording paper 16 and the printing unit in the paper feeding direction (sub-scanning direction). The image can be recorded on the entire surface of the recording paper 16 by performing the operation of relatively moving the 12 only once (that is, by one sub-scanning). Thereby, it is possible to perform high-speed printing as compared with a shuttle type head in which the recording head reciprocates in a direction orthogonal to the paper transport direction, and productivity can be improved.

  In this example, the configuration of KCMY standard colors (four colors) is illustrated, but the combination of ink color and number of colors is not limited to this embodiment, and light ink, dark ink, and special color ink are used as necessary. May be added. For example, it is possible to add an ink jet head that discharges light ink such as light cyan and light magenta. Also, the arrangement order of the color heads is not particularly limited. Further, after the treatment liquid and the ink are attached to the recording paper 16, the ink color material is aggregated or insolubilized on the recording paper 16 to separate the ink solvent and the ink color material on the recording paper 16. In this ink jet recording apparatus, an ink jet head may be provided as means for attaching the treatment liquid to the recording paper 16.

  The print detection unit 24 includes an image sensor for imaging the droplet ejection result of the print unit 12, and functions as a unit for checking nozzle clogging and other ejection abnormalities from the droplet ejection image read by the image sensor.

  The print detection unit 24 of this example is composed of a line sensor having a light receiving element array that is wider than at least the ink ejection width (image recording width) by the heads 12K, 12C, 12M, and 12Y. This line sensor includes an R light receiving element array in which photoelectric conversion elements (pixels) provided with a red (R) color filter are arranged in a line, and a G light receiving element array provided with a green (G) color filter. And a color separation line CCD sensor comprising a blue light receiving element array provided with a blue (B) color filter. Instead of the line sensor, an area sensor in which the light receiving elements are two-dimensionally arranged can be used.

  The print detection unit 24 reads the test patterns printed by the heads 12K, 12C, 12M, and 12Y of the respective colors, and detects ejection of the heads 12K, 12C, 12M, and 12Y. The ejection determination includes the presence / absence of ejection, measurement of dot size, measurement of dot landing position, and the like.

  A post-drying unit 42 is provided following the print detection unit 24. The post-drying unit 42 is means for drying the printed image surface, and for example, a heating fan is used. Since it is preferable to avoid contact with the printing surface until the ink after printing is dried, a method of blowing hot air is preferred.

  A heating / pressurizing unit 44 is provided following the post-drying unit 42. The heating / pressurizing unit 44 is a means for controlling the glossiness of the image surface, presses with a pressure roller 45 having a predetermined surface uneven shape while heating the image surface, and transfers the uneven shape to the image surface. To do.

  When the recording paper 16 is pressed by the heating / pressurizing unit 44, when printing is performed on the porous paper with dye-based ink, the pores of the paper are blocked by pressurization, which causes damage to the dye molecules such as ozone. By preventing contact with the image, the weather resistance of the image is improved.

  The printed matter generated in this manner is outputted from the paper output unit 26. It is preferable that the original image to be printed (printed target image) and the test print are discharged separately. The ink jet recording apparatus 10 is provided with a sorting means (not shown) for switching the paper discharge path in order to select the print product of the main image and the print product of the test print and send them to the discharge units 26A and 26B. Yes. Note that when the main image and the test print are simultaneously formed in parallel on a large sheet, the test print portion is separated by a cutter (second cutter) 48. The cutter 48 is provided immediately before the paper discharge unit 26, and cuts the main image and the test print unit when the test print is performed on the image margin. The structure of the cutter 48 is the same as that of the first cutter 28 described above, and includes a fixed blade 48A and a round blade 48B.

  Although not shown in FIG. 1, the paper output unit 26A for the target prints is provided with a sorter for collecting prints according to print orders.

[Head structure]
Next, the structure of the head will be described. Since the structures of the respective heads 12K, 12C, 12M, and 12Y for each color are common, the heads are represented by the reference numeral 50 in the following.

  FIG. 3 is a plan perspective view showing a structural example of the head 50, and FIG. 4A is a cross-sectional view showing a three-dimensional configuration of the head 50 and the ink chamber unit (cross-sectional view taken along line 4-4 in FIG. 3). It is.

  In order to increase the dot pitch printed on the recording paper 16, it is necessary to increase the nozzle pitch in the head 50. In the head 50 of this example, as shown in FIG. 3, a plurality of ink chamber units 53 including nozzles 51 serving as ink droplet ejection holes and pressure chambers 52 corresponding to the nozzles 51 are arranged in a staggered manner. With this structure, high density of the substantial nozzle interval (projection nozzle pitch) projected so as to be aligned along the head longitudinal direction (main scanning direction orthogonal to the paper feed direction) is achieved. .

  That is, the head 50 shown in FIG. 3 has two nozzle rows having a length corresponding to the entire width of the drawing region along the longitudinal direction, and the positions of the nozzle rows in the main scanning direction are between the nozzles in the main scanning direction. They are shifted by a half of the pitch. By performing such a nozzle arrangement, the substantial nozzle pitch in the main scanning direction is halved.

  The form in which one or more nozzle rows are formed in the main scanning direction over the length corresponding to the entire width of the recording paper 16 is not limited to this example. For example, a line head having a nozzle row having a length corresponding to the entire width of the recording paper 16 may be configured by connecting short head blocks.

  The pressure chamber 52 provided corresponding to each nozzle 51 has a substantially rectangular planar shape, and the nozzle 51 and the supply port 54 are provided on the side opposite to the side where the nozzle 51 is provided. . Each pressure chamber 52 communicates with a common flow channel 55 through a supply port 54. The common flow channel 55 communicates with an ink supply tank (not shown in FIG. 3; indicated by reference numeral 60 in FIG. 5) as an ink supply source, and ink supplied from the ink supply tank passes through the common flow channel 55. Distribution is supplied to each pressure chamber 52.

  FIG. 3 illustrates a two-row staggered arrangement as the nozzle arrangement. In implementing the present invention, the nozzle arrangement structure is not limited to the illustrated example, and various nozzle arrangement structures such as an arrangement structure having one nozzle row in the sub-scanning direction can be applied.

  As shown in FIG. 4A, a piezoelectric element 58 having an individual electrode (upper electrode) 57A and a common electrode (lower electrode) 57B is joined to a diaphragm 56 constituting the top surface of the pressure chamber 52. By applying a drive voltage (drive signal) to the individual electrode 57, the piezoelectric element 58 is deformed and ink is ejected from the nozzle 51. When ink is ejected, new ink is supplied from the common channel 55 to the pressure chamber 52 through the supply port 54.

  A flexible printed circuit board (FPC) 100 is bonded to the piezoelectric element mounting surface 50A on which the piezoelectric element 58 is disposed.

  FIG. 4B shows a cross-sectional view of the FPC 100 alone. The FPC 100 includes a piezoelectric element such that the base material 102, the wiring layer 104 provided with a wiring pattern electrically connected to the individual electrode 57A and the common electrode 57B of the piezoelectric element 58, and the wiring layer 104 and the individual electrode 57A of the piezoelectric element 58 are not in contact with each other. 58 and a protective layer (insulating layer) 106 that protects the wiring layer 104, and a cover portion 108 provided in an upper part of the piezoelectric element 58 and an upper part of the diaphragm 56 are sequentially laminated. A pad portion 110 to be joined to the individual electrode 57A and the common electrode 57B (or an extraction electrode extracted from the individual electrode 57A and the common electrode 57B) and an opening 112 corresponding to the ink introduction port of the head 50 are formed.

  The piezoelectric element mounting surface 50A of the head 50 and the cover part 108 of the FPC 100 are joined by an adhesive (not shown), and the individual electrode 57A and common electrode 57B of the piezoelectric element 58 and the pad part 110 of the FPC 100 are electrically conductive joining members. It is joined with (for example, conductive adhesive) to constitute an electrical connection structure.

  In FIG. 4A, the illustration of the pad portion bonded to the common electrode 57B is omitted, but the pad portion bonded to the common electrode 57B does not need to be individually provided for each piezoelectric element 58. The pad portion 110 common to the plurality of piezoelectric elements may be provided at an appropriate position (for example, the peripheral portion) of the piezoelectric element arrangement surface 50A.

  When the head 50 and the FPC 100 are joined, it is preferable to apply the adhesive to the cover portion 108 of the FPC 100 and apply the anisotropic adhesive to the pad portion 110 and then join the head 50 and the FPC 100.

  For the base material 102 of the FPC 100, a material having electrical insulation performance and predetermined flexibility is applied, and a resin material such as polyimide is preferably used.

  The cover portion 108 of the FPC 100 has a surrounding structure provided so as to surround the entirety of the plurality of piezoelectric elements 58 arranged in the longitudinal direction of the head 50 (the entire piezoelectric element arrangement region), and each piezoelectric element 58 is provided. A space is formed above each piezoelectric element 58 so as not to hinder the movement of the piezoelectric element 58, and functions as a sealing structure that blocks each piezoelectric element 58 from the external environment (humidity) and prevents deterioration of each piezoelectric element 58. . In other words, the concave portion (sealed space) formed by the cover portion 108 provided in the FPC 100 functions as a protective member for the piezoelectric element 58, ensuring a deformation region above the piezoelectric element 58 and preventing deterioration of the piezoelectric element 58. ing.

  The cover portion 108 is formed so as to surround the periphery of the opening 112 provided in the base material 102 and constitutes an introduction path for ink supplied to the head 50 from the outside. That is, the cover unit 108 functions as a sealing bank that seals the ink supplied to the head 50 so as not to leak to the piezoelectric element mounting surface 50A, and a liquid sealing structure (liquid sealing) is formed by the cover unit 108 and the adhesive. Stop function).

  A material having an electrical insulation performance and a durability performance against ink is applied to the cover portion 108. Further, in order to prevent warping due to heating such as when the head 50 and the FPC 100 are joined, a material having a thermal conductivity close to that of the base material of the head 50 may be applied. For example, when silicon is applied to the base material of the head 50, silicon or a liquid crystal resin having a thermal expansion coefficient close to that of silicon may be used as the material of the cover unit 108. Alternatively, the photosensitive polyimide may be selected by giving priority to productivity.

  The cover portion 108 only needs to have a thickness that exceeds the thickness of the piezoelectric element 58. When the thickness of the piezoelectric element 58 is 5 to 20 μm, the height of the cover portion 108 is about 100 μm to 200 μm so that the movement of the piezoelectric element 58 is not hindered. It is sufficient if a space is provided.

  Further, in consideration of an alignment error when the FPC 100 is bonded to the head 50, when the size of the piezoelectric elements 58 is 50 μm × 500 μm and a plurality of the piezoelectric elements 58 are arranged, the periphery of the plurality of piezoelectric elements 58 is The size of the cover portion 108 is determined so that a gap of about 100 μm to 300 μm is provided between the cover portion 108 and the cover portion 108.

The “piezoelectric element” in this example is a structure in which a piezoelectric material (piezoelectric body) is sandwiched between the individual electrode 57A and the common electrode 57B, and can be deformed by applying a drive signal (both on the upper and lower surfaces). The area is not constrained. Further, the “individual electrode” and the “common electrode” may include an extraction electrode extracted for electrical connection.
The opening 112 formed in the FPC 100 may be provided with a filter structure for preventing foreign matter and bubbles from entering the head 50. A general filter can be applied to the filter structure, and the mesh size is determined in accordance with the size of foreign substances and bubbles to be captured.

  The scope of application of the present invention is not limited to the printing method using the line-type head, and a short head that is less than the length in the width direction of the recording paper 16 is scanned in the width direction of the recording paper 16 to print in the width direction. When printing in the width direction is completed once, the recording paper 16 is moved by a predetermined amount in the direction orthogonal to the width direction, and printing in the width direction of the recording paper 16 in the next printing area is performed. A serial method in which printing is performed over the entire printing area of the recording paper 16 may be applied.

[Configuration of ink supply system]
FIG. 5 is a schematic diagram showing the configuration of the ink supply system in the inkjet recording apparatus 10. The ink supply tank 60 is a base tank that supplies ink to the head 50 and is included in the ink storage / loading unit 14 described with reference to FIG. The ink supply tank 60 includes a system that replenishes ink from a replenishing port (not shown) and a cartridge system that replaces the entire tank when the remaining amount of ink decreases. The cartridge system is suitable for changing the ink type according to the intended use. In this case, it is preferable that the ink type information is identified by a barcode or the like, and ejection control is performed according to the ink type.

  As shown in FIG. 5, a filter 62 is provided between the ink supply tank 60 and the head 50 in order to remove foreign substances and bubbles. The filter mesh size is preferably equal to or smaller than the nozzle diameter (generally about 20 μm).

  Although not shown in FIG. 5, a configuration in which a sub tank is provided in the vicinity of the head 50 or integrally with the head 50 is also preferable. The sub-tank has a function of improving a damper effect and refill that prevents fluctuations in the internal pressure of the head. Although not shown, the head 50 is provided with an ink introduction port, and the ink fed from the ink supply tank 60 is supplied into the head 50 through the ink introduction port.

  The ink jet recording apparatus 10 is provided with a cap 64 as a means for preventing the nozzle 51 from drying or preventing an increase in ink viscosity near the nozzle, and a cleaning blade 66 as a means for cleaning the nozzle surface.

  The maintenance unit including the cap 64 and the cleaning blade 66 can be moved relative to the head 50 by a moving mechanism (not shown), and is moved from a predetermined retracted position to a maintenance position below the head 50 as necessary.

  The cap 64 is displaced up and down relatively with respect to the head 50 by an elevator mechanism (not shown). The cap 64 is raised to a predetermined raised position when the power is turned off or during printing standby, and is brought into close contact with the head 50, thereby covering the nozzle surface with the cap 64.

  During printing or standby, if the frequency of use of a specific nozzle 51 is reduced and ink is not ejected for a certain period of time, the ink solvent near the nozzle evaporates and the ink viscosity increases. In such a state, ink cannot be ejected from the nozzle 51 even if the piezoelectric element 58 operates.

  Before such a state is reached (within the range of viscosity that can be discharged by the operation of the piezoelectric element 58), the piezoelectric element 58 is operated, and a cap is formed to discharge the deteriorated ink (ink in the vicinity of the nozzle whose viscosity has increased). Preliminary ejection (purge, idle ejection, collar ejection, dummy ejection) is performed toward 64 (ink receiver).

  Further, when air bubbles are mixed into the ink in the head 50 (in the pressure chamber 52), the ink cannot be ejected from the nozzle even if the piezoelectric element 58 is operated. In such a case, the cap 64 is applied to the head 50, the ink in the pressure chamber 52 (ink mixed with bubbles) is removed by suction with the suction pump 67, and the suctioned and removed ink is sent to the recovery tank 68.

  In this suction operation, the deteriorated ink with increased viscosity (solidified) is sucked out when the ink is initially loaded into the head or when the ink is used after being stopped for a long time. Since the suction operation is performed on the entire ink in the pressure chamber 52, the amount of ink consumption increases. Therefore, it is preferable to perform preliminary ejection when the increase in ink viscosity is small.

  The cleaning blade 66 is made of an elastic member such as rubber, and can slide on the ink discharge surface (nozzle plate surface) of the head 50 by a blade moving mechanism (wiper) (not shown). When ink droplets or foreign substances adhere to the nozzle plate, the nozzle plate surface is wiped by sliding the cleaning blade 66 on the nozzle plate to clean the nozzle plate surface. It should be noted that when the ink ejection surface is cleaned by the blade mechanism, preliminary ejection is performed in order to prevent foreign matter from being mixed into the nozzle 51 by the blade.

[Explanation of control system]
FIG. 6 is a principal block diagram showing the system configuration of the inkjet recording apparatus 10. The inkjet recording apparatus 10 includes a communication interface 70, a system controller 72, an image memory 74, a motor driver 76, a heater driver 78, a print control unit 80, an image buffer memory 82, a head driver 84, and the like.

  The communication interface 70 is an interface unit that receives image data sent from the host computer 86. As the communication interface 70, a serial interface such as USB (Universal Serial Bus), IEEE 1394, Ethernet (registered trademark), a wireless network, or a parallel interface such as Centronics can be applied. In this part, a buffer memory (not shown) for speeding up communication may be mounted. Image data sent from the host computer 86 is taken into the inkjet recording apparatus 10 via the communication interface 70 and temporarily stored in the image memory 74.

  The image memory 74 is a storage unit that temporarily stores an image input via the communication interface 70, and data is read and written through the system controller 72. The image memory 74 is not limited to a memory made of a semiconductor element, and a magnetic medium such as a hard disk may be used.

  The system controller 72 includes a central processing unit (CPU) and its peripheral circuits, and functions as a control device that controls the entire inkjet recording apparatus 10 according to a predetermined program, and also functions as an arithmetic device that performs various calculations. . That is, the system controller 72 controls each part such as the communication interface 70, the image memory 74, the motor driver 76, the heater driver 78, etc., performs communication control with the host computer 86, read / write control of the image memory 74, etc. A control signal for controlling the motor 88 and the heater 89 of the transport system is generated.

  The image memory 74 stores programs executed by the CPU of the system controller 72 and various data necessary for control. Note that the image memory 74 may be a non-rewritable storage means, or may be a rewritable storage means such as an EEPROM. The image memory 74 is used as a temporary storage area for image data, and is also used as a program development area and a calculation work area for the CPU.

  The motor driver 76 is a driver that drives the motor 88 in accordance with instructions from the system controller 72. In FIG. 6, the motor (actuator) disposed in each part in the apparatus is represented by reference numeral 88. For example, the motor 88 shown in FIG. 6 includes a motor for driving the drum 31 (32) in FIG. 1, a motor for a moving mechanism for moving the cap 64 in FIG. 5, and a moving mechanism for moving the cleaning blade 66 in FIG. Includes motors.

  The heater driver 78 is a driver that drives a heater 89 including a heater as a heat source of the heating fan 40 shown in FIG. 1 and a heater of the post-drying unit 42 according to an instruction from the system controller 72.

  The print control unit 80 has a signal processing function for performing various processing and correction processing for generating a print control signal from the image data in the image memory 74 according to the control of the system controller 72, and the generated print It is a control unit that supplies data (dot data) to the head driver 84. Necessary signal processing is performed in the print controller 80, and the ejection amount and ejection timing of the ink droplets of the head 50 are controlled via the head driver 84 based on the image data. Thereby, a desired dot size and dot arrangement are realized.

  The print control unit 80 includes an image buffer memory 82, and image data, parameters, and other data are temporarily stored in the image buffer memory 82 when image data is processed in the print control unit 80. Also possible is an aspect in which the print controller 80 and the system controller 72 are integrated and configured with one processor.

  The head driver 84 generates a drive signal to be applied to the piezoelectric element 58 of the head 50 based on the image data given from the print control unit 80, and drives the piezoelectric element 58 by applying the drive signal to the piezoelectric element 58. Drive circuit block. The head driver 84 shown in FIG. 6 may include a feedback control system for keeping the head driving conditions constant.

  In the aspect in which the drive circuit block described above is provided outside the head 50, the FPC 100 schematically illustrated by a broken line functions as a wiring structure for electrically connecting the drive circuit block and the head 50 (piezoelectric element 58). . That is, the drive signal generated by the drive circuit block is transmitted to the piezoelectric element 58 provided in the head 50 via the wiring provided in the FPC 100. In addition, a mode in which a drive circuit block including the head driver 84 is provided in the FPC 100 is also possible. In this mode, the FPC 100 functions as a transmission path for a command signal sent from the print control unit 80 to the head driver 84.

  As described with reference to FIG. 1, the print detection unit 24 is a block including a line sensor. The print detection unit 24 reads an image printed on the recording paper 16, performs necessary signal processing, and the like to perform a print status (whether ejection is performed, whether droplet ejection is performed). Variation), and the detection result is provided to the print controller 80.

  The print control unit 80 performs various corrections for the head 50 and maintenance of the head 50 based on information obtained from the print detection unit 24 as necessary.

  Image data to be printed is input from the outside via the communication interface 70 and stored in the image memory 74. At this stage, RGB image data is stored in the image memory 74.

  The image data stored in the image memory 74 is sent to the print controller 80 via the system controller 72, and is converted into dot data for each ink color by the print controller 80. That is, the print control unit 80 performs processing for converting the input RGB image data into dot data of four colors of KCMY. The dot data generated by the print controller 80 is stored in the image buffer memory 82.

  Various control programs are stored in the program storage unit 90, and the control programs are read and executed in accordance with instructions from the system controller 72. The program storage unit 90 may use a semiconductor memory such as a ROM or an EEPROM, or may use a magnetic disk or the like. An external interface may be provided and a memory card or PC card may be used. Of course, you may provide several recording media among these recording media. The program storage unit 90 may also be used as a recording means (not shown) for operating parameters.

[Description of flexible printed circuit board]
Next, the flexible printed circuit board 100 illustrated in FIG. 4A will be described in detail. For convenience of illustration, only a part of the FPC 100 is illustrated in the drawings referred to in the following description.

  FIG. 7 is a perspective view schematically showing a state where the FPC 100 is bonded to the head 50. As shown in the figure, the uppermost surface of the head 50 (the surface opposite to the surface on which the nozzle 51 is formed) is a piezoelectric element mounting surface 50A on which a piezoelectric element 58 (see FIG. 4A) is disposed. The FPC 100 provided with wiring for transmitting a drive signal supplied to the piezoelectric element 58 is joined.

  When a long line head is configured by connecting a plurality of head modules, an FPC 100 is provided for each head module. Note that the FPC 100 shown in this example may include a wiring structure (wiring member) called a flexible substrate or a flexible flat cable.

  Next, the structure of the FPC 100 will be described in more detail in the order of the manufacturing process with reference to FIGS.

  FIG. 8 illustrates a state in which the opening 112 is formed in the base material 102 of the FPC 100. In the manufacturing process of the FPC 100, first, the substrate 102 is processed into a predetermined shape, and an opening 112 having a shape corresponding to the ink introduction port is provided at a position corresponding to the ink introduction port (see FIG. 4A) of the head 50. Is formed.

  FIG. 9 illustrates a state in which the wiring layer (wiring pattern) 104 and the pad portion 110 are formed on the base material 102. In the formation of the wiring layer 104 and the pad portion 110, a metal film to be the wiring layer 104 and the pad portion 110 is formed, and after masking corresponding to the wiring pattern and the pad portion 110 is performed on the metal film, the metal layer is formed. A portion where the film is exposed is removed, and a pad portion 110 is formed at a predetermined position on the metal film.

  For the wiring layer 104, a metal material having high electrical conductivity such as gold or copper is preferably used. The pad portion 110 having a predetermined thickness may be formed by performing plating using the wiring layer 104 as a base layer. The thickness of the pad part 110 is determined according to the thickness of the cover part 108 and the thickness of the piezoelectric element 58.

  FIG. 10 illustrates a state in which the protective layer 106 is formed on the FPC 100 in which the opening 112, the wiring layer 104, and the pad portion 110 are formed. Although FIG. 10 illustrates a mode in which the protective layer 106 is formed only in the portion corresponding to the region where the piezoelectric element 58 is disposed, the protective layer 106 is formed over the entire surface except the pad portion 110 and the opening 112. Also good.

  As the material of the protective layer 106, a material such as photosensitive polyimide or photosensitive epoxy resin that can be easily formed and has a predetermined electrical insulation performance is used. A resin sheet provided with a pattern in advance may be laminated. The thickness of the protective layer 106 is preferably about several μm to several tens of μm.

  FIG. 11 illustrates a state in which the cover portion 108 is formed on the FPC 100 in which the opening 112, the wiring layer 104, the pad portion 110, and the protective layer 106 are formed. In order to form the cover portion 108, first, after joining the material to be the cover portion 108, the material may be processed using a technique such as etching according to the shape of the cover portion 108, or the cover portion 108 may be formed in advance. The material processed into the shape of 108 may be bonded to the FPC 100.

  FIG. 11 illustrates a mode in which the cover portion 108 having a bank shape (beam shape) is formed in which the protective layer 106 is exposed in a portion surrounded by the cover portion 108, but the protective layer 106 in FIG. 11 is exposed. You may have the structure where a part is covered with the material of the cover part 108. FIG.

  The cover 108 is preferably made of a material having a coefficient of thermal expansion close to that of the base material of the head 50. Specifically, silicon, liquid crystal polymer, photosensitive resin, or the like is preferably used.

  In the FPC 100 formed in this manner, an adhesive is applied to the cover portion 108, and a conductive bonding member is applied to the pad portion 110, alignment with the head 50 is performed, and the FPC 100 is bonded to the head 50. . In the step of bonding the FPC 100 to the head 50, heating and pressurization are appropriately performed.

  The flexible printed circuit board 100 configured as described above secures a space that does not hinder the movement (displacement) of the piezoelectric element 58 provided on the piezoelectric element placement surface 50A of the head 50, and the piezoelectric element 58 by the space. Is provided with a cover portion 108 having a function of blocking deterioration of the piezoelectric element 58 from the external environment (humidity) and an opening 112 functioning as an ink introduction path, and the bonding of the head 50 and the FPC 100 to a flat surface (piezoelectric element) Therefore, the head 50 and the FPC 100 can be easily joined to each other.

  That is, by forming a complicated uneven shape including the cover of the piezoelectric element 58 on the FPC side, the manufacture of the head 50 body is facilitated, high-density electrical connection between the head 50 and the FPC 100 is facilitated, and the entire head 50 is The production process is simplified and the yield is expected to improve.

  In this example, the cover portion 108 of the piezoelectric element 58 disposed on the piezoelectric element disposition surface 50A of the head 50 is illustrated as being formed on the FPC 100. However, an electronic component such as an IC is disposed on the piezoelectric element disposition surface 50A. When provided, a cover for protecting the electronic component may be formed on the FPC 100.

  In this example, the flexible printed circuit board is exemplified as the wiring structure bonded to the head 50, but the performance and shape of the wiring structure are not limited.

[First Modification]
Next, a modified example of the FPC 100 described above will be described. FIG. 12 is a schematic plan view of an FPC 200 according to this modification. 12, parts that are the same as or similar to those in FIGS. 8 to 11 are given the same reference numerals, and descriptions thereof are omitted.

The FPC 200 shown in FIG. 12 is provided with a number of holes 212 instead of the openings 112 of the FPC 100 described with reference to FIGS. The diameter of the hole 212 is equal to or smaller than the diameter of the nozzle (see FIGS. 3 and 4A) provided in the head 50 (5 μm to 20 μm), and a large number of holes are provided so as to cover the entire ink inlet of the head 50. 212 is formed.
According to this modification, the numerous holes 212 function as a filter structure of the ink inlet (see FIG. 4A), and foreign matter and bubbles are prevented from entering the head 50. The shape of the hole 212 is not limited to a circular shape, and may be a quadrangle, a polygon other than a quadrangle, or an ellipse. A plurality of types of holes having different diameters may be combined.

  Further, as the arrangement of the holes 212, other arrangement patterns such as a zigzag arrangement other than the arrangement shown in FIG. 12 (two rows of arrangement arrangement) may be applied, or the holes 212 may be arranged irregularly.

[Second Modification]
Next, the FPC 300 according to the second modification will be described. 13 is a cross-sectional view of the state in which the FPC 300 is bonded to the head 50, and FIG. 14 is a schematic plan view of the FPC 300 shown in FIG. 13 and 14, the same or similar parts as those in FIGS. 8 to 12 are denoted by the same reference numerals, and the description thereof is omitted.

  An FPC 300 illustrated in FIG. 13 has a structure in which the opening 112 of the FPC 100 illustrated in FIGS. 9 to 11 is omitted. That is, the FPC 300 is joined to the head 50 while being bent so as to rise substantially vertically from the piezoelectric element mounting surface 50A of the head 50, avoiding the ink introduction path 302 of the head 50.

  According to this modification, the structure and shape of the FPC 300 are simplified, and manufacturing is facilitated. Note that since the FPC 300 is bent substantially vertically and used, the base material 102 may be made of a material having higher flexibility (a material that can be used by bending the FPC 300). Further, it is preferable to apply a structure that reinforces the wiring at the bent portion by giving consideration in design so that the wiring on the base material is not disconnected.

  In this example, an inkjet recording apparatus is illustrated as an application example of the present invention. However, the present invention is widely applicable to a wiring structure of an inkjet head having a surface on which a piezoelectric element or an electronic component is mounted.

  Note that the above-described embodiment is merely an example of the present invention, and it is needless to say that modifications can be made as appropriate without departing from the spirit of the present invention.

1 is an overall configuration diagram of an ink jet recording apparatus according to an embodiment of the present invention. FIG. 1 is a plan view of a main part around a printing unit of the ink jet recording apparatus shown in FIG. Plane perspective view showing structural example of head Sectional view along line 4-4 in FIG. 1 is a schematic diagram showing the configuration of an ink supply system of the ink jet recording apparatus shown in FIG. Schematic diagram showing the configuration of the control system of the ink jet recording apparatus shown in FIG. The perspective view which shows the connection state of a head and FPC Explanatory drawing of the base material of FPC shown in FIG. Schematic plan view of the wiring layer of the FPC shown in FIG. Explanatory drawing of the protective layer of FPC shown in FIG. Explanatory drawing of the cover part of FPC shown in FIG. The top view of FPC which concerns on a 1st modification Sectional drawing of the head and FPC which concern on a 2nd modification The top view of FPC concerning the 2nd modification

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Inkjet recording device, 12K, 12C, 12M, 12Y, 50 ... Head, 51 ... Nozzle, 58 ... Piezoelectric element, 100, 200, 300 ... Flexible printed circuit board, 104 ... Wiring layer, 106 ... Protective layer, 108, 208 ... cover part, 110 ... pad part, 112 ... opening, 212 ... hole

Claims (11)

A wiring structure bonded to a piezoelectric element disposition surface on which a piezoelectric element for pressurizing the liquid of a liquid discharge head for discharging liquid is disposed,
A wiring pattern for transmitting a drive signal applied to the piezoelectric element;
An electrical connection portion that is electrically connected to the wiring pattern and is bonded to an electrode of the piezoelectric element;
A cover portion having a structure surrounding the periphery of the piezoelectric element, and forming a sealed space with the piezoelectric element;
A wiring structure comprising:   The wiring structure according to claim 1, wherein the cover portion has a thickness that exceeds a thickness of the piezoelectric element.   The wiring structure according to claim 1, further comprising a protective layer for protecting the wiring pattern.   The wiring structure according to claim 1, wherein an adhesive layer is provided on a surface of the cover portion to be bonded to the surface on which the piezoelectric element is provided.   5. The wiring structure according to claim 1, wherein an opening is provided at a position corresponding to a liquid introduction port through which liquid is introduced into the liquid ejection head.   The wiring structure according to claim 1, further comprising a filter structure at a position corresponding to the liquid introduction port.   The wiring structure according to claim 6, wherein the filter structure includes a plurality of holes.   The wiring structure according to any one of claims 1 to 7, wherein the wiring structure includes a flexible printed circuit board. A method of joining a liquid discharge head for discharging liquid and a wiring structure,
The wiring structure includes a wiring pattern for transmitting a drive signal applied to a piezoelectric element provided on a piezoelectric element-providing surface of the liquid ejection head;
An electrical connection portion that is electrically connected to the wiring pattern and is bonded to an electrode of the piezoelectric element;
A structure that surrounds the periphery of the piezoelectric element, and a cover portion that forms a sealed space between the piezoelectric element, and
The position of the piezoelectric element arranged on the piezoelectric element arrangement surface of the liquid discharge head and the cover part of the wiring structure are aligned, and the position of the electrode of the piezoelectric element and the electrical connection part of the wiring structure are adjusted. In addition, the bonding method is characterized in that the piezoelectric element disposition surface and the cover portion are bonded together, and the electrode of the piezoelectric element and the electrical connection portion are bonded. A method of manufacturing a liquid discharge head for discharging liquid,
A wiring pattern for transmitting a driving signal applied to a piezoelectric element provided on a piezoelectric element-providing surface of the liquid discharge head on a base material, and an electrical connection portion that is electrically connected to the wiring pattern and joined to an electrode of the piezoelectric element And forming a wiring structure by forming a cover portion that has a structure surrounding the periphery of the piezoelectric element and forms a sealed space between the piezoelectric element, and
Forming a nozzle for discharging a liquid, and a pressure chamber communicating with the nozzle;
Disposing a piezoelectric element that pressurizes the liquid in the pressure chamber;
An alignment step of aligning the position of the piezoelectric element and the cover portion of the wiring structure, and aligning the position of the electrode of the piezoelectric element and the electrical connection portion of the wiring structure;
Joining the piezoelectric element placement surface on which the piezoelectric element is placed and the cover part, and joining the electrode of the piezoelectric element and the electrical connection part;
A method for manufacturing a liquid discharge head, comprising: A nozzle for discharging liquid;
A pressure chamber communicating with the nozzle;
A piezoelectric element that pressurizes the liquid in the pressure chamber;
A wiring pattern that is bonded to a piezoelectric element mounting surface on which the piezoelectric element is disposed, transmits a drive signal applied to the piezoelectric element, and is electrically connected to the wiring pattern and is bonded to an electrode of the piezoelectric element. A wiring structure having a connection part, a structure surrounding the periphery of the piezoelectric element, and a cover part that forms a sealed space between the piezoelectric element; and
A liquid discharge head comprising:

Images