JP4359465B2 - Connection structure between flexible printed circuit board and hard circuit board, and pressing jig used for the connection structure - Google Patents

Connection structure between flexible printed circuit board and hard circuit board, and pressing jig used for the connection structure Download PDF

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JP4359465B2
JP4359465B2 JP2003299640A JP2003299640A JP4359465B2 JP 4359465 B2 JP4359465 B2 JP 4359465B2 JP 2003299640 A JP2003299640 A JP 2003299640A JP 2003299640 A JP2003299640 A JP 2003299640A JP 4359465 B2 JP4359465 B2 JP 4359465B2
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circuit board
flexible printed
printed circuit
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智也 大槻
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DDK Ltd
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Description

本発明は、携帯電話やノートパソコンやデジタルカメラ等に使用されるフレキシブルプリント基板(以下「FPC」という)とハード基板との接続構造に関するものである。   The present invention relates to a connection structure between a flexible printed circuit board (hereinafter referred to as “FPC”) used in a mobile phone, a notebook computer, a digital camera, and the like and a hard substrate.

携帯電話やCCDカメラ等に使用されるコネクタとして、1つのタイプは主にハウジングとコンタクトとを備え、ハウジングにFPCを挿入し、コンタクトの接触部に接触させる構造のもの(所謂、ノンZIFタイプ)やまた違うタイプとしては主にハウジングとコンタクトとスライダーとを備え、ハウジングとスライダーとでFPCを挟持する構造のもの(所謂、ZIFタイプとピアノタッチタイプ)がある。ハウジングとスライダーとでFPCを保持する方法には、色々考えられるが、中でもハウジングにFPCを挿入した後にスライダーを挿入しFPCをコンタクトに押しつける構造のものやハウジングにFPCを挿入した後にスライダーを回動させFPCをコンタクトに押しつける構造のものが多い。
ハウジングには、コンタクトが挿入される所要数の挿入孔が設けられるとともにFPCが挿入される嵌合口が設けられている。
コンタクトは主にFPCと接触する接触部とハード基板等に接続する接続部とハウジングに固定される固定部とを備えている。このコンタクトは、圧入等によってハウジングに固定されている。
下記にZIFタイプとしての特許文献1(実開平6−60983号)とピアノタッチタイプとしての特許文献2(特開平13−257020号)を例示する。
また、本出願人は、低背位化を実現するために、特許文献3(特願2003−29198)や特許文献4(特願2003−119167)を提案している。
例えば、ゼロインサーションフォース構造としては、実開平6−60983号がある。実開平6−60983号の要約によると、その目的は、電子機器や通信機器内の狭いスペースに使用されるスライダー付プリント基板用コネクタに関するものであり、その構成は、コネクタのスライダーの両側端部にそのスライダーが挿入されるハウジングへの挿入ガイドとして手前側が固定されたU字形状のアーム部を形成し、そのU字形状のアーム部の開放端側に凸部を設けるとともに、U字形状のアーム部の開放端が挿入方向から目視できるように切欠部を設け、ハウジングの両側端部にはスライダーの凸部が係合する傾斜面を有する突出部を設け、スライダーをフレキシブル・プリント基板の接続端子部とともにハウジングに挿入されるとき、当該スライダーの凸部がハウジングの傾斜面を有する突出部を乗り越えることにより、そのU字形状のアーム部の開放端が一時的に外側に広げられ、かつ挿入完了時にその開放端が正常位置に復帰するようにしたコネクタが開示されている。 所謂、ピアノタッチ構造としては、特開平13−257020号に、コネクタのコンタクトとFPC叉はFFCのパターンとの位置合わせを確実に行うことを目的とし、該文献2には、FPC叉はFFCが挿入される開口側の、コネクタの端子ブロックの各コンタクト間の稜線上に突起を列設して、端子ブロックにFPC叉はFFCを挿入した後に、スライダを移動させることによってFPC叉はFFCを前記コンタクトに押圧させ、前記スライダでFPC叉はFFCをコンタクトに押しつけ電気接続させる際に、この突起がFPC叉はFFCのパターン間の凹部に入ることにより、コネクタのコンタクトとFPC叉はFFCのパターンとの位置合わせを確実に行うものが開示されている。 本出願人は、低背位化を実現するために、特願2003−29198を提案している。この出願の要約によると、より一層の狭ピッチや低背位化を図ることのできる構造のコネクタ10を提供することを目的とし、発明として、FPC20とハード基板60とを接続するコネクタ10において、FPC20の接触部26上にバンプ接点22を設けるとともにバンプ接点22間にスリット24を設けることやFPC20の接触部26上にバンプ接点22を設けるとともに2個の接点22を1対とし該1対間にスリット24を設けるようにし、さらにハード基板60上に受け部材40を配置し、FPC20の接触部26上にバンプ接点22を設けるとともに該接点22の反対面側に弾性体50を配置し、FPC20と弾性体50を押圧する押圧部材30を設け、該押圧部材30を受け部材40に係合させることでFPC20と基板60との接続を図る構造のコネクタが提案されている。 また、本出願人は、低背位化を実現するために、特願2003−119167を提案している。この出願の要約によると、より一層の狭ピッチや低背位化を図ることのできる構造のコネクタ10を提供することを目的とし、発明として、FPC20とハード基板60とを接続するコネクタ10において、FPC20の接触部26上にバンプ接点22を設けるとともにハード基板60上に受け部材40を配置し、FPC20の接触部26上にバンプ接点22を設けるとともに該接点22の反対面側に弾性体50を配置し、FPC20と弾性体50を押圧する押圧部材30を設け、該押圧部材30を受け部材40に係合させることでFPC20と基板60との接続を図る構造のコネクタが提案されている。
One type of connector used in mobile phones, CCD cameras, etc., mainly has a housing and contacts, and has a structure in which an FPC is inserted into the housing and brought into contact with the contact portion (so-called non-ZIF type). Another different type mainly includes a housing, a contact, and a slider, and a structure in which the FPC is sandwiched between the housing and the slider (so-called ZIF type and piano touch type). There are various methods for holding the FPC between the housing and the slider. In particular, the FPC is inserted into the housing and then the slider is inserted and the FPC is pressed against the contact, or the slider is rotated after the FPC is inserted into the housing. In many cases, the FPC is pressed against the contact.
The housing is provided with a required number of insertion holes into which the contacts are inserted and a fitting port into which the FPC is inserted.
The contact mainly includes a contact portion that comes into contact with the FPC, a connection portion that is connected to a hard substrate or the like, and a fixed portion that is fixed to the housing. This contact is fixed to the housing by press fitting or the like.
Examples of Patent Document 1 (Japanese Utility Model Publication No. 6-60983) as a ZIF type and Patent Document 2 (Japanese Patent Laid-Open No. 13-257020) as a piano touch type are shown below.
In addition, the present applicant has proposed Patent Document 3 (Japanese Patent Application No. 2003-29198) and Patent Document 4 (Japanese Patent Application No. 2003-119167) in order to realize a low profile.
For example, Japanese Utility Model Publication No. 6-60983 is available as a zero insertion force structure. According to the summary of Japanese Utility Model Laid-Open No. 6-60983, the object is related to a connector for a printed circuit board with a slider used in a narrow space in an electronic device or a communication device. A U-shaped arm portion fixed on the front side is formed as an insertion guide to the housing into which the slider is inserted, and a convex portion is provided on the open end side of the U-shaped arm portion. A notch is provided so that the open end of the arm can be seen from the insertion direction, and a protruding part having an inclined surface that engages the convex part of the slider is provided on both side ends of the housing, and the slider is connected to the flexible printed circuit board. When the slider is inserted into the housing together with the terminal portion, the protruding portion of the slider gets over the protruding portion having the inclined surface of the housing. U-shaped open end of the arm portion of the shape is expanded outwardly temporarily and connector open end upon completion of insertion was made to return to the normal position is disclosed. The so-called piano touch structure is disclosed in Japanese Patent Application Laid-Open No. 13-257020 for the purpose of surely aligning the contact of the connector with the FPC or FFC pattern. Projections are arranged on the ridge lines between the contacts of the connector terminal block on the opening side to be inserted, and after inserting the FPC or FFC into the terminal block, the slider is moved to move the FPC or FFC to the above-mentioned position. When the FPC or FFC is pressed against the contact by the slider and electrically connected to the contact by the slider, the protrusion enters a recess between the FPC or FFC patterns, so that the connector contact and the FPC or FFC pattern A method for surely aligning the positions is disclosed. The present applicant has proposed Japanese Patent Application No. 2003-29198 in order to realize a low profile. According to the summary of this application, an object of the present invention is to provide a connector 10 having a structure that can achieve a further narrow pitch and a low profile, and as an invention, in the connector 10 that connects the FPC 20 and the hard board 60, A bump contact 22 is provided on the contact portion 26 of the FPC 20 and a slit 24 is provided between the bump contacts 22. A bump contact 22 is provided on the contact portion 26 of the FPC 20 and two contacts 22 are paired. Further, the slit 24 is provided on the hard substrate 60, the receiving member 40 is disposed on the hard substrate 60, the bump contact 22 is disposed on the contact portion 26 of the FPC 20, and the elastic body 50 is disposed on the opposite surface side of the contact 22. And the elastic member 50 are provided, and the FPC 20 and the substrate 6 are provided by engaging the pressing member 30 with the receiving member 40. Connector structure to achieve the connection have been proposed with. In addition, the present applicant has proposed Japanese Patent Application No. 2003-119167 in order to realize a low profile. According to the summary of this application, an object of the present invention is to provide a connector 10 having a structure that can achieve a further narrow pitch and a low profile, and as an invention, in the connector 10 that connects the FPC 20 and the hard board 60, The bump contact 22 is provided on the contact portion 26 of the FPC 20 and the receiving member 40 is disposed on the hard substrate 60. The bump contact 22 is provided on the contact portion 26 of the FPC 20 and the elastic body 50 is provided on the opposite side of the contact 22. There has been proposed a connector having a structure in which the FPC 20 and the substrate 60 are connected by providing a pressing member 30 that presses the FPC 20 and the elastic body 50 and engaging the pressing member 30 with the receiving member 40.

近年、機器の小型によりコネクタに対しても、狭ピッチで低背位といった小型化の要求がより強くなってきている。
狭ピッチ化が進むにつれて、前記接触部の左右隣接接触部間の高さの違いの影響を受けやすくなっており、左右隣接接触部間の高さの違いで、接続不良が発生し、狭ピッチ化することが出来ないといった課題と同時に、上述した特許文献1から4に示したように、コネクタを用いたFPCとハード基板との接続構造では、コネクタの低背位化にも限界があり、0.9mm以下に出来ないといった課題もあった。
また、従来、半田付けは永久接続手段とされていたが、半田接続部を再加熱することで、切離しや再接続ができることが見直されている。特に超小型部品では、製品のメンテナンスをユーザーが行うことはなく、専門のメンテナンスマンが専用の工具等を用いることで、半田接続部の切離し、再接続を容易に行うことができる状況となってきている。
文献1及び2に示したコネクタでは、まずリフロー等によりハード基板に固定され、その後に前記コネクタにFPCを挿入して、FPCとハード基板を接続させたものであり、少なくともハウジングとコンタクトが必要になり、該コンタクトは圧入等で前記ハウジングに固定されているので、もうこれ以上の狭ピッチ,狭エリアや低背位(厚さ1mm以下)といった小型化が出来ない。なぜなら、ハウジングは電気絶縁性のプラスチック材料であり加工性や強度などから小型化にも限度があり、また、コンタクトが圧入されるのでハウジングには最低限の肉厚が必要であるから、狭ピッチや低背位化が出来ない。
文献3及び4に示したコネクタでは、まず受け部材をハード基板に配置(固定)し、その後にFPC20の接触部26上にバンプ接点22を設け、該接点の反対側に弾性体50を配置した押圧部材30を前記受け部材に係合させたものであり、少なくとも弾性体と押圧部材と受け部材が必要になるので、これ以上の低背位化(0.9mm以下)といった小型化が出来ない。なぜなら、最低でも、弾性体と押圧部材と受け部材等の厚みが必要になるからである。
In recent years, the demand for miniaturization such as a narrow pitch and a low profile has become stronger for connectors due to the small size of equipment.
As the pitch becomes narrower, it becomes more susceptible to the difference in height between the left and right adjacent contact portions of the contact portion. Due to the difference in height between the left and right adjacent contact portions, poor connection occurs, resulting in a narrow pitch. At the same time as the problem that can not be made, as shown in Patent Documents 1 to 4 described above, in the connection structure between the FPC using a connector and the hard board, there is a limit to the low profile of the connector, There was also a problem that it could not be reduced to 0.9 mm or less.
Conventionally, soldering has been used as a permanent connection means. However, it has been reconsidered that the solder connection can be disconnected and reconnected by reheating. Especially for ultra-compact parts, the user does not perform product maintenance, and a specialized maintenance man can use a dedicated tool etc. to easily disconnect and reconnect the solder connection part. ing.
In the connectors shown in Documents 1 and 2, the FPC is first fixed to the hard board by reflow or the like, and then the FPC is inserted into the connector to connect the FPC and the hard board. At least a housing and a contact are required. Thus, since the contact is fixed to the housing by press-fitting or the like, it is no longer possible to reduce the size such as a narrow pitch, a narrow area, or a low profile (thickness 1 mm or less). This is because the housing is an electrically insulating plastic material, and there is a limit to downsizing due to workability and strength, etc. Also, since the contact is press-fitted, the housing needs a minimum wall thickness, so it has a narrow pitch. And low profile cannot be achieved.
In the connectors shown in Documents 3 and 4, first, the receiving member is arranged (fixed) on the hard board, and then the bump contact 22 is provided on the contact portion 26 of the FPC 20, and the elastic body 50 is arranged on the opposite side of the contact. Since the pressing member 30 is engaged with the receiving member, and at least an elastic body, a pressing member, and a receiving member are required, further downsizing (0.9 mm or less) cannot be achieved. . This is because at least the thicknesses of the elastic body, the pressing member, the receiving member and the like are required.

本発明は、このような従来の問題点に鑑みてなされたもので、狭ピッチ化をしても、前記接触部の左右隣接接触部間の高さの違いの影響を受け難く、独立追従性があり、より一層の低背位化を図ることのできる接続構造を提供せんとするものである。   The present invention has been made in view of such conventional problems, and even if the pitch is narrowed, it is hardly affected by the difference in height between the left and right adjacent contact portions of the contact portion, and independent follow-up performance is achieved. Therefore, it is intended to provide a connection structure that can further reduce the height.

上記接続構造の目的は、FPC10、101とハード基板20とを接続する接続構造において、前記FPC10、101の接触部14と前記ハード基板20のランド22とを合致させる位置決め手段と前記FPC10、101を前記ハード基板20に押圧する押圧部材とを有し、前記FPC10、101の接触部14側先端が一体になるように前記FPC10の接触部14間若しくは前記FPC101の2個の接触部14を1対とし該1対間または前記FPCの接触部14に追従性を持たせるために任意の前記接触部14間にスリット12を設け、前記押圧部材32には一体に固着されると共に前記FPC10、101の接触部14の反対面側に接する弾性体34を配置し、前記押圧部材で押圧しながら前記FPC10、101の接触部14と前記ハード基板20のランド22とを半田付けにより接続することにより達成できる。
前記押圧手段としては、前記FPC10、101の接触部14の反対面側に接する弾性体34を配置し、前記FPC10、101と前記弾性体34を押圧する押圧部材32を設け、該押圧部材32と前記弾性体34を一体に固着した押圧治具30、301を使用する。該押圧治具30、301は前記FPC10、101が前記ハード基板20に半田付けで接続された後は取り外される。
また、前記押圧部材32に加熱板を装着してもよい。加熱板を装着することで、前記押圧治具30、301をメンテナンス時の半田接続部の切離しや再接続にも使用することができる。
前記位置決め手段としては、前記FPC10、101の接触部14と前記ハード基板20のランド22とが合致するように、前記FPC10、101と前記ハード基板20に位置決め孔16、26を設け、該位置決め孔16、26に対応した位置に位置決めピン44を配置した位置決め治具40を用いる方法もある。この場合、前記押圧治具30側には前記位置決めピン44の逃げ部36として、貫通孔か止め孔が設けられている。
また、別の方法としては、前記FPC10、101及び前記ハード基板20側には位置決め孔16、26を設け、前記押圧治具301側には位置決めピン38を設け、前記位置決めピン38が前記FPC10、101及び前記ハード基板20の前記位置決め孔16、26に係合した際に、前記FPC10、101の接触部14と前記ハード基板20のランド22が合致するようにする方法もある。(前記位置決めピン38を前記ハード基板20側に設け、前記位置決め孔を前記FPC10、101と前記押圧治具301に設けても良い。)
The purpose of the connection structure is to connect positioning means for matching the contact portion 14 of the FPC 10, 101 and the land 22 of the hard substrate 20 with the FPC 10, 101 in the connection structure for connecting the FPC 10, 101 and the hard substrate 20. A pressing member that presses against the hard substrate 20, and a pair of the contact portions 14 of the FPC 10 or the two contact portions 14 of the FPC 101 are paired so that the tips of the contact portions 14 of the FPCs 10 and 101 are integrated . A slit 12 is provided between any one of the contact portions 14 in order to make the pair or the contact portion 14 of the FPC follow, and the FPCs 10 and 101 are fixed to the pressing member 32 and fixed together. the elastic body 34 in contact with the opposite side of the contact portion 14 is disposed, the contact portion 14 of the FPC10,101 while pressing with the pressing member It can be achieved by connecting the lands 22 of the hard substrate 20 by soldering.
As the pressing means, an elastic body 34 in contact with the opposite surface side of the contact portion 14 of the FPCs 10 and 101 is disposed, and a pressing member 32 for pressing the FPCs 10 and 101 and the elastic body 34 is provided. The pressing jigs 30 and 301 to which the elastic body 34 is fixed integrally are used. The pressing jigs 30 and 301 are removed after the FPCs 10 and 101 are connected to the hard substrate 20 by soldering.
Further, a heating plate may be attached to the pressing member 32. By attaching the heating plate, the pressing jigs 30 and 301 can be used for disconnecting and reconnecting the solder connection portion during maintenance.
As the positioning means, positioning holes 16 and 26 are provided in the FPCs 10 and 101 and the hard board 20 so that the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard board 20 coincide with each other. There is also a method using a positioning jig 40 in which positioning pins 44 are arranged at positions corresponding to 16 and 26. In this case, a through hole or a stop hole is provided as a relief portion 36 of the positioning pin 44 on the pressing jig 30 side.
As another method, positioning holes 16 and 26 are provided on the FPCs 10 and 101 and the hard substrate 20 side, positioning pins 38 are provided on the pressing jig 301 side, and the positioning pins 38 are the FPCs 10 and 26, respectively. There is also a method in which the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard substrate 20 coincide with each other when the 101 and the positioning holes 16 and 26 of the hard substrate 20 are engaged. (The positioning pins 38 may be provided on the hard substrate 20 side, and the positioning holes may be provided in the FPCs 10 and 101 and the pressing jig 301.)

上記のようなFPC10、101とハード基板20との接続構造をとることで、次のような顕著な効果を得ることができる。
(1)FPC10、101とハード基板20とを接続する接続構造において、前記FPC10、101の接触部14と前記ハード基板20のランド22とを合致させる位置決め手段と前記FPC10、101を前記ハード基板20に押圧する押圧手段とを有し、前記FPC10の接触部14間若しくは前記FPC101の2個の接触部14を1対とし該1対間または前記FPCの接触部14に追従性を持たせるために任意の前記接触部14間にスリット12を設け、該押圧手段で押圧しながら前記FPC10、101の接触部14と前記ハード基板20のランド22とを半田付けにより接続しているので、前記FPC10、101を前記ハード基板20に押圧した際に1個若しくは1対の接触部14又は任意の前記接触部14が独立するために前記接触部14の高さの違いを吸収でき、安定した接続を得られ、0.9mm以下といった低背位化が可能になった。
(2)前記FPC10の接触部14間にスリット12を設けたり、前記FPC101の2個の接触部14を1対とし、該1対の接触部14間にスリット12を設けたり、前記FPCの接触部に追従性を持たせるために任意の前記接触部間にスリット12を設けたりしているので、前記FPC10、101を前記ハード基板20に、前記押圧手段により押圧した際の追従性をよくすることができ、確実に前記FPC10、101の各接触部を前記ハード基板のランドに半田付け接続することができる。
(3)前記FPC10、101の接触部14と前記ハード基板20のランド22とは、半田付けで接続させているので、再加熱により、容易に半田を取り除き接続を解除できる。
(4)簡単に接続を解除できるため、前記FPC10、101や前記ハード基板20を容易に交換でき、コストアップにも繋がらない。
(5)前記押圧手段として、前記FPC10、101の接触部14の反対面側に接する弾性体34を配置し、前記FPC10、101と前記弾性体34を押圧する押圧部材32を設け、該押圧部材32と前記弾性体34を一体に固着した押圧治具30、301を使用しているので、押圧した際の追従性をよくすることができ、確実に前記FPC10、101の各接触部14を前記ハード基板20のランド22に半田付け接続することができる。
(6)前記押圧部材32に加熱板を装着しているので、前記押圧治具30、301をメンテナンス時の半田接続部の切離しや再接続にも使用することができ、コストの節減になる。
By taking the connection structure between the FPCs 10 and 101 and the hard substrate 20 as described above, the following remarkable effects can be obtained.
(1) In a connection structure for connecting the FPCs 10 and 101 and the hard board 20, positioning means for matching the contact portions 14 of the FPCs 10 and 101 with the lands 22 of the hard board 20 and the FPCs 10 and 101 are connected to the hard board 20. In order to make the contact between the contact portions 14 of the FPC 10 or the two contact portions 14 of the FPC 101 one pair, or to provide the follow-up property between the one pair or the contact portion 14 of the FPC. Since the slit 12 is provided between the arbitrary contact portions 14, and the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard substrate 20 are connected by soldering while being pressed by the pressing means, the FPC 10, One or a pair of contact portions 14 or any of the contact portions 14 are independent when 101 is pressed against the hard substrate 20. Can absorb the difference in height of the contact portion 14, it obtained a stable connection, has enabled low-profile position of such 0.9mm or less.
(2) The slit 12 is provided between the contact portions 14 of the FPC 10, the two contact portions 14 of the FPC 101 are paired, the slit 12 is provided between the pair of contact portions 14, and the FPC contact Since the slit 12 is provided between any of the contact portions in order to make the portion followable, the followability when the FPCs 10 and 101 are pressed against the hard substrate 20 by the pressing means is improved. It is possible to reliably connect the contact portions of the FPCs 10 and 101 to the lands of the hard substrate by soldering.
(3) Since the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard substrate 20 are connected by soldering, the solder can be easily removed and the connection can be released by reheating.
(4) Since the connection can be easily released, the FPCs 10 and 101 and the hard board 20 can be easily replaced, which does not increase the cost.
(5) As the pressing means, an elastic body 34 that is in contact with the opposite surface of the contact portion 14 of the FPCs 10 and 101 is disposed, and a pressing member 32 that presses the FPCs 10 and 101 and the elastic body 34 is provided. Since the pressing jigs 30 and 301 in which the elastic member 34 and the elastic body 34 are integrally fixed are used, the followability when pressed can be improved, and the contact portions 14 of the FPCs 10 and 101 are surely connected to the It can be soldered to the land 22 of the hard substrate 20.
(6) Since the heating plate is attached to the pressing member 32, the pressing jigs 30 and 301 can be used for disconnecting and reconnecting the solder connection part at the time of maintenance, thereby reducing the cost.

図1は押圧治具とFPCとハード基板と位置決め治具の斜視図である。図2は押圧治具とFPCとハード基板と位置決め治具とが係合した状態の位置決めピンの部分で断面した断面図である。図3はハード基板と別のFPCの斜視図である。図4はFPCとハード基板と別の押圧治具の斜視図である。図5は図4の押圧治具とFPCとハード基板とが係合した状態の位置決めピンの部分で断面した断面図である。
まず、FPC10、101とハード基板20は、図1及び図3・4のようにFPC10、101の接触部14とハード基板20のランド22とが合致するようにして、半田付けによって接続される。前記FPC10、101と前記ハード基板20との接続構造においては、前記FPC10、101の接触部14と前記ハード基板20のランド22とを合致させる位置決め手段と前記FPC10、101を前記ハード基板20に押圧する押圧手段とを有し、前記FPC10の接触部14間若しくは前記FPC101の2個の接触部14を1対とし該1対間または前記FPCの接触部14に追従性を持たせるために任意の前記接触部14間にスリット12を設けられている。
上述のように、FPC10、101とハード基板20とは、半田付けによって接続されているので、再加熱によって簡単に接続を解除することができる。
FIG. 1 is a perspective view of a pressing jig, an FPC, a hard substrate, and a positioning jig. FIG. 2 is a cross-sectional view taken along a section of the positioning pin in a state where the pressing jig, the FPC, the hard substrate, and the positioning jig are engaged. FIG. 3 is a perspective view of another FPC different from the hard substrate. FIG. 4 is a perspective view of another pressing jig for the FPC and the hard substrate. FIG. 5 is a cross-sectional view taken along a section of the positioning pin in a state where the pressing jig, the FPC, and the hard substrate of FIG. 4 are engaged.
First, the FPCs 10 and 101 and the hard board 20 are connected by soldering so that the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard board 20 coincide as shown in FIGS. In the connection structure between the FPCs 10 and 101 and the hard board 20, positioning means for matching the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard board 20 and the FPCs 10 and 101 are pressed against the hard board 20. Pressing means between the contact portions 14 of the FPC 10 or the two contact portions 14 of the FPC 101 as a pair, and the contact portion 14 of the FPC 101 or the contact portion 14 of the FPC has an arbitrary followability. A slit 12 is provided between the contact portions 14.
As described above, since the FPCs 10 and 101 and the hard board 20 are connected by soldering, the connection can be easily released by reheating.

まず、前記FPC10、101について説明する。前記FPC10、101には、所定の位置に接触部14が設けられ、前記FPC10、101を前記ハード基板20に押圧した際に、前記接触部14の高さのバラツキを吸収でき、高さ方向の追従性を持たせるために、所定の位置にスリット12が設けられている。図1のように前記接触部14間若しくは図3のように2個の前記接触部14を1対とし該1対の接触部14間に前記スリット12を設けている。また、図示はしないが、前記接触部14に追従性を持たせるために任意の前記接触部14間に前記スリット12を設けてもよい。各々の前記接触部14が追従性を持つようにすれば、前記スリット12はどこに設けても良く、例えば、スリット12を前記接触部14間の3個おきに設けると言った複数おきに設けるとか、前記接触部14の1個・2個、1個・2個、1個・2個、おきに前記スリット12を設けてもよい。
このように、前記スリット12を設けることで、前記接触部14若しくは2個の前記接触部1を1対とし該1対の接触部14または任意の前記接触部14が独立状態になり、前記接触部14の高さのバラツキを吸収できる。(前記接触部14に高さ方向の追従性を持たせることができる。)前記スリット12の形状や大きさは、このような役割を考慮して適宜設計する。
また、前記FPC10、101には、下述する位置決め手段である前記位置決め治具40または前記押圧治具301の位置決めピン44、38が入る位置決め孔16が前記位置決めピン44、38に対応した位置に設けられている。前記位置決め孔16の大きさは、前記FPC10、101の接触部14と前記ハード基板20のランド22との位置決めという目的から、該ピン44、38とあまりクリアランスがないようにしている。
First, the FPCs 10 and 101 will be described. The FPCs 10 and 101 are provided with contact portions 14 at predetermined positions. When the FPCs 10 and 101 are pressed against the hard substrate 20, variations in the height of the contact portions 14 can be absorbed, and A slit 12 is provided at a predetermined position in order to have followability. The slits 12 are provided between the contact portions 14 between the contact portions 14 as shown in FIG. 1 or between the two contact portions 14 as shown in FIG. Although not shown, the slits 12 may be provided between any of the contact portions 14 in order to make the contact portion 14 followable. The slits 12 may be provided anywhere as long as each of the contact portions 14 has a follow-up property. For example, the slits 12 may be provided at every third interval between the contact portions 14. The slits 12 may be provided every other one, two, one, two, one, or two of the contact portions 14.
Thus, by providing the slit 12, the contact portion 14 or the two contact portions 1 are paired, and the pair of contact portions 14 or any of the contact portions 14 become independent, and the contact Variations in the height of the portion 14 can be absorbed. (The contact portion 14 can have followability in the height direction.) The shape and size of the slit 12 are appropriately designed in consideration of such a role.
Further, in the FPCs 10 and 101, the positioning holes 16 into which the positioning pins 40 and 38 of the positioning jig 40 or the pressing jig 301 as positioning means described below are inserted are located at positions corresponding to the positioning pins 44 and 38. Is provided. The size of the positioning hole 16 is such that there is not much clearance from the pins 44 and 38 for the purpose of positioning the contact portion 14 of the FPCs 10 and 101 and the land 22 of the hard substrate 20.

位置決め手段としては、図1と図2のように位置決め治具40を用いる方法がある。この方法では、本体42上に別体もしくは一体の2本以上の位置決めピン44を設けた前記位置決め治具40を用い、前記位置決めピン44に対応した位置で、前記FPC10、101の接触部14と前記ハード基板20のランド22が合致するような位置に、前記FPC10、101と前記ハード基板20とに位置決め孔16、26を設けたものである。なお、前記押圧治具30には前記位置決めピン44の逃げ部36が設けられている。
また、別の位置決め手段としては、図4と図5のような方法がある。この方法では、前記FPC10、101の接触部14と前記ハード基板20のランド22とが接続時に合致するように、前記FPC10、101側と前記ハード基板20に2個以上の位置決め孔16、26を設け、押圧手段側(下述する押圧治具301側)で前記位置決め孔16、26に対応した位置に位置決めピン38を設けたものである。前記位置決めピン38は押圧部材32に一体もしくは別体に設けられ、弾性体34には該ピン38の逃げ部36が設けられている。また、前記位置決めピン38を前記ハード基板20側に設け、前記位置決め孔16を前記FPC10、101に設け、前記押圧治具301側に逃げ部36を設けたものでもよい。前記位置決めピン38、44の位置としては、前記FPC10、101の接触部14やパターンの位置及び前記ハード基板20のランド22やパターンの位置等を考慮して適宜設計する。前記位置決めピン38、44の形状としては、前記FPC10、101の接触部14と前記ハード基板20のランド22とが合致するという役割を満足できれば如何なる形状でもよく、本実施例のような丸ピンでも角ピンでもよい。
さらにまた、位置決め手段としては、図示しないがCCDカメラでパターンを読み取り、前記FPCの接触部と前記ハード基板のランドとを合致させる方法もある。
位置決め手段としては、上述したような方法もあるが、前記FPC10、101の接触部14と前記ハード基板20のランドとが半田付け時に合致すれば如何なる方法でもよい。
As the positioning means, there is a method using a positioning jig 40 as shown in FIGS. In this method, the positioning jig 40 having two or more positioning pins 44 provided separately or integrally on the main body 42 is used, and the contact portions 14 of the FPCs 10 and 101 are arranged at positions corresponding to the positioning pins 44. Positioning holes 16 and 26 are provided in the FPCs 10 and 101 and the hard substrate 20 at positions where the lands 22 of the hard substrate 20 coincide. The pressing jig 30 is provided with an escape portion 36 for the positioning pin 44.
As another positioning means, there are methods as shown in FIGS. In this method, two or more positioning holes 16 and 26 are provided in the FPC 10 and 101 side and the hard substrate 20 so that the contact portion 14 of the FPC 10 and 101 and the land 22 of the hard substrate 20 match at the time of connection. A positioning pin 38 is provided at a position corresponding to the positioning holes 16 and 26 on the pressing means side (the pressing jig 301 side described below). The positioning pin 38 is provided integrally or separately from the pressing member 32, and the elastic body 34 is provided with a relief portion 36 of the pin 38. Further, the positioning pin 38 may be provided on the hard substrate 20 side, the positioning hole 16 may be provided in the FPCs 10 and 101, and the relief portion 36 may be provided on the pressing jig 301 side. The positions of the positioning pins 38 and 44 are appropriately designed in consideration of the contact portions 14 and pattern positions of the FPCs 10 and 101, the land 22 and pattern positions of the hard substrate 20, and the like. The positioning pins 38 and 44 may have any shape as long as the contact portion 14 of the FPCs 10 and 101 and the land 22 of the hard substrate 20 can be satisfied. A square pin may be used.
Further, as a positioning means, there is a method of reading a pattern with a CCD camera (not shown) and aligning the contact portion of the FPC with the land of the hard substrate (not shown).
As the positioning means, there is a method as described above, but any method may be used as long as the contact portions 14 of the FPCs 10 and 101 and the lands of the hard substrate 20 match at the time of soldering.

押圧手段としては、図1や図4のような押圧治具30、301を用いている。
前記押圧治具30、301としては、前記FPC10、101の接触部14の反対面側に接する弾性体34を配置し、前記FPC10、101と前記弾性体34を押圧する押圧部材32を設け、該押圧部材32と前記弾性体34を一体に固着したものがある。
図1の場合の押圧治具30は、前記位置決め治具40の位置決めピン44に対応した位置に、該ピン44を逃げる逃げ部36が設けられている。
図4の場合の押圧治具301は、上述のように位置決めとしても機能を持たせるために、前記FPC10、101と前記ハード基板20の位置決め孔16、26に対応した位置に、前記押圧部材32と一体もしくは別体に位置決めピン38が設けられている。
As the pressing means, pressing jigs 30 and 301 as shown in FIGS. 1 and 4 are used.
As the pressing jigs 30 and 301, an elastic body 34 that is in contact with the opposite side of the contact portion 14 of the FPCs 10 and 101 is disposed, and a pressing member 32 that presses the FPCs 10 and 101 and the elastic body 34 is provided. There is one in which the pressing member 32 and the elastic body 34 are fixed integrally.
The pressing jig 30 in the case of FIG. 1 is provided with an escape portion 36 that escapes the pin 44 at a position corresponding to the positioning pin 44 of the positioning jig 40.
The pressing jig 301 in the case of FIG. 4 has the pressing member 32 at positions corresponding to the FPCs 10 and 101 and the positioning holes 16 and 26 of the hard substrate 20 in order to have a function as positioning as described above. A positioning pin 38 is provided integrally or separately.

前記弾性体34は、前記FPC10、101の接触部14が前記ハード基板20のランド22に押し付けられた際の押し付け反力により前記FPC10、101が破損しないように押し付け反力を吸収するためのものである。その為、前記弾性体34の材質としては、半田の融点以上の耐熱性を持ったシリコンゴムなどを挙げることができる。前記弾性体34の大きさとしては、上記役割や押圧治具30、301の取扱性を考慮して適宜設計されている。前記FPC10、101の接触部14を覆れる範囲であれば十分であり、該厚さは押し付け反力を吸収出来れば0.3〜0.5mm程度で十分である。
図4の押圧治具301に用いる弾性体34の場合、前記押圧部材32に設けられた前記位置決めピン38の逃げ部36が設けられている。
図1及び図4の前記逃げ部36の形状としては、前記位置決めピン38、44を逃げられれば如何なる形状でもよく、本実施例のように孔(貫通孔や止め孔)でも、凹部といった溝等でもよい。
The elastic body 34 absorbs the pressing reaction force so that the FPCs 10 and 101 are not damaged by the pressing reaction force when the contact portion 14 of the FPCs 10 and 101 is pressed against the land 22 of the hard substrate 20. It is. Therefore, examples of the material of the elastic body 34 include silicon rubber having heat resistance equal to or higher than the melting point of solder. The size of the elastic body 34 is appropriately designed in consideration of the above role and the handleability of the pressing jigs 30 and 301. It is sufficient if it is within a range that can cover the contact portion 14 of the FPCs 10 and 101, and a thickness of about 0.3 to 0.5 mm is sufficient if the pressing reaction force can be absorbed.
In the case of the elastic body 34 used in the pressing jig 301 in FIG. 4, a relief portion 36 of the positioning pin 38 provided in the pressing member 32 is provided.
The shape of the relief portion 36 in FIGS. 1 and 4 may be any shape as long as the positioning pins 38 and 44 can escape, such as a hole (through hole or stop hole), a groove such as a recess, etc. as in this embodiment. But you can.

前記押圧部材32は略板状をしており、材質は金属製であり、図示しないが、発熱体が接しているか、埋め込まれており、熱伝達性を有している材料で製作されている。このように前記押圧部材32に発熱体を接するか埋め込むことで、押圧治具30、301としてだけでなく、メンテナンス時の半田接続部の切離しや再接続にも使用することができる。該発熱体は半田の融点以上を発するものであれば如何なるものでもよい。
前記押圧部材32は、前記FPC10、101を前記ハード基板20に押圧するためのものであり、前記弾性体34(しいては前記FPC10、101)を押圧する押圧部(図示せず)が設けられ、該押圧部は、前記FPC10、101を前記ハード基板20に押し付けられればよく、押圧し易いように適宜設計している。
図1の場合の押圧治具30は、前記位置決め治具40の位置決めピン44に対応した位置に、該ピン44を逃げる逃げ部36が設けられ、図4の場合の押圧治具301は、上述のように位置決めとしても機能を持たせるために、前記FPC10、101と前記ハード基板20の位置決め孔16、26に対応した位置に、前記押圧部材32と一体もしくは別体に位置決めピン38が設けられている。
The pressing member 32 has a substantially plate shape, and is made of metal. Although not shown, the heating member is in contact with or embedded in the heating member 32 and is made of a material having heat transfer properties. . As described above, the heating member is brought into contact with or embedded in the pressing member 32, so that it can be used not only as the pressing jigs 30 and 301 but also for disconnecting and reconnecting the solder connection portion during maintenance. Any heating element may be used as long as it generates a temperature higher than the melting point of the solder.
The pressing member 32 is for pressing the FPCs 10 and 101 against the hard substrate 20 and is provided with a pressing part (not shown) for pressing the elastic body 34 (and thus the FPCs 10 and 101). The pressing portion is appropriately designed so that the FPCs 10 and 101 can be pressed against the hard substrate 20 and can be easily pressed.
The pressing jig 30 in the case of FIG. 1 is provided with an escape portion 36 for escaping the pin 44 at a position corresponding to the positioning pin 44 of the positioning jig 40. The pressing jig 301 in the case of FIG. In order to provide a function for positioning as described above, positioning pins 38 are provided integrally or separately from the pressing member 32 at positions corresponding to the positioning holes 16 and 26 of the FPCs 10 and 101 and the hard substrate 20. ing.

図1、図3及び図4のように、前記ハード基板20には、客先仕様等により所定の位置にランド22が設けられている。このランド22に前記FPC10、101の接触部14が半田付けによって接続される。また、前記ハード基板20には、位置決め手段である前記位置決め治具40または前記押圧治具301の位置決めピン44、38が入る位置決め孔26が前記位置決めピン44、38に対応した位置に設けられている。前記位置決め孔26の大きさは、前記FPC10、101の接触部14と前記ハード基板20のランド22との位置決めという目的から、該ピン44、38とあまりクリアランスがないようにしている。   As shown in FIGS. 1, 3 and 4, the hard substrate 20 is provided with lands 22 at predetermined positions according to customer specifications and the like. The contact portions 14 of the FPCs 10 and 101 are connected to the lands 22 by soldering. The hard substrate 20 is provided with a positioning hole 26 into which the positioning pins 44 and 38 of the positioning jig 40 or the pressing jig 301 serving as positioning means are inserted, at positions corresponding to the positioning pins 44 and 38. Yes. The size of the positioning hole 26 is such that there is not much clearance from the pins 44 and 38 for the purpose of positioning the contact portion 14 of the FPCs 10 and 101 and the land 22 of the hard substrate 20.

最後に、前記FPC10、101と前記ハード基板20との接続方法について説明する。
第一に、図1の場合について説明する。
まず、位置決め手段である前記位置決め治具40に設けられた位置決めピン44に、図1の矢印「イ」方向に前記ハード基板20の位置決め孔26を挿入する。
次に、前記位置決め治具40に前記ハード基板20が装着した状態で、前記位置決めピン44に、矢印「ロ」方向に前記FPC10、101の位置決め孔16を挿入する。
次に、前記位置決め治具40に前記ハード基板20及び前記FPC10、101が装着した状態で、矢印「ハ」方向に前記弾性体34が固着した前記押圧部材32の押圧治具30で前記FPC10、101を押圧する。
最後に、前記FPC10、101の接触部14と前記ハード基板20のランド22とが合致し、前記FPC10、101が押圧した状態で、前記FPC10、101を前記ハード基板20に半田付けで接続する。
Finally, a connection method between the FPCs 10 and 101 and the hard substrate 20 will be described.
First, the case of FIG. 1 will be described.
First, the positioning hole 26 of the hard substrate 20 is inserted into the positioning pin 44 provided in the positioning jig 40 as positioning means in the direction of the arrow “A” in FIG.
Next, with the hard substrate 20 mounted on the positioning jig 40, the positioning holes 16 of the FPCs 10 and 101 are inserted into the positioning pins 44 in the direction of the arrow “B”.
Next, in a state where the hard substrate 20 and the FPCs 10 and 101 are attached to the positioning jig 40, the FPC 10 101 is pressed.
Finally, the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard substrate 20 are matched and the FPCs 10 and 101 are pressed, and the FPCs 10 and 101 are connected to the hard substrate 20 by soldering.

第二に、図4の場合について説明する。
まず、位置決め手段である押圧治具301に設けられた位置決めピン38に、前記FPC10、101の位置決め孔16を挿入する。
次に、前記押圧治具301に前記FPC10、101が装着した状態で、前記位置決めピン38に、前記ハード基板20の位置決め孔26を挿入する。
最後に、前記FPC10、101の接触部14と前記ハード基板20のランド22とが合致し、前記FPC10、101が押圧した状態で、前記FPC10、101を前記ハード基板20に半田付けで接続する。
Second, the case of FIG. 4 will be described.
First, the positioning holes 16 of the FPCs 10 and 101 are inserted into the positioning pins 38 provided in the pressing jig 301 serving as positioning means.
Next, the positioning hole 26 of the hard substrate 20 is inserted into the positioning pin 38 in a state where the FPCs 10 and 101 are mounted on the pressing jig 301.
Finally, the contact portions 14 of the FPCs 10 and 101 and the lands 22 of the hard substrate 20 are matched and the FPCs 10 and 101 are pressed, and the FPCs 10 and 101 are connected to the hard substrate 20 by soldering.

本発明の活用例としては、携帯電話やノートパソコンやデジタルカメラ等に使用されるFPCとハード基板との接続に活用され、接続の狭ピッチ化と低背位化を図ったものである。   As an application example of the present invention, it is used for connecting an FPC used in a mobile phone, a notebook personal computer, a digital camera, and the like to a hard substrate, and a connection pitch is narrowed and a low profile is achieved.

押圧治具とFPCとハード基板と位置決め治具の斜視図である。It is a perspective view of a pressing jig, an FPC, a hard substrate, and a positioning jig. 押圧治具とFPCとハード基板と位置決め治具とが係合した状態の位置決めピンの部分で断面した断面図である。FIG. 6 is a cross-sectional view taken along a section of a positioning pin in a state where a pressing jig, an FPC, a hard substrate, and a positioning jig are engaged. ハード基板と別のFPCの斜視図である。It is a perspective view of another FPC from a hard substrate. FPCとハード基板と別の押圧治具の斜視図である。It is a perspective view of FPC, a hard substrate, and another pressing jig. 図4の押圧治具とFPCとハード基板とが係合した状態の位置決めピンの部分で断面した断面図である。FIG. 5 is a cross-sectional view taken along a portion of a positioning pin in a state where a pressing jig, an FPC, and a hard substrate in FIG. 4 are engaged.

10,101 FPC(フレキシブルプリント基板)
12 スリット
14 接触部
16,26 位置決め孔
20 ハード基板
22 ランド
30,301 押圧治具
32 押圧部材
34 弾性体
36 逃げ部
38,44 位置決めピン
40 位置決め治具
42 本体
10,101 FPC (Flexible Printed Circuit Board)
12 Slit 14 Contact portion 16, 26 Positioning hole 20 Hard substrate 22 Land 30, 301 Press jig 32 Press member 34 Elastic body 36 Escape portion 38, 44 Positioning pin 40 Positioning jig 42 Main body

Claims (4)

フレキシブルプリント基板(FPC)とハード基板とを接続する接続構造において、
前記フレキシブルプリント基板の接触部と前記ハード基板のランドとを合致させる位置決め手段と前記フレキシブルプリント基板を前記ハード基板に押圧する押圧部材とを有し、
前記フレキシブルプリント基板の接触部側先端が一体になるように前記フレキシブルプリント基板の接触部間にスリットを設け、
前記押圧部材には一体に固着されると共に前記フレキシブルプリント基板の接触部の反対面側に接する弾性体を配置し、
前記押圧部材で押圧しながら前記フレキシブルプリント基板の接触部と前記ハード基板のランドとを半田付けにより接続することを特徴とするフレキシブルプリント基板とハード基板との接続構造。
In the connection structure that connects the flexible printed circuit board (FPC) and the hard circuit board,
Positioning means for matching the contact portion of the flexible printed circuit board and the land of the hard circuit board, and a pressing member that presses the flexible printed circuit board to the hard circuit board,
A slit is provided between the contact parts of the flexible printed circuit board so that the contact part side tip of the flexible printed circuit board is integrated ,
An elastic body that is integrally fixed to the pressing member and is in contact with the opposite surface side of the contact portion of the flexible printed circuit board is disposed,
Connection structure between the flexible printed circuit board and the hard substrate, characterized in that the connection by soldering and the land of the hard substrate and the contact portion of the pressing member the flexible printed circuit board while being pressed in.
フレキシブルプリント基板(FPC)とハード基板とを接続する接続構造において、
前記フレキシブルプリント基板の接触部と前記ハード基板のランドとを合致させる位置決め手段と前記フレキシブルプリント基板を前記ハード基板に押圧する押圧部材とを有し、
前記フレキシブルプリント基板の2個の接触部を1対とし、前記フレキシブルプリント基板の接触部側先端が一体になるように前記1対間にスリットを設け、
前記押圧部材には一体に固着されると共に前記フレキシブルプリント基板の接触部の反対面側に接する弾性体を配置し、
前記押圧部材で押圧しながら前記フレキシブルプリント基板の接触部と前記ハード基板のランドとを半田付けにより接続することを特徴とするフレキシブルプリント基板とハード基板との接続構造。
In the connection structure that connects the flexible printed circuit board (FPC) and the hard circuit board,
Positioning means for matching the contact portion of the flexible printed circuit board and the land of the hard circuit board, and a pressing member that presses the flexible printed circuit board to the hard circuit board,
A pair of two contact portions of the flexible printed circuit board is provided, and a slit is provided between the pair so that the front end of the contact portion of the flexible printed circuit board is integrated .
An elastic body that is integrally fixed to the pressing member and is in contact with the opposite surface side of the contact portion of the flexible printed circuit board is disposed,
Connection structure between the flexible printed circuit board and the hard substrate, characterized in that the connection by soldering and the land of the hard substrate and the contact portion of the pressing member the flexible printed circuit board while being pressed in.
フレキシブルプリント基板(FPC)とハード基板とを接続する接続構造において、
前記フレキシブルプリント基板の接触部と前記ハード基板のランドとを合致させる位置決め手段と前記フレキシブルプリント基板を前記ハード基板に押圧する押圧部材とを有し、
前記フレキシブルプリント基板の接触部側先端が一体になるように前記フレキシブルプリント基板の接触部に追従性を持たせるために任意の前記接触部間にスリットを設け、
前記押圧部材には一体に固着されると共に前記フレキシブルプリント基板の接触部の反対面側に接する弾性体を配置し、
前記押圧部材で押圧しながら前記フレキシブルプリント基板の接触部と前記ハード基板のランドとを半田付けにより接続することを特徴とするフレキシブルプリント基板とハード基板との接続構造。
In the connection structure that connects the flexible printed circuit board (FPC) and the hard circuit board,
Positioning means for matching the contact portion of the flexible printed circuit board and the land of the hard circuit board, and a pressing member that presses the flexible printed circuit board to the hard circuit board,
In order to give the contact part of the flexible printed circuit board so that the contact part side tip of the flexible printed circuit board is integrated, a slit is provided between any of the contact parts,
An elastic body that is integrally fixed to the pressing member and is in contact with the opposite surface side of the contact portion of the flexible printed circuit board is disposed,
Connection structure between the flexible printed circuit board and the hard substrate, characterized in that the connection by soldering and the land of the hard substrate and the contact portion of the pressing member the flexible printed circuit board while being pressed in.
前記押圧部材に加熱板を装着したことを特徴とする請求項1、2または3記載のフレキシブルプリント基板とハード基板との接続構造に使用する押圧治具。 4. A pressing jig used for a connection structure between a flexible printed board and a hard board according to claim 1, wherein a heating plate is attached to the pressing member.
JP2003299640A 2003-08-25 2003-08-25 Connection structure between flexible printed circuit board and hard circuit board, and pressing jig used for the connection structure Expired - Fee Related JP4359465B2 (en)

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WO2011092809A1 (en) * 2010-01-27 2011-08-04 株式会社コグコフ Ultrasonic bonding method and ultrasonic bonding device
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