JP5982427B2 - 両面加工装置に用いられるキャリアプレート - Google Patents
両面加工装置に用いられるキャリアプレート Download PDFInfo
- Publication number
- JP5982427B2 JP5982427B2 JP2014118811A JP2014118811A JP5982427B2 JP 5982427 B2 JP5982427 B2 JP 5982427B2 JP 2014118811 A JP2014118811 A JP 2014118811A JP 2014118811 A JP2014118811 A JP 2014118811A JP 5982427 B2 JP5982427 B2 JP 5982427B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- carrier plate
- grinding
- disk
- shaped substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012545 processing Methods 0.000 title claims description 91
- 238000005498 polishing Methods 0.000 claims description 291
- 239000000758 substrate Substances 0.000 claims description 237
- 239000007788 liquid Substances 0.000 claims description 77
- 230000002093 peripheral effect Effects 0.000 claims description 37
- 239000012530 fluid Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 40
- 239000006061 abrasive grain Substances 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 31
- 239000002002 slurry Substances 0.000 description 26
- 239000002699 waste material Substances 0.000 description 23
- 238000007517 polishing process Methods 0.000 description 15
- 239000011521 glass Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000004744 fabric Substances 0.000 description 9
- 229910000838 Al alloy Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000002826 coolant Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000008119 colloidal silica Substances 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010408 sweeping Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 238000007518 final polishing process Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Images
Landscapes
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014118811A JP5982427B2 (ja) | 2014-06-09 | 2014-06-09 | 両面加工装置に用いられるキャリアプレート |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014118811A JP5982427B2 (ja) | 2014-06-09 | 2014-06-09 | 両面加工装置に用いられるキャリアプレート |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012137764A Division JP5613723B2 (ja) | 2012-06-19 | 2012-06-19 | キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014168846A JP2014168846A (ja) | 2014-09-18 |
| JP2014168846A5 JP2014168846A5 (OSRAM) | 2015-05-07 |
| JP5982427B2 true JP5982427B2 (ja) | 2016-08-31 |
Family
ID=51691656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014118811A Active JP5982427B2 (ja) | 2014-06-09 | 2014-06-09 | 両面加工装置に用いられるキャリアプレート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5982427B2 (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106625202A (zh) * | 2016-11-02 | 2017-05-10 | 浙江蓝特光学股份有限公司 | 一种晶圆片的加工方法及其抛光夹具 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7291795B2 (ja) * | 2019-09-30 | 2023-06-15 | Hoya株式会社 | 基板配置支援治具及び基板の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338966U (OSRAM) * | 1986-08-29 | 1988-03-12 | ||
| JPH1110530A (ja) * | 1997-06-25 | 1999-01-19 | Shin Etsu Handotai Co Ltd | 両面研磨用キャリア |
| US6390909B2 (en) * | 2000-04-03 | 2002-05-21 | Rodel Holdings, Inc. | Disk for conditioning polishing pads |
| JP2004023038A (ja) * | 2002-06-20 | 2004-01-22 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの研磨装置 |
-
2014
- 2014-06-09 JP JP2014118811A patent/JP5982427B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106625202A (zh) * | 2016-11-02 | 2017-05-10 | 浙江蓝特光学股份有限公司 | 一种晶圆片的加工方法及其抛光夹具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014168846A (ja) | 2014-09-18 |
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