JP2014168846A5 - - Google Patents

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Publication number
JP2014168846A5
JP2014168846A5 JP2014118811A JP2014118811A JP2014168846A5 JP 2014168846 A5 JP2014168846 A5 JP 2014168846A5 JP 2014118811 A JP2014118811 A JP 2014118811A JP 2014118811 A JP2014118811 A JP 2014118811A JP 2014168846 A5 JP2014168846 A5 JP 2014168846A5
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JP
Japan
Prior art keywords
carrier plate
double
blade
sided processing
disposed
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Granted
Application number
JP2014118811A
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English (en)
Japanese (ja)
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JP2014168846A (ja
JP5982427B2 (ja
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Priority to JP2014118811A priority Critical patent/JP5982427B2/ja
Priority claimed from JP2014118811A external-priority patent/JP5982427B2/ja
Publication of JP2014168846A publication Critical patent/JP2014168846A/ja
Publication of JP2014168846A5 publication Critical patent/JP2014168846A5/ja
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Publication of JP5982427B2 publication Critical patent/JP5982427B2/ja
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JP2014118811A 2014-06-09 2014-06-09 両面加工装置に用いられるキャリアプレート Active JP5982427B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014118811A JP5982427B2 (ja) 2014-06-09 2014-06-09 両面加工装置に用いられるキャリアプレート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014118811A JP5982427B2 (ja) 2014-06-09 2014-06-09 両面加工装置に用いられるキャリアプレート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012137764A Division JP5613723B2 (ja) 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置

Publications (3)

Publication Number Publication Date
JP2014168846A JP2014168846A (ja) 2014-09-18
JP2014168846A5 true JP2014168846A5 (OSRAM) 2015-05-07
JP5982427B2 JP5982427B2 (ja) 2016-08-31

Family

ID=51691656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014118811A Active JP5982427B2 (ja) 2014-06-09 2014-06-09 両面加工装置に用いられるキャリアプレート

Country Status (1)

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JP (1) JP5982427B2 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106625202A (zh) * 2016-11-02 2017-05-10 浙江蓝特光学股份有限公司 一种晶圆片的加工方法及其抛光夹具
JP7291795B2 (ja) * 2019-09-30 2023-06-15 Hoya株式会社 基板配置支援治具及び基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338966U (OSRAM) * 1986-08-29 1988-03-12
JPH1110530A (ja) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd 両面研磨用キャリア
US6390909B2 (en) * 2000-04-03 2002-05-21 Rodel Holdings, Inc. Disk for conditioning polishing pads
JP2004023038A (ja) * 2002-06-20 2004-01-22 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの研磨装置

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