JP2016523724A5 - - Google Patents

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Publication number
JP2016523724A5
JP2016523724A5 JP2016518346A JP2016518346A JP2016523724A5 JP 2016523724 A5 JP2016523724 A5 JP 2016523724A5 JP 2016518346 A JP2016518346 A JP 2016518346A JP 2016518346 A JP2016518346 A JP 2016518346A JP 2016523724 A5 JP2016523724 A5 JP 2016523724A5
Authority
JP
Japan
Prior art keywords
substrate
abrasive
structured
recess
backing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016518346A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016523724A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/039691 external-priority patent/WO2014197244A1/en
Publication of JP2016523724A publication Critical patent/JP2016523724A/ja
Publication of JP2016523724A5 publication Critical patent/JP2016523724A5/ja
Pending legal-status Critical Current

Links

JP2016518346A 2013-06-07 2014-05-28 基板に凹みを形成するための方法、及び凹みを有する物品 Pending JP2016523724A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361832330P 2013-06-07 2013-06-07
US61/832,330 2013-06-07
PCT/US2014/039691 WO2014197244A1 (en) 2013-06-07 2014-05-28 Techniques for forming recess in substrate and articles including recesses

Publications (2)

Publication Number Publication Date
JP2016523724A JP2016523724A (ja) 2016-08-12
JP2016523724A5 true JP2016523724A5 (OSRAM) 2017-07-06

Family

ID=52008500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016518346A Pending JP2016523724A (ja) 2013-06-07 2014-05-28 基板に凹みを形成するための方法、及び凹みを有する物品

Country Status (7)

Country Link
US (1) US20160101499A1 (OSRAM)
JP (1) JP2016523724A (OSRAM)
KR (1) KR20160015354A (OSRAM)
CN (1) CN105263701B (OSRAM)
SG (1) SG11201509813VA (OSRAM)
TW (1) TW201505757A (OSRAM)
WO (1) WO2014197244A1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014197551A2 (en) * 2013-06-07 2014-12-11 3M Innovative Properties Company Method of forming a recess in a substrate, abrasive wheel, and cover
CN205384625U (zh) 2015-06-05 2016-07-13 旭硝子株式会社 玻璃基板、保护玻璃、以及便携式信息终端
DE102015111491A1 (de) * 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum Abtrennen von Glas- oder Glaskeramikteilen
US10051353B2 (en) * 2016-12-13 2018-08-14 Cisco Technology, Inc. Telecommunications audio endpoints
US10863035B2 (en) 2017-11-30 2020-12-08 Cisco Technology, Inc. Microphone assembly for echo rejection in audio endpoints
CN108640494B (zh) * 2018-04-24 2020-02-14 昆山国显光电有限公司 显示屏开槽方法及显示屏
JP7156377B2 (ja) * 2018-07-04 2022-10-19 Ａｇｃ株式会社 ガラス板、反射防止層付きガラス板、およびガラス板の製造方法
CN108890529B (zh) * 2018-07-25 2023-06-23 浙江工业大学 光催化钴基合金加工控制系统及控制方法
CN110943142A (zh) * 2018-09-21 2020-03-31 邵丙璜 一种制备光伏电池的方法
EP4072782A1 (en) 2019-12-12 2022-10-19 3M Innovative Properties Company Polymer bond abrasive articles including continuous polymer matrix, and methods of making same
CN112157544B (zh) * 2020-09-29 2022-01-28 维沃移动通信(重庆)有限公司 玻璃制作方法、玻璃及电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07209155A (ja) * 1994-01-13 1995-08-11 Jeol Ltd 試料作製装置及び方法
US6866560B1 (en) * 2003-01-09 2005-03-15 Sandia Corporation Method for thinning specimen
US7830011B2 (en) * 2004-03-15 2010-11-09 Yamaha Corporation Semiconductor element and wafer level chip size package therefor
US7695353B2 (en) * 2004-11-19 2010-04-13 Toyoda Van Moppes Ltd. Grinding wheel
JP2006250677A (ja) * 2005-03-10 2006-09-21 Seiko Epson Corp 試料作製方法
US8425278B2 (en) * 2009-08-26 2013-04-23 3M Innovative Properties Company Structured abrasive article and method of using the same
JP5881414B2 (ja) * 2011-04-20 2016-03-09 Hoya株式会社 携帯機器用カバーガラス

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