JP5977392B2 - 樹脂製の板状キャリアと金属層とからなる積層体 - Google Patents

樹脂製の板状キャリアと金属層とからなる積層体 Download PDF

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Publication number
JP5977392B2
JP5977392B2 JP2015063271A JP2015063271A JP5977392B2 JP 5977392 B2 JP5977392 B2 JP 5977392B2 JP 2015063271 A JP2015063271 A JP 2015063271A JP 2015063271 A JP2015063271 A JP 2015063271A JP 5977392 B2 JP5977392 B2 JP 5977392B2
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JP
Japan
Prior art keywords
metal layer
laminate
resin
metal
laminated body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015063271A
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English (en)
Japanese (ja)
Other versions
JP2015212076A (ja
Inventor
晃正 森山
晃正 森山
倫也 古曳
倫也 古曳
雅史 石井
雅史 石井
雅之 高森
雅之 高森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2015063271A priority Critical patent/JP5977392B2/ja
Publication of JP2015212076A publication Critical patent/JP2015212076A/ja
Application granted granted Critical
Publication of JP5977392B2 publication Critical patent/JP5977392B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2015063271A 2014-03-26 2015-03-25 樹脂製の板状キャリアと金属層とからなる積層体 Active JP5977392B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015063271A JP5977392B2 (ja) 2014-03-26 2015-03-25 樹脂製の板状キャリアと金属層とからなる積層体

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014064899 2014-03-26
JP2014064899 2014-03-26
JP2014085837 2014-04-17
JP2014085837 2014-04-17
JP2015063271A JP5977392B2 (ja) 2014-03-26 2015-03-25 樹脂製の板状キャリアと金属層とからなる積層体

Publications (2)

Publication Number Publication Date
JP2015212076A JP2015212076A (ja) 2015-11-26
JP5977392B2 true JP5977392B2 (ja) 2016-08-24

Family

ID=54158581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015063271A Active JP5977392B2 (ja) 2014-03-26 2015-03-25 樹脂製の板状キャリアと金属層とからなる積層体

Country Status (4)

Country Link
JP (1) JP5977392B2 (zh)
KR (2) KR20150111877A (zh)
CN (1) CN104943273A (zh)
TW (1) TWI551438B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105491820B (zh) * 2015-11-24 2019-02-26 广州兴森快捷电路科技有限公司 埋线路板的内层板边标记制作方法
KR101932326B1 (ko) * 2016-12-20 2018-12-24 주식회사 두산 인쇄회로기판 및 이의 제조방법
WO2018225760A1 (ja) * 2017-06-07 2018-12-13 株式会社旭電化研究所 可撓性複合フィルム、それを用いた可撓性回路フィルム
CN108330517B (zh) * 2018-01-25 2019-12-24 胡旭日 一种载体铜箔剥离层的镀液及剥离层的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558735A (en) * 1991-12-27 1996-09-24 Square D Company Method for making laminate with U. V. cured polymer coating
JP2001127429A (ja) * 1999-10-25 2001-05-11 Hitachi Chem Co Ltd 多層印刷配線板の製造方法
JP4395295B2 (ja) * 2002-10-17 2010-01-06 日立化成工業株式会社 プリント配線板の製造方法並びにプリント配線板
JP4273895B2 (ja) * 2003-09-24 2009-06-03 日立化成工業株式会社 半導体素子搭載用パッケージ基板の製造方法
JP2005144816A (ja) * 2003-11-13 2005-06-09 Tomoegawa Paper Co Ltd フレキシブル金属積層体
KR101089649B1 (ko) * 2009-12-01 2011-12-06 삼성전기주식회사 금속적층판 및 이를 이용한 코어기판 제조방법
WO2012121373A1 (ja) * 2011-03-09 2012-09-13 日立化成工業株式会社 半導体素子搭載用パッケージ基板の製造方法、半導体素子搭載用パッケージ基板及び半導体パッケージ
JP2012216824A (ja) * 2011-03-31 2012-11-08 Hitachi Chem Co Ltd 半導体素子搭載用パッケージ基板の製造方法
JP5962094B2 (ja) * 2012-03-16 2016-08-03 凸版印刷株式会社 積層基板の製造方法

Also Published As

Publication number Publication date
KR20150111877A (ko) 2015-10-06
TW201540493A (zh) 2015-11-01
KR20180048476A (ko) 2018-05-10
TWI551438B (zh) 2016-10-01
CN104943273A (zh) 2015-09-30
JP2015212076A (ja) 2015-11-26

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