JP5968544B2 - 光吸収層製造用ci(g)sナノ粒子の製造方法及びその方法により製造されたci(g)sナノ粒子 - Google Patents
光吸収層製造用ci(g)sナノ粒子の製造方法及びその方法により製造されたci(g)sナノ粒子 Download PDFInfo
- Publication number
- JP5968544B2 JP5968544B2 JP2015527411A JP2015527411A JP5968544B2 JP 5968544 B2 JP5968544 B2 JP 5968544B2 JP 2015527411 A JP2015527411 A JP 2015527411A JP 2015527411 A JP2015527411 A JP 2015527411A JP 5968544 B2 JP5968544 B2 JP 5968544B2
- Authority
- JP
- Japan
- Prior art keywords
- nanoparticles
- solution
- group
- producing
- glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002105 nanoparticle Substances 0.000 title claims description 73
- 238000004519 manufacturing process Methods 0.000 title claims description 44
- 238000000034 method Methods 0.000 title claims description 25
- 230000031700 light absorption Effects 0.000 title claims description 15
- 239000002245 particle Substances 0.000 claims description 60
- 239000010949 copper Substances 0.000 claims description 53
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 52
- 239000011669 selenium Substances 0.000 claims description 50
- 239000002904 solvent Substances 0.000 claims description 33
- 239000002243 precursor Substances 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052717 sulfur Inorganic materials 0.000 claims description 20
- 150000003839 salts Chemical class 0.000 claims description 19
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 18
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 17
- 229910052738 indium Inorganic materials 0.000 claims description 16
- 229910052711 selenium Inorganic materials 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 14
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 14
- 229920001223 polyethylene glycol Polymers 0.000 claims description 12
- 229910052733 gallium Inorganic materials 0.000 claims description 10
- -1 polyethylene Polymers 0.000 claims description 10
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 9
- MCAHWIHFGHIESP-UHFFFAOYSA-N selenous acid Chemical compound O[Se](O)=O MCAHWIHFGHIESP-UHFFFAOYSA-N 0.000 claims description 8
- 239000012798 spherical particle Substances 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 7
- 239000011593 sulfur Substances 0.000 claims description 7
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000000746 purification Methods 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 5
- 229920005862 polyol Polymers 0.000 claims description 5
- 150000003077 polyols Chemical class 0.000 claims description 5
- 230000002194 synthesizing effect Effects 0.000 claims description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 4
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- 125000004386 diacrylate group Chemical group 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- 230000005012 migration Effects 0.000 claims description 3
- 238000013508 migration Methods 0.000 claims description 3
- XFDQLDNQZFOAFK-UHFFFAOYSA-N 2-benzoyloxyethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOC(=O)C1=CC=CC=C1 XFDQLDNQZFOAFK-UHFFFAOYSA-N 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 229910002651 NO3 Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 2
- 150000004677 hydrates Chemical class 0.000 claims description 2
- IYKVLICPFCEZOF-UHFFFAOYSA-N selenourea Chemical compound NC(N)=[Se] IYKVLICPFCEZOF-UHFFFAOYSA-N 0.000 claims description 2
- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 claims description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N thioacetamide Natural products CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- LXUFUILJBKOKJN-UHFFFAOYSA-N ethane-1,2-diol ethene Chemical compound C=C.C=C.C=C.OCCO LXUFUILJBKOKJN-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 description 56
- 239000000243 solution Substances 0.000 description 24
- 238000000576 coating method Methods 0.000 description 18
- 239000010408 film Substances 0.000 description 18
- 239000010410 layer Substances 0.000 description 17
- 239000012046 mixed solvent Substances 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 229910021476 group 6 element Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 229910001431 copper ion Inorganic materials 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229940000207 selenious acid Drugs 0.000 description 6
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- XURCIPRUUASYLR-UHFFFAOYSA-N Omeprazole sulfide Chemical compound N=1C2=CC(OC)=CC=C2NC=1SCC1=NC=C(C)C(OC)=C1C XURCIPRUUASYLR-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 4
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000872 buffer Substances 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 2
- PMBXCGGQNSVESQ-UHFFFAOYSA-N 1-Hexanethiol Chemical compound CCCCCCS PMBXCGGQNSVESQ-UHFFFAOYSA-N 0.000 description 2
- NVJUHMXYKCUMQA-UHFFFAOYSA-N 1-ethoxypropane Chemical compound CCCOCC NVJUHMXYKCUMQA-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 2
- 229940088601 alpha-terpineol Drugs 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 229940044658 gallium nitrate Drugs 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ZRKMQKLGEQPLNS-UHFFFAOYSA-N 1-Pentanethiol Chemical compound CCCCCS ZRKMQKLGEQPLNS-UHFFFAOYSA-N 0.000 description 1
- YUVPIJXXUPESKO-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO.CCNCCO YUVPIJXXUPESKO-UHFFFAOYSA-N 0.000 description 1
- DYSYTOUAGABXJV-UHFFFAOYSA-N 2-(methylamino)ethanol Chemical compound CNCCO.CNCCO DYSYTOUAGABXJV-UHFFFAOYSA-N 0.000 description 1
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 description 1
- KKNSUXKKLIIIQS-UHFFFAOYSA-N CC(CCC)O.CC(CCC)O Chemical compound CC(CCC)O.CC(CCC)O KKNSUXKKLIIIQS-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- KXAFRRNDGVAIDW-UHFFFAOYSA-N NC(CO)(C)C.CC(CC)O Chemical compound NC(CO)(C)C.CC(CC)O KXAFRRNDGVAIDW-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 230000018199 S phase Effects 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- VYRDHRYMAZWQJH-UHFFFAOYSA-N [P].P Chemical class [P].P VYRDHRYMAZWQJH-UHFFFAOYSA-N 0.000 description 1
- 159000000021 acetate salts Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004067 bulking agent Substances 0.000 description 1
- 229950005499 carbon tetrachloride Drugs 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- UQZIQMNBAURFFO-UHFFFAOYSA-N hexan-1-ol;hexan-2-ol Chemical compound CCCCCCO.CCCCC(C)O UQZIQMNBAURFFO-UHFFFAOYSA-N 0.000 description 1
- ASFLDIVAXZKKSO-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O.CCCCC(C)O ASFLDIVAXZKKSO-UHFFFAOYSA-N 0.000 description 1
- LSXRQJWRXAOUIA-UHFFFAOYSA-N hexan-3-ol Chemical compound CCCC(O)CC.CCCC(O)CC LSXRQJWRXAOUIA-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- SYJRVVFAAIUVDH-UHFFFAOYSA-N ipa isopropanol Chemical compound CC(C)O.CC(C)O SYJRVVFAAIUVDH-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- KVYJZMJPHSXEDZ-UHFFFAOYSA-N pentan-1-ol Chemical compound CCCCCO.CCCCCO KVYJZMJPHSXEDZ-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- USGIERNETOEMNR-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO.CCCO USGIERNETOEMNR-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- ACTRVOBWPAIOHC-XIXRPRMCSA-N succimer Chemical compound OC(=O)[C@@H](S)[C@@H](S)C(O)=O ACTRVOBWPAIOHC-XIXRPRMCSA-N 0.000 description 1
- 229960005346 succimer Drugs 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/002—Compounds containing, besides selenium or tellurium, more than one other element, with -O- and -OH not being considered as anions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/004—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/007—Tellurides or selenides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/85—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by XPS, EDX or EDAX data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Description
(i)硫黄(S)、またはセレニウム(Se)、または硫黄(S)及びセレニウム(Se)を含む化合物からなる群から選択される1種以上のVI族ソースとインジウム(In)塩を溶媒に溶解させて、第1溶液を準備する過程と、
(ii)第1溶液を反応させて、1次前駆体粒子を形成させる過程と、
(iii)銅(Cu)塩を溶媒に溶解させて、第2溶液を準備する過程と、
(iv)前記1次前駆体が形成された第1溶液に第2溶液を混合して、混合物を製造する過程と、
(v)前記混合物の反応によりCI(G)Sナノ粒子を合成した後、精製する過程と、
を含むことを特徴とする。
硝酸インジウム水溶液5mmolと亜セレン酸10mmolをエチレングリコール70mlに溶解させ、これらを混合した後、摂氏150度まで加熱して2時間反応させた。これに、銅(II)窒酸化物5mmolを溶解させたエチレングリコール溶液50mlを加えた後、摂氏150度まで加熱し、4時間維持した。反応が完了した後、遠心分離法で精製することで、無定形のInSe2粒子に銅イオンがマイグレーション(migration)されている略CuInSe2の組成を有するCI(G)Sナノ粒子を製造した。
硝酸インジウム水溶液7mmol、硝酸ガリウム水溶液3mmol及び亜セレン酸20mmolをエチレングリコール150mlに溶解させ、これらを混合した後、摂氏150度まで加熱して1時間反応させた。これに、銅(II)窒酸化物10mmolを溶解させたエチレングリコール溶液50mlを加えた後、摂氏150度で2時間、170度で1時間維持した。反応が完了した後、遠心分離法で精製することで、無定形のIn(Ga)Se粒子に銅イオンがマイグレーション(migration)されている略CuIn(Ga)Se2の組成を有するCI(G)Sナノ粒子を製造した。
硝酸インジウム水溶液7mmol、硝酸ガリウム水溶液3mmol及び亜セレン酸20mmolをエチレングリコール150mlに溶解させ、これらを混合した後、摂氏150度まで加熱して2時間反応させた。これに、銅(II)窒酸化物10mmolを溶解させたエチレングリコール溶液20mlを加えた後、摂氏150度で2時間維持した。反応が完了した後、遠心分離法で精製することで、無定形のIn(Ga)Se粒子に銅イオンがマイグレーション(migration)されている略CuIn(Ga)Se1.5の組成を有するCI(G)Sナノ粒子を製造した。
硝酸インジウム水溶液5mmolと亜セレン酸10mmolをエチレングリコール100mlに溶解させ、これらを混合した後、摂氏150度まで加熱して4時間反応させた。これに、銅(II)窒酸化物5mmolを溶解させたエチレングリコール溶液50mlを加えた後、摂氏170度まで加熱し、4時間維持した。反応が完了した後、遠心分離法で精製することで、無定形のInSe2粒子に銅イオンがマイグレーション(migration)されている略CuInSe2の組成を有するCI(G)Sナノ粒子を製造した。
Cu(NO3)25mmol、In(NO3)35mmol、及び亜セレン酸10mmolをエチレングリコール溶液120mlに混合して、オートクレーブに入れ、210℃で15時間撹拌して反応させ、製造された粒子を遠心分離法で精製することで、略CuInSe2の組成を有するCI(G)Sナノ粒子を製造した。
Cu(NO3)27.5mmol、In(NO3)310.5mmol、Ga(NO3)34.5mmol及び亜セレン酸15mmolをエチレングリコール溶液100mlに混合して、170℃で6時間撹拌して反応させ、製造された粒子を遠心分離法で精製することで、略Cu0.5In0.7Ga0.3Seの組成を有するCI(G)Sナノ粒子を製造した。
上記実施例1〜4及び比較例1、2で形成されたナノ粒子を分析した電子顕微鏡(SEM)写真を図1、図2及び図5乃至図8に示した。
薄膜の製造
実施例1に係るCI(G)Sナノ粒子を、アルコール系混合溶媒からなる溶媒に20%の濃度で分散させて、インクを製造した。ガラス基板にMoを蒸着して得られた基板に前記インクをコーティングし、CI(G)S薄膜の製造のためのコーティング膜を製造した。これを200℃まで乾燥させた後、Se雰囲気下で530℃で10分間熱処理して、CI(G)S薄膜を得た。得られた薄膜の断面形状及びXRD像を図9及び図10に示した。
薄膜の製造
実施例2に係るCI(G)Sナノ粒子を、アルコール系混合溶媒からなる溶媒に25%の濃度で分散させて、インクを製造した。ガラス基板にMoを蒸着して得られた基板に前記インクをコーティングし、CI(G)S薄膜の製造のためのコーティング膜を製造した。これを220℃まで乾燥させた後、Se雰囲気下で550℃で5分間熱処理して、CI(G)S薄膜を得た。得られた薄膜の断面形状及びXRD像を図11及び図12に示した。
薄膜の製造
実施例3に係るCI(G)Sナノ粒子を、アルコール系混合溶媒からなる溶媒に25%の濃度で分散させて、インクを製造した。ガラス基板にMoを蒸着して得られた基板に前記インクをコーティングし、CI(G)S薄膜の製造のためのコーティング膜を製造した。これを260℃まで乾燥させた後、Se雰囲気下で640℃で5分間熱処理して、CI(G)S薄膜を得た。得られた薄膜の断面形状及びXRD像を図13及び図14に示した。
薄膜の製造
実施例4に係るCI(G)Sナノ粒子を、アルコール系混合溶媒からなる溶媒に22%の濃度で分散させて、インクを製造した。ガラス基板にMoを蒸着して得られた基板に前記インクをコーティングし、CI(G)S薄膜の製造のためのコーティング膜を製造した。これを200℃まで乾燥させた後、Se雰囲気下で575℃で5分間熱処理して、CI(G)S薄膜を得た。
薄膜の製造
実施例1と同様の方法で合成したが、Cu/Inの組成比を0.2に調節したCu0.2InSe粒子とCu2In粒子とを混合して、アルコール系混合溶媒からなる溶媒に25%の濃度で分散させて、インクを製造した。ガラス基板にMoを蒸着して得られた基板に前記インクをコーティングし、CI(G)S薄膜の製造のためのコーティング膜を製造した。これを200℃まで乾燥させた後、Se雰囲気下で575℃で5分間熱処理して、CI(G)S薄膜を得た。
薄膜の製造
比較例2で合成したCI(G)Sナノ粒子を、アルコール系混合溶媒からなる溶媒に16.5%の濃度で分散させて、インクを製造した。ガラス基板にMoを蒸着して得られた基板に前記インクをコーティングし、CI(G)S薄膜の製造のためのコーティング膜を製造した。これを260℃まで乾燥させた後、Se雰囲気下で640℃で5分間熱処理して、CI(G)S薄膜を得た。得られた薄膜の断面形状及びXRD像を図15及び図16に示した。
薄膜太陽電池の製造
実施例6で得られたCI(G)S薄膜にCBD法を用いてCdS buffer層を製造し、ZnOとAlZnOを順次蒸着した後、Al電極をe−beamを用いて載せて、cellを製造し、これからVoc=0.34V、Jsc=4.05mA/cm2、fill factor=25.73%、効率0.36%のcellを製造した。
薄膜太陽電池の製造
実施例7で得られたCI(G)S薄膜にCBD法を用いてCdS buffer層を製造し、ZnOとAlZnOを順次蒸着した後、Al電極をe−beamを用いて載せて、cellを製造し、これからVoc=0.04V、Jsc=4.94mA/cm2、fill factor=24.91%、効率0.05%のcellを製造した。
薄膜太陽電池の製造
実施例9で得られたCI(G)S薄膜にCBD法を用いてCdS buffer層を製造し、ZnOとAlZnOを順次蒸着した後、Al電極をe−beamを用いて載せて、cellを製造し、これからVoc=0.24V、Jsc=23.15mA/cm2、fill factor=34.37%、効率1.92%のcellを製造した。
実施例10〜12で製造されたCI(G)S系薄膜太陽電池の光電効率を測定し、その結果を下記表1に整理した。
Claims (10)
- 太陽電池の光吸収層を形成するCI(G)Sナノ粒子を製造する方法であって、
(i)硫黄(S)、またはセレニウム(Se)、または硫黄(S)及びセレニウム(Se)を含む化合物からなる群から選択される1種以上のVI族ソースとインジウム(In)塩を溶媒に溶解させて第1溶液を準備する過程と、
(ii)第1溶液を反応させて1次前駆体粒子を形成させる過程と、
(iii)銅(Cu)塩を溶媒に溶解させて第2溶液を準備する過程と、
(iv)前記1次前駆体が形成された第1溶液に第2溶液を混合して混合物を製造する過程と、
(v)前記混合物の反応によりCI(G)Sナノ粒子を合成した後、精製する過程と、
を含み、
前記第1溶液及び第2溶液の溶媒はポリオール溶媒であり、
前記過程(i)の第1溶液には、インジウム1モルに対してVI族ソースが0.5〜2モル含まれていて、
前記過程(iv)の混合物には、インジウム(In)1モルに対して銅(Cu)が0.2〜1モル含まれていて、
前記1次前駆体粒子を形成するための過程(ii)は、第1溶液を摂氏130度〜170度下で1時間〜4時間維持することによって実施され、
前記CI(G)Sナノ粒子を形成するための過程(v)は、2時間〜5時間の間、第1溶液と第2溶液との混合物を摂氏150度〜190度下で維持することによって実施されることを特徴とする、CI(G)Sナノ粒子の製造方法。 - 前記ポリオール溶媒は、エチレングリコール(ethylene glycol)、ジエチレングリコール(diethylene glycol)、ジエチレングリコールエチルエーテル(diethylene glycol ethyl ether)、ジエチレングリコールブチルエーテル(diethylene glycol butyl ether)、トリエチレングリコール(triethylene glycol)、テトラエチレングリコール(tetraethylene glycol)、ポリエチレングリコール(poly(ethylene glycol)、分子量;200〜100,000)、ポリエチレングリコールジアクリレート(poly(ethylene glycol)diacrylate)、ポリエチレングリコールジベンゾエート(poly(ethylene glycol)dibenzoate)、ジプロピレングリコール(dipropylene glycol)、トリプロピレングリコール(dipropylene glycol)、グリセロール(glycerol)からなる群から選択される1種以上であることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
- 前記第1溶液にはガリウム(Ga)塩がさらに含まれていることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
- 前記塩は、塩化物(chloride)、硝酸塩(nitrate)、亜硝酸塩(nitrite)、硫酸塩(sulfate)、酢酸塩(acetate)、亜硫酸塩(sulfite)、アセチルアセトネート塩(acetylacetonate)及び水酸化物(hydroxide)からなる群から選択される1つ以上の形態であることを特徴とする、請求項1又は3に記載のCI(G)Sナノ粒子の製造方法。
- 前記VI族ソースは、Na2Se、K2Se、Ca2Se、(CH3)2Se、SeO2、SeCl4、H2SeO3、Na2S、K2S、Ca2S、(CH3)2S、H2SO4、NH2SO3H、(NH2)2SO2、Na2S2O3及びこれらの水和物からなる群から選択される1つ以上であることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
- 前記VI族ソースは、チオ尿素(thiourea)、チオアセトアミド(thioacetamide)、セレノ尿素(selenourea)、及び亜セレン酸(selenous acid)からなる群から選択される1つ以上であることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
- 前記合成されたCI(G)Sナノ粒子は、30nm〜200nmの平均粒径を有する球状粒子であることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
- 前記CI(G)Sナノ粒子は、50nm〜150nmの平均粒径を有することを特徴とする、請求項7に記載のCI(G)Sナノ粒子の製造方法。
- 前記合成されたCI(G)Sナノ粒子は、無定形の1次前駆体粒子のチャネルに銅(Cu)イオンがマイグレーション(migration)された形態であることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
- 前記1次前駆体粒子は無定形であり、銅(Cu)イオンがマイグレーション(migration)されたCI(G)Sナノ粒子は、無定形であるか、または無定形の1次前駆体粒子に銅イオンがマイグレーションされることによって結晶形が一部形成された形態であることを特徴とする、請求項1に記載のCI(G)Sナノ粒子の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0085340 | 2013-07-19 | ||
KR20130085340 | 2013-07-19 | ||
PCT/KR2014/006231 WO2015008974A1 (ko) | 2013-07-19 | 2014-07-11 | 광흡수층 제조용 ci(g)s 나노 입자의 제조 방법 및 이 방법에 의해 제조된 ci(g)s 나노 입자 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015527971A JP2015527971A (ja) | 2015-09-24 |
JP5968544B2 true JP5968544B2 (ja) | 2016-08-10 |
Family
ID=52346375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015527411A Active JP5968544B2 (ja) | 2013-07-19 | 2014-07-11 | 光吸収層製造用ci(g)sナノ粒子の製造方法及びその方法により製造されたci(g)sナノ粒子 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9356168B2 (ja) |
EP (1) | EP3024036B1 (ja) |
JP (1) | JP5968544B2 (ja) |
KR (1) | KR101621743B1 (ja) |
CN (1) | CN104488091B (ja) |
ES (1) | ES2700823T3 (ja) |
TW (1) | TWI562955B (ja) |
WO (1) | WO2015008974A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107059131A (zh) * | 2017-04-21 | 2017-08-18 | 南京信息工程大学 | 一种半导体纳米晶及其制备方法与应用 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7663057B2 (en) * | 2004-02-19 | 2010-02-16 | Nanosolar, Inc. | Solution-based fabrication of photovoltaic cell |
KR100495925B1 (ko) * | 2005-01-12 | 2005-06-17 | (주)인솔라텍 | 태양전지용 광흡수층 및 그 제조 방법 |
KR100850000B1 (ko) | 2005-09-06 | 2008-08-01 | 주식회사 엘지화학 | 태양전지 흡수층의 제조방법 |
GB0522027D0 (en) * | 2005-10-28 | 2005-12-07 | Nanoco Technologies Ltd | Controlled preparation of nanoparticle materials |
FR2898519B1 (fr) * | 2006-03-20 | 2009-01-09 | Commissariat Energie Atomique | Nanoparticules notamment a structure coeur coquilles, enrobees |
KR100909179B1 (ko) * | 2006-07-24 | 2009-07-22 | 주식회사 엘지화학 | Cis계 태양전지 흡수층의 제조방법 |
WO2008057119A1 (en) * | 2006-11-09 | 2008-05-15 | Midwest Research Institue | Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors |
EP2101931B1 (en) * | 2006-11-09 | 2015-05-13 | Alliance for Sustainable Energy, LLC | Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films |
KR101054747B1 (ko) * | 2007-10-18 | 2011-08-05 | 주식회사 엘지화학 | 환원제를 이용한 6a족 원소를 포함하는 화합물의제조방법 |
KR20090110090A (ko) * | 2008-04-17 | 2009-10-21 | 엘지전자 주식회사 | 초음파를 이용한 인듐 셀레나이드 나노화합물의 제조방법및 이를 포함하는 화합물 반도체 태양전지 |
JP5180813B2 (ja) * | 2008-12-26 | 2013-04-10 | Dowaホールディングス株式会社 | カルコゲン化合物粉の製造方法 |
US20110076798A1 (en) * | 2009-09-28 | 2011-03-31 | Rohm And Haas Electronic Materials Llc | Dichalcogenide ink containing selenium and methods of making and using same |
US20130280854A1 (en) * | 2010-10-05 | 2013-10-24 | The University Of Melbourne | Sintered device |
JP5497160B2 (ja) * | 2010-12-07 | 2014-05-21 | Dowaホールディングス株式会社 | カルコゲン化合物粉、カルコゲン化合物ペースト、カルコゲン化合物粉の製造方法、カルコゲン化合物ペーストの製造方法およびカルコゲン化合物薄膜の製造方法 |
KR101197228B1 (ko) | 2010-12-29 | 2012-11-02 | 재단법인대구경북과학기술원 | 화합물 반도체 태양전지의 광흡수층 제조방법 |
US20120280185A1 (en) * | 2011-05-06 | 2012-11-08 | Yueh-Chun Liao | Method for Forming an Ink |
JP5962306B2 (ja) | 2011-08-31 | 2016-08-03 | 東レ株式会社 | 炭素繊維強化樹脂組成物およびその成形品 |
JP2013064108A (ja) * | 2011-09-16 | 2013-04-11 | Delsolar Co Ltd | インク組成物及びその形成方法 |
CN102923763B (zh) * | 2012-09-19 | 2014-03-12 | 江苏大学 | 离子交换法合成铜铟硒纳米片的方法 |
-
2014
- 2014-07-08 KR KR1020140085099A patent/KR101621743B1/ko active IP Right Grant
- 2014-07-11 JP JP2015527411A patent/JP5968544B2/ja active Active
- 2014-07-11 EP EP14814659.0A patent/EP3024036B1/en active Active
- 2014-07-11 WO PCT/KR2014/006231 patent/WO2015008974A1/ko active Application Filing
- 2014-07-11 CN CN201480001912.9A patent/CN104488091B/zh active Active
- 2014-07-11 ES ES14814659T patent/ES2700823T3/es active Active
- 2014-07-15 TW TW103124269A patent/TWI562955B/zh active
-
2015
- 2015-01-02 US US14/588,864 patent/US9356168B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI562955B (en) | 2016-12-21 |
EP3024036B1 (en) | 2018-09-05 |
CN104488091B (zh) | 2016-10-26 |
ES2700823T3 (es) | 2019-02-19 |
CN104488091A (zh) | 2015-04-01 |
TW201518201A (zh) | 2015-05-16 |
KR101621743B1 (ko) | 2016-05-17 |
WO2015008974A1 (ko) | 2015-01-22 |
EP3024036A1 (en) | 2016-05-25 |
US9356168B2 (en) | 2016-05-31 |
EP3024036A4 (en) | 2017-04-05 |
US20150118473A1 (en) | 2015-04-30 |
KR20150010598A (ko) | 2015-01-28 |
JP2015527971A (ja) | 2015-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6113284B2 (ja) | 金属ナノ粒子を含む光吸収層製造用インク組成物及びそれを用いた薄膜の製造方法 | |
JP6316947B2 (ja) | 太陽電池光吸収層製造用3層コア−シェルナノ粒子及びその製造方法 | |
KR101747540B1 (ko) | 금속 칼코게나이드 나노 입자의 제조방법 및 그에 기반한 광흡수층 박막의 제조방법 | |
KR101650049B1 (ko) | 태양전지 광흡수층 제조용 금속 칼코게나이드 나노 입자 및 이의 제조방법 | |
JP6276401B2 (ja) | 太陽電池の光吸収層製造用金属カルコゲナイドナノ粒子及びその製造方法 | |
KR20150016139A (ko) | 태양전지 광흡수층 제조용 잉크 조성물 및 이를 사용한 박막의 제조 방법 | |
JP6338660B2 (ja) | 太陽電池光吸収層製造用凝集相前駆体及びその製造方法 | |
JP5968544B2 (ja) | 光吸収層製造用ci(g)sナノ粒子の製造方法及びその方法により製造されたci(g)sナノ粒子 | |
KR101660265B1 (ko) | 태양전지 광흡수층 제조용 금속 칼코게나이드 나노 입자 및 이의 제조방법 | |
KR101869138B1 (ko) | 태양전지 광흡수층 제조용 전구체 및 이의 제조방법 | |
KR101723062B1 (ko) | 태양전지 광흡수층 제조용 금속 칼코게나이드 나노 입자 및 이의 제조방법 | |
KR101723033B1 (ko) | 태양전지의 광흡수층 제조용 전구체 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160506 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160606 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160705 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5968544 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |