JP5956584B2 - 硝酸含有媒質中でのエッチング後のプラスチック表面の処理 - Google Patents
硝酸含有媒質中でのエッチング後のプラスチック表面の処理 Download PDFInfo
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- JP5956584B2 JP5956584B2 JP2014533529A JP2014533529A JP5956584B2 JP 5956584 B2 JP5956584 B2 JP 5956584B2 JP 2014533529 A JP2014533529 A JP 2014533529A JP 2014533529 A JP2014533529 A JP 2014533529A JP 5956584 B2 JP5956584 B2 JP 5956584B2
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- 229920003023 plastic Polymers 0.000 title claims description 47
- 239000004033 plastic Substances 0.000 title claims description 47
- 238000005530 etching Methods 0.000 title claims description 20
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 title claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 title claims description 5
- 238000000034 method Methods 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 150000001412 amines Chemical class 0.000 claims description 30
- 239000000243 solution Substances 0.000 claims description 28
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 20
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- -1 nitrate ions Chemical class 0.000 claims description 16
- 239000003929 acidic solution Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 229910002651 NO3 Inorganic materials 0.000 claims description 10
- 229910021529 ammonia Inorganic materials 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 230000003750 conditioning effect Effects 0.000 claims description 8
- 150000003335 secondary amines Chemical class 0.000 claims description 8
- 150000003141 primary amines Chemical class 0.000 claims description 7
- 150000003512 tertiary amines Chemical class 0.000 claims description 7
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 5
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- MXZROAOUCUVNHX-UHFFFAOYSA-N 2-Aminopropanol Chemical compound CCC(N)O MXZROAOUCUVNHX-UHFFFAOYSA-N 0.000 claims description 4
- KDSNLYIMUZNERS-UHFFFAOYSA-N 2-methylpropanamine Chemical compound CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 claims description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical group CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 4
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 4
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 4
- LIWAQLJGPBVORC-UHFFFAOYSA-N ethylmethylamine Chemical compound CCNC LIWAQLJGPBVORC-UHFFFAOYSA-N 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 claims description 3
- 229940043276 diisopropanolamine Drugs 0.000 claims description 3
- 239000000080 wetting agent Substances 0.000 claims description 3
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 claims description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 2
- FNVOFDGAASRDQY-UHFFFAOYSA-N 3-amino-2,2-dimethylpropan-1-ol Chemical compound NCC(C)(C)CO FNVOFDGAASRDQY-UHFFFAOYSA-N 0.000 claims description 2
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 238000006056 electrooxidation reaction Methods 0.000 claims description 2
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 2
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- HXMVNCMPQGPRLN-UHFFFAOYSA-N 2-hydroxyputrescine Chemical compound NCCC(O)CN HXMVNCMPQGPRLN-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 238000010306 acid treatment Methods 0.000 claims 1
- 230000004913 activation Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 claims 1
- 229940102253 isopropanolamine Drugs 0.000 claims 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 28
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 25
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 24
- 238000004458 analytical method Methods 0.000 description 10
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 10
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 9
- 229910052804 chromium Inorganic materials 0.000 description 9
- 239000011651 chromium Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- 229920002857 polybutadiene Polymers 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 238000006555 catalytic reaction Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 2
- 238000004566 IR spectroscopy Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005102 attenuated total reflection Methods 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- DGEVYSNMDDDGCR-UHFFFAOYSA-N 3-ethylperoxypropan-1-amine Chemical compound CCOOCCCN DGEVYSNMDDDGCR-UHFFFAOYSA-N 0.000 description 1
- 206010007269 Carcinogenicity Diseases 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 231100000260 carcinogenicity Toxicity 0.000 description 1
- 230000007670 carcinogenicity Effects 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005588 protonation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007019 strand scission Effects 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Description
(1)続いて付けられる堆積物が良好な接着性を有するよう、プラスチックの表面が粗面化してぬれ性を有するように好適なエッチング液中でプラスチックをエッチングする工程と、
(2)典型的には銅又はニッケルの自己触媒的に付けられる金属コーティングの堆積を開始することが可能な金属のコロイド溶液又はイオン溶液を用いて、プラスチックの表面を活性化する工程と、
(3)自己触媒的に付けられる金属の薄層を堆積させる工程と、
(4)金属化プラスチック基材上への金属の電着を行う工程と、
を含む。
a)プラスチック基材を、硝酸イオンを含む酸性溶液と接触させることにより、少なくともプラスチック基材の表面をエッチングする工程と、
b)前記エッチングしたプラスチック基材を、アンモニア、アミン、又はこれらの組合せを含む水溶液を含む調整溶液と接触させる工程と、
c)前記エッチングされ調整されたプラスチック基材を活性化する工程と、
d)前記活性化されたプラスチック基材を無電解金属めっき液中に浸漬してその上に金属を堆積させる工程と、
を含む方法に関する。
a)プラスチック基材を、硝酸イオンを含む酸性溶液と接触させることにより、少なくともプラスチック基材の表面をエッチングする工程と、
b)前記エッチングしたプラスチック基材を、アンモニア、アミン、又はこれらの組合せを含む水溶液を含む調整溶液と接触させる工程と、
c)前記エッチングされ調整されたプラスチック基材を活性化する工程と、
d)前記活性化されたプラスチック基材を無電解金属めっき液中に浸漬してその上に金属を堆積させる工程と、
を含む。
R1、R2、R3及びR4は、独立して、同一又は異なっていてもよく、−CH3、−CH2CH3、−CH(CH3)2又は−CH2CH2OHから選択されてもよく、
R5は、−CH2CH2−、−CH2CH2CH2−、−CH2CH2CH2CH2−、−CH2CHOHCH2−、又は−CH2CH2OCH2CH2であり、
X及びYは、同一又は異なっていてもよく、Cl、Br、及びIから選択され、
v及びuは、同一又は異なっていてもよく、それぞれ1〜7とすることができ、
nは、2〜約200である。
R1、R2、R3及びR4がそれぞれCH3であり、
R5が、−CH2CH2OCH2CH2であり、
v及びuが3であり、
X及びYがClであり、
nが平均約6である、
Mirapol(登録商標)WT(Rhodiaから入手可能)である。
機器−PerkinElmerスペクトル100FTIR分光計
分析の詳細:
−減衰全反射(ATR)モード
−波数範囲 4000cm−1〜6000cm−1
−スキャンの回数 8
未処理のPOLYLAC(登録商標)PA727
従来のクロム酸/硫酸エッチング液で処理した、POLYLAC(登録商標)PA727。
実施例3は、非クロムエッチング液で処理したABS基材を示す。
実施例4は、非クロムエッチング液及びアンモニア後処理液で処理したABS基材を示す。
実施例5は、非クロムエッチング液、アンモニア後処理液、及び無電解ニッケル段階まで処理したABS基材を示す。
実施例6は、非クロムエッチング液、脱イオン水後処理液、及び無電解ニッケル段階まで処理したABS基材を示す。
実施例7は、非クロムエッチング液、N,N−ジメチルエタノールアミン後処理液、及び無電解ニッケル段階まで処理したABS基材を示す。
実施例8は、非クロムエッチング液、ジエチレントリアミン後処理液、及び無電解ニッケル段階まで処理したABS基材を示す。
実施例9は、非クロムエッチング液、高分子第四級アミン後処理液、及び無電解ニッケル段階まで処理したABS基材を示す。
Claims (21)
- プラスチック基材を処理して無電解めっきをその上に受ける方法であって、
a)前記プラスチック基材を、硝酸イオンを含む酸性溶液と接触させることにより、前記プラスチック基材の表面をエッチングする工程と、
b)前記エッチングしたプラスチック基材を、アンモニア、アミン、又はこれらの組合せを含む水溶液を含む調整溶液と接触させる工程と、
c)前記プラスチック基材を活性化する工程と、
d)前記活性化されたプラスチック基材を無電解金属めっき液と接触させてその上に金属を堆積させる工程と、
を含み、
前記酸性溶液が、電気化学的酸化の工程により最大の酸化状態とした+2価の銀イオンを酸化性金属イオンとして含み、
前記プラスチック基材を活性化する工程c)が、パラジウムを含む活性化溶液に前記プラスチック基材を接触させる工程である
ことを特徴とする方法。 - 酸性溶液が、さらに硫酸を含む請求項1に記載の方法。
- 酸性溶液が、硝酸銀及び硝酸を含む請求項2に記載の方法。
- 酸性溶液が、湿潤剤を含む請求項3に記載の方法。
- 工程(b)の後に、プラスチック基材を酸洗浄液に浸漬する工程を含む請求項1に記載の方法。
- アミンが、第一級アミン、第二級アミン、第三級アミン、及び第四級アミンの少なくとも1種を含む請求項1に記載の方法。
- 第一級アミンが、モノエチルアミン、モノ−n−プロピルアミン、イソプロピルアミン、モノ−n−ブチルアミン、イソブチルアミン、モノエタノールアミン、ネオペンタノールアミン、2−アミノプロパノール、3−アミノプロパノール、2−ヒドロキシ−2’(アミノプロポキシ)エチルエーテル、1−アミノプロパノール、モノイソプロパノールアミン、ジエチルアミノプロピルアミン、2−アミノエチルエタノールアミン、及びこれらの組合せからなる群から選択される請求項6に記載の方法。
- 第一級アミンが、モノイソプロパノールアミンを含む請求項7に記載の方法。
- 第二級アミンが、ジエチルアミン、ジブチルアミン、ジエタノールアミン、メチルエチルアミン、ジ−n−プロパノールアミン、イソプロパノールアミン、N−メチルエタノールアミン、ジエチレントリアミン、N−エチルエタノールアミン、N−メチルエタノールアミン、ジイソプロパノールアミン、及びこれらの組合せからなる群から選択される請求項6に記載の方法。
- 第二級アミンが、ジエタノールアミンを含む請求項9に記載の方法。
- 第三級アミンが、N,N−ジメチルエタノールアミン、トリエチルアミン、トリメチルアミン、トリイソプロピルアミン、メチルジエタノールアミン、トリエタノールアミン、及びこれらの1以上の組合せからなる群から選択される請求項6に記載の方法。
- 第三級アミンが、N,N−ジメチルエタノールアミンを含む請求項11に記載の方法。
- 第二級アミンが、ジエチレントリアミンを含む請求項9に記載の方法。
- 第四級アミンが、以下の一般式を有する高分子第四級アミンを含み、
R1、R2、R3及びR4は、独立して、同一又は異なっていてもよく、−CH3、−CH2CH3、−CH(CH3)2又は−CH2CH2OHから選択されてもよく、
R5は、−CH2CH2−、−CH2CH2CH2−、−CH2CH2CH2CH2−、−CH2CHOHCH2−、又は−CH2CH2OCH2CH2であり、
X及びYは、同一又は異なっていてもよく、Cl、Br、及びIから選択され、
v及びuは、同一又は異なっていてもよく、それぞれ1〜7とすることができ、
nは、2〜200である、
請求項6に記載の方法。 - 高分子第四級アミンにおいて、
R1、R2、R3及びR4がそれぞれCH3であり、
R5が−CH2CH2OCH2CH2であり、
v及びuが3であり、
X及びYがClであり、
nが平均6である、
請求項14に記載の方法。 - 調整溶液中のアミン及びアンモニアの少なくともいずれかの濃度が、5g/L〜100g/Lである請求項1に記載の方法。
- 調整溶液中のアミン及びアンモニアの少なくともいずれかの濃度が、10g/L〜50g/Lである請求項16に記載の方法。
- 調整溶液のpHが、0〜14である請求項1に記載の方法。
- 調整溶液のpHが、6〜12である請求項18に記載の方法。
- 工程(d)の前に、活性化されたプラスチック基材を酸処理に接触させる工程を更に含む請求項1に記載の方法。
- 無電解金属めっき液が、無電解ニッケルを含む請求項1に記載の方法。
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US13/248,550 US20130084395A1 (en) | 2011-09-29 | 2011-09-29 | Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media |
US13/248,550 | 2011-09-29 | ||
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JP5930525B2 (ja) * | 2011-12-20 | 2016-06-08 | 株式会社Adeka | 無電解めっき前処理剤及び該前処理剤を用いた無電解めっき前処理方法 |
WO2015183304A1 (en) | 2014-05-30 | 2015-12-03 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
KR20170008309A (ko) | 2014-07-10 | 2017-01-23 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 수지 도금 방법 |
JP7005363B2 (ja) * | 2018-01-29 | 2022-01-21 | マクセル株式会社 | メッキ膜被覆体の製造方法及び前処理液 |
WO2021014599A1 (ja) * | 2019-07-24 | 2021-01-28 | マクセルホールディングス株式会社 | メッキ部品の製造方法、及び無電解メッキ触媒付与用の前処理液 |
CN113637970A (zh) * | 2020-04-27 | 2021-11-12 | 苏州硕贝德创新技术研究有限公司 | 一种增强非导体表面金属化附着力的方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899617A (en) * | 1973-07-19 | 1975-08-12 | Enthone | Process for conditioning ABS resin surface |
US4132700A (en) * | 1976-02-04 | 1979-01-02 | Ethyl Corporation | Process for preparing filled polyvinyl chloride compositions |
JPS5481127A (en) * | 1977-12-13 | 1979-06-28 | Toshiba Corp | Method of forming chemical plating foundation |
US4370401A (en) * | 1979-12-07 | 1983-01-25 | Minnesota Mining And Manufacturing Company | Light sensitive, thermally developable imaging system |
US4415406A (en) * | 1980-03-07 | 1983-11-15 | Standard Oil Company | Chemical etching of polymers for metallizing |
US4652311A (en) * | 1984-05-07 | 1987-03-24 | Shipley Company Inc. | Catalytic metal of reduced particle size |
GB8613960D0 (en) * | 1986-06-09 | 1986-07-16 | Omi International Gb Ltd | Treating laminates |
DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
DE3743743A1 (de) * | 1987-12-23 | 1989-07-06 | Basf Ag | Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung |
US5073303A (en) * | 1988-06-20 | 1991-12-17 | Bsg, Inc. | Photochromic emulsion |
US5160600A (en) * | 1990-03-05 | 1992-11-03 | Patel Gordhanbai N | Chromic acid free etching of polymers for electroless plating |
US5132191A (en) * | 1990-10-26 | 1992-07-21 | General Electric Company | Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
GB9722028D0 (en) * | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
DE19918833C2 (de) * | 1999-04-22 | 2002-10-31 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens |
US6387229B1 (en) * | 1999-05-07 | 2002-05-14 | Enthone, Inc. | Alloy plating |
DE10022987A1 (de) * | 2000-05-11 | 2001-11-22 | Aventis Cropscience Gmbh | Kombinationen von Pflanzenschutzmitteln mit kationischen Polymeren |
DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
JP2002252445A (ja) * | 2001-02-26 | 2002-09-06 | Nec Toyama Ltd | 印刷配線板の製造方法 |
US6645557B2 (en) * | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
US7481948B2 (en) * | 2002-02-19 | 2009-01-27 | Honeywell International Inc. | Heat transfer compositions with high electrical resistance for fuel cell assemblies |
US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
DE102005051632B4 (de) * | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
EP1793013B1 (en) * | 2005-12-05 | 2017-07-19 | Rohm and Haas Electronic Materials LLC | Metallization of dielectrics |
DE102005060030A1 (de) * | 2005-12-15 | 2007-06-21 | Coventya Gmbh | Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung |
US8394289B2 (en) | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
EP1876262A1 (en) * | 2006-07-07 | 2008-01-09 | Rohm and Haas Electronic Materials, L.L.C. | Environmentally friendly electroless copper compositions |
US20100155255A1 (en) * | 2007-05-22 | 2010-06-24 | Okuno Chemical Industries Co., Ltd. | Pretreatment process for electroless plating of resin molded body, method for plating resin molded body, and pretreatment agent |
JP5715748B2 (ja) * | 2008-10-31 | 2015-05-13 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 無電解めっき用コンディショナー |
DE102011000138A1 (de) * | 2011-01-14 | 2012-07-19 | Lpkf Laser & Electronics Ag | Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger |
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