JP5951425B2 - Solder ball printing device - Google Patents

Description

  The present invention relates to a printing apparatus that supplies solder balls onto electrodes of a semiconductor substrate, and more particularly to a solder ball printing apparatus that includes a solder ball supply unit that supplies solder balls to a filling head.

  An example of a conventional solder ball printing apparatus is described in Patent Document 1. In the printing machine described in this publication, in order to disperse the solder balls uniformly on the mask surface with a simple configuration and to fill the openings of the mask, the solder ball supply head stores the solder balls. A solder ball supply unit for supplying a predetermined amount of solder balls to the mask surface is provided below the solder ball storage unit. The solder ball supply head further includes a solder ball filling member, and a plurality of solder ball filling members are provided across the solder ball supply member, and the solder ball is pressed against the opening of the mask surface as the solder ball supply head moves. However, it is configured to scrape excess solder balls. Therefore, it has a semi-spiral wire on the side that contacts the mask surface.

  A conventional example of a weighing device used when supplying solder balls to a solder ball printing apparatus is described in Patent Document 2. In the granular material measuring device described in this publication, when supplying solder balls, which are granular materials, to the transfer head, the supply amount is measured and then supplied to the printing unit. That is, the measuring device includes a storage unit for storing the particulate matter and a measuring unit for measuring. The measuring unit has a measuring cavity for measuring the particulate matter, a temporary storage cavity for temporarily storing the measured particulate matter, and a flow path connecting them.

  The angle difference between the measuring cavity and the temporary storage cavity is set to 90 degrees, and the solder ball is first supplied to the storage unit and held in the standby state which is the reference state. The meter is then rotated 90 degrees to the right. Thereby, the granular material filled in the measurement cavity in the standby state is temporarily moved to the temporary storage cavity. At this time, the amount of the particulate matter moved into the temporary storage cavity is regarded as the measured amount of solder balls. Next, the meter is rotated 90 degrees counterclockwise to discharge the particulate material in the temporary storage cavity and fill the metering cavity with the particulate material. By repeating the above operation, the weighing operation is executed.

JP 2010-135457 A JP 2009-204442 A

  In the solder ball printing apparatus described in Patent Document 1, a solder ball storage section constituted by a syringe or the like is rotatably provided on the solder ball supply table. In a normal state, the solder ball discharge port of the solder ball storage unit is set in the horizontal direction, and the rotary actuator rotates the solder ball storage unit when supplying the solder ball to the solder ball supply unit. As a result, the solder ball storage section is operated according to the amount of solder balls in the solder ball supply section so that the solder balls can be replenished.

  In the printing machine described in Patent Document 1, since the solder balls in the solder ball supply unit can be supplied, it is possible to supply according to the change in the required amount. However, there is no sufficient disclosure on how to secure the necessary amount of solder balls in the solder ball supply unit.

  Further, in the weighing device described in Patent Document 2, a flow path through which solder balls circulate is formed in one of two superposed plates by an S-shaped process. A measuring cavity and a primary storage cavity are provided in the flow path until the solder balls are discharged, and the discharging and filling of the particulate matter are alternately performed by rotating the measuring device by 90 degrees. In this weighing device, since the solder balls are discharged after storing a certain amount, they cannot be discharged continuously, and it is necessary to repeat the rotating operation of the measuring device many times. Further, since the solder ball container must be rotated together, it is necessary to secure a sufficient space.

  The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to appropriately control a solder ball supply amount by a solder ball supply mechanism provided in a solder ball printing apparatus. It is another object of the present invention to be able to supply an arbitrary amount of solder balls with high accuracy without causing an increase in the size of the apparatus.

  In order to achieve the above object, in the present invention, a mask for printing a solder ball on an electrode formed on a substrate placed on a printing table and a solder ball filling head are provided, and the solder ball filling head is a solder ball. The filling unit is composed of a filling unit and a solder ball supply unit, and a filling head vertical drive mechanism for moving the solder ball filling unit and the solder ball supply unit up and down together, and moving the solder ball supply unit up and down to move the solder ball It consists of a feed unit vertical drive mechanism that feeds and stops.

  The solder ball supply unit is composed of a syringe for storing the solder ball and a hose for supplying the solder ball onto the mask surface. The solder ball supply unit is moved up and down by the supply unit up-and-down driving mechanism. The solder ball is supplied and stopped by bending or stretching the wire.

  Further, the present invention for achieving the above object is characterized in that a mask on which a large number of openings are formed is superposed on a substrate placed on a printing table and on which an electrode is formed, and an electrode of the substrate is used by using a solder ball filling head. In the solder ball printing apparatus for printing a solder ball on the solder ball, the solder ball filling head includes a solder ball filling portion for filling the solder ball into the mask, and a solder ball filling portion for storing the solder ball in the solder ball filling portion. A solder ball supply unit for supplying a predetermined amount, and the solder ball supply unit is connected to the syringe for storing the solder ball, and the flow path for supplying the solder ball onto the surface of the mask. A flexible antistatic hose forming an intermediate portion of the antistatic hose and forming the solder ball on the mask And an inclined switching mechanism for switching between the stopping and to supply to the surface, the tilt switch mechanism is to varying the angle of the first straight line portion formed in the middle of the antistatic hose.

  With the above configuration, the solder ball can be supplied by extending the hose for supplying the solder ball, and the supply of the solder ball can be stopped by bending, and the desired amount can be controlled by controlling the supply time of the solder ball. Solder balls can be supplied onto the mask surface, the amount of solder balls consumed can be properly managed, and high-precision printing can be performed.

  Further, according to the present invention, the solder ball supply portion is a flow path made of an elastic member, and the inclination switching mechanism is provided in the flow path, so that a desired amount of solder balls can be supplied onto the mask surface. As a result, in the solder ball printing apparatus, the consumption amount of the solder balls can be properly managed, and printing can be performed while supplying the balls easily. In addition, it is only necessary to provide a flow path made of an elastic member and an inclination switching mechanism, and the solder ball can be supplied to the mask surface by simply moving up and down without moving the solder ball storage portion, etc. Can be avoided.

1 is a schematic configuration diagram of a solder ball printing apparatus. It is a schematic block diagram of a solder ball filling head. It is a figure explaining a solder ball filling member. It is a figure explaining operation | movement of a solder ball supply part. It is a figure which shows the state of a solder ball filling part, a mask, and a printed circuit board. It is a figure which shows the other Example of a solder ball supply mechanism. It is a figure for demonstrating operation | movement of a solder ball supply mechanism. It is a flowchart which shows the process of solder ball printing.

  Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 shows the overall configuration of the solder ball printing apparatus of the present invention. FIG. 1A shows a state before the solder ball is filled, and FIG. 1B shows a state during the solder ball filling. FIG. 2 is a configuration diagram of the solder ball printing head portion and shows a state away from the mask surface. FIG. 3 shows a plan view of the solder ball filling portion before being attached to the wire filling member mounting frame. FIG. 4A is a diagram showing a state where the solder ball supply unit is in contact with the mask surface. FIG. 4B is a diagram illustrating a state in which solder balls are supplied from the solder ball supply unit to the mask surface.

  As shown in FIG. 1, the solder ball printing apparatus 1 is provided with a support 2, and a moving beam 10 for moving the solder ball filling head 3 horizontally on the surface of the mask 12 is provided above the support 2. The head table 8 provided with the solder ball filling head 3 is configured to reciprocate in the horizontal direction (X-axis direction) on the surface of the mask 12 by rotationally driving the ball screw 5 through the coupling 6a by the driving motor 6. It has become. A solder ball supply unit 4 constituting the solder ball filling head 3 is attached to a head table 8. The head table 8 includes a vertical driving cylinder 7 constituting a charging head vertical driving mechanism for moving the solder ball filling unit 9 and the solder ball supply unit 4 up and down (Z-axis direction), and an auxiliary vertical driving mechanism (not shown). Is provided. Further, a supply unit drive cylinder 4M (see FIG. 2), which is a supply unit vertical drive mechanism that moves only the solder ball supply unit up and down, is provided.

  That is, the solder ball supply unit 4 is configured to move up and down together with the solder ball filling unit 9 by the vertical drive cylinder 7 and to move the solder ball supply unit 4 up and down independently. For this reason, the hose 4c (antistatic hose) for supplying the solder ball attached to the solder ball supply unit 4 is set to have a slack length so that it can move up and down independently. The mask 12 is provided on the mask mounting frame 11 and can be configured to move the mask mounting frame 11 up and down.

  Further, a printing table 17 is provided on the gantry 1 a side of the solder ball printing apparatus 1, and a camera moving beam 13 is provided between the printing table 17 and the mask 12. The camera moving beam 13 is provided on the support column 2 provided on the gantry 1a, and is configured to be movable in the front-rear direction (Y-axis direction) in the figure. Although not shown, the printing table 17 is provided with a vacuum suction mechanism having a plurality of suction holes for fixing the substrate 15 to be printed. Note that a vertical two-view camera 14 that moves on the camera moving beam 13 is provided on a moving table (not shown). Although not shown, the print table 17 is configured to be movable in the horizontal direction (front / rear / left / right / rotation direction). In other words, the printing table 17 is provided with a printing table vertical drive mechanism 16 for moving up and down, and an XYθ table below the printing table 17 to move the printing table in a horizontal direction (not shown). When the substrate 15 to be printed is placed on the printing table 17 and fixed, the upper and lower two-field camera 14 images the alignment marks provided on the mask 12 surface and the substrate 15 surface, and the control unit (not shown) Image processing is performed to detect misalignment of the alignment mark, the XYθ table is driven, and the print table 17 is horizontally moved by the misalignment to align the positions.

  When the alignment is completed, the table vertical drive mechanism 16 is operated to raise the printing table 17 and bring the substrate 15 into contact with the mask 12 surface. Next, the vertical drive mechanism 7 is operated to lower the filling portion 9 of the solder ball filling head 3 to a position where it contacts the surface of the mask 12. Then, the supply unit drive cylinder 4M is driven to move upward to extend the solder ball supply hose (antistatic hose) 4c connected to the supply port of the solder ball supply unit 4, and then the solder ball filling unit 9, solder balls are supplied to the surface of the mask 12, and then the solder ball filling head 3 is moved horizontally so that the solder balls 23 are transferred from the openings of the mask 12 to the electrode portions of the substrate 15 by the solder ball filling unit 9. To supply.

  FIG. 2 shows the overall configuration of the solder ball filling head. In this figure, the solder ball filling head 3 is separated from the surface of the mask 12, and a bent portion is provided in the middle of the solder ball supply hose 4c so that the solder ball 23 is not supplied to the mask surface. When the solder ball filling head 3 is outlined, the solder ball supply unit 4 and the solder ball filling unit 9 are attached to the head table 8 so as to be vertically movable. In the solder ball supply unit 4, a syringe 18 that stores a solder ball 23 is attached to a syringe attachment member (base plate) 20 by a fixture 39. A solder ball supply hose 4c is connected to a solder ball supply port provided at the lower portion of the syringe 18. Moreover, the supply part drive cylinder 4M is connected to the syringe attachment member 20, and this supply part drive cylinder 4M is driven to move the syringe 18 up and down together with the syringe attachment member 20. One end side of the solder ball supply hose 4c is fixed (screwed) to a lid provided in the solder ball filling portion 9. For this reason, when the supply part drive cylinder 4M is operated and the syringe 18 of the solder ball supply part 4 is moved up and down, the supply and stop of the solder ball 23 are stopped by expanding and contracting the intermediate part of the solder ball supply hose 4c. It can be carried out. That is, when the syringe 18 is moved away from the solder ball filling unit 9 (upward), the solder ball supply hose 4c extends to supply the solder ball 23 to the solder ball filling unit 9, and the syringe 18 is When the solder ball filling portion 9 is moved in a direction (downward), the solder ball supply hose 4c can be slackened, and the supply of the solder ball 23 is stopped.

  The solder ball filling unit 9 and the solder ball supply unit 4 are configured to move horizontally on a linear rail 10r provided on the moving beam 10, and are configured to be driven by a motor and a ball screw as described with reference to FIG. . The solder ball filling unit 9 includes a lid 22 (see FIG. 5), a filling member mounting frame 19 provided on the lid 22, and a solder ball filling member 21.

  In addition, a filling member 21 for filling the solder ball 23 into the mask opening is attached to the filling member mounting frame 19 below the lid portion 22. The filling member 21 is composed of a plurality of semi-helical wires. When a solder ball is supplied from the solder ball supply unit 4 into the filling member 21, the solder balls 23 are masked between the semi-spiral wires 21L. It is configured to be supplied on the surface. Further, as the solder ball filling head 3 moves horizontally (in the X-axis direction), a rotational force is applied to the solder ball 23 by the action of the semi-spiral wire 21L constituting the filling member 21, and the solder ball filling head 3 is easily pushed into the mask opening. Become. Further, the solder ball filling portion 9 can be easily dropped on the mask 12 surface by providing a vibration mechanism that vibrates in the same direction as the horizontal movement direction of the solder ball filling head 3.

  FIG. 3 shows a plan view of the wire 21L of the solder ball filling portion 9 before being attached to the filling member attachment frame 19 of the wire 21L. 3A is a plan view before the filling member 21 is attached to the filling member attachment frame 19, and FIG. 3B is an enlarged view of a portion B in FIG. 3A. As shown in the figure, the filling member 21 includes two attachment portions 21P (a width of the attachment portion is about 5 mm) provided in parallel and having a predetermined interval (about 35 mm in this embodiment), and the attachment portion 21P. A plurality of wires 21L (thickness 0.1 mm) having a predetermined angle (θ = about 5 to 35 degrees) are formed at a predetermined interval 21S (about 0.1 mm). The attachment portion 21P is provided with holes 21H for attachment to the filling member attachment frame 19 at a predetermined interval. The hole 21H is fixed to the filling member mounting frame 19 with screws or the like. The main wire 21L is formed by etching a steel sheet having a thickness of 0.1 mm. Note that the wire 21L of the present embodiment is provided in a state in which the axis is shifted in the two attachment portions 21P having a gap. The angle θ of the wire 21L is preferably about 10 degrees. The mounting portion 21P is formed such that the direction perpendicular to the direction of travel of the solder ball supply head 3 is the longitudinal direction. That is, it is the length of the width of the solder ball filling head 3. The wire 21L is attached so as to straddle the opening of the filling member attachment frame 19. That is, at the time of attachment, the upper half of the spiral coil is cut and attached in the vertical direction so as to straddle the opening of the solder ball filling member attachment frame 19. For this reason, when the solder ball filling head 3 is brought into contact with the mask side by applying a predetermined pressing force to the mask side by the head up-and-down drive mechanism 7, the wire rod having a predetermined angle with respect to the head traveling direction is in contact with the mask 12. Will move simultaneously.

  Although not shown, the solder ball filling head 3 is provided with a distance sensor constituted by an optical sensor in order to measure the amount of the solder ball 23 remaining on the surface of the mask 12. By moving the solder ball filling head 3, the height is measured with respect to the mask surface, and by measuring the height of the portion where the height of the mask surface is changed and the head moving distance, The height is obtained, and the remaining amount of the solder ball 23 is obtained from the width. That is, the height and the remaining amount of the solder ball 23 are measured in advance according to the diameter of the solder ball 23 to be used, and stored in the control unit, and the remaining amount is obtained using this.

  Next, the operation of supplying solder balls to the mask surface will be described with reference to FIGS.

  When supplying the solder balls, the solder ball filling head is lowered from the state of the solder ball filling head shown in FIG. 2 until the solder ball filling head shown in FIG. 4 (a) comes into contact with the mask surface, and the solder ball supply unit is bent. Shift to the state of having. Next, in a state where the solder ball filling portion 9 shown in FIG. 4B is lowered to the mask surface, the solder ball supply portion 4 shifts to a state where the solder ball supply hose 4c is extended to a state where there is no bending.

  That is, first, the filling head up-and-down drive mechanism 7 is driven and lowered until the filling member 21 contacts the mask 12. At this time, the syringe mounting member 20 is also lowered together. Until the filling member 21 comes into contact with the mask 12, the solder ball 23 is prevented from dropping onto the mask surface. Next, as shown in FIG. 4 (b), the solder ball supply unit 4 is raised, the solder ball supply hose 4 c is extended, and the solder ball 23 in the syringe 18 is placed on the mask 12 surface via the solder ball filling member 21. To supply. At this time, the amount of the solder balls 23 to be supplied onto the mask 12 surface is determined in advance by measuring the relationship between the amount of time for which the solder ball supply hose 4c is extended and the supply amount, and controlling the supply amount based on the result. Like to do. When a certain amount of solder balls 23 are supplied onto the surface of the mask 12, the syringe 18 is raised by the vertical drive mechanism so that the solder ball supply hose 4c is slack. In this state, the solder ball filling member 21 is moved in the horizontal direction, and the solder ball 23 is filled in the opening of the mask 12 surface.

  FIG. 5 shows a top view when the solder ball filling head 3 moves on the mask surface. In this figure, the head table 8 and the filling head vertical drive mechanism 7 are omitted. In the drawing, the mask 12 is placed on the substrate 15 and the filling head 3 moves in the X-axis direction on the mask 12. The width direction of the solder ball filling portion 9 is set longer than the width of the substrate 15.

  Next, another embodiment will be described with reference to FIG. FIG. 6 is a view showing portions of the solder ball supply unit 4 and the solder ball filling unit 9 in the solder ball filling head 3. In this figure, the configuration in which the solder balls are directly supplied from the solder ball supply unit 4 onto the mask surface is shown, but the configuration may be such that it is supplied to the central portion of the solder ball filling member 21 as in FIG. .

  The solder ball filling head 3 is connected to a head table 8, a drive cylinder 7 mounted on the head table 8, a solder ball supply unit 4 attached to the side of the head table 8, and the solder ball supply unit 4. The solder ball filling portion 9 is provided.

  The solder ball supply unit 4 is storage / supply means for supplying the solder ball 23 accommodated in the syringe 18 to the solder ball filling unit 9 and includes an antistatic hose 4c on the lower end side. Details of the solder ball supply unit 4 will be described later with reference to FIG.

  The solder ball filling unit 9 has a support member 24 attached to the tip of the piston rod 33 of the upper and lower cylinders 7 attached to the back side of the head table 8, and a plurality of filling member attachment frames 19 attached to the support member 24. doing. An antistatic hose 4 c of the solder ball supply unit 4 is attached to the side surface of the support member 24 by a fixture 27.

  A filling member 21 to be used when the solder ball 23 is pushed into a minute opening formed in the mask 12 is attached to the filling member mounting frame 19 by a fixture 25. The pair of the filling member mounting frame 19 and the filling member 21 is disposed in the moving direction of the solder ball filling head 3, that is, in the left-right direction in FIG. The filling member 21 collects the solder balls 23 which are supplied onto the surface of the mask 12 from the opening 4ch at the tip of the antistatic hose 4c and cannot fill the opening of the mask 12. At the same time, the solder balls 23 are filled into the openings of the mask 12 that are not filled with the solder balls 23.

  Here, the filling member 21 has the same configuration as that described with reference to FIG. 3, and includes a plurality of semi-spiral wires. When the solder ball 23 is supplied from the solder ball supply unit 4 to the solder ball supply hose (antistatic hose) 4c, the solder ball 23 is supplied to the upper surface of the mask 12 from the opening 4ch of the solder ball supply unit 4c. As the solder ball filling head 3 moves horizontally (X-axis direction), the semi-spiral wire constituting the filling member 21 moves and pushes the solder ball 23 into the opening of the mask 12.

  The solder ball filling head 3 is provided with a distance sensor (not shown) constituted by an optical sensor in order to measure the amount of the solder ball 23 remaining on the mask 12 surface. When the solder ball filling head 3 is moved horizontally, the height of the portion of the mask 12 where the opening of the mask 12 is filled with the solder ball 23 is higher than the surface of the mask 12. Therefore, if this height is measured, the remaining amount of the solder ball 23 can be obtained. That is, according to the diameter of the solder ball 23 to be used, the height and the remaining amount of the solder ball 23 are measured in advance, and these values are stored in a control unit (not shown) to obtain the remaining amount.

  Next, the solder ball supply unit 4 will be described with reference to FIG. In the solder ball supply unit 4, the cylindrical syringe 18 that stores the solder ball 23 is fixed to the vertically attached syringe mounting member 20 by a belt-shaped fixing means 39. Further, a pressing pin 39b is provided in order to make the mounting height of the syringe 18 constant. The lower end portion of the syringe 18 is conical, and the antistatic hose 4c is connected to the lower end of the constricted portion 18a via a connecting means 18b. The antistatic hose 4c has a vertically extending portion (first straight portion) 4ca and a vertically extending portion (third straight portion) 4cf and bent portions 4cb to 4ce. An inclination switching mechanism that switches the inclination of the antistatic hose 4c to stop the supply of the solder ball 23 to the solder ball filling section 9 at the middle portion (second straight portion) 4cd of the bent portion. 30.

  The antistatic hose 4c is made of resin, and preferably a flexible material such as tetrafluoroethylene resin. The antistatic hose 4c is preferably transparent or translucent. The length of the antistatic hose 4c for supplying the solder ball 23 to the solder ball filling part 9 is provided with a slack so that the solder ball filling part 9 can cope with the vertical movement.

  The tilt switching mechanism 30 includes a tilt switching plate 35 that is a rectangular plate, a hose fixture 36 that fixes the antistatic hose 4c to the tilt switching plate 35, a shaft 41a for rotating the tilt switching plate 35, and a bearing 42. (See FIG. 7C). A pinion 38 is fixed to one end of the shaft 41a, and a rack 37 is provided to rotate the pinion 38. The shaft 41a, the inclination switching plate 35, and the pinion 38 can be connected by using a key 41b or the like, or although not shown, the shaft 41a can be clamped and fixed. Further, in order to move the rack 37 up and down, a cylinder 41 is attached to one end (the upper end in FIG. 7B) side of the rack.

  When the rack 37 is moved up and down, the pinion 38 held by the syringe mounting member 20 via the bearing 42 is rotated, and the tilt switching plate 35 fixed to the pinion shaft 38a is also rotated. The inclination of the fixed antistatic hose 4c changes.

  A hole into which the pinion shaft 38 a is inserted is formed near the center of the tilt switching plate 35 so that the tilt switching plate 35 can rotate with respect to the syringe mounting member 20. The length of the antistatic hose 4c between the inclination switching plate 35 and the syringe 18 and between the inclination switching plate 35 and the solder ball filling portion 9 is such that excessive tension is applied to the antistatic hose 4c even when the inclination switching plate 35 rotates. It is set longer so that it will not be. Moreover, even if the inclination of the inclination switching plate 35 is changed or the solder ball filling portion 9 moves up and down, the length is such that the antistatic hose 4c can cope. Further, although not shown, an adjustment plate that can adjust the length of the antistatic hose 4 c is provided between the syringe 18 and the inclination switching plate 35.

  In this embodiment, when the supply of the solder ball 23 is stopped, the inclination switching plate 35 is inclined and installed so that the supply port side of the antistatic hose 4c is upward about 30 degrees (FIG. 7 ( b)). This prevents the solder ball 23 from falling into the solder ball filling portion 9. When the solder ball 23 is supplied to the solder ball filling unit 9, the controller 40 drives the rack 37 so that the supply port side of the antistatic hose 4c faces downward, and the inclination switching plate 35 is moved at an angle of about 45 degrees. (See FIG. 7 (d)). At this time, the antistatic hose 4c on the syringe 18 side is bent into a “<” shape.

  The amount of solder balls 23 to be supplied is obtained experimentally in advance. That is, the relationship between the elapsed time since the angle of the inclination switching plate 35 is set to 45 degrees and the amount of the supplied solder balls 23 is obtained and stored in the storage means 40 b of the controller 40. Based on this relationship, the calculating means 40a calculates the amount of solder balls 23 required and drives the rack 37 to control the supply time.

  In the present embodiment, the diameter of the microball used is 20 μm to 100 μm, and the inner diameter of the antistatic hose 4c is 4 mm. However, the present invention is not limited to this. Furthermore, in this embodiment, the solder ball supply unit 4 can be removed together with the syringe mounting member 20, and if the solder ball 23 disappears in the syringe 18, the entire syringe mounting member 20 may be replaced, so that maintenance is easy. .

  Further, a pin 35a is provided on the upstream side of the hose fixture 36 attached to the inclination switching plate 35 and below the portion where the antistatic hose 4c is located. The pin 35a is positioned downstream of the bent portion 4cc of the antistatic hose 4c. Since the pin 35a is provided, when the solder ball 23 is dropped by tilting the tilt switching plate 35, a straight portion can be secured on the tilt switching plate 35, and the solder ball 23 can be stably dropped.

  In addition, if two or more hose fixtures 36 for fixing the antistatic hose 4c to the inclination switching plate 35 are provided, a straight line portion can be reliably secured on the inclination switching plate 35. However, if the degree of freedom of deformation of the antistatic hose 4c is increased, the size of the printing apparatus 1 can be reduced. Therefore, in this embodiment, the position where the antistatic hose 4c is fixed to the tilt switching plate 35 is one place, and the straight portion of the antistatic hose 4c is secured by the pin 35a only when the solder ball is dropped.

  FIG. 8 shows a flowchart of the operation of the printing apparatus 1. This flowchart explains the method of stopping the supply of solder balls by bending or extending the antistatic hose by moving the solder ball supply unit up and down with respect to the solder ball filling unit described before the supply of solder balls. It is a thing. The method for rotating the middle portion of the hose differs only in the operation in the solder ball supply process, and the other processes are the same as the main operation.

  A substrate 15 for printing is mounted on the printing table 17 of the solder ball printer 1 (S10). Next, the board mounted on the printing table 17 is fixed to the printing table 17 (S11). When the fixing of the substrate 15 is completed, the two-view camera 14 is moved to image the alignment marks provided on the substrate 15 and the mask 12 (S12). The captured image is subjected to image processing to determine the amount of deviation of the mark position (S13). The printing table 17 is horizontally moved in accordance with the obtained shift amount to align the position (S14). When the alignment is completed, the two-field camera 14 is retracted, and the print table 17 is raised to a position where it contacts the surface of the mask 12 (S15). The solder ball filling portion 9 is lowered to a position where it contacts the surface of the mask 12 (S16). The solder ball supply unit 4 is raised with respect to the filling head 3, and a desired amount of solder balls 23 is supplied to the surface of the mask 12 through the solder ball filling unit 9 (S17). The solder ball supply unit 4 lowers the solder ball filling head 3 (S18). The solder ball filling head 3 is moved in the mask longitudinal direction (X direction) while horizontally oscillating, and the solder ball 23 is printed on the electrode surface on the substrate 15 from the opening of the mask 12 (S19). In addition, before carrying in the printing table 17, the flux is previously printed by the electrode part before solder ball supply. When printing is completed, the solder ball filling head 3 is raised, and the solder ball filling head 3 is separated from the mask 12 by a predetermined distance (S20). Next, the amount of the solder balls 23 remaining on the mask 12 surface is measured by moving the solder ball filling head 3 in the horizontal direction and using a height sensor (optical sensor) provided on the solder ball filling head 3. (S21). Based on the measurement result, the amount of the solder ball 23 used for the next printing is determined and recorded in the control unit (S22). The printing table 17 is lowered to separate the substrate 15 from the surface of the mask 12, and the substrate 15 is transported to the next process (S23).

  As described above, in the present invention, after the solder ball filling head is lowered to a position in contact with the mask surface, the supply time of the supply mechanism is controlled in order to supply the solder ball to the mask surface in a desired amount. Often, after printing is completed, the remaining amount of solder balls is measured by an optical sensor and the shortage is supplied, so that generation of useless solder balls can be eliminated.

  DESCRIPTION OF SYMBOLS 1 ... Solder ball printing apparatus, 2 ... Pillar, 3 ... Solder ball filling head, 4 ... Solder ball supply part, 4M ... Supply part drive cylinder, 5 ... Ball screw, 6 ... Drive motor, 6a ... Coupling, 7 ... Drive Cylinder, 8 ... head table, 9 ... solder ball filling unit, 10 ... moving beam, 10r ... linear rail, 11 ... mask mounting frame, 12 ... mask, 13 ... camera moving beam, 14 ... 2-field camera, 15 ... substrate ( Wafer), 16 ... Table vertical drive mechanism, 17 ... Print table, 18 ... Syringe, 19 ... Filling member mounting frame, 20 ... Syringe mounting member, 21 ... Filling member, 22 ... Cover, 23 ... Solder ball, 24 ... Support 30, an inclination switching mechanism, 35 ... an inclination switching plate.

Claims (7)

In a solder ball printing apparatus having a mask for printing solder balls on electrodes formed on a substrate placed on a printing table, and a solder ball filling head having a vertical drive mechanism for moving up and down on the mask surface ,
The solder ball filling head is composed of a solder ball filling unit and a solder ball supply unit, and a vertical drive mechanism that moves the solder ball filling unit and the solder ball supply unit up and down simultaneously, and the solder ball supply unit up and down. A supply drive mechanism for moving,
The solder ball supply unit connects the syringe storing the solder ball and the solder ball filling unit with an antistatic hose, and moves the syringe in a direction to separate the syringe with respect to the solder ball filling unit. A structure in which the prevention hose extends to supply solder balls to the solder ball filling section, and the syringe is moved in a direction approaching the solder ball filling section so that the antistatic hose can sag and the supply of the solder balls is stopped. Solder ball printing apparatus characterized by that. The solder ball printer according to claim 1,
A configuration in which the supply amount of the solder ball to the mask surface is controlled by the time for extending the antistatic hose , based on the relationship between the time for extending the antistatic hose measured in advance and the supply amount of the solder ball; Solder ball printing apparatus characterized by that. The solder ball printing apparatus according to claim 2,
The solder ball filling unit includes a support member connected to the piston rod of the vertical drive cylinder provided on the head table, the lower surface and a plurality of filling mounted side by side in the traveling direction of the solder ball filling head of the supporting support member A solder ball printing apparatus comprising: a part support member; and a filling member composed of a semi-spiral wire attached to a lower side of the filling part support member. The solder ball printing apparatus according to claim 2,
A solder ball printing apparatus, wherein a slack is provided on the syringe side of the antistatic hose, and the slack is formed at an approximately equal angle with respect to a horizontal direction when supplying a solder ball. The solder ball printing apparatus according to claim 3 ,
The antistatic hose is screwed to the lid constituting the solder ball filling unit, that solder balls through a wire semi helical shape constituting the filler member is configured to be supplied onto the mask surface Solder ball printing device characterized. The solder ball printer according to claim 1,
Instead of the supply unit driving mechanism, one end of the antistatic hose is fixed to the outer end of the solder ball filling unit, and the solder ball is supplied to the surface of the mask in the middle of the antistatic hose. An inclination switching mechanism for switching the stop is provided, and the solder ball is supplied and stopped by varying the inclination of the second linear portion formed in the intermediate portion of the antistatic hose. Solder ball printing device. The solder ball printing apparatus according to claim 6,
The tilt switching mechanism includes a syringe mounting member, a tilt switching plate rotatably provided on the syringe mounting member, and a fixing portion that fixes the antistatic hose to the tilt switching plate. A pinion that makes the inclination angle of the inclination switching plate variable is provided at one end of the antistatic hose, and a rack that meshes with the pinion is provided on the syringe mounting member. When the rack moves, the second straight line of the antistatic hose Solder ball printer characterized in that the inclination of the part is variable.

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