CN105813400A - Ball grid array (BGA) ball mounting method based on surface mount technology (SMT) chip mounter - Google Patents
Ball grid array (BGA) ball mounting method based on surface mount technology (SMT) chip mounter Download PDFInfo
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- CN105813400A CN105813400A CN201610193677.0A CN201610193677A CN105813400A CN 105813400 A CN105813400 A CN 105813400A CN 201610193677 A CN201610193677 A CN 201610193677A CN 105813400 A CN105813400 A CN 105813400A
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- bga
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
Abstract
The invention discloses a ball grid array (BGA) ball mounting method based on a surface mount technology (SMT) chip mounter. The BGA ball mounting method involves an SMT chip mounter, a solder ball supply device and a plurality of BAG support plates, wherein each BGA support plate is fixed on a rail of the chip mounter by a clamping device and comprises a BGA placing groove and a clamping part, the groove depth and the length and width of each BGA placing groove can be adjusted, the solder ball supply device comprises a vibration barrel and an inclined transmission rail, a telescopic baffle plate is arranged on the inclined transmission rail, an arc groove is formed in the inclined transmission rail and is used for placing a solder ball, a transparent cover is arranged above the inclined transmission rail, the depth of the arc groove is not less than one second of the diameter of the solder ball, the maximum distance between the transparent cover and the arc groove is smaller than twice of the diameter of the solder ball, and the inclined angle between the inclined transmission rail and a horizontal direction is smaller than 30 degrees. After the adoption of the above method, the method is simple and convenient in operation, high in production efficiency and low in cost, and can be applicable to mass production, and high restoration is achieved.
Description
Technical field
The present invention relates to a kind of BGA manufacture field, particularly a kind of BGA ball-establishing method based on SMT chip mounter.
Background technology
In SMT mounting technology, it is numerous and be hidden in the feature under encapsulation that BGA Package element (BGA) has number of welds, causes and is difficult to mounting quality is controlled, thus being difficult to realize the good welds of BGA.When the bad BGA of attachment is reprocessed, need to be dismantled, just necessarily cause stannum ball bottom BGA to damage.Reinstalling BGA, be necessary for being replied completely by soldered ball, method is exactly again plant ball.And any ball mode first step of planting all needs to clean out bottom BGA pad, but how to plant, the method for ball exists larger difference.
The ball-establishing method that at home and abroad each SMT production line is taked at present mainly has two kinds:
Plant ball by hand: utilize tweezers and filter screen to be placed in one by one by stannum ball in the BGA bottom land that need to plant ball, carry out Reflow Soldering afterwards.The shortcoming of this mode is that efficiency is low, not easily operates during soldered ball large number of, and stannum spherical pendulum puts slightly deviation, and just to easily cause tin welding in subsequent reflow weldering bad, operator requires height, underaction, it is impossible to plant ball suitable in multiple BGA.
Plant ball device and plant ball: common ball device of planting generally is made up of one block of web plate and a sleeve clamp, web plate position of opening mates with BGA bottom land, aperture is generally larger than sphere diameter, fixture is used for fixing BGA and web plate, make it closely cooperate will not rock, then soldered ball is spread out on web plate equably, rock and plant ball device, then soldered ball is rolled in the perforate of web plate, after each Kong Jun making web plate position of opening has rolled a soldered ball, finally unnecessary soldered ball is rolled into web edge, poured out by reserved opening, finally will plant ball device entirety and carry out Reflow Soldering, afterwards by BGA from planting taking-up ball device.The method is higher than manual ball success rate of planting, and speed is fast；Shortcoming is to be required for every kind different BGA buy or make corresponding web plate, and the conventional encapsulation of BGA just has hundreds of, and constantly has and newly encapsulate generation, and with high costs and web plate makes and at least needs 2-3 days, produces response speed slow.It addition, the mesh of web plate is more than Diameter of Solder Ball, when carrying out the soldered ball web plate demoulding, it is easily caused soldered ball position and does not fix, still need to after the demoulding manually adjust, otherwise may result in planting ball failure when Reflow Soldering.
8 months years 201310168536.X patent application on the 7th in 2013, disclose a kind of BGA and plant ball single-point repair method, comprising: first step: remove oxide layer and the pollutant of the bond pad surface of losing on bga chip bottom surface: second step: take paste soldering flux, and it is coated in and is lost on pad;Third step: be coated with in the second step to have helped and place the stannum ball matched with pad diameter on the pad of paste soldering flux;4th step: utilize heat gun by the air outlet vertical of heat gun in the way of bga chip bottom surface, the position that placed stannum ball at third step being heated: the 5th step: close heat gun after stannum ball melts, and whether detection reprocesses successful after closing heat gun.
Above-mentioned patent application, once can only plant ball to a single-point and reprocess, and work efficiency is low, additionally Hot-blast Heating welding, easily causes bga chip on the one hand and moves, and causes thermal loss relatively big on the other hand, and work efficiency is relatively slow, is not suitable for vigorously promoting the use.
No. 201210346219.8 Chinese invention patent, disclosed a kind of BGA and planted ball technique, utilize printer, carrier, steel mesh, tin cream, carry out batch and plant ball on January 16th, 2013.It is very fast that this invention produces corresponding speed, less costly, but carry out planting ball because have employed tin cream, owing to steel mesh thickness and pad opening diameter limit solder paste amounts, can cause that the BGA difference in height with untouched dress of the BGA after reprocessing is from bigger, the height of soldered ball cannot reduce, for need element height coordinate technique cannot use.
Summary of the invention
The technical problem to be solved in the present invention is for above-mentioned the deficiencies in the prior art, and provide a kind of simple to operation, adapt to produce in enormous quantities, production efficiency is high, the cost BGA ball-establishing method based on SMT chip mounter low, highly reducible.
For solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of BGA ball-establishing method based on SMT chip mounter, a kind of BGA ball-establishing method based on SMT chip mounter, it is characterised in that: comprise the following steps:
Step 1, BGA support plate size regulates: be consistent with the groove depth of ball BGA to be planted and length and width size by the groove depth of BGA placing trough in BGA support plate and length and width size adjusting.
Step 2, BGA support plate is fixed: is placed on by BGA in the BGA placing trough after step 1 size has regulated, and is fixed on chip mounter rail by BGA support plate by the clamping device in SMT chip mounter.
Step 3, soldered ball feedway installation and debugging: soldered ball feedway is arranged on the side of chip mounter rail, soldered ball feedway includes shake charging basket and tilts transporting rail；The one end tilting transporting rail is connected with shake charging basket, and the other end tilting transporting rail is provided for material level；It is positioned on the inclination transporting rail for material level upstream and is provided with telescopic baffle；Tilting and be provided with the arc groove for placing soldered ball on transporting rail, what tilt transporting rail is provided above translucent cover, and the degree of depth of arc groove is not less than 1/2nd of Diameter of Solder Ball, and the ultimate range between translucent cover and arc groove is less than twice Diameter of Solder Ball；Tilt the transporting rail angle with horizontal direction less than 30 °.
Step 4, soldered ball feed: poured into by soldered ball in the shake charging basket in step 3, and start shake charging basket, soldered ball will along tilting transporting rail roller to for material level.
Step 5, plants ball: start chip mounter, and the BGA calling correspondence plants ball paster program, and chip mounter suction nozzle, by the BGA pad in step 2 of the mounting solder ball in step 4, carries out planting ball.
Step 6, after having mounted, checks that the soldered ball on each BGA pad has intact ball, skew and bridge even.
Step 7, after confirming that attachment is qualified, puts to Reflow Soldering baking.
Step 8, plants ball and completes.
In described step 5, after chip mounter starts, whether the infrared sensor on SMT chip mounter can automatically detect BGA support plate and transmit and put in place；After BGA carrier plate transmission puts in place, chip mounter suction nozzle just starts action.
The twice that vertical dimension is chip mounter suction nozzle diameter between confession material level and the telescopic baffle of described soldered ball feedway.
The degree of depth of described arc groove is 2/3rds of Diameter of Solder Ball.
In described step 1, BGA support plate includes peripheral frame, base plate, cross spacing slide block and vertical spacing slide block；Peripheral frame and floor combination form BGA placing trough；Cross spacing slide block and vertical spacing slide block are arranged on the top of BGA placing trough, cross spacing slide block energy Y-direction sliding, and vertical spacing slide block energy X is to sliding；Base plate includes backing plate, counter-force bearing plate and pressurised airbag；Backing plate is fixedly installed on the bottom of peripheral frame, and counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, and pressurised airbag is fixedly installed between backing plate and counter-force bearing plate, is provided with pressure transducer in pressurised airbag.
After the present invention adopts said method, aforesaid operations is simple and convenient, adapt to production in enormous quantities, production efficiency is high, cost is low, highly reducible.
Accompanying drawing explanation
Fig. 1 shows the structural representation of a kind of BGA ball-planting device based on SMT chip mounter of the present invention.
Fig. 2 shows the structural representation of soldered ball feedway of the present invention.
Fig. 3 shows the top view of BGA the first embodiment of support plate.
Fig. 4 shows the sectional view of BGA the first embodiment of support plate.
Fig. 5 shows the top view of BGA support plate the second embodiment.
Fig. 6 shows the sectional view of BGA support plate the second embodiment.
Detailed description of the invention
Below in conjunction with accompanying drawing and concrete better embodiment, the present invention is further detailed explanation.
nullAs shown in Figures 1 to 6，A kind of BGA ball-planting device based on SMT chip mounter，Including SMT chip mounter 1、Chip mounter suction nozzle 11、Chip mounter rail 12、Clamping device 13、Infrared sensor 14、Soldered ball feedway 2、Shake charging basket 21、Tilt transporting rail 22、Translucent cover 221、For material level 222、Telescopic baffle 23、Heating and dehumidification machine 24、Photoelectric sensor 25、BGA support plate 3、Peripheral frame 31、Retaining part 32、Base plate 33、Counter-force bearing plate 34、Pressurised airbag 35、Pressure transducer 351、Height sensor 36、Cross spacing slide block 37、Vertical spacing slide block 38、Backing plate 39、Limited post 40、First motor 401、First displacement transducer 402、L-shaped postive stop baffle 41、Expansion link 411、Second motor 412、Touch sensor 413、The technical characteristics such as soldered ball 4 and BGA5.
As it is shown in figure 1, a kind of BGA ball-planting device based on SMT chip mounter, including SMT chip mounter, soldered ball feedway and some pieces of BGA support plates.
SMT chip mounter includes chip mounter suction nozzle, chip mounter rail, clamping device and the chip mounter being built in SMT chip mounter plants ball program；Clamping device is slidably connected on chip mounter rail.
Every piece of BGA support plate is fixed on chip mounter rail each through clamping device, and can slide along chip mounter rail.
Every piece of BGA support plate all includes BGA placing trough and the retaining part matched with clamping device, and groove depth and the length and width size of each BGA placing trough all can regulate.
Soldered ball feedway is arranged on the side of chip mounter rail.
As in figure 2 it is shown, soldered ball feedway includes shake charging basket, tilts transporting rail, heating and dehumidification machine, photoelectric sensor, humidity sensor and PLC.
The vibrations of shake charging basket are preferably driven by interval motor.
The one end tilting transporting rail is connected with shake charging basket, and the other end tilting transporting rail is provided for material level.
It is positioned on the inclination transporting rail for material level upstream and is provided with telescopic baffle；Tilting and be provided with the arc groove for placing soldered ball on transporting rail, the degree of depth of arc groove is not less than 1/2nd of Diameter of Solder Ball, it is preferred to 2/3rds of Diameter of Solder Ball.
What tilt transporting rail is provided above translucent cover, and the ultimate range between translucent cover and arc groove is less than twice Diameter of Solder Ball.
Tilt the transporting rail angle with horizontal direction less than 30 °, it is preferred to 15 ~ 20 °.
Heating and dehumidification machine is arranged on the surface for material level, and photoelectric sensor and humidity sensor are arranged on heating and dehumidification machine.
Shake charging basket, heating and dehumidification machine, photoelectric sensor, humidity sensor are all connected with PLC with telescopic baffle；Whether photoelectric sensor has soldered ball for detecting on material level；Humidity sensor is for detecting for the wetness of soldered ball on material level.
Further, it is the twice of chip mounter suction nozzle diameter in SMT chip mounter for the vertical dimension between material level and telescopic baffle.
Further, above-mentioned SMT chip mounter is additionally provided with can detect whether BGA support plate transmits the infrared sensor put in place.
Further, the twice that vertical dimension is chip mounter suction nozzle diameter between confession material level and the telescopic baffle of above-mentioned soldered ball feedway.
Above-mentioned BGA support plate groove depth and length and width size all can regulate, and have the following two kinds preferred embodiment.
The first embodiment
BGA support plate includes BGA placing trough and the retaining part matched with clamping device, and groove depth and the length and width size of BGA placing trough all can regulate；BGA support plate includes peripheral frame, base plate, cross spacing slide block and vertical spacing slide block；Peripheral frame and floor combination form BGA placing trough；Cross spacing slide block and vertical spacing slide block are arranged on the top of BGA placing trough, cross spacing slide block energy Y-direction sliding, and vertical spacing slide block energy X is to sliding；Base plate includes backing plate, counter-force bearing plate and pressurised airbag；Backing plate is fixedly installed on the bottom of peripheral frame, and counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, and pressurised airbag is fixedly installed between backing plate and counter-force bearing plate, is provided with pressure transducer in pressurised airbag.
The outer surface of pressurised airbag is bonding with backing plate and counter-force bearing plate respectively.
The groove depth of BGA placing trough can be adjusted between 1-4mm, can cover current all types of BGA size.
The height dimension of cross spacing slide block and vertical spacing slide block is both preferably 1mm.
The medial wall of peripheral frame is preferably provided with groove depth scale.
Further, peripheral frame or be provided with the height sensor that can detect BGA placing trough groove depth size on backing plate, this height sensor is connected with pressure transducer.
The second embodiment
BGA support plate includes BGA placing trough and the retaining part matched with clamping device, and groove depth and the length and width size of BGA placing trough all can regulate；BGA support plate includes peripheral frame, base plate and L-shaped postive stop baffle；Peripheral frame and floor combination form BGA placing trough；L-shaped postive stop baffle is arranged on the top of BGA placing trough, and the outer corner point of L-shaped postive stop baffle is connected by expansion link is fixing with an inside corner point of peripheral frame；Base plate includes backing plate, counter-force bearing plate and lifting column；Backing plate is fixedly installed on the bottom of peripheral frame, counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, lifting column is fixedly installed between backing plate and counter-force bearing plate, fix with the first motor being arranged in backing plate bottom lifting column and be connected, lifting column is provided with displacement transducer.
Further, expansion link and the second motor are connected, and the second motor drives the flexible of expansion link.
Further, the side that L-shaped postive stop baffle contacts with BGA is provided with the touch sensor being connected with the second motor.When L-shaped postive stop baffle contacts with BGA, making contact signal can be sent to the second motor by touch sensor, makes the second motor quit work.
Further, the groove depth of BGA placing trough can be adjusted between 1-4mm.
Further, the height of L-shaped postive stop baffle is 1mm.
The size adjustment method of above-mentioned flexible BGA support plate, comprises the following steps:
Step 1, BGA support plate assembles: BGA support plate includes peripheral frame, base plate and L-shaped postive stop baffle；Peripheral frame and floor combination form BGA placing trough；L-shaped postive stop baffle is arranged on the top of BGA placing trough, and the outer corner point of L-shaped postive stop baffle is connected by expansion link is fixing with an inside corner point of peripheral frame；Base plate includes backing plate, counter-force bearing plate and lifting column；Backing plate is fixedly installed on the bottom of peripheral frame, counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, lifting column is fixedly installed between backing plate and counter-force bearing plate, fix with the first motor being arranged in backing plate bottom lifting column and be connected, lifting column is provided with displacement transducer.
Step 2, BGA placing trough groove depth regulates: the gauge according to ball BGA to be planted, and arranges the lifting shift value of lifting column top offset sensor；Start the first motor, lifting column is made to increase together with counter-force bearing plate, the lifting displacement of lifting column is detected by displacement transducer in real time, when rising to the lifting shift value of setting, stop signal is sent to the first motor by displacement transducer, first motor quits work, and BGA placing trough groove depth has regulated.
Step 3, places ball BGA to be planted: be placed in the BGA placing trough that step 2 groove depth size has regulated by ball BGA to be planted, and the upper surface making ball BGA to be planted is concordant with BGA placing trough top.
Step 4, BGA placing trough length and width size regulates: the expansion link elongation in step 1, makes L-shaped postive stop baffle that two adjacent side of ball BGA to be planted in step 3 to be fixed.
Step 5, is fixed on chip mounter rail by the BGA support plate that BGA placing trough length and width size in step 4 regulates by the clamping device in SMT chip mounter, waits and plants ball.
A kind of BGA ball-establishing method based on SMT chip mounter, comprises the following steps.
Step 1, BGA support plate size regulates: be consistent with the groove depth of ball BGA to be planted and length and width size by the groove depth of BGA placing trough in BGA support plate and length and width size adjusting.
Step 2, BGA support plate is fixed: is placed on by BGA in the BGA placing trough after step 1 size has regulated, and is fixed on chip mounter rail by BGA support plate by the clamping device in SMT chip mounter.
Step 3, soldered ball feedway installation and debugging: soldered ball feedway is arranged on the side of chip mounter rail, soldered ball feedway includes shake charging basket and tilts transporting rail；The one end tilting transporting rail is connected with shake charging basket, and the other end tilting transporting rail is provided for material level；It is positioned on the inclination transporting rail for material level upstream and is provided with telescopic baffle；Tilting and be provided with the arc groove for placing soldered ball on transporting rail, what tilt transporting rail is provided above translucent cover, and the degree of depth of arc groove is not less than 1/2nd of Diameter of Solder Ball, and the ultimate range between translucent cover and arc groove is less than twice Diameter of Solder Ball；Tilt the transporting rail angle with horizontal direction less than 30 °.
Step 4, soldered ball feed: poured into by soldered ball in the shake charging basket in step 3, and start shake charging basket, soldered ball will along tilting transporting rail roller to for material level.
Step 5, plants ball: start chip mounter, and the BGA calling correspondence plants ball paster program, and chip mounter suction nozzle, by the BGA pad in step 2 of the mounting solder ball in step 4, carries out planting ball；
In above-mentioned steps 5, after chip mounter starts, whether the infrared sensor on SMT chip mounter can automatically detect BGA support plate and transmit and put in place；After BGA carrier plate transmission puts in place, chip mounter suction nozzle just starts action.
Step 6, after having mounted, checks that the soldered ball on each BGA pad has intact ball, skew and bridge even.
Step 7, after confirming that attachment is qualified, puts to Reflow Soldering baking.
Step 8, plants ball and completes.
The preferred embodiment of the present invention described in detail above; but, the present invention is not limited to the detail in above-mentioned embodiment, in the technology concept of the present invention; technical scheme can being carried out multiple equivalents, these equivalents belong to protection scope of the present invention.
Claims (5)
1. the BGA ball-establishing method based on SMT chip mounter, it is characterised in that: comprise the following steps:
Step 1, BGA support plate size regulates: be consistent with the groove depth of ball BGA to be planted and length and width size by the groove depth of BGA placing trough in BGA support plate and length and width size adjusting；
Step 2, BGA support plate is fixed: is placed on by BGA in the BGA placing trough after step 1 size has regulated, and is fixed on chip mounter rail by BGA support plate by the clamping device in SMT chip mounter；
Step 3, soldered ball feedway installation and debugging: soldered ball feedway is arranged on the side of chip mounter rail, soldered ball feedway includes shake charging basket and tilts transporting rail；The one end tilting transporting rail is connected with shake charging basket, and the other end tilting transporting rail is provided for material level；It is positioned on the inclination transporting rail for material level upstream and is provided with telescopic baffle；Tilting and be provided with the arc groove for placing soldered ball on transporting rail, what tilt transporting rail is provided above translucent cover, and the degree of depth of arc groove is not less than 1/2nd of Diameter of Solder Ball, and the ultimate range between translucent cover and arc groove is less than twice Diameter of Solder Ball；Tilt the transporting rail angle with horizontal direction less than 30 °；
Step 4, soldered ball feed: poured into by soldered ball in the shake charging basket in step 3, and start shake charging basket, soldered ball will along tilting transporting rail roller to for material level；
Step 5, plants ball: start chip mounter, and the BGA calling correspondence plants ball paster program, and chip mounter suction nozzle, by the BGA pad in step 2 of the mounting solder ball in step 4, carries out planting ball；
Step 6, after having mounted, checks that the soldered ball on each BGA pad has intact ball, skew and bridge even；
Step 7, after confirming that attachment is qualified, puts to Reflow Soldering baking；
Step 8, plants ball and completes.
2. the BGA ball-establishing method based on SMT chip mounter according to claim 1, it is characterised in that: in described step 5, after chip mounter starts, whether the infrared sensor on SMT chip mounter can automatically detect BGA support plate and transmit and put in place；After BGA carrier plate transmission puts in place, chip mounter suction nozzle just starts action.
3. the BGA ball-establishing method based on SMT chip mounter according to claim 1, it is characterised in that: the twice that vertical dimension is chip mounter suction nozzle diameter between confession material level and the telescopic baffle of described soldered ball feedway.
4. the BGA ball-establishing method based on SMT chip mounter according to claim 1, it is characterised in that: the degree of depth of described arc groove is 2/3rds of Diameter of Solder Ball.
5. the BGA ball-establishing method based on SMT chip mounter according to claim 1, it is characterised in that: in described step 1,
BGA support plate includes peripheral frame, base plate, cross spacing slide block and vertical spacing slide block；Peripheral frame and floor combination form BGA placing trough；Cross spacing slide block and vertical spacing slide block are arranged on the top of BGA placing trough, cross spacing slide block energy Y-direction sliding, and vertical spacing slide block energy X is to sliding；Base plate includes backing plate, counter-force bearing plate and pressurised airbag；Backing plate is fixedly installed on the bottom of peripheral frame, and counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, and pressurised airbag is fixedly installed between backing plate and counter-force bearing plate, is provided with pressure transducer in pressurised airbag.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610193677.0A CN105813400A (en) | 2016-03-31 | 2016-03-31 | Ball grid array (BGA) ball mounting method based on surface mount technology (SMT) chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610193677.0A CN105813400A (en) | 2016-03-31 | 2016-03-31 | Ball grid array (BGA) ball mounting method based on surface mount technology (SMT) chip mounter |
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| CN105813400A true CN105813400A (en) | 2016-07-27 |
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| CN201610193677.0A Pending CN105813400A (en) | 2016-03-31 | 2016-03-31 | Ball grid array (BGA) ball mounting method based on surface mount technology (SMT) chip mounter |
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Cited By (1)
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| CN110277325A (en) * | 2019-06-04 | 2019-09-24 | 深圳市金新福电子技术有限公司 | Batch bga chip ball-planting device and ball-establishing method |
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| US20070131661A1 (en) * | 1999-02-25 | 2007-06-14 | Reiber Steven F | Solder ball placement system |
| CN103077896A (en) * | 2011-10-04 | 2013-05-01 | 株式会社日立工业设备技术 | Solder ball printing apparatus |
| US20140224773A1 (en) * | 2013-02-14 | 2014-08-14 | HGST Netherlands B.V. | High-speed transportation mechanism for micro solder balls |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277325A (en) * | 2019-06-04 | 2019-09-24 | 深圳市金新福电子技术有限公司 | Batch bga chip ball-planting device and ball-establishing method |
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