JP4766242B2 - Conductive ball array device - Google Patents

Description

  The present invention relates to an improvement of an apparatus for arranging conductive balls on an arrangement jig by moving a ball cup containing the conductive balls on the arrangement jig. This is an arrangement device of conductive balls developed by paying attention to the concentrated position of the conductive balls.

  As a solder ball mounting device for mounting a solder ball after applying an adhesive material to each electrode formed in a predetermined array pattern on a mounting target, a ball mounting head having an array plate as shown in Patent Document 1 is used. 2. Description of the Related Art Conventionally, there has been an apparatus for mounting a solder ball on each electrode on a mounting object after the solder ball is suctioned and adsorbed. However, with the increase in the size of products to be mounted such as wafers, the number of solder balls to be mounted at a time exceeds 1 million, and it is difficult to reduce defects in solder ball arrangement and mounting. Was the current situation.

  Therefore, an array mask (a template in Patent Document 2) is provided on an electronic substrate that is a mounting object printed with a flux as shown in Patent Document 2, and a ball cup (a solder ball storage section in Patent Document 2) is placed on the array mask. ) Moved to drop the solder ball directly onto the electrode of the electronic substrate. However, in this type of conductive ball arrangement device, if the solder balls in the ball cup are gathered at a specific portion, the solder balls are difficult to drop, which causes deformation of the conductive balls and generation of foreign matters.

  In particular, when the ball cup is dropped into the insertion portion of the ball array mask by a plurality of forward or backward movements, it is necessary to move laterally to the next forward or backward start position. At that time, as shown in FIG. 8 (A), the distribution of the solder balls 21 in the ball cup is evenly concentrated on the rear wall side in the forward direction and is appropriate at the stop point after the forward or backward movement. However, if the lateral movement is made to the start position of the next forward or backward movement, the solder balls 21 gather on the opposite side to the lateral movement direction as shown in FIG. If the next retreat is started as it is, the solder ball is difficult to drop, which causes deformation of the conductive ball and generation of foreign matter.

Japanese Patent Laid-Open No. 2001-358451 Japanese Patent No. 3271482

  In the present invention, when the ball cup moves to the next forward or backward start position in the direction orthogonal to the forward and backward direction of the ball cup, it is overrun before the start position and then moved to the next forward or backward start position. The conductive balls are prevented from being collected in one direction, and the conductive balls are likely to fall into the insertion portion of the arrangement jig.

In order to solve the above-mentioned problems, the first invention employs the following means for the conductive ball arraying device.
First, the arrangement jig in which the insertion portion of the conductive ball is formed in a predetermined region, and the opening having a width narrower than the width of the region of the arrangement jig is formed on the lower surface, and the arrangement jig. A ball cup capable of accommodating a large number of conductive balls; and a moving means for moving the ball cup along an upper surface of the arrangement jig.
Second, a conductive ball arraying device that drops and arranges a conductive ball into an insertion part of the arraying jig by moving a ball cup containing a large number of conductive balls forward and backward along the upper surface of the arraying jig. And
Third, when the moving means moves to the next forward or backward start position in the direction orthogonal to the forward and backward directions of the ball cup, it is overrun before the start position, and then the next forward or backward Returned to the start position of retreat.

  2nd invention is the arrangement | sequence apparatus of the conductive ball which added the means to maintain the quantity of the conductive ball accommodated in a ball cup in a predetermined range to 1st invention.

  In the first invention, when the ball cup moves to the next forward or backward start position in the direction orthogonal to the forward and backward directions of the ball cup, after starting overrun before the start position, the next forward or backward start is started. Since the position is returned to the position, the conductive ball once moved to one side as shown in FIG. 8 (B) at the time of overrun is returned by movement, and shown in FIG. 8 (C). As shown in FIG. 8 (D), it is possible to disperse the entire width of the ball cup by positioning it in the vicinity of the center, and then starting forward or backward movement, so that an appropriate conductive ball arrangement is obtained. Can do. This makes it easier for the conductive ball to fall into the insertion portion, and the falling conductive ball is sandwiched between the edges of the insertion portion of the ball arrangement mask, the conductive ball is missing, and foreign matter is generated, The risk of the conductive ball itself being deformed can be avoided.

  In the second invention, since the amount of the conductive balls accommodated in the ball cup is maintained within a predetermined range, there are too many conductive balls in the ball cup, and there is one conductive ball. Cannot be prevented, or the conductive balls are strongly pressed against each other in the lowermost layer and the movement is hindered, so that the balls do not fall out of the ball cup, or there are too few conductive balls in the ball cup. As a result, the problem that the conductive balls did not fall out was eliminated, and the productivity of the conductive ball arrangement device could be improved.

  Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. In the present invention, a conductive ball mounting target includes a semiconductor wafer (hereinafter simply referred to as a wafer), an electronic circuit substrate, a ceramic substrate, and the like. In the embodiment, the wafer 14 is used. Further, as the adhesive material, flux, solder paste, conductive adhesive, or the like is used, but in the embodiment, flux is used.

  FIG. 1 is a schematic plan view showing the entire solder ball mounting apparatus 1. The solder ball mounting apparatus 1 has a wafer delivery unit 2, a flux printing unit 3, and a ball mounting unit for loading from the left side of FIG. 4. It has a wafer delivery unit 5 for unloading. A wafer supply unit 6, a primary alignment unit 7 and a carry-in robot 8 are present in the pre-process of the solder ball mounting apparatus 1, and a reversing unit 9, a wafer storage unit 10 and a carry-out robot 11 are present in the post-process.

  The primary alignment unit 7 in the previous process rotates the wafer 14 on a horizontal plane. By rotating the wafer 14, the position of the orientation flat or notch of the wafer 14 is detected, and the rough position of the wafer 14 is corrected. At the same time, the wafer 14 placed on the wafer delivery section 2 is a portion in a predetermined direction. On the other hand, the reversing unit 9 in the subsequent process rotates the wafer 14 in the horizontal direction, and rotates the wafer 14 so that the orientation flat or notch position of the wafer 14 becomes a predetermined position, and stores it in the cassette 32.

  In the solder ball mounting apparatus 1, a wafer transfer stage 12 and a transfer path 13 for transferring the wafer 14 from the wafer transfer unit 2 to the flux printing unit 3, the ball mount unit 4, and the wafer transfer unit 5 are formed. As shown in FIG. 3, the transport path 13 is provided with an X-axis (left-right direction in the drawing) moving device 40 of the transport stage 12.

  In the flux printing unit 3, the flux supply device 16, the print mask 15 for printing the flux as the adhesive material on the wafer 14, the alignment marks of the wafer 14 and the print mask 15 are observed, and the wafer 14 and the print mask 15 are observed. As shown in FIG. 3, a vertical observation camera 31 for positioning with the upper and lower observation cameras 31 is provided. The printing mask 15 is formed with through holes arranged in accordance with the pattern of the electrodes on the wafer 14, and alignment marks (not shown) are provided at two places on the lower surface of the printing mask 15 in the through hole forming region 38. Is affixed to the mold 17 and further held by a fixed part such as a frame.

  The flux supply device 16 moves a squeegee (not shown) along the upper surface of the printing mask 15 so that the flux is imprinted in the through hole of the printing mask 15 and is supplied onto the electrode of the wafer 14. ing. In the figure, reference numeral 33 denotes a cleaning unit for removing the flux adhering to the printing mask 15.

  The ball mounting portion 4 includes a solder ball supply device 20 and a plurality of insertion portions 18 (shown in FIG. 4) arranged in accordance with the electrode pattern on the wafer 14. A mask 19 and a vertical observation camera 34 (shown in FIG. 3) for observing and aligning the alignment marks of the wafer 14 and the ball array mask 19 are provided.

  The thickness of the ball array mask 19 is substantially the same as the diameter of the solder balls 21 to be supplied, and the diameter of the insertion portion 18 is slightly larger than the diameter of the solder balls. As shown in FIG. 7, the arrangement pitch P in the horizontal direction of the insertion portion 18 in the ball arrangement mask 19 is generally about twice the hole diameter d of the insertion portion 18. As with the printing mask 15, the ball arrangement mask 19 is provided with alignment marks (not shown) at two places on the lower surface in the insertion portion formation region 36, and is affixed to a mold 37 to be attached to a fixed portion such as a frame. Is retained.

  As shown in FIG. 4, the solder ball supply device 20 includes a ball hopper 22 storing a large number of solder balls 21, a ball cup 23a for dropping the solder balls 21 into the ball arrangement mask 19, and a mask height as height measuring means. A height detection sensor 27, a ball cup moving means 24 for moving the ball cups 23a, b in the X-axis direction and the Y-axis direction shown in FIG. 5, and an elevating means 45 for moving the ball cups 23a, b in the Z-axis direction. Have.

  The ball cups 23a and 23b are formed with an opening 63 having a rectangular shape for supplying a ball on the upper portion and an opening 64 having a rectangular shape for dropping the ball on the lower surface, and the ball cups 23a and 23b have an opening portion. Inclined so as to narrow toward 64. The opening 64 on the lower surface is formed with a width narrower than the width of the insertion portion formation region 36 of the ball arrangement mask 19, and a large number of conductive balls are formed between the ball cups 23 a and b and the upper surface of the ball arrangement mask 19. It can be accommodated.

  As shown in FIG. 5, the ball cup moving means 24 serving as the moving means (moving means for moving along the upper surface of the ball arrangement mask 19) of the ball cups 23a and 23b in the horizontal plane includes an X-axis drive mechanism 25 and a Y-axis. A drive mechanism 26 is provided. The X-axis drive mechanism 25 uses a ball screw 55 rotated by an X-axis drive motor 54 to move a base member 58 to which the ball cups 23a and 23b are attached via an elevating means 45 along the X-axis guide 56 in the X-axis direction. The Y-axis drive mechanism 26 moves the base member 58 in the Y-axis direction along the Y-axis guide 57 by the ball screw 53 that is rotated by the Y-axis drive motor 52 together with the X-axis drive mechanism 25.

  The movement of the ball cups 23a and 23b is specifically performed as follows. First, the Y-axis drive mechanism and the X-axis drive mechanism are interlocked and moved forward in the Y-axis direction in a zigzag manner as indicated by arrows in FIGS. By this movement, the solder ball 21 is dropped and inserted into the insertion portion 18 of the ball arrangement mask 19. By moving the ball cups 23a and 23b in a zigzag manner, the ball cups 23a and 23b always move obliquely forward with respect to the inner wall surfaces of the ball cups 23a and 23b into which the solder balls 21 are pushed. It will be easy to fall.

  The width W of the zigzag moving ball cups 23a, b in the direction intersecting the traveling direction is equal to or less than one half of the arrangement pitch P of the insertion portions 18 in the same direction as shown in FIG. In the embodiment, the movement is accompanied by a zigzag motion, but it may be a linear motion or a movement accompanied by another motion.

  When the operation of dropping the solder ball 21 into the insertion portion 18 of the predetermined course is completed by the advance, the ball cup 23a stops at the position shown in FIG. At this time, the solder balls 21 in the ball cup 23a are uniformly stored in the entire width of the ball cup 23a as shown in FIG.

  After that, it moves to the next backward movement start position, but when it moves directly to the next backward start position in the direction orthogonal to the forward and backward direction (horizontal left side in the figure) and stops, it is shown in FIG. As shown, the solder balls 21 gather on the side opposite to the lateral movement direction. Therefore, as shown by the solid line portion in FIG. 6B in the same direction, the ball cup is overrun before the start position and stopped. At this time, the solder balls 21 in the ball cup 23a are gathered on the side opposite to the lateral movement direction as shown in FIG. 8B.

  Therefore, the ball cup 23a is returned from the overrun position to the next forward or backward start position shown in FIG. With this return movement, the conductive ball that has once approached one side at the time of overrun can be positioned near the center as shown in FIG. In this way, the position is changed in the X-axis direction (right lateral direction in the figure). At this time, as indicated by the hatched portion in the center of FIG. 6C, the opening 64 at the lower part of the ball cup 23a is slightly at the position of the forward stop time (FIG. 6A) and the position of the backward start position (FIG. 6C). overlapping. This prevents the insertion portion forming region 36 where the solder ball 21 is not dropped from being generated.

  Then, it moves back in a zigzag manner in the Y-axis direction. At this time, the solder balls 21 in the ball cup 23a are spread out over the entire width of the ball cup 23a as shown in FIG. Such an operation is repeated, and the solder ball 21 is dropped into the insertion portion 18 of the ball arrangement mask 19 and inserted. Although this movement has been described for the ball cup 23a, the same applies to the ball cup 23b.

  As shown in FIG. 5, two ball cups 23a, b are mounted on the same mounting base 41 side by side in the lateral direction (X-axis direction), and the entire mounting area is covered with both ball cups 23a, b. . Thus, the productivity is improved by covering the entire surface of the wafer 14 with the two ball cups 23a and 23b.

  As shown in FIG. 4, the lifting / lowering means 45 of the ball cups 23a, 23b attaches the mounting base 41 to the nut member 44 on the ball screw 51 rotated by the Z-axis drive motor 50 mounted on the base member 58 of the ball cup moving means 24. The mounting base 41 can be moved up and down along the guide rail 43. A ball cup 23a is attached to the attachment base 41 via an inclination adjusting mechanism 42 for adjusting the attachment inclination of the ball cup 23a. The mounting inclination of the ball cups 23a, b is performed when the ball cups 23a, b are assembled.

  A ball hopper 22 is disposed above the ball supply opening 63 of the ball cups 23a and 23b. The ball hopper 22 stores a large number of solder balls 21 in the internal space and discharges the stored solder balls 21 to the ball cups 23a, b, and a shutter 65 serving as an opening / closing means that can open and close the supply ports. The ball hopper 22 is also mounted on the same mounting base 41 as the ball cups 23a, b. In the figure, reference numeral 66 denotes a cylinder for operating the shutter 65. The ball hopper 22 is exchanged depending on the size and material of the solder ball 21.

  Below the ball supply port of the ball hopper 22, the receiving part 67 with a ball detection mechanism, the switching part 68 for switching the supply of balls to the left and right ball cups 23a, b, and the solder balls 21 are introduced into the ball cups 23a, b. A ball introducing portion 69 is disposed. The ball detection sensor 70 provided in the receiving portion 67 detects the supply amount of the solder ball 21 supplied from the ball supply port of the ball hopper 22 and the ball clogging. In the embodiment, a light projecting / receiving sensor is used. . The switching portion 68 is swung by a swinging air cylinder 71 and distributes the solder balls 21 from the receiving portion 67 to the left and right ball cups 23a, b via the left and right ball introducing portions 69.

  The ball replenishment operation is performed when the shutter 65 of the ball hopper 22 is opened. The ball replenishment time, which is the operation time of the shutter 65, is obtained in advance from the number of solder balls arranged. Further, a ball supply amount with respect to a ball supply time when the shutter 65 is opened is also obtained in advance. The amount of the solder balls 21 accommodated in the ball cups 23a and 23b is grasped from the amount of balls supplied from the ball hopper 22 and the amount of balls discharged from the ball cups 23a and 23b accompanying the movement of the ball cups 23a and 23b. The amount of solder balls in the ball cups 23a, b is obtained in advance.

  The ball replenishment operation is performed as follows. First, the vacuum in the ball hopper 22 is turned on to generate a negative pressure in the ball hopper 22. Here, the shutter 65 is opened. Next, when the vacuum in the ball hopper 22 is turned off, the negative pressure in the ball hopper 22 is released, and the solder ball 21 in the ball hopper 22 falls from the supply port to the receiving portion 67. At this time, the solder ball 21 dropped to the receiving portion 67 is detected by the ball detection sensor 70. After a predetermined time has elapsed, the vacuum in the ball hopper 22 is turned on to stop the falling of the solder ball 21, the shutter 65 is closed, and the vacuum is turned off.

  The solder ball 21 that has dropped to the receiving portion 67 is replenished to one ball cup 23a via the switching portion 68 and the ball introducing portion 69. When the replenishment to one side is completed, the swinging air cylinder 71 is operated to switch the supplied ball cups 23a, b, the direction of introduction of the switching unit 68 is switched, and the replenishment of the ball to the other ball cup 23b is performed. Preparation is complete.

  Here, the ball replenishing operation is repeated again to replenish the ball to the other ball cup 23b. Repeat the above operation to replenish the ball frequently. This ball replenishment operation may be performed while the ball cups 23a, b are stopped, but can also be performed while moving.

  The mask height detection sensor 27 is attached in the vicinity of the ball cups 23a, b, and may be a contact type or a non-contact type. Specifically, a laser sensor or a capacitance sensor is used. Mask height detection is performed after fixing the mold frame 37 of the ball arrangement mask 19 to the support provided on the frame side when changing the ball arrangement mask 19 at the time of initial setting or mold change. Specifically, after the ball arrangement mask 19 is fixed, the ball cups 23a and 23b in which the solder balls 21 are empty have a plurality of height detection points (4 in the embodiment) set in advance outside the insertion portion formation region 36. The height of the upper surface of the ball arrangement mask 19 is measured. Of course, the mask height detection may be performed continuously during the movement of the mask height detection sensor 27 accompanying the movement of the ball cups 23a, b, instead of measuring only the four detection points.

  On the other hand, the height of the upper surface of the ball array mask 19 in the insertion portion formation region 36 is obtained by calculation. Further, the height at each position is calculated in consideration of the weight applied when the solder balls 21 are accommodated in the ball cups 23a and 23b. When the ball is mounted, the vertical movement of the ball cups 23a and 23b is moved up and down so that the gap between the upper surface of the ball arrangement mask 19 and the lower surfaces of the ball cups 23a and 23b does not exceed a predetermined distance based on the obtained height. While controlling at 45, the ball cups 23a, b move in the X-axis direction and the Y-axis direction.

  The wafer transfer stage 12 is a stage on which the wafer 14 is placed, and is mounted on the transfer path 13 so as to be movable in the X-axis direction by the transfer path 13, and in the transfer direction of the wafer 14 as shown in FIG. It has a Y-axis drive mechanism 28 that is a moving means in a direction orthogonal to the Y-axis direction, a θ-axis drive mechanism 29 that is a rotation means, and a Z-axis drive mechanism 30 that is a vertical movement means.

  The operation of the solder ball mounting apparatus 1 according to the embodiment will be described below with reference to the drawings. First, the wafer 14 on which the solder balls 21 are mounted is stored in the cassette 32 of the wafer supply unit 6. Therefore, one wafer 14 is taken out from the cassette 32 of the wafer supply unit 6 by the loading robot 8 and loaded into the primary alignment unit 7. The primary alignment unit 7 detects the position of the orientation flat or notch by rotating the wafer 14, corrects the approximate position of the wafer 14, and sets the orientation flat or notch to a predetermined position. Subsequently, the wafer 14 is placed on the wafer transfer stage 12 waiting from the primary alignment unit 7 to the wafer delivery unit 2 by the loading robot 8.

  The wafer transfer stage 12 on which the wafer 14 is placed moves to the flux printing unit 3 along the transfer path 13 and stops at a predetermined position. Here, the alignment marks on the wafer 14 and the printing mask 15 are observed by the vertical observation camera 31, and the wafer transfer stage 12 is moved in the X-axis direction by the X-axis drive mechanism 40 of the transfer path 13 and in the Y-axis by the Y-axis drive mechanism 28. The direction and the θ-axis drive mechanism 29 position in the θ-axis direction. After the positioning is completed, the wafer transfer stage 12 is raised by the Z-axis drive mechanism 30 and stopped at a predetermined height position with respect to the printing mask 15 on which the flux is prepared. In this state, flux is supplied to one end of the print mask 15 in the Y-axis direction, and the squeegee is moved from one end to the other end in the Y-axis direction to move the wafer 14 from the through hole of the print mask 15. Flux is printed on the electrodes.

  After the flux printing, the wafer transfer stage 12 is lowered by the Z-axis drive mechanism 30, moves to the ball mounting unit 4 by the transfer path 13, and stops at a predetermined position. Here again, the vertical observation camera 34 observes the alignment marks on the wafer 14 and the ball array mask 19, and the wafer transfer stage 12 is moved in the X-axis direction, Y-axis drive mechanism 28 and θ by the X-axis drive mechanism 40 in the transfer path 13. Positioning is performed in the Y-axis direction and the θ-axis direction by the shaft drive mechanism 29. Thereafter, the wafer transfer stage 12 is lifted by the Z-axis drive mechanism 30 and stops with a gap to the extent that the flux printed on the wafer 14 does not adhere to the ball arrangement mask 19 with the ball arrangement mask 19.

  Up to now, the solder ball supply device 20 has positioned the ball cups 23a, b outside the insertion portion formation region 36 of the ball arrangement mask 19 and accommodates a predetermined amount of the solder balls 21 in the ball cups 23a, b. . When the wafer 14 is set below the ball arrangement mask 19, the ball cups 23 a and 23 b are moved in the Y-axis direction on the ball arrangement mask 19 by zigzag movement, and solder balls are inserted into the insertion portion 18 of the ball arrangement mask 19. 21 is dropped and a solder ball 21 is mounted on the wafer 14. Thereafter, the ball cups 23a, 23b move back and forth in the Y-axis direction after moving a predetermined amount in the X-axis direction. The predetermined amount of movement in the X-axis direction is one-quarter to one-half of the cup width of the ball cup 23a from the position in the X-axis direction of the drop-in portion of the next solder ball 21 in the ball cups 23a, b. After overrun by the distance, the next ball arrangement mask 19 is returned to the drop-in portion of the solder balls 21. During this time, the solder balls 21 are replenished from the ball hopper 22 to the ball cups 23a, b so that the amount of solder balls in the ball cups 23a, b is maintained within an optimal range determined in advance.

  The supply of the solder balls 21 to the ball cups 23a, b is performed by the ball hopper 22, but the ball array mask 19 is disposed with a gap to the extent that the flux printed on the wafer 14 does not adhere to the ball array mask 19. Therefore, if there are many solder balls 21 in the ball cups 23a, 23b, it is easy for the solder balls 21 not to fall, and the deflection amount of the ball arrangement mask 19 increases, resulting in a risk of flux adhesion. Since the solder balls 21 are difficult to drop due to various causes, they are frequently replenished so as to be the minimum necessary amount.

  After the balls are dropped, the position of the solder balls 21 in the insertion portion 18 is moved by slightly moving the ball arrangement mask 19 relative to the wafer transfer stage 12 in the horizontal direction (X-axis direction and Y-axis direction). to correct.

  After mounting the solder balls, the wafer transfer stage 12 is lowered by the Z-axis drive mechanism 30, moves to the wafer transfer section 5 for unloading, and stops. In the wafer storage unit 10, the unloading robot 11 transfers the wafer 14 from the wafer transfer stage 12 to the reversing unit 9 and rotates it so that the orientation flat or notch is at a predetermined position. The wafer 14 is further transferred from the reversing unit 9 to the cassette 32 of the wafer storage unit 10 by the unloading robot 11. When the unloading robot 11 takes out the wafer 14 from the wafer transfer stage 12, the wafer transfer stage 12 returns to the wafer delivery unit 2 which is the original position, and one process is completed. This apparatus repeats the above operation.

  In the embodiment shown in FIG. 1, the wafer supply unit 6 is provided in front of the solder ball mounting apparatus 1 and the wafer storage unit 10 is provided in the rear. However, the wafer transfer stage 12 is in its original position as described above. Therefore, the wafer supply unit 6 and the wafer storage unit 10 may be provided in the same direction as shown in FIG.

  With this configuration, the carry-out robot 11 can be substituted by the carry-in robot 8, and the wafer 14 is held and stored in the same direction as that of the wafer 14 at the time of carry-in, so that it is reversed. The unit 9 can also be omitted, and the wafer transfer portions 2 and 5 can also omit one wafer transfer portion, so that the number of constituent members can be reduced.

  In addition, as an alignment unit for the print mask 15 and the ball array mask 19 and the wafer 14, this embodiment simultaneously photographs the alignment mark between the wafer 14 and the print mask 15 or the ball array mask 19 when the wafer transfer stage 12 is stopped. Although the vertical observation cameras 31 and 34 are used, the present invention is not limited to this, and various configurations are conceivable.

  In this embodiment, the solder ball 21 is directly mounted on the electrode on the upper surface of the wafer 14, and the insertion portion 18 becomes the ball insertion portion. However, the present invention is applied to the arrangement jig once provided with the ball storage recess. It is also applicable to the case where the solder balls 21 are arranged, the solder balls are sucked and held by the arrangement jig by the solder ball suction head, and the solder balls 21 are transferred to a mounting object such as an electrode on the wafer 14. In this case, the ball housing recess is the ball insertion portion.

Schematic plan view showing the entire solder ball mounting apparatus according to the present embodiment Schematic plan view when the wafer supply unit and the wafer storage unit are provided in the same direction Explanatory drawing showing movement of wafer transfer stage Side view of a partial cross section showing the ball mounting part Top view of ball mounting part (A) is an explanatory view showing the position of the ball cup when stopped from forward, (B) is an explanatory view showing the position of the ball cup in the stopped state after overrun. (C) is explanatory drawing which shows the state which returned to the next retreat start position of a ball cup. Explanatory drawing of zigzag width in the direction crossing the direction of travel of the ball cup It is explanatory drawing which shows the position of the solder ball in a ball cup, (A) is explanatory drawing which shows the state of the solder ball in the ball cup at the time of a stop from advance, (B) is the stop state after an overrun. An explanatory view showing a state of the solder ball in the ball cup, (C) is an explanatory view showing a state of the solder ball in the ball cup in a state of returning to the next backward start position, and (D) is an illustration after the backward movement. It is explanatory drawing which shows the state of the solder ball in a ball cup.

Explanation of symbols

1. . . . . . Solder ball mounting device 2,5. . . . 2. Wafer delivery section . . . . . 3. Flux printing part . . . . . Ball mounting part 6. . . . . . Wafer supply unit 7. . . . . . Primary alignment unit 8. . . . . . 8. Robot for loading . . . . . Inversion unit 10. . . . . 10. Wafer storage unit . . . . Unloading robot 12. . . . . Wafer transfer stage 13. . . . . Transport path 14. . . . . Wafer 15. . . . . Print mask 16. . . . . Flux supply device 17, 37. Formwork 18. . . . . Insertion section 18A. . . Edge 19. . . . . Ball array mask 20. . . . . Solder ball supply device 21, 21A, 21B, 21C. . . . . Solder balls 22. . . . . Ball hopper 23a, 23b. . . . . Ball cup 24. . . . . Ball cup moving means 25. . . . . X-axis drive mechanism 26. . . . . Y axis drive mechanism 27. . . . . Mask height detection sensor 28. . . . . Y-axis drive mechanism 29. . . . . θ axis drive mechanism 30. . . . . Z-axis drive mechanism 31,34. Vertical observation camera 32. . . . . Cassette 33. . . . . Cleaning unit 36. . . . . Insertion section forming region 38. . . . . Through-hole forming region 40. . . . . X-axis drive device 41. . . . . Mounting base 42. . . . . Tilt adjustment mechanism 43. . . . . Guide rail 44. . . . . Nut member 45. . . . . Lifting means 50, 52, 54. . . . . Drive motor 51,53,55. . . . . Ball screw 56. . . . . X-axis guide 57. . . . . Y-axis guide 58. . . . . Base member 63,64. . . . Opening 65. . . . . Shutter 66. . . . . Cylinder 67. . . . . Receiving part 68. . . . . Switching unit 69. . . . . Ball introduction part 70. . . . . Ball detection sensor 71. . . . . Swing type air cylinder

Claims (2)

The arrangement jig in which the insertion portion of the conductive ball is formed in a predetermined region, and an opening having a width narrower than the width of the region of the arrangement jig is formed on the lower surface, and the arrangement jig has a large number of conductivity. A ball cup that can accommodate a ball and a moving means that moves the ball cup along the upper surface of the arrangement jig, and the ball cup that accommodates a number of conductive balls moves forward and backward along the upper surface of the arrangement jig. In the conductive ball arraying device that drops and arranges the conductive balls in the insertion part of the arraying jig by moving them,
When the moving means moves to the next forward or backward start position in a direction orthogonal to the forward and backward directions of the ball cup, it is overrun before the start position, and then the next forward or backward start position. An apparatus for arranging conductive balls, wherein the arrangement is made to return to (1).
2. The conductive ball arraying device according to claim 1, wherein the amount of the conductive balls accommodated in the ball cup is maintained within a predetermined range.

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