JP2011035160A - Suction table, and device for mounting spherical body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction table capable of reducing cost while maintaining a function of surely holding a suction object. <P>SOLUTION: This suction table includes: a plate-like base body part 81 formed with intakes 81h on an upper surface 81a side; a sheet body 82 having ventilation and arranged on the upper surface 81a side of the base body part 81 to cover the intakes 81h; and a suction plate 83 formed with a plurality of vent holes 83c penetrating in the thickness direction and arranged on the upper surface 81a side by interposing the sheet body 82 so that one surface 83a faces the upper surface 81a of the base body part 81; wherein the intakes 81h communicate with the vent holes 83c through the sheet body 82 in the state where the suction plate 83 is arranged on the upper surface 81a side, and air is sucked from the intakes 81h to suck and hold a substrate 400 mounted on the other surface 83b of the suction plate 83. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a suction stand for sucking and holding a suction target body, and a spherical body mounting device including the suction stand.

  A solder ball mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 2002-254163 is known as an apparatus including this type of holding table. This solder ball mounting apparatus includes a ball mounting stage, a ball suction tool, a warp amount measuring means, and the like. In this solder ball mounting apparatus, the warpage amount of the substrate (BGA substrate) is measured by the warpage amount measuring means prior to mounting of the solder ball. Next, the substrate on which the measured value of the warpage amount is determined to be within the specified value is transferred to and placed on the ball mounting stage. Subsequently, a solder ball is mounted on the electrode of the substrate placed on the ball mounting stage by a ball suction tool.

JP 2002-254163 (page 2-3, FIG. 1)

  However, this type of solder ball mounting apparatus including the above-described solder ball mounting apparatus has the following problems to be improved. That is, in the above solder ball mounting apparatus, a substrate is mounted on a ball mounting stage, and the solder balls are mounted on the electrodes of the solder balls in that state. On the other hand, with the recent increase in the density of substrates, the pitch of electrodes has been reduced, and when mounting a small solder ball on such a narrow pitch electrode, the substrate is accurately placed on the ball mounting stage. It is necessary to align and securely fix. However, in the above solder ball mounting apparatus, since the ball mounting stage is not provided with a fixing means, there is a possibility that the solder ball cannot be accurately mounted on the electrode due to displacement.

  In order to avoid the above situation, the inventor has already developed a suction stand 553 that can suck and hold (fix) the substrate securely. As shown in FIGS. 17 and 18, the suction table 553 includes a base portion 581 in which a recess 581b is formed on the upper surface 581a side, and an intake port 581d is formed in a bottom surface 581c of the recess 581b. And a suction plate 582 that is formed of a high-quality ceramic material and is fitted in the concave portion 581b of the base body portion 581. In this case, in order to avoid the inclination of the placed substrate, the upper surface 581a of the base body 581 and the upper surface 582a of the suction plate 582 are flattened with high accuracy, and a step is not generated between the both surfaces 581a and 582a. Must be configured. Therefore, when manufacturing the suction table 553, the suction plates 582 are fitted into the recesses 581b of the base body 581 and fixed with an adhesive or the like, and then both surfaces 581a and 582a are polished. However, it takes a long time to polish the suction plate 582 formed of a hard ceramic material. For this reason, the production cost of the suction table 553 is soaring, and improvement of this point is desired. Further, when the suction plate 582 is clogged due to long-term use, it is necessary to perform polishing by replacing the suction plate 582, so there is a problem to be improved that the running cost is rising.

  The present invention has been made in view of such problems, and it is a main object of the present invention to provide an adsorption platform and a spherical body mounting device that can realize a reduction in cost while maintaining a function of reliably holding an object to be adsorbed. And

  In order to achieve the above object, an adsorption platform according to claim 1 is an adsorption platform for adsorbing and holding an object to be adsorbed, and has a plate-like base portion having an air inlet on the upper surface side and air permeability. The sheet body is disposed on the upper surface side of the base portion so as to cover the intake port, and a plurality of air holes penetrating in the thickness direction are formed and the sheet body is opposed to the upper surface. A suction plate disposed on the upper surface side of the suction plate, and the suction port and the vent hole communicate with each other through the sheet body in a state where the suction plate is disposed on the upper surface side. It sucks in and sucks and holds the suction object mounted on the other surface of the suction plate.

  According to a second aspect of the present invention, there is provided the suction table according to the first aspect, wherein a recess into which the sheet body can be fitted is formed on at least one of the upper surface of the base portion and the one surface of the suction plate. .

  According to a third aspect of the present invention, in the suction table according to the first or second aspect, the suction plate is made of a conductive material.

  According to a fourth aspect of the present invention, in the suction table according to the first or second aspect, the suction plate is formed of a non-conductive material.

  Moreover, the spherical body mounting apparatus of Claim 5 mounts a spherical body on the adsorption | suction stand in any one of Claim 1 to 4, and the mounting target body as the said adsorption | suction target object currently hold | maintained by the said adsorption | suction stand. And a mounting portion.

  According to the suction table according to claim 1 and the spherical body mounting device according to claim 5, the base portion having an air inlet formed on the upper surface side, and the upper surface of the base portion so as to have air permeability and cover the air inlet. Hard and polished by having a suction base comprising a sheet body arranged on the side and a suction plate formed on the upper surface side of the base portion with a plurality of vent holes formed and sandwiching the sheet body Therefore, the object to be adsorbed can be reliably adsorbed and held without using a ceramic that requires a long time. Therefore, according to the suction table and the spherical body mounting device, the upper surface of the base portion, one surface of the suction plate, and the other surface of the suction plate are shortened by forming the base portion and the suction plate with a material that can be easily polished. Since the polishing can be performed in time, the manufacturing cost of the suction table and thus the spherical body mounting device can be sufficiently reduced as much as the cost of the polishing process is reduced. Further, according to the suction table and the spherical body mounting apparatus, even if the sheet body is clogged due to long-term use, only the sheet body is replaced without replacing the base portion and the suction plate that require polishing. Therefore, the running cost can be kept sufficiently low.

  In addition, according to the suction table according to claim 2 and the spherical body mounting device according to claim 5, the concave portion into which the sheet member can be fitted is formed on at least one of the upper surface of the base portion and one surface of the suction plate. Since the upper surface of the part and one surface of the suction plate can be brought into close contact with each other, it is possible to reliably avoid the inclination of the suction object placed on the suction plate by flattening both surfaces with high accuracy.

  Moreover, according to the suction stand according to claim 3 and the spherical body mounting device according to claim 5, the suction plate is formed of a conductive material, so that, for example, the suction target body having a terminal formed on the back side When the spherical body is mounted, charging of the object to be attracted can be prevented by connecting the terminal on the back side to the reference potential (ground potential) via the attracting plate.

  Moreover, according to the suction stand of Claim 4, and the spherical body mounting apparatus of Claim 5, since the suction plate was formed with the nonelectroconductive material, for example, the terminal is formed on the back side of the suction object. Sometimes, the suction object can be sucked while the terminals are insulated from each other.

1 is a configuration diagram showing a configuration of a solder ball mounting device 1. 3 is a cross-sectional view showing a configuration of a mounting unit 2. FIG. FIG. 4 is a cross-sectional view showing the configuration of the suction head 11 and the alignment plate 13. FIG. 2 is a plan view showing a configuration of a solder ball mounting device 1. It is a block diagram which shows the structure of the application part 3 and the adsorption stand 53. FIG. FIG. 6 is a first exploded perspective view showing the configuration of the suction table 53. FIG. 6 is a second exploded perspective view showing the configuration of the suction table 53. It is a perspective view of the adsorption stand 53. FIG. FIG. 6 is a first explanatory view explaining the operation of the solder ball mounting apparatus 1. FIG. 6 is a second explanatory view for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a third explanatory view for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a fourth explanatory view for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a fifth explanatory diagram for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a sixth explanatory diagram illustrating the operation of the solder ball mounting apparatus 1. FIG. 10 is a seventh explanatory diagram for explaining the operation of the solder ball mounting apparatus 1; FIG. 10 is an eighth explanatory view for explaining the operation of the solder ball mounting apparatus 1; It is a disassembled perspective view which shows the structure of the conventional suction stand 553. It is a perspective view which shows the structure of the conventional suction stand 553.

  Hereinafter, embodiments of the suction table and the spherical body mounting device will be described with reference to the accompanying drawings.

  First, the configuration of the solder ball mounting apparatus (spherical body mounting apparatus) 1 shown in FIG. 1 will be described. As shown in the figure, the solder ball mounting device 1 includes a mounting unit 2, a coating unit 3, a transport unit 4, a detection unit 5, and a control unit 6, and is a small spherical particle as an example of a spherical body. A solder ball (microball) 300 (see FIG. 3) can be mounted (placed) on a terminal 401 (see FIG. 15) of a substrate 400 as a mounting object (and an adsorption object). In this case, the solder ball 300 has a spherical shape with a diameter L1 (see FIG. 3) of about 70 μm. Further, the solder balls 300 are mounted on the terminals 401 of the substrate 400 by the solder ball mounting apparatus 1 and then heated and melted to constitute a ball grid array (BGA) on the substrate 400.

  The mounting unit 2 executes a mounting process for mounting the solder balls 300 on the terminals 401 of the substrate 400. Specifically, as illustrated in FIG. 1, the mounting unit 2 includes a suction head 11, a supply unit 12, an alignment plate 13, and a moving mechanism 14.

  The suction head 11 performs a suction process for sucking a plurality of solder balls 300. Specifically, as shown in FIG. 2, the suction head 11 is configured in a box shape in which a gap 11 a is formed as an example. As shown in FIG. 3, the bottom wall 11b of the suction head 11 has an intake hole 11d that opens to the outer surface of the bottom wall 11b (hereinafter also referred to as “suction surface 11c”) and communicates with the gap 11a. A plurality (only one of them is shown in the figure) is formed along the thickness direction of 11b. In addition, the opening portion of the suction hole 11d in the suction surface 11c is also referred to as “a suction port 11e” hereinafter.

  In this case, as shown in FIG. 3, the diameter L2 of the intake hole 11d (that is, the intake port 11e) is defined to be about 40 μm, which is shorter than the diameter L1 of the solder ball 300 (70 μm in this example). As shown in FIG. 2, the suction head 11 is formed with an exhaust hole 11f for exhausting the air in the gap 11a. In the suction head 11, the inside of the gap 11 a is brought into a negative pressure state by the exhaust of air in the gap 11 a, and the suction from the suction port 11 e is performed accordingly, whereby the suction port 11 e of the suction surface 11 c of the suction head 11 is sucked. The solder ball 300 can be adsorbed to the edge (see FIG. 3).

  The supply unit 12 executes a supply process for supplying the solder balls 300 to the suction head 11 according to the control of the control unit 6 and also performs a removal process for sucking and removing excess solder balls 300. Specifically, as shown in FIG. 2, the supply unit 12 includes a storage container 21, a suction holding unit 22, a suction unit 23, and a driving mechanism (not shown). As shown in the figure, the container 21 includes a container body 21c whose inner surface is curved in a semicircular cross section, and two side walls (not shown) disposed on both sides of the container body 21c. Thus, the solder ball 300 can be accommodated in the accommodating portion 21a (see the same figure) formed by the container main body 21c and the side wall. In addition, a wiper 21d having both end portions supported by side walls is disposed on the opening 21b (see the same figure) side of the container 21. Further, a bearing (not shown) for rotatably supporting the suction holding portion 22 is disposed on the side wall. In this case, the storage container 21 is arranged so that the opening 21b faces the suction surface 11c of the suction head 11 when the supply process is executed.

  The suction holding part 22 is formed in a rectangular parallelepiped shape as a whole, and as shown in FIG. 2, an intake passage 22 c from the base end part 22 b side to the tip end part 22 a is formed inside, and the storage part of the storage container 21. The solder ball 300 accommodated in 21a is configured to be attracted and held by its tip 22a. A breathable sheet 22 e is attached to the tip 22 a of the suction holding unit 22. In addition, the suction holding unit 22 is supported by a shaft disposed outside the drawing disposed on the base end portion 22b side and an intake pipe 22d rotatably supported by a bearing disposed on the side wall of the storage container 21. 21 is disposed so as to be rotatable about the base end portion 22b on the opening 21b side.

  In this case, as shown in FIG. 2, the suction holding portion 22 is accommodated in the accommodating portion 21 a of the accommodating container 21 when the distal end portion 22 a faces the bottom side of the container main body 21 c of the accommodating container 21. The solder ball 300 is attracted and held by the tip 22a. Further, as shown in FIG. 13, the suction holding unit 22 is rotated by a driving mechanism so that the tip 22 a holding the solder ball 300 faces the suction surface 11 c of the suction head 11 during the supply process. Be moved.

  As shown in FIG. 2, the suction portion 23 is configured to include two partition walls 23 b and 23 c, and a suction path 23 a (formed by the two side walls and the partition walls 23 b and 23 c in the storage container 21. The solder ball 300 is configured to be suckable via the same). In this case, in the solder ball mounting apparatus 1, the storage container 21, the suction holding unit 22 and the suction unit 23 are configured as described above, so that they are integrated (hereinafter referred to as integrated storage). The container 21, the suction holding unit 22, and the suction unit 23 as a whole are also referred to as “main body unit 100”).

  The alignment plate 13 is configured to be detachable from the suction head 11 and, as shown in FIG. 3, the suction head 11 is mounted in a state where the upper surface 13a is in contact with the suction surface 11c of the suction head 11. An insertion hole 13c communicating with the intake port 11e is formed. In this case, as shown in the figure, the thickness L3 of the aligning plate 13 is defined to be about 80 μm so that the solder ball 300 adsorbed on the edge of the air inlet 11e does not protrude from the lower surface 13b. Further, the diameter L4 of the insertion hole 13c is defined to be about 90 μm through which the solder ball 300 can pass. Further, the alignment plate 13 is disposed at a position above the position where the main body 100 is disposed.

  Under the control of the control unit 6, the moving mechanism 14 is located at an arrangement position of the alignment plate 13 (a position above the arrangement position of the main body 100, and an adsorption position P 1 (at which an adsorption process for adsorbing the solder balls 300 is performed) The suction head 11 is transported between the mounting position P2 (see FIG. 4) and the mounting position P2 (see FIG. 4) where the mounting process for mounting the solder balls 300 on the substrate 400 is performed.

  As shown in FIG. 4, the coating unit 3 is disposed between the supply position P3 to which the substrate 400 is supplied and the mounting position P2, and executes a coating process for applying flux to the surface of the substrate 400. In this case, as shown in FIG. 5, the application unit 3 includes a mask 31, a supply mechanism 32, and a squeegee 33. When the substrate 31 is transported to the application position P4 where the application process is performed, the mask 31 is moved to the surface side of the substrate 400 by a driving mechanism (not shown), and the flux application target portion (specifically, the substrate 400) Covers the portion excluding the portion where the terminal 401 is formed. When the substrate 400 is transported to the application position P4, the supply mechanism 32 supplies the flux to a portion (exposed portion) that is not covered with the mask 31 on the surface of the substrate 400. The squeegee 33 is moved along the surface of the mask 31 by the drive mechanism, thereby stretching the flux supplied to the surface of the substrate 400.

  As shown in FIG. 4, the transport unit 4 transports the substrate 400 along a transport path R that connects the supply position P <b> 3 and the mounting position P <b> 2. In this case, the transport unit 4 includes a first transport mechanism 41, a second transport mechanism 42, and a third transport mechanism 43, and each divided path (for example, three) divided into a plurality of (for example, three) transport paths R Each of the transport mechanisms 41 to 43 transports the substrate 400 along a first route R1, a second route R2, and a third route R3, which will be described later.

  As shown in FIG. 4, the first transport mechanism 41 has a first path R1 (a part of the transport path R) that connects the supply position P3 and the delivery position P5 (a position that is located closer to the mounting position P2 than the application position P4). ) To carry out the first transfer process for transferring the substrate 400. Specifically, the first transport mechanism 41 includes a stage 51, a rail 52, a suction stand 53, and a moving mechanism 54. The stage 51 is moved by the moving mechanism 54 on the rail 52 arranged along the first path R1.

  The suction stand 53 is fixed on the stage 51 and configured to suck and hold the substrate 400 as a suction target body placed (supplied). Specifically, as shown in FIGS. 5 and 6, the suction stand 53 includes a base portion 81, a sheet body 82, and a suction plate 83. The base portion 81 is formed in a rectangular plate shape as a whole with metal (for example, aluminum), and is formed in a rectangular plate shape as a whole. A rectangular recess 81c into which the sheet body 82 can be fitted is formed on the upper surface 81a side of the base body 81. Further, a stepped portion 81e that is recessed from the upper surface 81a by the thickness of the sheet body 82 is formed at the edge of the recessed portion 81c. Further, a rib 81f that supports the sheet body 82 is formed on the bottom surface 81d of the recess 81c. The base portion 81 is formed with an intake hole 81g that opens on the side surface of the base portion 81 and communicates with the recess 81c. In addition, the opening part of the intake hole 81g in the recessed part 81c is also called "intake port 81h" below.

  As an example, the sheet body 82 is formed in a rectangular sheet shape by a breathable material made of nonwoven fabric, woven fabric, polyethylene, polypropylene, paper, and the like. In this case, as shown in FIGS. 5 and 7, the sheet body 82 is fitted into the recess 81 c of the base portion 81 (that is, disposed on the upper surface 81 a side of the base portion 81), whereby the air inlet 81 h of the base portion 81. Is covered by the sheet body 82.

  The suction plate 83 is formed in a rectangular plate shape as a whole by a conductive material (for example, aluminum). Further, as shown in FIGS. 7 and 8, the suction plate 83 has a surface 83 a (the lower surface in FIG. 7) facing the upper surface 81 a of the base portion 81, and sandwiches the sheet body 82 so that the upper surface 81 a side of the base portion 81. And is fixed to the base portion 81 with a screw 84. Further, the suction plate 83 is formed with a plurality of vent holes 83c penetrating in the thickness direction. In this case, each air hole 83c is formed in a rectangular region 83d (see FIG. 6) that faces the sheet body 82 in a state of being arranged on the upper surface 81a side of the base portion 81.

  Here, in the apparatus in which the minute solder balls 300 are mounted on the terminals 401 having a narrow pitch, such as the solder ball mounting apparatus 1, the solder balls 300 are placed in the correct positions only by the substrate 400 being slightly inclined. It becomes difficult to mount securely. For this reason, in this suction table 53, in order to avoid the inclination of the held substrate 400, the outer surface of the recess 81c on the upper surface 81a of the base portion 81 (the contact portion with the one surface 83a of the suction plate 83), the suction plate 83 One surface 83a and the other surface 83b (upper surface in the figure) of the suction plate 83 are flattened with high precision by polishing. In this case, the suction table 53 is different from the suction table already developed by the inventor in that the sheet body 82 is used in place of the ceramic that is hard and requires a long time for polishing and sandwiches the sheet body 82. The base portion 81 and the suction plate 83 arranged in (1) are formed of aluminum that is easy to polish. For this reason, in this suction stand 53 and the solder ball mounting apparatus 1, each of the surfaces 81a, 83a, 83b can be polished in a short time. The production cost of the mounting device 1 can be sufficiently reduced.

  Here, the suction stand 53 is assembled as follows. First, as shown in FIG. 6, the sheet body 82 is fitted into the recess 81 c of the base portion 81. At this time, the sheet body 82 is supported by the step portion 81e formed at the edge of the recess 81c and the rib 81f formed on the bottom surface 81d of the recess 81c. Further, the sheet body 82 covers the intake port 81 h of the intake hole 81 g that opens to the bottom surface 81 d of the recess 81 c in the base body 81. Next, the upper surface 81a of the base portion 81 into which the sheet body 82 is fitted is opposed to the one surface 83a of the suction plate 83, and the suction plate 83 is placed on the upper surface 81a side of the base portion 81 with the sheet body 82 interposed therebetween. To do. Subsequently, as shown in FIG. 8, the suction plate 83 is fixed to the base portion 81 using a screw 84. Thus, the suction table 53 is completed.

  In this case, in the suction platform 53 configured as described above, the other surface 83b of the suction plate 83 (upper surface in FIG. 7) is sucked from the air vent 83c communicating with the suction port 81h via the sheet body 82. The substrate 400 placed on is sucked and held. Further, in this suction stand 53, even if the sheet body 82 is clogged due to long-term use, only the sheet body 82 is replaced without replacing the base portion 81 and the suction plate 83 that require polishing. Therefore, the running cost can be kept sufficiently low.

  As shown in FIG. 4, the second transport mechanism 42 has a second path R2 (a part of the transport path R) that connects the delivery position P5 and the delivery position P6 (position located on the mounting position P2 side from the delivery position P5). ) To carry out the second transfer process for transferring the substrate 400. Specifically, the second transport mechanism 42 includes a suction unit 61 and a moving mechanism 62 as shown in FIG. The adsorption unit 61 adsorbs the substrate 400. The moving mechanism 62 moves the suction portion 61 up and down and moves the suction portion 61 along the second path R2.

  As shown in FIG. 4, the third transport mechanism 43 performs a second transport process for transporting the substrate 400 along a third path R3 (a part of the transport path R) connecting the delivery position P6 and the mounting position P2. To do. Specifically, the third transport mechanism 43 includes a stage 71, a rail 72, a suction stand 73, a moving mechanism 74, and a correction mechanism 75. The stage 71 is moved by the moving mechanism 74 on the rail 72 disposed along the third route R3. The suction stand 73 is configured in the same manner as the suction stand 53 of the first transport mechanism 41 described above, and sucks and holds the substrate 400 placed on the upper surface. The correction mechanism 75 is disposed below the suction table 73 and rotates the suction table 73 around a central axis that penetrates the suction table 73 in the vertical direction. As a result of detection processing described later by the detection unit 5. Based on the above, a correction process for correcting the positional deviation of the substrate 400 held by the suction table 73 is executed.

  The detection unit 5 includes a camera (not shown) that images the surface of the substrate 400 held on the suction platform 73 of the third transport mechanism 43, and as shown in FIG. 4, the delivery position P6 and the mounting position It is arranged at a predetermined position (detection position P7 shown in the figure) between P2. In this case, the detection unit 5 performs a detection process of detecting a positional deviation in the rotation direction of the substrate 400 around the central axis penetrating the substrate 400 in the vertical direction by analyzing the captured image of the substrate 400. .

  The control unit 6 controls the mounting unit 2, the coating unit 3, the transport unit 4, and the detection unit 5 to mount the solder ball 300 on the terminal 401 of the substrate 400.

  Next, the process of mounting the solder ball 300 on the terminal 401 of the substrate 400 using the solder ball mounting apparatus 1 and the operation of the solder ball mounting apparatus 1 at that time will be described with reference to the drawings. In the initial state, as shown in FIG. 4, the stage 51 of the first transport mechanism 41 in the transport unit 4 is located at the supply position P3, and the stage 71 of the third transport mechanism 43 in the transport unit 4 is at the delivery position P6. Assume that it is located. Further, the substrate 400 is supplied (placed) on the other surface 83b (upper surface) of the suction plate 83 in the suction table 53 of the first transport mechanism 41 located at the supply position P3 by a substrate supply device (not shown). To do.

  In the solder ball mounting apparatus 1, when the start operation is performed, the control unit 6 causes the first transport mechanism 41 of the transport unit 4 to execute the first transport process. In the first transport process, the suction table 53 of the first transport mechanism 41 holds the supplied (mounted) substrate 400. Specifically, in the suction stand 53, the suction port 81 h of the base portion 81 and the vent hole 83 c of the suction plate 83 communicate with each other through the sheet body 82 in a state where the suction plate 83 is disposed on the upper surface 81 a side of the base portion 81. Then, when an unillustrated intake device connected to the intake hole 81g of the base portion 81 via the intake pipe is operated, intake from the intake port 81h is performed, and thereby the other surface 83b of the suction plate 83 The substrate 400 placed on is sucked and held. In this case, in the suction table 53, the suction plate 83 is formed of a conductive material. Therefore, for example, when the solder ball 300 is mounted on the substrate 400 on which the terminal 401 is formed on the back side, the back side terminal 401 is connected to the reference potential (ground potential) via the suction plate 83. The charging of the substrate 400 can be prevented.

  Subsequently, the moving mechanism 54 moves the stage 51 on the rail 52 disposed along the first path R1, as shown in FIG. Next, the moving mechanism 54 stops the movement when the stage 51 is positioned at the application position P4.

  Subsequently, the control unit 6 causes the coating unit 3 to perform a coating process. In this coating process, the mask 31 of the coating unit 3 is moved to the surface side of the substrate 400 by a driving mechanism (not shown) (see FIG. 5). At this time, the portion of the substrate 400 excluding the portion where the terminal 401 is formed is covered. Next, the supply mechanism 32 of the application unit 3 supplies the flux to the formation part (exposed part) of the terminal 401 in the substrate 400. Subsequently, the squeegee 33 is moved along the mask 31 (the surface of the substrate 400) by a driving mechanism (not shown). Thereby, the flux is stretched and applied to the portion where the terminal 401 is formed on the surface of the substrate 400.

  Next, the moving mechanism 54 of the first transport mechanism 41 moves the stage 51 toward the delivery position P5, and stops the movement when the stage 51 is located at the delivery position P5. As a result, the substrate 400 is transported by the first transport mechanism 41 along the first path R1 connecting the supply position P3 and the delivery position P5.

  Subsequently, the control unit 6 causes the second transport mechanism 42 of the transport unit 4 to execute the second transport process. In the second transport process, the moving mechanism 62 of the second transport mechanism 42 moves the suction portion 61 above the delivery position P5 as shown in FIG. Next, the moving mechanism 62 lowers the suction unit 61 to bring the suction unit 61 closer to the substrate 400 held by the suction table 53 of the first transport mechanism 41. Subsequently, the control unit 6 releases the suction of the substrate 400 by the suction stand 53. As a result, the substrate 400 is adsorbed by the adsorption unit 61, and the substrate 400 is transferred from the first conveyance mechanism 41 to the second conveyance mechanism 42. Next, the moving mechanism 62 raises the suction portion 61 and then moves the suction portion 61 along the second path R2 to be positioned above the delivery position P6. Subsequently, the moving mechanism 62 lowers the suction unit 61 to place the substrate 400 on the upper surface of the suction platform 73 of the third transport mechanism 43 in the transport unit 4. As a result, the substrate 400 is transported by the second transport mechanism 42 along the second path R2 connecting the delivery position P5 and the delivery position P6.

  Further, the moving mechanism 54 of the first transport mechanism 41 moves the stage 51 from the delivery position P5 to the supply position as shown in FIG. 11 when the substrate 400 is delivered from the first transport mechanism 41 to the second transport mechanism 42. Move to P3 (return to initial position).

  Next, the control unit 6 causes the third transport mechanism 43 of the transport unit 4 to execute the third transport process. In the third transport process, the suction table 73 of the third transport mechanism 43 sucks and holds the substrate 400 placed by the second transport mechanism 42, and the moving mechanism 74 moves the stage as shown in FIG. 71 is moved on the rail 72 arranged along the third route R3. Subsequently, as shown in the figure, the moving mechanism 74 stops the movement when the stage 71 is located at the detection position P7.

  Next, the control unit 6 causes the detection unit 5 to execute detection processing. In this detection process, the detection unit 5 captures the substrate 400 held by the suction platform 73 of the third transport mechanism 43 from above the suction platform 73 and analyzes the captured image to thereby analyze the substrate 400. A positional shift of the substrate 400 in the rotation direction about the central axis penetrating in the vertical direction is detected.

  Subsequently, the control unit 6 causes the correction mechanism 75 of the third transport mechanism 43 to perform correction processing. In this correction process, the correction mechanism 75 is held by the suction stand 73 by rotating the suction stand 73 about the central axis that penetrates the suction stand 73 in the vertical direction based on the result of the detection process by the detection unit 5. The positional deviation of the substrate 400 is corrected.

  Next, as shown in FIG. 12, the moving mechanism 74 of the third transport mechanism 43 moves the stage 71 toward the mounting position P2, and stops the movement when the stage 71 is positioned at the mounting position P2. As a result, the substrate 400 is transported by the third transport mechanism 43 along the third path R3 connecting the delivery position P6 and the mounting position P2.

  On the other hand, for example, the control unit 6 causes the mounting unit 2 to start the mounting process when a predetermined time has elapsed since the start of the first transport process. In this mounting process, the moving mechanism 14 transports the suction head 11 to the arrangement position of the alignment plate 13 as shown in FIG. At this time, as shown in FIG. 3, the suction surface 11 c of the bottom wall 11 b of the suction head 11 and the upper surface 13 a of the alignment plate 13 come into contact with each other. Subsequently, the control unit 6 causes the suction head 11 to perform a suction process and causes the supply unit 12 to perform a supply process and a removal process. Specifically, the control unit 6 operates an intake device (not shown). As a result, the space 11a of the suction head 11 is in a negative pressure state and intake from the intake port 11e is started. In addition, intake from the intake path 22 c in the suction holding unit 22 of the supply unit 12 and intake from the suction path 23 a in the suction unit 23 of the supply unit 12 are started.

  Next, with the suction from the suction path 22 c in the suction holding unit 22, the solder ball 300 stored in the storage container 21 of the supply unit 12 is sucked and held by the tip 22 a of the suction holding unit 22. Subsequently, the control unit 6 controls the driving mechanism (not shown) to rotate the intake pipe 22d attached to the proximal end portion 22b of the suction holding portion 22, thereby making the proximal end as shown in FIG. The suction holding part 22 is rotated around the part 22b. At this time, the solder ball 300 held by the tip 22 a is moved toward the opening 21 b of the container 21 as the suction holding unit 22 rotates. Further, a part of the solder ball 300 moved to the opening 21b side is wiped off by the wiper 21d provided on the opening 21b side. For this reason, the amount (number) of solder balls 300 supplied to the suction head 11 is limited to an appropriate amount.

  Next, the control unit 6 controls the drive mechanism when the tip 22a of the suction holding unit 22 faces the suction surface 11c of the suction head 11 (when the suction holding unit 22 rotates 180 °), The rotation of the tube 22d is stopped. Subsequently, the control unit 6 controls the drive mechanism to move the main body 100 toward the suction surface 11c (alignment plate 13) of the suction head 11, and the tip 22a is moved to the alignment plate 13 (suction surface). 11c) is brought close to one end side. At this time, the solder ball 300 located on the alignment plate 13 side (upper part) of the solder balls 300 held at the tip 22 a close to the alignment plate 13 is sucked into the suction head 11. The suction force generated by the suction from the mouth 11 e is attracted to the suction head 11 against the suction force of the suction holding unit 22 and supplied to the suction head 11. Further, a part of the supplied solder ball 300 is attracted to the suction port 11 e and is sucked by the edge of the suction port 11 e on the suction surface 11 c of the suction head 11 through each insertion hole 13 c of the alignment plate 13. The

  Next, the control unit 6 controls the drive mechanism to place the main body unit 100 on the alignment plate 13 (suction surface 11c) in a state where the tip 22a is brought close to the alignment plate 13 as shown in FIG. And is moved toward the other end side (right side in the figure) of the alignment plate 13 (in the direction indicated by the arrow in the figure). At this time, as described above, the solder balls 300 located on the alignment plate 13 side among the solder balls 300 held by the tip 22 a are attracted by the suction force of the suction head 11. The suction head 11 is attracted to the suction head 11 against the suction force and supplied to the suction head 11, and a part of the suction head 11 passes through the insertion holes 13 c of the alignment plate 13 and the edge of the suction port 11 e on the suction surface 11 c of the suction head 11. Adsorbed to the part. In this way, the solder balls 300 held by the tip 22a of the suction holding unit 22 are gradually supplied to the suction head 11 as the suction holding unit 22 moves (while being distributed). A part of the solder ball 300 is sucked one by one at the edge of each suction port 11e in the suction surface 11c of the suction head 11.

  Here, since the solder ball 300 is minute as described above, the force with which the solder balls 300 attract each other due to static electricity or intermolecular force is relatively large with respect to the weight of the solder ball. For this reason, another surplus solder ball 300 adheres to the solder ball 300 to be mounted adsorbed on the edge of the air inlet 11e. In this case, in the solder ball mounting apparatus 1, as described above, the thickness L3 of the alignment plate 13 is defined to be about 80 μm, which is slightly thicker than the diameter L1 of the solder ball 300, and the diameter L4 of the insertion hole 13c is It is defined to be about 90 μm, which is slightly larger than 300 diameter L1. Therefore, only the solder ball 300 to be mounted is accommodated in the insertion hole 13c, and the excess solder ball 300 is partly (volume part) or entirely outside the lower surface 13b of the insertion hole 13c (lower side). ) Sticks in a protruding state. Further, in this solder ball mounting apparatus 1, as described above, the solder balls 300 held at the tip 22a are supplied while being dispersed, so that excessive supply of the solder balls 300 is prevented and excessive solder is supplied. The adhesion of the balls 300 is suppressed to a small extent.

  Subsequently, the control unit 6 controls the driving mechanism to further move the main body unit 100 along the alignment plate 13 (in the direction indicated by the arrow in FIG. 14) as shown in FIG. At this time, as shown in the figure, the suction part 23 is moved following the suction holding part 22, and surplus solder balls 300 are sucked by suction from the suction path 23 a in the suction part 23. For this reason, even if the solder balls 300 to be mounted and the excessive solder balls 300 attract each other strongly, all of the excessive solder balls 300 are forcibly separated from the solder balls 300 to be mounted and the suction head 11 or It is surely removed from the alignment plate 13.

  Subsequently, the control unit 6 controls the moving mechanism 14 to move the suction head 11 so that the suction head 11 is separated from the alignment plate 13. Next, the control unit 6 controls the moving mechanism 14 to cause the suction head 11 that sucks the solder balls 300 to be transported to the mounting position P2, and then is sucked by the suction head 11 as shown in FIG. The suction head 11 is moved toward the substrate 400 (in the direction of the arrow shown in the figure) so that the solder balls 300 being in contact with the flux applied to the terminals 401 of the substrate 400.

  Next, the control unit 6 controls the intake device to stop intake from the intake port 11 e in the suction head 11. At this time, as shown in FIG. 16, the suction by the suction head 11 is released, and the solder ball 300 is placed on the flux applied to the terminal 401 of the substrate 400. Subsequently, the control unit 6 controls the moving mechanism 14 to move the suction head 11 upward (in the direction of the arrow shown in the figure) and then transport it to the initial position as shown in the figure. Let Thus, the mounting of the solder balls 300 on the terminals 401 on the substrate 400 is completed. Next, the substrate 400 on which the mounting of the solder balls 300 is completed is moved from the suction platform 73 of the third transport mechanism 43 to the stock location by a take-out device (not shown). Subsequently, the moving mechanism 74 of the third transport mechanism 43 moves the stage 71 from the mounting position P2 to the delivery position P6 (returns to the initial position).

  On the other hand, the control unit 6 causes the first transport mechanism 41 to start the first transport process for the next substrate 400 while the mounting process described above is being performed, and then performs the coating process on the substrate 400. 3 is executed. That is, in this solder ball mounting apparatus 1, the coating process can be performed in parallel with the mounting process. Therefore, the next substrate 400 is placed on the suction platform 73 without the suction platform 73 (stage 71) of the third transport mechanism 43 being kept on standby for a long time at the delivery position P6. In addition, the control unit 6 starts the mounting process (adsorption processing, supply processing, and removal processing) for the next substrate 400 to the mounting unit 2 when a predetermined time has elapsed from the start of the first transport processing for the next substrate 400. Let For this reason, in this solder ball mounting apparatus 1, the suction process, the supply process, and the removal process can be completed (or almost completed) until the next substrate 400 is transported to the mounting position P2. It is possible to shorten the time that the suction stand 73 of the transport mechanism 43 waits at the mounting position P2. Therefore, in this solder ball mounting apparatus 1, it is possible to sufficiently shorten the processing time per one substrate 400, and as a result, it is possible to sufficiently improve productivity. Hereinafter, the control unit 6 causes the mounting unit 2, the application unit 3, the transport unit 4, and the detection unit 5 to perform the above-described processes, thereby continuously mounting the solder balls 300 on the substrate 400.

  As described above, according to the suction table 53 and the solder ball mounting device 1, the base portion 81 having the air inlet 81h formed on the upper surface 81a side and the base portion 81 so as to cover the air inlet 81h with air permeability. The suction table 53 is configured to include a sheet body 82 disposed on the upper surface 81a side and a suction plate 83 formed with a plurality of vent holes 83c and disposed on the upper surface 81a side with the sheet body 82 interposed therebetween. Thus, the substrate 400 can be reliably adsorbed and held without using a hard ceramic that requires a long time for polishing. For this reason, according to the suction table 53 and the solder ball mounting device 1, the base portion 81 and the suction plate 83 are formed of aluminum which is easy to polish, whereby the upper surface 81a of the base portion 81 and the one surface 83a of the suction plate 83 are formed. In addition, since the other surface 83b of the suction plate 83 can be polished in a short time, the manufacturing cost of the suction table 53 and thus the solder ball mounting device 1 can be sufficiently reduced by the amount of the polishing process. Further, according to the suction table 53 and the solder ball mounting device 1, even if the sheet body 82 is clogged due to long-term use, the sheet portion 82 and the suction plate 83 that need to be polished can be replaced without replacing the sheet body 82. Since only the body 82 needs to be replaced, the running cost can be kept sufficiently low.

  Further, according to the suction table 53 and the solder ball mounting device 1, the concave portion 81 c into which the sheet body 82 can be fitted is formed on the upper surface 81 a of the base portion 81, whereby the upper surface 81 a of the base portion 81 and one surface of the suction plate 83. 83a can be brought into intimate contact with each other, and the inclination of the substrate 400 placed on the suction plate 83 can be reliably avoided by flattening both surfaces with high accuracy.

  In addition, according to the suction table 53 and the solder ball mounting device 1, since the suction plate 83 is formed of a conductive material, for example, the solder ball 300 is mounted on the substrate 400 on which the terminal 401 is formed on the back side. In doing so, charging of the substrate 400 can be prevented by connecting the terminal 401 on the back side to the reference potential (ground potential) via the suction plate 83.

  In addition, although it mentioned above about the example which formed the adsorption | suction board 83 with aluminum, it can also form with another metal. Moreover, the adsorption | suction board 83 formed with other electroconductive materials (for example, electroconductive resin) other than a metal is also employable. Furthermore, an adsorption plate 83 formed of a non-conductive material can be employed. In this case, in the solder ball mounting apparatus 1, since the suction base 53 is configured by the base portion 81, the sheet body 82, and the suction plate 83, the suction plate 83 formed of a conductive material and a non-conductive material are used. Any one of the formed suction plates 83 can be used. For this reason, it is possible to correspond to various substrates 400 by exchanging the suction plate 83 according to the necessity of insulation between the terminals 401 on the substrate 400 or the like.

  Further, the configuration example in which the concave portion 81c into which the sheet body 82 can be fitted is formed only on the upper surface 81a of the base body 81, but the configuration in which the concave portion into which the sheet body 82 can be fitted is formed on the one surface 83a of the suction plate 83, A configuration in which such a concave portion is formed on both the upper surface 81a of the base portion 81 and the one surface 83a of the suction plate 83 may be employed.

DESCRIPTION OF SYMBOLS 1 Solder ball mounting apparatus 2 Mounting part 53 Suction stand 81 Base part 81a Upper surface 81c Recessed part 81h Air inlet 82 Sheet body 83 Suction plate 83a One side 83b Other side 83c Vent hole 300 Solder ball 400 Substrate

Claims (5)

An adsorption platform for adsorbing and holding an adsorption object,
A plate-like base portion having an air inlet formed on the upper surface side, a sheet body disposed on the upper surface side of the base portion so as to cover the air inlet with air permeability, and a plurality of holes penetrating in the thickness direction And a suction plate disposed on the upper surface side of the sheet body so that one surface faces the upper surface, and the suction plate is disposed on the upper surface side in the state where the suction plate is disposed on the upper surface side. A suction stand for communicating the suction port and the vent hole through a body, sucking from the suction port, and sucking and holding the suction target object placed on the other surface of the suction plate.   The suction stand according to claim 1, wherein a concave portion into which the sheet body can be fitted is formed on at least one of the upper surface of the base portion and the one surface of the suction plate.   The suction table according to claim 1, wherein the suction plate is made of a conductive material.   The suction table according to claim 1, wherein the suction plate is made of a non-conductive material.   A spherical body mounting apparatus comprising: the suction table according to any one of claims 1 to 4; and a mounting unit for mounting the spherical body on the mounting target body as the suction target body held by the suction base.

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