JP5950574B2 - Dust-free packaging bag with excellent automatic packaging - Google Patents

Description

  The present invention relates to a dust-free packaging bag suitably used for packaging electronic material parts or electronic material products such as a wafer case loaded with, for example, a silicon wafer, a compound semiconductor wafer, a hard disk, etc. Related to excellent packaging bags.

  Electronic materials such as silicon wafers, compound semiconductor wafers (eg, gallium / phosphorus wafers), and hard disks have extremely high requirements for cleanliness. Therefore, for example, the disk-shaped products such as silicon wafers, compound semiconductor wafers, and hard disks are stored in a cleanly washed box-shaped resin case and then a clean packaging bag made of a laminate having polyethylene as a sealant layer. Generally packaged. In this way, if the inner plastic case lacks confidentiality in the packaging bag that packages the electronic material product, the so-called breathing phenomenon, in which air enters and exits the resin case due to the pressure change of the surrounding environment during the transportation process Will occur. For example, when air cargo is temporarily stored in a warehouse in a high-temperature environment in an airport, or when it is stored as air cargo in the cargo compartment of an aircraft and decompressed above, a breathing phenomenon occurs due to pressure change. When such a breathing phenomenon occurs, ionic impurities and floating particles present in the innermost layer of the packaging bag adhere to the surface of the clean electronic material stored in the resin case, and the electronic material is contaminated. Therefore, the innermost sealant layer of the packaging bag is strongly required to have a small content of ionic impurities and a small amount of floating particles.

  Therefore, the applicant of the present invention has previously proposed a laminate for a dust-free packaging bag as shown in Patent Documents 1 and 2 below, as a solution to meet such a requirement.

That is, in Patent Document 1, the melt flow rate produced by a high-pressure radical polymerization method using a peroxide radical initiator alone having a half-life in the range of 150 to 200 ° C. or a combination of two or more of these is 0. The present invention proposes a laminate for a packaging bag using a low-density polyethylene film having a density of 0.92 g / cm ³ or less, which is ^{3 to 5} g / 10 min, as a sealant layer (see claim 4 of Patent Document 1).

Patent Document 2 does not contain an additive having a density of 0.925 to 0.935 g / cm ³ containing a linear ethylene-α-olefin copolymer produced using a metallocene catalyst as a polymerization catalyst. A laminate for packaging bags using a film as a sealant layer (see claim 1 of Patent Document 2), or a linear ethylene-α-olefin copolymer produced using a Ziegler catalyst as a polymerization catalyst is an operation for removing ionic impurities. A film containing no linear additives having a density of 0.925 to 0.935 g / cm ³ and containing a linear ethylene-α-olefin copolymer with reduced or eliminated ionic impurities contained in the sealant layer was used. A laminate for packaging (see claim 2 of Patent Document 2) is proposed.

  On the other hand, as mentioned above, box-shaped resin cases containing disc-shaped products such as silicon wafers, compound semiconductor wafers, and hard disks are generally automatically packaged in clean, dust-free packaging bags by automatic packing machines. is there. At this time, the empty bags stacked on the supply stage of the automatic packing machine are taken out one by one with a sucker or the like of an automatic bag feeder, automatically opened, and sealed after the resin case is loaded.

  In addition, the dust-free packaging bag used above is a laminated body in which a laminated body of polyester, polyamide, and polyolefin plastic films is used for the inner bag and a barrier layer such as aluminum foil or silica-deposited polyester is used for the outer bag. It is usual to use the inside and outside double packaging.

  However, these packaging bags are basically made of a laminate made of a synthetic resin film, so that static electricity easily occurs and is easily charged. In particular, it is more easily charged in factories such as silicon wafers, compound semiconductor wafers, and hard disks where the inside of the factory is controlled at a low humidity. For this reason, when taking out the dust-free packaging bags pooled in the stacking state one by one with the sucker of the automatic bag feeder, the bags are adsorbed by static electricity and lifted with the sucker. An empty bag adhesion phenomenon in which the lower bags also stick to each other, and process troubles such as the fact that the packaging bags cannot be taken out one by one or the positions of the lower bags are shifted even if they do not adhere easily occurred.

  In order to prevent or avoid such an electrostatic failure, it is a matter of course to take antistatic measures on the laminated body constituting the packaging bag.

  However, the conventional antistatic technology proposed for this type of dust-free packaging bag, as described in the following Patent Documents 3, 4, and 5, mainly contains the contents, i.e. For example, a conductive ink layer in which antimony-containing tin oxide fine particles are dispersed is formed on the outer surface of a packaging bag for the purpose of preventing adverse effects on electronic material parts and the like that require high cleanliness (see Patent Document 3). Or an antistatic agent such as an inorganic substance such as metal powder, carbon, a silicone compound, or a surfactant is added to the constituent material of the laminate (see Patent Document 4), or as described above An antistatic agent is formed on the outer surface or the like of the laminate by a coating containing an antistatic agent (see Patent Document 5), and an automatic bag feeder for an automatic packaging machine In addition to the intended purpose of improving the transportability, the above-mentioned conventionally known antistatic techniques may cause ionic impurities such as metal ions and floating particles. Since the function as a dust-free packaging bag may be greatly impaired, it has not been able to be suitably employed.

  In addition, as seen in Patent Documents 6 and 7, it is also known that an antistatic layer made of a conductive polymer is formed on the surface of a film as an antistatic measure such as a polyester film for packaging. In addition to the fact that the effects of ionic impurities and suspended particulates when packaging bags are the target, and the effects of these, are not known at all. Since it has to be given in a large amount, its adoption has hardly been recalled or tried because of the unforeseeable cost unpredictability. In addition, since the conductive polymer layer does not have a function as an adhesive, a coating process on the base film is required, and there is a difficulty in making the cost unprofitability more remarkable.

  Furthermore, Patent Document 8 proposes a method for suppressing the generation of static electricity on the surface of a plastic film by using a specific adhesive primer made of a crosslinkable polymer having antistatic properties. This method is effective as a countermeasure against static electricity, but when a dust-free packaging bag is used as an object, generation of ionic impurities is a concern, and it has not always been suitably employed.

  Also, dust-free packaging bags are generally degassed and packed at the time of factory shipment. However, degassing packaging causes the bags to adhere tightly and cause the above process trouble.

  In order to prevent such bags from sticking to each other, it is effective to use a mat film or embossing. However, in the conventional general countermeasure techniques, the visibility of the contents, the mechanical strength of the bag, the bag making Since there is a concern about lowering the efficiency of the time, it could not be suitably employed.

JP 2003-191363 A JP 2006-137010 A JP 7-329142 A JP-A-8-276528 JP-A-8-276527 JP 2003-292655 A JP 2006-282941 A Japanese Patent No. 2608383

  The present invention is required to be dust-free packaging bags as described above, that is, not to generate ionic impurities and suspended particles, and therefore, it is difficult to use a general antistatic agent, and in particular, the inner bag is transparent. As a specific object, a dust-free packaging bag for packaging such as electronic material parts that is also repelled from the use of carbon black is satisfied, while satisfying the above various requirements for the dust-free packaging bag, When packing with an automatic packing machine, in the process of taking out empty bags one by one with a sucker of an automatic bag feeding (conveying) device, etc. It is an object of the present invention to provide a dust-free packaging bag that can effectively prevent the occurrence of a process trouble and is excellent in automatic packaging suitability that can be implemented at a relatively low cost.

  The present inventors have conducted various experiments and researches on the technical problems as described above. In order to prevent the occurrence of the above process trouble at the time of empty bag pick-up conveyance by the bag feeder of the automatic packaging machine. In addition, the present inventors have found that it is important to control the surface friction force between the films on the outer surface of the packaging bag within a predetermined range along with the adoption of the predetermined antistatic technology. More specifically, an adhesive primer layer or an adhesive layer containing an antistatic agent of a specific type is preferably provided on the inner or innermost surface of the laminated base material layer of the packaging bag so that the adhesion suitability and the antistatic function are improved. Can be formed at the same time, without significantly increasing the cost, and without compromising various performances required for dust-free packaging bags such as pollution prevention, It is possible to suppress the frictional voltage to the expected range, and thus it is possible to suppress peeling electrification, and the roughened state of the surface of the bag, the static friction coefficient (μs) between the surfaces Commonly used in dust-free packaging bags by setting the surface roughness (Ra) to a range of 0.10 to 0.40 μm while controlling the coefficient of dynamic friction (μk) to 0.35 or less to 0.40 or less. The content visibility required for The combination of the two can reliably improve the automatic transportability of the dust-free packaging bag, based on the knowledge that the bag can prevent strong physical adhesion between the bags while maintaining the required mechanical strength. Thus, the present invention has been completed.

  Therefore, the present invention presents the following configuration as means for achieving the above object.

[1] In a dust-free packaging bag for packaging electronic parts and the like composed of a laminate of at least two layers of a base material layer including an outermost layer film and an innermost sealant layer,
The surface of the outermost layer film is a rough surface having a static friction coefficient (μs) of 0.40 or less, a dynamic friction coefficient (μk) of 0.35 or less, and a surface roughness (Ra) of 0.10 to 0.40 μm. And formed into
A dust-free packaging bag excellent in automatic packaging suitability, wherein an adhesive layer or an adhesive primer layer containing at least one antistatic agent is provided inside or on the innermost surface of the base material layer.

  [2] The dust-free packaging bag excellent in automatic packaging suitability as described in [1] above, wherein the surface of the outermost layer film is roughened by embossing the laminate.

  [3] A dust-free packaging bag excellent in automatic packaging suitability according to [1] or [2] above, wherein the adhesive primer layer or adhesive layer containing an antistatic agent is provided on the back side of the outermost layer film. .

  [4] The above-mentioned outermost layer film is a polyester film, and the innermost sealant layer is a linear low-density polyethylene, which is excellent in automatic packaging suitability as described in any one of [1] to [3] above. Dust packaging bag.

  [5] Any one of [1] to [4] above, wherein the peak value of the initial charging voltage in the frictional charging voltage test on the surface of the outermost layer film is 2.0 kV or less in absolute value. A dust-free packaging bag excellent in automatic packaging suitability as described in the item.

[6] The surface resistivity of the surface of the outermost layer film is 10 ¹⁶ Ω / sq or more, and the attenuation voltage after 6 minutes in the friction voltage test is 1.0 kV or less in absolute value. The dust-free packaging bag excellent in automatic packaging suitability described in any one of [1] to [5] above.

  [7] The dust-proof material having excellent automatic packaging suitability according to any one of [1] to [6] above, wherein the antistatic agent is mainly composed of alkylammonium sulfate. Packaging bag.

  [8] The above-mentioned item [7], wherein the antistatic agent is mainly composed of one of alkyl quaternary ammonium ethosulphate, N-alkyloyltrialkylammonium sulphate or a mixed composition. ] Is a dust-free packaging bag excellent in automatic packaging suitability.

[9] The automatic according to any one of [1] to [8], wherein the adhesive primer layer or the adhesive layer containing the antistatic agent has a surface resistivity of 10 ⁵ to 10 ¹⁴ Ω / sq. Dust-free packaging bag with excellent packaging suitability.

[10] [1] to [1] to [1] to [1] to [1] to [1], wherein the coating amount of the adhesive primer layer or the adhesive layer containing the antistatic agent is a uniform coating film of 1 to 1000 mg / m ^{2 in} terms of solid content of the coating amount of the antistatic agent. [9] A dust-free packaging bag excellent in automatic packaging suitability according to any one of [9].

  First, as described in the above item [1], in the dust-free packaging bag for packaging electronic material parts, the surface of the outermost layer film on the side opposite to the sealant layer on the innermost layer side is In the frictional force, the static friction coefficient (μs) is 0.40 or less, the dynamic friction coefficient (μk) is 0.35 or less, and the surface roughness (Ra) is 0.10 to 0.40 μm. A basic characteristic is a combination of the fact that an adhesive layer or a primer layer containing an antistatic agent is formed inside or on the innermost surface of the laminated base material layer. Due to the specific surface properties of the former outermost layer film, without causing the outermost layer film to become clouded, and thus without losing the visibility of the contents of the dust-free packaging bag, when vacuum deaeration packaging is performed. Also, the bags can be prevented from sticking firmly together. On the other hand, by adding an additive type antistatic agent like the latter, the adhesive layer or the adhesive primer layer can have an antistatic function at the same time, and by increasing the number of steps when an antistatic layer is separately formed. Cost increase can be avoided. In addition, by forming an adhesive layer or adhesive primer layer containing an antistatic agent on the inside or innermost surface of the laminated base material, the antistatic layer does not fall off due to external factors such as abrasion, and blocking due to the antistatic agent In addition, the frictional charging voltage on the bag surface can be suppressed to a low level, and the peeling electrification at the time of the sucking and taking out of the packaging bag by the automatic bag feeder can be suppressed. Accordingly, it is possible to reliably prevent the occurrence of the bag conveyance trouble due to the close contact of the bag and the static electricity failure as described above, and to provide a dust-free packaging bag excellent in automatic packaging suitability at a relatively low cost. In addition, by setting the surface roughness (Ra) of the film by embossing in the range of 0.10 to 0.40 μm, the surface frictional force is reduced while suppressing the clouding of the film by embossing, and the static friction coefficient ( μs) and the coefficient of dynamic friction (μk) can be controlled to the above values.

  In addition, as described in the above item [2], by roughening the surface of the outermost layer film by embossing the laminate of the base material layer and the sealant layer, immediately before bag making. High-efficiency, sharp and uniform surface irregularities can be formed on the entire surface, and surface roughness control can be set accurately and easily. As a result, it is easy to accurately set the static friction coefficient and the dynamic friction coefficient and to ensure uniformity. By the way, when laminating after applying single-sided embossing to the single-layer film for the outermost layer before laminating in advance, the embossing is relaxed by the processing heat applied during laminating, etc., and the surface roughness changes. As a result, the possession of uniform and accurate surface friction force may be hindered. In addition, the embossing may deteriorate the processability of the film and may deteriorate the productivity of the laminate.

  Moreover, as described in the above item [3], when the layer containing the antistatic agent is disposed on the back surface side of the outermost layer film, the required antistatic performance can be imparted most efficiently.

  Moreover, as described in the preceding item [4], the outermost layer film as the strength member is originally made of a polyester film having excellent transparency, and the innermost sealant layer is made of linear low density polyethylene. When it consists of the above laminated body, it can be set as the most preferable laminated material from points, such as intensity | strength, heat-seal aptitude, transparency, bag-making aptitude, as a dust-free bag for packaging, such as electronic material components.

  Further, as described in the above item [5], it is preferable that the outermost layer film surface has an absolute value of the peak value of the initial charging voltage in the friction charging voltage test of 2.0 kV or less. When the absolute value of the peak value of the frictional voltage exceeds 2.0 kV, it is charged during the process of sucking and taking out the packaging bag by the automatic bag feeder and causes a conveyance trouble.

Further, as described in the above item [6], the surface specific resistivity of the outermost layer film surface is 10 ¹⁶ Ω / sq or more, and the decay voltage after 6 minutes of the friction voltage test is 1.0 kV in absolute value. The following is preferable. When the surface resistivity of the outer layer film surface is 10 ¹⁶ Ω / sq or more, the desired effect can be achieved without any trouble even when a normal plastic film not subjected to antistatic treatment is used as it is. However, if the decay voltage after 6 minutes of the frictional voltage test exceeds 1.0 kV in absolute value, the charge decay is slow and charge is accumulated, causing a transport trouble.

  In addition, as described in the above item [7], as the antistatic material, a material mainly composed of alkylammonium sulfate can be suitably used as an additive type to an adhesive or the like. Specifically, it is preferable to use any one of alkyl quaternary ammonium ethosulphate, N-alkyloyl trialkylammonium sulphate or a mixed composition as described in the above item [8].

The surface specific resistivity of the back surface (coating surface) of the film on which the primer layer or the adhesive layer containing the antistatic agent is formed is set in the range of at least 10 ⁵ to 10 ¹⁴ Ω / sq as described in [9] above. Preferably, it is set in the range of 10 ⁹ to 10 ¹² Ω / sq. By setting the surface resistivity range as described above, the antistatic performance necessary for preventing the occurrence of the above-mentioned process troubles during automatic bag feeding (conveying) of the packaging bag is provided, and excellent in automatic packaging suitability. A dust packaging bag may be provided.

Moreover, in order to realize the surface specific resistivity as described above, the coating amount of the antistatic adhesive or primer is 1 to 1000 mg as the solid content of the coating amount of the antistatic agent as shown in the above item [10]. set in the range of / ^{m 2.} By controlling the coating amount in this way, the surface resistivity can be controlled within the desired range as described above in a uniform coating film.

It is sectional drawing which shows the laminated structure of the laminated body for packaging bags which concerns on this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is an external appearance perspective view of the packaging bag by this invention, (A) shows a box-type packaging bag in a packaging state, (B) shows an envelope-type packaging bag in an unpacked state. It is a conceptual explanatory drawing which shows the automatic bag supply process by an automatic bag supply conveyance apparatus.

  First, the basic laminated structure of the laminated body (1), which is a material of a dust-free packaging bag for packaging electronic parts and the like as an application object of the present invention, will be described. A typical example of the laminated structure is shown in FIGS.

  As shown in FIGS. 1 (a) and 1 (b), the laminate (1) comprises a base material layer (3) and a sealant layer (2) as the innermost layer. The material layer (3) includes a surface outermost layer (4) and an intermediate layer (5). Each of the layers (2), (4), and (5) is bonded by, for example, a dry laminating method using an adhesive, or bonded by an extrusion laminating method through an adhesive primer layer.

  Here, in the present invention, an additive type antistatic agent is added to the adhesive layer (6) or the adhesive primer layer provided on the laminated layer of the base material layer (3), that is, the inside or the innermost surface. It is made. In the embodiment shown in FIG. 1 (a), an intermediate layer is formed by applying an adhesive layer (6) or an adhesive primer layer containing an antistatic agent to the back side of the outermost layer (4) of the base material layer (3). (5) is provided between. Further, in another embodiment of FIG. 1 (b), an adhesive layer (6) or an adhesive primer layer that also contains an antistatic agent is provided on the back side of the intermediate layer (5), that is, the innermost surface of the base material layer. The coating is formed.

  The sealant layer (2) is composed of a linear low density polyethylene film having a density of about 0.910 to 0.940, preferably an additive (sliding material, anti-blocking material, antistatic agent, antioxidant, ultraviolet ray). What does not contain an absorbent etc. is used. In addition, it is a linear ethylene-α olefin copolymer as described in Patent Document 2, which is a copolymer produced using a metallocene catalyst as a polymerization catalyst, or a Ziegler catalyst as a polymerization catalyst. A linear ethylene-α-olefin copolymer produced by using an ionic impurity that has been reduced or removed through an ionic impurity removal operation is preferably used.

  The material for a dust-free packaging bag to which the present invention is applied comprises a laminate of at least two layers including the sealant layer (2) and a base material layer (3) laminated thereon. Moreover, the said base material layer (3) is provided with the surface outermost layer (4) at least, and the structure further provided with the intermediate | middle layer (5) of 1 layer or 2 layers or more as needed is employ | adopted.

  The film material of the outermost surface layer (4) is not particularly limited, but a polyester film is preferably used. Here, the polyester film is preferred as the film material of the outermost layer (4) because of its excellent mechanical strength and excellent transparency so that the contents stored in the packaging bag can be seen from the outside. Because it can give good visibility for.

  By the way, it is essential that the outermost layer (4) film has its outer surface preferably roughened by embossing. Moreover, this rough surface has a coefficient of static friction (μs) of 0.40 or less, a coefficient of dynamic friction (μk) of 0.35 or less, and a surface roughness in the friction force between the surfaces of the roughened film. It is necessary that (Ra) be controlled in the range of 0.10 to 0.40 μm. When the static friction coefficient (μs) of the outermost layer (4) exceeds 0.40 or the dynamic friction coefficient (μk) exceeds 0.35, it is conveyed by physical adhesion between the stacked bags. Trouble cannot be prevented. The same applies when the surface roughness (Ra) is less than 0.10 μm. On the other hand, when the surface roughness (Ra) exceeds 0.40 μm, the transparency of the film decreases due to clouding of the film, and the visibility of the contents in the bag is remarkably deteriorated. A preferable surface friction force for achieving the effect of the present invention most reliably and satisfactorily is 0.35 or less in the static friction coefficient (μs) and 0.30 or less in the dynamic friction coefficient (μk). Moreover, the preferable range of surface roughness is Ra0.15-0.35 micrometer.

  Further, the means for roughening the surface of the outermost layer (4) film is not particularly limited, but it is preferable that it is preferably applied by embossing as described above, and before lamination. It is desirable that embossing be performed in the step immediately before bag making, using the laminated body after lamination as a processing object instead of a single-layer film.

  Here, the embossing is a single-sided embossing process, and an embossing roll and an elastic roll such as a paper roll or a resin roll are used to heat and compress the laminated film at room temperature or 100 ° C. or less, and the outer surface of the film. It is the processing which transfers the unevenness | corrugation of an embossing roll. Such embossing is more uniform than roughening, processing efficiency, and mechanical strength compared to other surface roughening means such as sandblasting, mat coating, rewinding, and hairline processing. This is advantageous. In addition, by embossing the laminated body after lamination, embossing is mitigated by the processing heat received after embossing compared to the case of laminating using a film that has been embossed in advance. This is advantageous in that deterioration can be avoided and a sharp and uniform roughened state can be retained on the surface of the packaging bag.

  The shape of the embossing is not particularly limited as long as it satisfies the above ranges in surface friction force and surface roughness. Specifically, for example, a satin pattern, a cotton pattern, a dot pattern, or the like can be arbitrarily employed.

  In addition, when the light shielding property and oxygen gas barrier property are required as the outermost layer (4), for example, a barrier in which a metal or a metal oxide such as silicon oxide or aluminum is deposited or an aluminum foil is adhered. A conductive polyester film can be used.

  The said intermediate | middle layer (5) is a layer for supplementing mechanical strength (puncture strength etc.) and various barrier properties of a laminated body (1) mainly. Examples of the film used for the intermediate layer (5) include plastics such as polypropylene, polyethylene terephthalate, polyamide (nylon-6, nylon-6, 6, etc.), cellulose acetate, ethylene-vinyl acetate copolymer saponified product, and polycarbonate. Stretched or unstretched film, paper, aluminum foil and the like.

  In addition, it is preferable to use an antistatic agent containing an alkylammonium sulfate as a main component as the antistatic agent contained in the adhesive layer (6) or the adhesive primer layer in the base material layer (3). Specifically, it is preferable to use any one of alkyl quaternary ammonium ethosulphate, N-alkyloyl trialkylammonium sulfate, or a mixed composition. The antistatic agent must be halogen-free. The primer or adhesive is not particularly limited, but must be compatible with the antistatic agent. For example, urethane, epoxy, and acrylic resins are preferable. When using an isocyanate hardening | curing agent for an adhesive agent, it is preferable to add 5-30% of propylene carbonate as a non-aqueous ion electrolytic agent.

  Although the specific laminated structure in the laminated body (1) for dustless packaging bags made into the application object of this invention is enumerated below, a laminated structure is not specifically limited to these illustrations. In the following, “LLD” is linear low-density polyethylene, “PET” is biaxially stretched polyethylene terephthalate film, “Ny” is biaxially stretched polyamide film, and “PE (EXT)” is extrusion-bonded by low-density polyethylene. Indicates the layer.

PET / Ny / LLD,
PET / Ny / PE (EXT) / LLD
PET / LLD
PET / PE (EXT) / LLD

  The present invention relates to a box-type dust-free packaging bag (10) as shown in FIG. 2 (a) where the bag is produced with the laminate (1) subjected to the embossing treatment as described above, or FIG. In the envelope-type dust-free packaging bag (10A) as shown in FIG. 1 (b), as another element for improving the automatic packaging suitability, the substrate layer (3) has an inner or innermost surface as shown in FIG. As shown in (b), the formation of a primer layer or an adhesive layer (6) containing an antistatic agent is an essential feature. That is, when packaging a box-shaped resin case containing electronic material parts and products in the above-described packaging bag (10) using an automatic packaging machine, the packaging bags stacked in the bag feeding station as shown in FIG. (10) is picked up one by one from the top (arrow a) and picked up by the pick-up transfer means such as the suction cup (21) equipped in the automatic bag supply (transfer) device (20), and transferred toward the packing station. (Arrow b) When the bag is in close contact with each other, due to static electricity effects, especially the effects of peeling electrification, the lower bags may stick together and be lifted together or misaligned, and the packaging bag in the normal position and normal posture (10) As a means for preventing the occurrence of a process trouble that can prevent automatic feeding, the above-mentioned characteristic configuration as an anti-static measure in combination with the above-mentioned embossing treatment It is intended to adopt.

Unlike the case where a coating-type antistatic agent is applied, the coating process does not increase by using an adhesive or adhesive primer containing an additive-type antistatic agent as described above. Since a stable antistatic function is exhibited with a small addition amount, the original performance of the primer and the adhesive can be maintained. Accordingly, it is possible to achieve the desired surface resistance value of 10 ¹⁴ Ω / sq or less with a very small amount of use, and no significant increase in cost is caused. From such a cost point of view, it is necessary to control the surface resistivity of the coated surface by applying a primer layer or an adhesive layer containing an antistatic agent to a low value beyond the required antistatic performance range. Absent. Specifically, it is necessary and sufficient to be able to impart a surface resistivity of 10 ⁵ Ω / sq or more. More preferably, it is desirable to set it in the range of 10 ⁹ to 10 ¹² Ω / sq.

And by giving such surface specific resistivity, the peak value of the initial charging voltage in the frictional band voltage test on the surface of the outermost layer film is 2.0 kV or less in absolute value, and the attenuation band after 6 minutes has passed. The voltage is controlled to be 1.0 kV or less in absolute value. By controlling the frictional band voltage, even if a polyester film having a surface resistivity of 10 ¹⁶ Ω / sq or more with no antistatic treatment on the surface is used for the outermost layer, there is no inconvenience. The effect of preventing the conveyance trouble expected by the invention can be satisfactorily achieved.

The surface specific resistivity depends on the amount of the antistatic agent added to the primer layer or the adhesive layer (6) containing the antistatic agent. The greater the amount added, the lower the surface resistivity, which is induced in the direction of conductivity. However, it is disadvantageous in terms of material cost rather than a further improvement in the effect of applying a large amount beyond the range required for improving the automatic packaging suitability and automatic transport suitability of the present invention. Is bigger. Therefore, the coating amount in terms of solid content of the antistatic agent, should be in the range of 1 to 1000 mg / ^{m 2,} preferably from to the 5 to 100 mg / ^{m 2.}

  As a coating method for forming the primer layer or the adhesive layer (6) containing the antistatic agent, any means such as gravure coating, spray coating, and spin coater coating can be adopted. Here, the concentration of the paint is set to 1 to 30% by weight of the solid content, so that the coating operation can be easily performed including the control of the coating amount.

  The friction coefficient and the surface roughness specified in the present invention are measured values using a Toyo Seiki friction measuring instrument TR type (conforming to JIS K7125) and measured values using a surf coder SE3500 manufactured by Kosaka Laboratory (conforming to JIS B0601). Is due to. Further, the surface resistivity and frictional voltage are based on a measurement value (according to JIS K6911) by a high resistance meter manufactured by Agilent Technologies and a measurement value (according to JIS L1094) by an electrostatic measurement device manufactured by Kanebo Engineering. .

  The following materials were used as the constituent materials of the packaging laminates of Examples and Comparative Examples of the present invention and Reference Examples.

(Laminated material)
PET1: Biaxially stretched polyethylene terephthalate film, thickness 25μm
Ny1: Biaxially stretched polyamide film 15 μm thick
PE (extrusion): low density polyethylene resin (MFR 5 g / 10 min,
Density 0.924 g / cm ³ )
LLD1: linear low density polyethylene (MFR 2 g / 10 min,
Density 0.930 g / cm ³ )

  And the laminated body for packaging of the various laminated constitution shown to sample No. 1-12 of Table 1 with the said structural material was produced. In Table 1, “Film 3” is not used. The laminates 1, 2, and 5 are obtained by dry-laminating other constituent material films 1, 2, 4, or 1, 4 using a polyurethane-based dry laminate adhesive. No.) using " The laminated bodies of 3, 4, 6 to 12 are laminated and integrated by an extrusion sandwich lamination method.

Next, for the sample Nos. 1 to 9 and 12 of the above various laminates, the following single-sided embossing treatment was performed on the laminates, that is, laminate films. That is, for Sample Nos. 1 to 6 and 12, the static friction coefficient (μ _S ) between the outermost polyester films is 0.30, the dynamic friction coefficient (μ _k ) is 0.25, and the surface roughness of the outermost polyester film ( Embossing was carried out with an embossing roll having a cotton pattern and an engraving depth of 0.12 mm so that Ra) was 0.15 μm. Sample No. 7 is embossed with an embossing roll having a texture pattern and an engraving depth of 0.1 mm so that the coefficient of static friction (μ _S ) is 0.40, the coefficient of dynamic friction (μ _k ) is 0.35, and the surface roughness (Ra) is 0.10 μm. The sample No. 2 was processed. 8 is embossed with an embossing roll with a satin pattern and a sculpture depth of 0.15 mm so that the static friction coefficient (μ _S ) is 0.15, the dynamic friction coefficient (μ _k ) is 0.10, and the surface roughness (Ra) is 0.40 μm. The sample No. 2 was further processed. 9 is an embossed roll with a minimum matte pattern and a sculpture depth of 0.12 mm so that the coefficient of static friction (μ _S ) is 0.10, the coefficient of dynamic friction (μ _k ) is 0.10, and the surface roughness (Ra) is 0.55 μm. Embossed.

  Sample No. For Nos. 2 and 4, an adhesive layer containing an antistatic agent is provided on the back surface of the nylon film of the intermediate layer. In each of 1, 3, 5 to 11, an adhesive layer containing an antistatic agent was provided on the back surface of the outermost PET film. Here, as the antistatic agent, SAT-F-01 manufactured by Altec Co., Ltd., which is a mixture of an alkyl quaternary ammonium etosulphate and propylene carbonate, was used. As the adhesive, an arbitrary urethane-based adhesive having a solid content of 10% diluted with ethyl acetate is used, and the above-mentioned antistatic agent is added at a ratio of 15% by weight with respect to the solid content. It was. And after apply | coating the adhesive agent solution which added this antistatic agent with the arrangement | positioning and application quantity which are shown in Table 1 by the gravure coating method, the drying process of 100 degreeC x 1 minute was performed, and the adhesive layer containing the said antistatic agent was formed. To be formed. On the other hand, for sample No. 12, a laminate was obtained using an adhesive that did not contain an antistatic agent.

(Measurement of surface resistivity of outermost film)
Sample No. above. No. 1-11 laminated body formed with an adhesive layer containing an antistatic agent and No. 1 For the laminate not containing 12 antistatic agents, the surface specific resistivity of the outer surface side of the outermost layer film and the adhesive application surface (back surface) (application surface) of the film before lamination was measured. This measurement was performed according to JIS K6911 using a high resistance meter manufactured by Agilent Technologies, as described above. The results are also shown in Table 1.

(Measurement of friction coefficient)
In the above sample No. About 1-12, when the friction coefficient of outermost layer polyester films was measured, the static friction coefficient ((micro | micron | mu) _S ) and the dynamic friction coefficient ((micro | micron | mu) _k ) were as showing in Table 1. FIG. In addition, the measurement of this friction coefficient is based on JIS K7125 by the Toyo Seiki Co., Ltd. friction measuring device TR type | mold as mentioned above.

(Measurement of surface roughness)
Next, the above sample No. About each outermost layer film of 1-12, when those surface roughness was measured, the surface roughness (Ra) was as showing in Table 1. The surface roughness was measured according to JIS B0601 using the surf coder SE3500 manufactured by Kosaka Laboratory as described above.

―Performance evaluation―
(Measurement of frictional voltage)
Therefore, next, the above-mentioned sample No. About each outermost layer film of 1-12, when the frictional band voltage of those outer surfaces (non-application surface of an antistatic adhesive) was measured, the initial band voltage value and the attenuation band voltage value after 6-minute progress were shown. 2 as shown in the left column. In addition, the measurement of this frictional voltage was measured based on JISL1094 by the static electricity measuring apparatus by Kanebo Engineering as mentioned above.

  As shown in the measurement results of Table 1, in the outermost layer film having an adhesive layer containing an antistatic agent, the peak value of the initial electric voltage in the frictional electric voltage test is not limited by the application of a predetermined amount or more of the antistatic agent. It was confirmed that the attenuation band voltage value after 6 minutes could be controlled to a sufficiently low value.

(Automatic transfer test)
Next, in order to investigate the automatic conveyance suitability of the dust-free packaging bag in the correspondence relationship with the measurement result of the surface specific resistivity and the frictional voltage, the various sample laminates of Sample Nos. 1 to 12 obtained as described above are used. An envelope-shaped packaging bag (vertical x horizontal: 80 cm x 84 cm) as shown in 2 (b) was produced, and an automatic conveyance (bag feeding) test was performed by an automatic packaging machine.

  Here, in the automatic conveyance test, when 50 packaging bags are set as one set in the automatic conveyance device, and when the pick-up type pick-up conveyance device carries out the conveyance one by one from the top, at least two bags are temporarily stored. The number of occurrences was counted as an error when the above phenomenon occurred or even a slight shift occurred in the lower bag, and the determination was made according to the following evaluation criteria.

  The sample No. Nos. 1 to 10 and 12 are degassed and used to reproduce the normal shipping time of the packaging bags. For reference No. 11, the sample was not degassed for reference.

  The results of the automatic conveyance test are shown in Table 2.

Evaluation: ◎ 0 times
○ 1-2 times
△ 3-5 times
× 5 times or more

(Visibility)
Sample No. used for the above automatic conveyance test. About each packaging bag by 1-12, the visibility of the content from the outside when packaging a to-be-packaged item was evaluated, and the good thing was evaluated by (circle) mark and the poor thing was determined by x mark.

  The results are also shown in Table 2.

  As shown in the results of the evaluation “automatic conveyance test” in Table 2, for the samples that have been subjected to appropriate improvement measures according to the present invention, in the automatic bag feeding and conveyance process, process troubles such as adhering empty bags or misalignment due to the influence of static electricity are caused. It was confirmed that the automatic conveyance suitability could be improved as expected.

  It was also confirmed that the required transparency was maintained and the content visibility could be improved.

(Ion analysis)
Next, in order to confirm the presence or absence of ion contamination of the packaging bag, the following anion analysis and metal ion analysis were performed.

Here, the analysis method was performed using the sample No. according to the example of the present invention in which the primer layer or the adhesive layer containing the antistatic agent was formed. Comparative Sample No. 6 in which a laminate or a primer layer or an adhesive layer containing no antistatic agent was formed. 1000 ml of the extract (using pure water) was poured into each packaging bag of 12 laminates, sealed so that the inner area was 250 cm ^2, and then shaken for 2 minutes. For “anion analysis”, components of Cl ⁻ , NO ₂ ⁻ , SO ₄ ²⁻ , and NO ₃ ⁻ were measured with the ion chromatograph after shaking. The results are shown in Table 3.

  On the other hand, for “metal ion analysis”, after shaking with pure water, 20 ml of the extract was transferred to a fluororesin container (PFA container), 20 ml of 68% nitric acid was added, and then ICP-MS (inductively coupled plasma mass spectrometer). ), Na, Al, Mg, Zn, Fe, Cu components were measured. The results are shown in Table 4.

  As shown in the results of evaluations “Anion analysis” and “Metal ion analysis” in Tables 3 and 4, the samples subjected to appropriate antistatic measures by addition of the antistatic agent according to the present invention have no antistatic agent. It can be confirmed that the content of ionic impurities such as metal ions and inorganic ions is very low, and that it is suitable for non-contamination when using dust-free packaging bags. It was.

  The dust-free packaging bag according to the present invention is used for sealed packaging for transportation of electronic material products or parts such as silicon wafers, compound semiconductor wafers, and hard disks, and medical equipment that requires a high degree of cleanliness. It is also applied for packaging.

1 ... Laminate for packaging 2 ... Sealant layer (innermost layer)
DESCRIPTION OF SYMBOLS 3 ... Base material layer 4 ... Outermost layer 5 ... Intermediate | middle layer 6 ... Primer layer containing an antistatic agent, or contact bonding layer

Claims (9)

In a dust-free packaging bag for electronic component packaging or medical device packaging consisting of a laminate of at least two layers of a base material layer including an outermost layer film and an innermost sealant layer,
The surface of the outermost layer film is a rough surface having a static friction coefficient (μs) of 0.40 or less, a dynamic friction coefficient (μk) of 0.35 or less, and a surface roughness (Ra) of 0.10 to 0.40 μm. And
The base material layer further includes an intermediate layer,
An adhesive layer or an adhesive primer layer containing at least one antistatic agent is provided on the back surface of the outermost layer film, and the adhesive layer or the adhesive primer layer is provided between the outermost layer film and the intermediate layer. A dust-free packaging bag excellent in automatic packaging suitability, characterized in that is provided. In a dust-free packaging bag for electronic component packaging or medical device packaging consisting of a laminate of at least two layers of a base material layer including an outermost layer film and an innermost sealant layer,
The surface of the outermost layer film is a rough surface having a static friction coefficient (μs) of 0.40 or less, a dynamic friction coefficient (μk) of 0.35 or less, and a surface roughness (Ra) of 0.10 to 0.40 μm. And
The base material layer further includes an extruded adhesive layer,
An adhesive layer or an adhesive primer layer containing at least one antistatic agent is provided on the back surface of the outermost layer film, and the adhesive layer or the adhesive primer is provided between the outermost layer film and the extruded adhesive layer. A dust-free packaging bag excellent in automatic packaging suitability, wherein a layer is provided. The dust-free packaging bag excellent in automatic packaging suitability according to claim 1 or 2 , wherein the outermost layer film is a polyester film, and the innermost sealant layer is a linear low density polyethylene. The automatic packaging according to any one of claims 1 to 3 , wherein the peak value of the initial charging voltage in the frictional charging voltage test on the surface of the outermost layer film is 2.0 kV or less in absolute value. Dust-free packaging bag with excellent suitability. The surface resistivity of the surface of the outermost layer film is 10 ¹⁶ Ω / sq or more, and the decay voltage after 6 minutes in the friction voltage test is 1.0 kV or less in absolute value. The dust-free packaging bag excellent in automatic packaging suitability according to any one of claims 1 to 4 . The dust-free packaging bag excellent in automatic packaging suitability according to any one of claims 1 to 5 , wherein the antistatic agent is mainly composed of alkylammonium sulfate. 7. The antistatic agent according to claim 6 , wherein the antistatic agent is mainly composed of any one of alkyl quaternary ammonium ethosulphate, N-alkyloyltrialkylammonium sulphate, or a mixed composition. Dust-free packaging bag with excellent suitability for automatic packaging. The adhesive primer layer or the adhesive layer containing the antistatic agent has a surface resistivity of 10 ⁵ to 10 ¹⁴ Ω / sq, which is excellent in automatic packaging suitability according to any one of claims 1 to 7. Dust packaging bag. The coating amount of the antistatic agent adhesive primer layer or adhesive layer containing the any of claims 1-8 comprising a uniform coating of 1 to 1000 mg / m ² in terms of solid content coating amount of the antistatic agent 1 A dust-free packaging bag excellent in automatic packaging suitability as described in the item.

Images