JP5926620B2 - 半田付け方法 - Google Patents
半田付け方法 Download PDFInfo
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- JP5926620B2 JP5926620B2 JP2012126913A JP2012126913A JP5926620B2 JP 5926620 B2 JP5926620 B2 JP 5926620B2 JP 2012126913 A JP2012126913 A JP 2012126913A JP 2012126913 A JP2012126913 A JP 2012126913A JP 5926620 B2 JP5926620 B2 JP 5926620B2
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- Prior art keywords
- chamber
- processing chamber
- solder
- hydrogen gas
- piston
- Prior art date
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- 238000005476 soldering Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 26
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 29
- 229910001873 dinitrogen Inorganic materials 0.000 description 29
- 239000007789 gas Substances 0.000 description 20
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Description
Claims (2)
- 被処理物の半田付け部の半田を処理室内の還元ガス雰囲気中で加熱溶融する半田付け方法において、ピストンが配置されたシリンダ室が前記処理室に接続されており、前記ピストンの作動によりシリンダ室内にある還元ガスが前記処理室に供給されて半田の加熱溶融処理が実施され、半田の加熱溶融処理が実施された後、前記ピストンの作動により前記処理室内にある還元ガスがシリンダ室内に戻されることを特徴とする半田付け方法。
- 前記シリンダ室に供給及びシリンダ室から排出されるピストン駆動用ガスによって前記ピストンが作動することを特徴とする請求項1記載の半田付け方法。
Priority Applications (1)
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JP2012126913A JP5926620B2 (ja) | 2012-06-04 | 2012-06-04 | 半田付け方法 |
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JP2012126913A JP5926620B2 (ja) | 2012-06-04 | 2012-06-04 | 半田付け方法 |
Publications (2)
Publication Number | Publication Date |
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JP2013248662A JP2013248662A (ja) | 2013-12-12 |
JP5926620B2 true JP5926620B2 (ja) | 2016-05-25 |
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ID=49847865
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JP2012126913A Active JP5926620B2 (ja) | 2012-06-04 | 2012-06-04 | 半田付け方法 |
Country Status (1)
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JP (1) | JP5926620B2 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5629796U (ja) * | 1979-08-10 | 1981-03-20 | ||
US4860942A (en) * | 1987-11-30 | 1989-08-29 | Ceradyne, Inc. | Method for soldering void-free joints |
JP2006308748A (ja) * | 2005-04-27 | 2006-11-09 | Olympus Medical Systems Corp | 光学ユニット組立方法 |
JP5144069B2 (ja) * | 2006-12-26 | 2013-02-13 | オルガノ株式会社 | 超臨界流体による処理装置 |
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2012
- 2012-06-04 JP JP2012126913A patent/JP5926620B2/ja active Active
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JP2013248662A (ja) | 2013-12-12 |
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