JP5922838B2 - リソグラフィ装置用の回転フレームおよび投影システム - Google Patents
リソグラフィ装置用の回転フレームおよび投影システム Download PDFInfo
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- JP5922838B2 JP5922838B2 JP2015504883A JP2015504883A JP5922838B2 JP 5922838 B2 JP5922838 B2 JP 5922838B2 JP 2015504883 A JP2015504883 A JP 2015504883A JP 2015504883 A JP2015504883 A JP 2015504883A JP 5922838 B2 JP5922838 B2 JP 5922838B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
- G03F7/70366—Rotary scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本出願は、2012年4月11日に出願された米国特許仮出願第61/622,922号の利益を主張し、その全体が本明細書に援用される。
Claims (17)
- 軸周りに回転するように構成された、リソグラフィ装置で使用する回転フレームであって、
前記軸に沿って穴を備えるシャフトと、
前記軸に対してある角度で径方向外側に延び、レンズを保持するように構成され、前記軸に沿って前記穴を備えるフランジと、
を備え、
前記フランジは前記シャフトの上部と下部との間に配置され、回転中に、前記上部によって前記フランジに作用するモーメントが、前記下部によって前記フランジに作用するモーメントと反対向きかつ実質的に同等であるように、前記上部および前記下部が構成されることを特徴とする回転フレーム。 - 前記上部の断面が前記下部の断面と異なることを特徴とする請求項1に記載の回転フレーム。
- 前記上部の断面が前記下部の断面と一致することを特徴とする請求項1に記載の回転フレーム。
- 軸周りに回転するように構成された、リソグラフィ装置で使用する回転フレームであって、
前記軸に沿って穴を備えるシャフトと、
前記軸に対してある角度で径方向外側に延び、レンズを保持するように構成され、前記軸に沿って前記穴を備えるフランジと、
を備え、
回転中に、前記フランジの軸方向の一側面上のシャフト部分が該フランジに実質的にモーメントを与えないことを特徴とする回転フレーム。 - 軸周りに回転するように構成された、リソグラフィ装置で使用する回転フレームであって、
前記軸に沿って穴を備えるシャフトと、
前記軸に対してある角度で径方向外側に延び、レンズを保持するように構成され、前記軸に沿って前記穴を備えるフランジと、
を備え、
前記フランジは、前記シャフトの軸方向の中間部に面する凹部または突出リムを前記フランジの表面に有することを特徴とする回転フレーム。 - 軸周りに回転するように構成された、リソグラフィ装置で使用する回転フレームであって、
前記軸に沿って穴を備えるシャフトと、
前記軸に対してある角度で径方向外側に延び、レンズを保持するように構成され、前記軸に沿って前記穴を備えるフランジと、
を備え、
前記フランジは、該フランジよりも柔軟性の高いコネクタによって前記シャフトに接続されることを特徴とする回転フレーム。 - 前記コネクタは前記フランジよりも細いことを特徴とする請求項6に記載の回転フレーム。
- 前記フランジは、回転中に前記コネクタが曲がるように前記コネクタによって前記シャフトに接続されることを特徴とする請求項6または7に記載の回転フレーム。
- 回転中に、前記フランジの前記軸に沿った位置が回転速度の変化に対して実質的に一定となるようにコネクタが曲がるように構成されることを特徴とする請求項6ないし8のいずれかに記載の回転フレーム。
- 前記コネクタは、前記シャフトへの接続点から該シャフトの軸方向の中間部に向けて延びるシャフト接続部を有することを特徴とする請求項6ないし9のいずれかに記載の回転フレーム。
- 前記コネクタは、該コネクタが前記シャフトに接続される位置よりも前記シャフトの軸方向の中間部に近い位置で前記フランジに接続されることを特徴とする請求項10に記載の回転フレーム。
- 前記コネクタは、前記フランジへの接続点から前記シャフトの軸方向の中間部に向けて延びるフランジ接続部を有することを特徴とする請求項10または11に記載の回転フレーム。
- 前記フランジは、前記軸から距離R0にある内縁と、前記軸から距離R1にある外縁とを有し、前記内縁は前記穴により定められ、前記フレームに隣接する前記シャフトの部分は、前記軸から距離R2にある内縁と、前記軸から距離R3にある外縁とを有し、前記内縁は前記穴により定められ、R0とR1の積が、R2とR3の積と最大で10%だけ異なることを特徴とする請求項1ないし12のいずれかに記載の回転フレーム。
- R0とR1の積がR2とR3の積と実質的に等しいことを特徴とする請求項13に記載の回転フレーム。
- 前記フランジは、前記シャフトによって作用するモーメントから少なくとも部分的に分離されていることを特徴とする請求項1ないし14のいずれかに記載の回転フレーム。
- 前記穴は、アクチュエータおよび/またはベアリング用の空間を確保するために設けられていることを特徴とする請求項1ないし14のいずれかに記載の回転フレーム。
- ターゲット上に放射ビームを投影するように構成された投影システムであって、
接線方向および径方向を規定する軸の周りに回転するように構成された請求項1から16のいずれかに記載の回転フレームであって、接線方向または径方向のみに放射ビームを合焦させるように構成されたレンズを保持する回転フレームと、
接線方向または径方向の他方のみに放射ビームを合焦させるように構成された実質的に静止したレンズを有する静止部と、を備えることを特徴とする投影システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261622922P | 2012-04-11 | 2012-04-11 | |
US61/622,922 | 2012-04-11 | ||
PCT/EP2013/051800 WO2013152877A1 (en) | 2012-04-11 | 2013-01-30 | Rotatable frame for a lithographic apparatus |
Publications (2)
Publication Number | Publication Date |
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JP2015516681A JP2015516681A (ja) | 2015-06-11 |
JP5922838B2 true JP5922838B2 (ja) | 2016-05-24 |
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JP2015504883A Expired - Fee Related JP5922838B2 (ja) | 2012-04-11 | 2013-01-30 | リソグラフィ装置用の回転フレームおよび投影システム |
Country Status (5)
Country | Link |
---|---|
US (2) | US20150034788A1 (ja) |
JP (1) | JP5922838B2 (ja) |
KR (1) | KR101688444B1 (ja) |
NL (1) | NL2010204A (ja) |
WO (1) | WO2013152877A1 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US4692603A (en) | 1985-04-01 | 1987-09-08 | Cauzin Systems, Incorporated | Optical reader for printed bit-encoded data and method of reading same |
JPS645016A (en) * | 1987-06-26 | 1989-01-10 | Matsushita Electric Ind Co Ltd | Scanning type projection aligner |
US7012768B2 (en) * | 2000-12-27 | 2006-03-14 | Ntn Corporation | Optical pick-up |
US7436484B2 (en) | 2004-12-28 | 2008-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2007142215A1 (ja) * | 2006-06-05 | 2007-12-13 | Bridgestone Corporation | 防振装置 |
WO2010032224A2 (en) | 2008-09-22 | 2010-03-25 | Asml Netherlands B.V. | Lithographic apparatus, programmable patterning device and lithographic method |
TWI524091B (zh) * | 2008-12-05 | 2016-03-01 | 麥可尼克資料處理公司 | 使用旋轉印刷臂以投射或觀看在工作部件上之影像之方法及裝置 |
WO2010100273A2 (en) * | 2009-03-06 | 2010-09-10 | Micronic Laser Systems Ab | Variable overlap method and device for stitching together lithographic stripes |
WO2011026610A2 (en) * | 2009-09-01 | 2011-03-10 | Micronic Mydata AB | Pattern generation systems and high bandwidth focus control systems with suppressed reaction forces and noise |
CN102844713B (zh) * | 2010-02-23 | 2016-04-20 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
WO2013029879A1 (en) * | 2011-08-30 | 2013-03-07 | Asml Netherlands B.V. | Lithographic apparatus, method of setting up a lithographic apparatus and device manufacturing method |
NL2009902A (en) * | 2011-12-27 | 2013-07-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
-
2013
- 2013-01-30 US US14/382,228 patent/US20150034788A1/en not_active Abandoned
- 2013-01-30 KR KR1020147029049A patent/KR101688444B1/ko active IP Right Grant
- 2013-01-30 WO PCT/EP2013/051800 patent/WO2013152877A1/en active Application Filing
- 2013-01-30 JP JP2015504883A patent/JP5922838B2/ja not_active Expired - Fee Related
- 2013-01-30 NL NL2010204A patent/NL2010204A/en not_active Application Discontinuation
-
2016
- 2016-08-12 US US15/235,542 patent/US20160349628A1/en not_active Abandoned
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Publication number | Publication date |
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WO2013152877A1 (en) | 2013-10-17 |
US20150034788A1 (en) | 2015-02-05 |
KR20140144225A (ko) | 2014-12-18 |
US20160349628A1 (en) | 2016-12-01 |
JP2015516681A (ja) | 2015-06-11 |
NL2010204A (en) | 2013-10-15 |
KR101688444B1 (ko) | 2016-12-21 |
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