JP5903589B2 - Arrangement decision support device and arrangement decision support method for receiving pin - Google Patents

Description

  The present invention relates to an arrangement determination support apparatus and an arrangement determination support method for supporting pins that support the determination of the arrangement of receiving pins for receiving a substrate in an electronic component mounting apparatus.

  In a component mounting process for mounting electronic components on a substrate, a substrate receiving method that supports a plurality of receiving pins in contact with the lower surface of the substrate is widely used as a substrate supporting method for supporting the substrate from the lower surface side. . In this base pin method, if there are already mounted parts mounted in the previous process on the bottom side of the board, the parts that can be received are set so as not to cause positional interference with these already mounted parts. It is necessary to select and determine the arrangement of the receiving pin. This determination of the placement of the receiving pin is performed by the operator at the production site by observing the arrangement of the electronic components on the already mounted surface to find the part that can be received, and various support is provided to facilitate this pin placement work. An apparatus is used (for example, refer to Patent Document 1). In the prior art shown in this patent document example, the image of the already mounted surface and the image showing the arrangement of the pin holes where the receiving pins are arranged are displayed so as to overlap each other. The state of occurrence of interference can be observed visually.

JP 2008-211051 A

  In recent years, in the field of electronic component mounting, the versatility of equipment has been demanded, and a mounting work method that moves a board and positions it multiple times for a so-called long board whose size exceeds the mounting work range of the electronic component mounting apparatus. Is being used. In such a mounting work system, the substrate whose position is moved every time positioning must be received by a common receiving pin, and therefore the determination of the arrangement of the receiving pin described above positions the substrate at a single position. Compared to normal mounting work, it becomes more complicated. For this reason, in the prior art, it has been necessary to repeatedly perform a plurality of trials and confirmations when determining the placement of the receiving pin, which complicates the complicated work.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an arrangement determination support device and an arrangement determination support method for a receiving pin that can simplify an operation for determining an arrangement of receiving pins that are commonly used for a plurality of mounting operation positions. .

The support pin placement determination support device according to the present invention targets a substrate that is sequentially positioned at a plurality of mounting work positions including at least a first mounting work position and a second mounting work position and is a target of a plurality of mounting work objects. A support pin placement determination support device for supporting the determination of the placement of the support pins for receiving the already mounted surface of the substrate from the lower surface side in the substrate holding part of the electronic component mounting device, wherein the already mounted surface Display means for displaying an image for pin placement determination support including a board image indicating the shape and placement of the already mounted component, and a position input unit for inputting the placement position of the receiving pin on the displayed image, A pin image display processing unit that causes the display means to display a composite image obtained by superimposing the pin arrangement image to which the arrangement position is input on the substrate image, wherein the substrate is the first image. Assuming the first pin arrangement image in which the arrangement position is input as the state positioned at the mounting work position and the state in which the substrate is positioned at the second mounting operation position, the first pin arrangement image. A composite image obtained by superimposing the second pin arrangement image generated on the basis of the substrate image is displayed .

  The underpinning pin placement determination supporting method of the present invention targets a substrate that is sequentially positioned at a plurality of mounting work positions including at least a first mounting work position and a second mounting work position and is a target of a plurality of mounting work objects. An arrangement determination support method for receiving pins for supporting the determination of the arrangement of receiving pins for receiving the already mounted surface of the substrate from the lower surface side in the substrate holding part of the electronic component mounting apparatus, wherein the already mounted surface A display step of displaying an image for pin placement determination support including a board image indicating the shape and arrangement of the already mounted component, and a position input step of inputting the placement position of the receiving pin on the displayed image, A pin image display processing step for causing the display means to display a composite image obtained by superimposing the pin arrangement image to which the arrangement position is input on the substrate image. In the display processing step, the substrate is Assuming the first pin arrangement image in which the arrangement position is inputted as a state positioned at one mounting work position and the state where the substrate is positioned at the second mounting work position A composite image obtained by superimposing the second pin arrangement image generated based on the arrangement image on the board image is displayed.

  According to the present invention, for a substrate that is sequentially positioned at a plurality of mounting operation positions and is a target of a plurality of mounting operations, the arrangement of the lower receiving pins for receiving the already mounted surface of the substrate from the lower surface side in the substrate holding portion When determining the position of the pin, the image including the board image showing the shape / arrangement of the already mounted parts on the already mounted surface is displayed, the arrangement position of the receiving pin is input on the displayed image, and the pin arrangement where the arrangement position is input In a pin image display processing step of displaying a composite image in which an image is superimposed on a substrate image, a first pin arrangement image in which an arrangement position is input as the substrate is positioned at the first mounting work position, and the substrate is the first A plurality of mountings are displayed by displaying a composite image obtained by superimposing a second pin layout image generated based on the first pin layout image on the board image, assuming a state where it is positioned at two mounting work positions. It is possible to simplify the operation of determining common to the lower receiving pin arrangement used for work position.

The top view which shows the structure of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the board | substrate conveyance mechanism and board | substrate lowering mechanism in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the board | substrate positioning system in the board | substrate holding part of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the board | substrate lowering mechanism in the board | substrate holding | maintenance part of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the board | substrate used as the work object of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the receiving pin module used for the board | substrate receiving mechanism of the electronic component mounting apparatus of one embodiment of this invention Functional explanatory drawing of the receiving pin module in the board | substrate holding | maintenance part of the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting system containing the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the component data and receiving pin data in the electronic component mounting apparatus of one embodiment of this invention Process explanatory drawing of the arrangement | positioning decision support method of the receiving pin in the electronic component mounting apparatus of one embodiment of this invention Process explanatory drawing of the arrangement | positioning decision support method of the receiving pin in the electronic component mounting apparatus of one embodiment of this invention The flowchart which shows the arrangement | positioning decision support method of the receiving pin in the electronic component mounting apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the overall configuration of the electronic component mounting apparatus 1 will be described with reference to FIG. The electronic component mounting apparatus 1 has a function of holding an electronic component by a suction nozzle mounted on a mounting head and mounting the electronic component on a substrate. The electronic component mounting apparatus 1 is an electronic component together with other devices and a host system 15 connected via a communication network 16. Configure the mounting system.

  In FIG. 1, a substrate transport mechanism 2 is arranged in the X direction (substrate transport direction) at the center of the base 1a. The board transport mechanism 2 has a function of transporting the board 3 carried in from the upstream side and positioning it at a mounting work position by a component mounting mechanism described below, and includes two transport rails 2a arranged in parallel. have. In the central portion of the substrate transport mechanism 2, a substrate lower receiving mechanism 2c for receiving the loaded substrate 3 and side edges of two opposite sides of the substrate 3 lifted by the substrate lower receiving mechanism 2c A pressing member 2b is provided for pressing and clamping from above.

  On both sides of the substrate transport mechanism 2, component supply units 4 that supply electronic components to be mounted are arranged. A plurality of tape feeders 5 are arranged in parallel in the component supply unit 4, and the tape feeder 5 has a function of pitch-feeding the components held on the carrier tape to a take-out position by a component mounting mechanism described below. Yes. A Y-axis moving table 6 is disposed on one end in the X direction on the upper surface of the base 1a, and two X-axis moving tables 7 are slidably coupled to the Y-axis moving table 6 in the Y direction. ing. A mounting head 8 is mounted on each X-axis moving table 7 so as to be slidable in the X direction.

  The mounting head 8 is a multiple head composed of a plurality of unit holding heads 9, and is provided by a suction nozzle 14 </ b> A for component suction mounted on a nozzle holder 9 a provided at the lower end of the unit holding head 9 (see FIG. 7). The electronic component P to be mounted is held from the tape feeder 5 by vacuum suction. The Y-axis moving table 6 and the X-axis moving table 7 constitute a head moving mechanism that moves the mounting head 8.

  By driving the head moving mechanism, the mounting head 8 moves between the component supply unit 4 and the substrate 3 positioned by the substrate transport mechanism 2. The component P (see FIG. 7) is mounted on the substrate 3. The head moving mechanism that moves the mounting head 8 and the mounting head 8 constitutes a component mounting mechanism 17 (see FIG. 8) that takes out components from the component supply unit 4 and mounts them on the substrate 3.

  A substrate recognition camera 10 that moves integrally with the mounting head 8 is mounted on the lower surface of the X-axis moving table 7. By driving the head moving mechanism and moving the substrate recognition camera 10 above the substrate 3 held by the substrate transport mechanism 2, the substrate recognition camera 10 captures an image of the recognition mark formed on the substrate 3. A component recognition camera 11, a first nozzle storage unit 12, and a second nozzle storage unit 13 are disposed on the movement path of the mounting head 8 between the component supply unit 4 and the substrate transport mechanism 2.

  The component recognition camera 11 picks up an image of the component held by the mounting head 8 by performing a scanning operation in which the mounting head 8 taking out the component from the component supply unit 4 passes above the component recognition camera 11 in a predetermined direction. . A plurality of suction nozzles 14A mounted on the nozzle holder 9a of the unit holding head 9 are stored and held in the first nozzle storage unit 12 corresponding to the component type. When the lower receiving pin module 22 shown in FIG. 6 is moved, the suction nozzle 14B (see FIG. 7) used by being mounted on the nozzle holder 9a of the unit holding head 9 is stored and held. When the mounting head 8 accesses the first nozzle storage unit 12 and the second nozzle storage unit 13 and performs a nozzle replacement operation, the suction nozzle mounted on the unit holding head 9 is changed to a target and target component type. Can be exchanged accordingly.

  Next, referring to FIG. 2 and FIG. 3, the mounting work position in the board transport mechanism 2 of the electronic component mounting apparatus 1, that is, the configuration of the mounting stage where the component mounting work by the above-described component mounting mechanism is performed on the board 3. explain. 2A, the substrate transport mechanism 2 includes a conveyor mechanism 2d disposed in the X direction along two transport rails 2a. As shown in FIG. 2B, the conveyor mechanism 2 d conveys the substrate 3 in the X direction by a conveyance belt that reciprocates horizontally by a motor 19.

  A mounting stage [S] having a length dimension Lo in the X direction is set in the substrate transport mechanism 2 in accordance with the range in which the mounting head 8 can move, that is, the work range in which the component mounting mechanism 17 can mount components. ing. The mounting stage [S] is provided with a substrate holding part for holding the substrate 3, and the substrate 3 is supported from the lower surface side by the substrate receiving mechanism 2c. The substrate receiving mechanism 2c is configured such that a horizontal plate-shaped lower receiving base portion 21 is moved up and down (arrow a) by an elevating mechanism 20, and the substrate 3 is placed on the upper surface of the lower receiving base portion 21 from the lower surface side. A supporting lower receiving pin module 22 (lower receiving pin) is erected.

  The transport rail 2a is provided with a first positioning sensor 18A corresponding to the front end of the mounting stage [S], and further from the first positioning sensor 18A corresponding to the rear end of the mounting stage [S]. A second positioning sensor 18B is disposed at a position separated by a length Lo on the upstream side. The first positioning sensor 18A and the second positioning sensor 18B are both transmissive optical sensors, and the tip 3c (see FIG. 3) of the substrate 3 conveyed by the conveyor mechanism 2d is the first positioning sensor 18A and the substrate 3. The rear end 3d (see FIG. 3) shields the detection optical axis of the second positioning sensor 18B, so that the front end 3c of the substrate 3 is the first positioning sensor 18A, and the rear end 3d of the substrate 3 is the second positioning sensor. It is detected that the position 18B has been reached.

  Detection signals from the first positioning sensor 18A and the second positioning sensor 18B are transmitted to the control unit 40 (FIG. 8), and the control unit 40 controls the motor 19 and the lifting mechanism 20 based on the detection signals, whereby the substrate transfer mechanism. 2, the substrate 3 can be positioned at a predetermined position, and the work range of the positioned substrate 3 can be received from below and held. The first positioning sensor 18A, the second positioning sensor 18B, and the board receiving mechanism 2c constitute a board positioning mechanism that positions and holds the board 3 at a first mounting work position and a second mounting work position described below. To do.

Next, with reference to FIG. 3, a description will be given of substrate positioning when a substrate 3A having a size exceeding the length Lo of the mounting stage [S] (see FIG. 11 ) is to be mounted. When the substrate 3A having a length dimension larger than the length dimension Lo is targeted, first, as shown in FIG. 3A, the tip 3c reaches the detection optical axis position of the first positioning sensor 18A. The substrate 3 is positioned at the position (first mounting work position). In this state, the protruding portion 3 * of the protruding length L * of the substrate 3 protrudes upstream from the mounting stage [S], and the component mounting mechanism 17 can perform component mounting work on the protruding portion 3 *. Can not.

  For this reason, as shown in FIG. 3B, the substrate 3A is moved downstream by the conveyor mechanism 2d (arrow b), and the position where the rear end 3d reaches the detection optical axis position of the second positioning sensor 18B ( The board 3A is positioned at the second mounting work position. For this reason, in the state where the board 3A is positioned at the second mounting work position, the protruding portion 3 * is included in the range of the mounting stage [S], and the component mounting work by the component mounting mechanism 17 becomes possible. That is, in the present embodiment, at least the first mounting work position and the second mounting work when the board 3A having a length dimension larger than the work range in which the component mounting work by the component mounting mechanism 17 is possible is targeted. A plurality of component mounting operations are executed for the board 3A sequentially positioned at a plurality of mounting operation positions including the position.

  Next, the configuration and function of the substrate receiving mechanism 2c provided in the substrate transport mechanism 2 will be described with reference to FIG. As shown in FIG. 2, a conveyor mechanism 2 d is provided along the transport direction inside the two transport rails 2 a constituting the substrate transport mechanism 2. By driving the conveyor mechanism 2d with both end portions of the substrate 3 in contact with the upper surface of the conveyor mechanism 2d, the substrate 3 is transported in the substrate transport direction. Further, on the inner side of the conveyor mechanism 2d, when the side end portion of the substrate is clamped from above by the pressing member 2b and clamped, the clamp portion 2e that supports the side end portion of the substrate from below contacts the lower receiving base portion 21. Therefore, it can be moved up and down.

  The substrate receiving mechanism 2c provided in the central portion of the substrate transport mechanism 2 corresponding to the mounting stage [S] is configured to move the horizontal plate-shaped lower receiving base portion 21 up and down (arrow c) by the lifting mechanism 20. A lower receiving pin module 22 for supporting the substrate 3 from the lower surface side is provided upright on the upper surface of the lower receiving base portion 21. In the present embodiment, the substrate 3 to be received includes a double-sided mounting substrate on which electronic components are mounted on either the first surface 3a or the second surface 3b that forms the front and back of the substrate.

  FIG. 5 shows an example of such a double-sided mounting board. In this example, a plurality of types of electronic components P (BGA type components Pa, DIP type components Pb, chip type components Pc, etc.) are mounted on the first surface 3a shown in FIG. Also, a plurality of types of electronic components P including the connector component Pd are mounted on the second surface 3b shown in FIG. When the first surface 3a is a mounting target surface, the second surface 3b is a receiving surface, and when the second surface 3b is a mounting target surface, the first surface 3a is a receiving surface.

  Here, when the lower surface is an already mounted surface on which an electronic component has already been mounted in the previous process, the interference with the lower pin module 22 is reduced in consideration of the position of the already mounted component on the already mounted surface. It is necessary to select a receiving pin arrangement that does not occur. Therefore, in the present embodiment, the lower receiving pin module 22 is configured to be arranged at an arbitrary position on the lower receiving base portion 21. That is, the lower receiving base portion 21 is configured such that the upper surface of a plate member 21b made of a non-magnetic material such as aluminum is covered with a magnetic material 21a such as a steel plate, and the lower receiving pin module is placed at an arbitrary position on the magnetic material 21a. 22 is arranged according to the receiving position of the substrate 3 to be received.

  In this underlaying state, an attractive force acts between the magnet member 27 (see FIG. 6B) built in the base 23 of the underpinning pin module 22 and the magnetic body 21a. The pin module 22 is fixed to the lower base portion 21. Note that the entire lower receiving base portion 21 may be made of a magnetic material, and at least the upper surface of the lower receiving base portion 21 may be provided with a magnetic material. In this state, as shown in FIG. 4B, the elevating mechanism 20 is driven to raise the lower receiving base 21 (arrow d), whereby the upper end of the lower receiving pin module 22 and the upper end of the clamping portion 2e. The substrate 3 is in contact with the lower surface of the substrate 3, and the substrate 3 is supported by the substrate receiving mechanism 2c, and both ends of the substrate 3 are pressed against the lower surface of the pressing member 2b to be fixed in position.

  Next, the configuration and function of the receiving pin module 22 will be described with reference to FIG. As shown in FIG. 6A, the lower receiving pin module 22 has a configuration in which a hollow shaft portion 24 is extended upward from a base portion 23 that is in contact with the lower receiving base portion 21. The top portion 25 attached to the upper end portion of the shaft portion 24 has a thin pin-shaped contact portion 25a protruding upward and a suction flange portion 25b extending in the lateral direction. At the time of receiving, the upper end part contacts and supports the lower surface of the substrate 3. A suction hole 24a is provided through the shaft portion 24, and the suction hole 24a communicates with a suction hole 25c provided vertically through the contact portion 25a.

  In FIG. 6B, the base 23 has a structure in which a lid member 23b having a shaft portion 24 fixed thereto is coupled to a base main body 23a in which a cylindrical lifting chamber 23c is provided. Inside the elevating chamber 23c, a piston 26 fitted with a magnet member 27 is slidably fitted vertically. In the normal state, the piston 26 is located at the bottom in the elevating chamber 23c, and the base 23 is fixed to the magnetic body 21a by the attractive force of the magnet member 27.

  By performing vacuum suction from the suction hole 24a of the shaft portion 24, the piston 26 rises in the elevating chamber 23c, and the distance between the lower surface of the magnet member 27 and the upper surface of the magnetic body 21a is increased. Thereby, the attractive force acting between the magnet member 27 and the magnetic body 21a is greatly reduced, and the fixing of the base 23 to the receiving base portion 21 is released. That is, a magnet for fixing the lower receiving pin module 22 is built in a base portion 23 which comes into contact with the lower receiving base portion 21 provided in the substrate holding portion in the lower receiving pin module 22. It can be freely arranged at any position on the base portion 21.

  FIG. 7A shows a state in which the electronic component P is mounted on the substrate 3 held by the substrate receiving mechanism 2c by the mounting head 8 in which the suction nozzle 14A is mounted on the nozzle holder 9a. . In this state, the upper end portion of the contact portion 25a of the lower receiving pin module 22 receives the substrate 3 from the lower surface side. At this time, even when the underside surface of the substrate 3 is an already mounted surface and the electronic component P is present, by appropriately setting the arrangement of the underside pin module 22 in the underside base portion 21, these Interference between the already mounted electronic component P and the suction flange 25b or the contact portion 25a is prevented.

  FIG. 7B shows an operation of moving the lower receiving pin module 22 arranged on the lower receiving base portion 21. In this case, the mounting head 8 having the suction nozzle 14B mounted on the nozzle holder 9a is moved above the lower receiving pin module 22, and vacuum suction is performed with the suction nozzle 14B placed on the top 25. Thereby, the attractive force of the magnet member 27 acting between the base 23 having the configuration shown in FIG. 6 and the magnetic body 21a is reduced, and the suction nozzle 14B sucks and holds the suction flange 25b. Then, by moving the mounting head 8 in this state, the receiving pin module 22 is moved.

  Next, with reference to FIG. 8 to FIG. 11, the configuration of the control system of the electronic component mounting system including the electronic component mounting apparatus 1 and the support function for determining the arrangement of the receiving pins of the electronic component mounting system will be described. . This function supports the determination of the arrangement of the lower receiving pin module 22 that lowers the already mounted surface of the substrate 3 from the lower surface side in the substrate holding portion including the substrate lowering mechanism 2c.

  In FIG. 8, the host system 15 includes an overall control unit 30, a storage unit 31, a pin image display processing unit 32, an interference determination unit 33, a warning processing unit 34, a display device 35, an operation / input unit 36, and a communication unit 37. Yes. The overall control unit 30 is a processing arithmetic unit, and supervises the placement determination support processing operation of the receiving pins in the electronic component mounting apparatus 1 based on various programs and data stored in the storage unit 31.

  In this processing operation, as shown in FIG. 10A, an image showing the shape and arrangement of the electronic component P on the substrate 3 is displayed on the display screen 35a of the display device 35 (display means) such as a liquid crystal panel. On the image, an operator inputs an arrangement position at which the receiving pin module 22 is to be arranged via an operation / input unit 36 (position input unit) having a pointing device such as a mouse.

  Here, the image displayed on the display screen 35a includes a board image (first board image) indicating the shape / arrangement of the mounted parts on the already mounted surface of the board 3 and the shape / arrangement of the mounted parts on the mounting target surface. The board image to be shown (second board image) is included. The reason why the second board image is included in the display object is that, as will be described later, depending on the type of the mounted component, the lower receiving pin module 22 is arranged to receive the vicinity of the component from the lower surface side during the mounting operation. By need arises. Here, as the board image, in addition to an image based on image data output at the design stage such as CAD data, a camera image obtained by imaging a real board can also be used.

  The underlay arrangement data indicating the decided arrangement position of the underpinning pin module 22 is transmitted to the electronic component mounting apparatus 1 via the communication network 16 by the communication unit 37. In the electronic component mounting apparatus 1, by operating the mounting head 8 based on the receiving arrangement data, the receiving pin module 22 automatically moves on the lower receiving base portion 21, and the lower receiving of the target substrate 3. Appropriate support pin arrangement according to the surface is realized.

  The storage unit 31 stores mounting data 31a, component data 31b, support pin data 31c, and board position data 31d. The mounting data 31a is data necessary for a component mounting operation by the mounting head 8, such as the type of electronic component mounted on the substrate 3 and mounting position coordinates. The component data 31b is data relating to the three-dimensional shape (see FIG. 9A) of the electronic component mounted on the substrate 3 and the component characteristics. The component characteristics include the lower surface side when the component is mounted on the mounting target surface. An under-necessity characteristic that specifies whether under-needing is required is included. The base pin data 31 c is data relating to the three-dimensional shape of the top portion 25 attached to the base pin module 22.

  The substrate position data 31d indicates that the mounting operation target is the substrate 3A shown in FIG. 3, and the substrate 3A is placed on the mounting stage [S] with a plurality of mounting operation positions (here, the first mounting operation position and the second mounting operation position). This is positioning control data used for positioning at each of the mounting work positions). By referring to the substrate position data 31d, it is possible to display a substrate image in a state where the substrate 3A is positioned at each of the plurality of mounting work positions.

  The pin image display processing unit 32 performs processing for causing the display device 35 to display an image to be referred to when the operator inputs the arrangement position of the receiving pin module 22 in the receiving base unit 21. The pin image display processing unit 32 includes processing function units of an image composition unit 32a and a display switching unit 32b, and the image composition unit 32a is a pin arrangement in which an operator inputs a pin arrangement position via the operation / input unit 36. A process of generating a composite image by superimposing the image on the substrate image is performed.

  Here, as the board image, either the first board image showing the shape / arrangement of the mounted parts on the already mounted surface or the second board image showing the shape / arrangement of the mounted parts on the mounting target surface (see FIG. 5). ) Can be selected. For example, when the first surface 3a shown in FIG. 5A is an already mounted surface, the first surface 3a is the first board image, and the second surface 3b shown in FIG. 5B is the mounting target surface. This is the second substrate image shown. That is, the pin image display processing unit 32 causes the display device 35 to display a composite image obtained by superimposing the pin layout image to which the layout position is input on the first board image or the second board image.

  FIG. 10B shows an example of a composite image in which a pin arrangement image is superimposed on the first surface 3a corresponding to the first board image. Here, the operator can observe the first board image to support the board 3 in a well-balanced manner, and the pin arrangement so as not to cause interference with the already mounted parts is performed by the pointing function of the operation / input unit 36. input. Here, five points of the arrangement positions SP1 to SP5 are input, and thereby the position coordinates (xpi, ypi) on the substrate surface of each arrangement position SPi are captured. In this example, the arrangement position SP5 located in the center is in a position sandwiched between two already mounted components, and the presence or absence of interference between the receiving pin module 22 and these already mounted components becomes a problem. . In the present embodiment, the presence / absence of such interference is automatically determined by using shape data and position data stored in advance and input arrangement position SP data.

  Here, a planar image of the receiving pin module 22 in the above-described pin arrangement image will be described with reference to FIG. The plan view in FIG. 9A shows a planar image in a state where the mounted surface of the substrate 3 is received by the receiving pin module 22. The planar image includes an image of the top portion 25 of the shaft portion 24 erected on the substrate holding portion, and a cross-sectional shape that is smaller than the suction flange portion 25b at the tip of the top portion 25 and is in contact with the lower surface of the substrate 3. An image of the abutting portion 25a to be received is included. The contour portion A and the central portion B of the top portion 25 in the planar image of the receiving pin module 22 correspond to the suction flange portion 25b (outer peripheral portion) and the contact portion 25a of the top portion 25, respectively.

  The display switching unit 32b switches between the composite image based on the first board image (see FIG. 10B) and the composite image based on the second board image (FIG. 10C) when displaying the composite image. To perform the process. Since the first substrate image and the second substrate image are front and back images of the same substrate, the positional relationship between the first substrate image and the second substrate image is a mirror image relationship at the time of switching. The image data is inverted and displayed. Thereby, the operator can refer to the substrate image in a state where the substrate 3 actually positioned on the mounting stage [S] is viewed in plan.

  Here, when the second surface 3b shown in FIG. 5B is the mounting target surface, the connector component Pd is included in the mounting component, so that the receiving pin is taken into consideration in consideration of the position of the connector component Pd. Placement needs to be done. That is, when mounting the connector component Pd, which is a fitting component, on the substrate 3, it is necessary to press the connector component Pd against the substrate 3 with a larger mounting load than a normal surface mounting component. In order to prevent the bending deformation of 3, the lower surface side of the connector component Pd is desirably received.

  In this embodiment, an electronic component that needs to receive the opposite surface side during mounting is specified in advance and defined in the component data 31b as one item of component characteristics. When an electronic component that requires such a support exists on the mounting target surface, the pin image display processing unit 32 displays a second board image indicating the shape and arrangement of the mounting component on the mounting target surface. ing. In other words, the pin image display processing unit 32 causes the display device 35 to display a composite image based on the second board image based on whether or not the acceptance is specified in the data regarding the component characteristics included in the component data 31b.

  FIG. 10C shows an example in which the second surface 3b, which is the second substrate image, is displayed on the display screen 35a instead of the first substrate image. In this example, since there is a connector part Pd which is an under-required part specified in the part data 31b on the second surface 3b, the operator observes the second board image and in the vicinity of the connector part Pd, the board 3 Is selected, that is, a position on the first surface 3a that does not interfere with the already mounted components. Here, in the vicinity of the connector part Pd, a part on the first surface 3a where there is no mounted part is selected and the arrangement position SP6 is input.

  In this operation, since both the first surface 3a and the second surface 3b must be observed, it may be necessary to repeat the front and back inversion several times. In such a case, by operating the front / back reversing button 35b provided on the display screen 35a, the function of the display switching unit 32b switches between the first board image and the second board image at a desired timing. Can do.

  The interference determination unit 33 determines whether any of the receiving pin modules 22 to which the arrangement position is input interferes with an already mounted component that already exists on the receiving surface, in the three-dimensional electronic component included in the component data 31b. The determination is made based on the shape data and the three-dimensional shape data of the abutment portion of the receiving pin module 22 included in the receiving pin data 31c, that is, the top portion 25 that abuts the lower receiving surface of the substrate 3.

  FIG. 9A shows an example of the three-dimensional shape data of the electronic component and the top portion 25. That is, the component data 31b stores (a1, b1, c1), (a2, b2, c21),... Indicating the sizes of the electronic components P1, P2,. . The bottom pin data 31c indicates the size of the top portion 25 attached to the bottom pin module 22, that is, the diameter of the suction flange 25b and the diameter and length of the contact portion 25a (d1, d2, d3), respectively. ) Is stored.

  Here, the positions of the already mounted electronic components P1, P2,... On the already mounted surface are given by mounting coordinates (x1, y1), (x2, y2) stored in the mounting data 31a. In addition, the arrangement position SP (xp, yp) at which the receiving pin module 22 is arranged is input by performing an operation with the operation / input unit 36 on the image displayed on the display screen 35a. And the interference determination part 33 determines the presence or absence of the positional interference with the electronic components P1, P2, ... and the top part 25 based on these three-dimensional shape data and position data.

  For example, as shown in FIG. 9 (b), since c1 is larger than d3 when viewed from the relationship between the electronic component P1 and the top portion 25, the arrangement position SP (xp, yp) and the diameter dimension of the suction flange portion 25b. As long as the outer surface of the electronic component P1 does not enter the first interference region R1 defined by d1, it is determined that there is no interference. Further, as shown in FIG. 9 (c), since c3 is smaller than d3 when viewed in the relationship between the electronic component P2 and the top portion 25, the arrangement position SP (xp, yp) and the diameter dimension of the suction flange portion 25b. Even if the outer surface of the electronic component P2 enters the first interference region R1 defined by d1, the outer surface of the electronic component P2 enters the second interference region R2 defined by the diameter dimension d1 of the suction flange 25b. Unless otherwise, it is determined that there is no interference. That is, the interference determination unit 33 determines the three-dimensional positional interference between the mounted parts such as the electronic components P1 and P2 and the contact part 25a in the region between the contour part A and the central part B.

  If the interference determination unit 33 determines that there is interference, the warning processing unit 34 performs a process of displaying a warning screen informing that effect on the display device 35. Then, the operator accepts this warning screen and performs a process of changing the arrangement position SP (xp, yp). As a result, even when the already mounted surface on which the electronic components are mounted at a high density is the backing surface, it is possible to determine whether or not interference has occurred more precisely, and to achieve a more accurate placement of the receiving pin. If it is determined that there is interference, the warning processing unit 34 and the display device 35 constitute warning means for notifying the display device 35 to that effect.

  A type in which the substrate to be mounted is positioned at a plurality of mounting work positions (here, the first mounting work position and the second mounting work position) on the mounting stage [S] as in the board 3A shown in FIG. In the case of this board, the pin image display processing unit 32 executes the following processing. That is, in this case, since the different parts of the same substrate 3A are received by the plurality of lower support pin modules 22 arranged in advance on the lower support base portion 21, the substrate 3A is in the first mounting work position. It is necessary to determine the arrangement position so that the substrate 3A can be properly received by the receiving pin module 22 in any of the second mounting work positions. For this reason, the pin image display processing unit 32 displays a pin arrangement image on the assumption that the substrate 3A is positioned at each of the first mounting work position and the second mounting work position so as to overlap the board image, and the operator In any of these states, the pin placement position is adjusted so that interference with the already mounted components does not occur.

  In the example shown here, the substrate image of the substrate 3A is displayed on the display screen 35a of the display device 35 as shown in FIG. Next, in the state where the substrate 3A is positioned at the first mounting work position, a mounting area (an area other than the protruding portion 3 * having the protruding length L *) positioned on the mounting stage [S] is received. An arrangement position SP (here, five points of arrangement positions SP1 to SP5) of the lower receiving pin module 22 is selected and input by the operation / input unit 36. Then, the input first pin arrangement image is overlapped with the board image to generate a composite image shown in FIG. 11B and display it on the display screen 35a.

  Here, although the arrangement position SP3 has no possibility of interference with the already mounted parts in the first pin arrangement image corresponding to the first mounting work position, the arrangement position SP3 is already mounted in the second pin arrangement image described below. There is a risk of interference with the electronic component P. For this reason, when inputting the arrangement position SP3, the operator selects an appropriate position in consideration of interference with the already mounted electronic component P in the second pin arrangement image.

  Next, a composite image is generated by superimposing the second pin arrangement image on the assumption that the substrate 3A is positioned at the second mounting work position with the substrate image, and is displayed on the display screen 35a. That is, as shown in FIG. 11C, the protruding portion 3 * excluded from the mounting area at the first mounting work position is completely included in the mounting stage [S] based on the substrate position data 31d. The second pin arrangement image is generated by superimposing the board image in a state where the board 3A is moved to the second mounting work position and the input first pin arrangement image.

  In other words, based on the first pin placement image in which the positioning position and the placement position of the board 3A at the first mounting work position and the second mounting work position stored in advance in the board position data 31d are input. A second pin arrangement image is generated, and a composite image in which the first pin arrangement image and the second pin arrangement image are combined and superimposed on the board image is displayed. By observing the composite image generated in this manner, the operator can observe the lower receiving pin module 22 disposed on the lower receiving base 21 and the existing receiving pin module 22 even when the substrate 3A is moved to the second mounting work position. It is confirmed that an appropriate substrate underlay state is realized without causing interference with the mounted component.

  In the above-described composite image display, the plane image of the receiving pin indicating the arrangement position SP is selected from any pin using colors / graphics that are different between the first pin arrangement image and the second pin arrangement image. It is desirable to display it so that it can be identified whether it is a receiving pin belonging to the arrangement. In the example shown in FIG. 11, the arrangement positions SP1 to SP5 corresponding to the first pin arrangement image shown in FIG. 11A display the central portion B (see FIG. 9) with a black circle, and are shown in FIG. 11B. Arrangement positions SP1 to SP5 corresponding to the second pin arrangement image display the central portion B with white circles for easy identification. Thereby, when selecting the arrangement position SP, it is possible to prevent mistakes that make a mistake as to which mounting work position the pin arrangement corresponds to. That is, in this embodiment, the planar image of the receiving pin in the first pin arrangement image and the planar image of the receiving pin in the second pin arrangement image are displayed in different display forms.

  That is, in the present embodiment, when the board 3A of the above-described form is a work target, the pin image display processing unit 32 is input with the arrangement position in a state where the board 3A is positioned at the first mounting work position. Mounting the first pin arrangement image and the second pin arrangement image generated based on the first pin arrangement image on the assumption that the substrate 3A is positioned at the second mounting work position A process of causing the display device 35 to display a composite image (see FIGS. 11B and 11C) superimposed on the board image corresponding to the mounting area at the work position is performed.

  The electronic component mounting apparatus 1 includes a control unit 40, a storage unit 41, a recognition processing unit 42, a display unit 43, an operation / input unit 44, and a communication unit 45. The control unit 40 is a processing arithmetic unit, and controls work operations of the board transport mechanism 2, the component supply unit 4, and the component mounting mechanism 17 based on the operation program and mounting data stored in the storage unit 41. The recognition processing unit 42 performs recognition processing on the imaging results obtained by the board recognition camera 10 and the component recognition camera 11. The display unit 43 is a display panel such as a liquid crystal display, and displays a guidance screen and various notification screens when operated by the operation / input unit 44. The communication unit 45 exchanges signals with the host system 15 and other devices via the communication network 16.

  In the above configuration, the overall control unit 30, the storage unit 31, the pin image display processing unit 32, the interference determination unit 33, the warning processing unit 34, the display device 35, and the operation / input unit 36 are the board holding unit of the electronic component mounting apparatus 1. In FIG. 2, a support pin placement determination support device is provided that supports the determination of the placement of the support pins for receiving the mounted surfaces of the substrates 3 and 3A from the lower surface side. In this embodiment, the configuration example in which the support determination function for placing the receiving pins is provided on the board 3 is shown. However, this function may be executed by the control processing function of the electronic component mounting apparatus 1.

  Here, regarding the support determination method for supporting the placement of the support pin using the support device for determining the support placement of the support pin described above, refer to each figure in accordance with the flow of FIG. While explaining. In FIG. 12, first, an image for determining pin arrangement including a substrate image is displayed on the display screen 35a (display process) (ST1). That is, when the normal-size board 3 is targeted, the board image of the first surface 3a shown in FIG. 10A is displayed, and a plurality of mountings including at least the first mounting work position and the second mounting work position. When the substrate 3A that is sequentially positioned at the work position and is a target of a plurality of mounting operations is targeted, the substrate image shown in FIG. 11A is displayed on the display screen 35a.

  Next, the arrangement position SP of the receiving pin module 22 is input onto the displayed image by the pointing function of the operation / input unit 36 (position input step) (ST2). That is, as shown in FIGS. 10 (b) and 11 (b), while observing the shape and arrangement of the already mounted parts on the already mounted surface that is the object of the receiving, the appropriate arrangement positions SP1 to SP5 for the receiving are provided. Select and enter. Here, the lower receiving pin module 22 can be arranged at an arbitrary position on the lower receiving base portion 21.

  Then, a composite image in which the pin placement image indicating the placement position SP is superimposed on the board image is generated (ST3), and the generated composite image is displayed on the display screen 35a (pin image display processing step) (ST4). The planar image of the lower receiving pin module 22 in the composite image includes the images of the suction flange 25b and the contact portion 25a of the top 25 shown in FIG. 9, and the top 25 and the already mounted components on the composite image. It is possible to determine the presence or absence of interference.

  When the board 3A is targeted, as shown in FIGS. 11B and 11C, the first pin whose arrangement position is input with the board 3A positioned at the first mounting work position is shown. Assuming the arrangement image and the state in which the board 3A is positioned at the second mounting work position, the board 3A at each of the first mounting work position and the second mounting work position stored in the board position data 31d in advance. A second pin arrangement image is generated based on the positioning position and the first pin arrangement image, and a composite image in which the first pin arrangement image and the second pin arrangement image are combined and superimposed on the substrate image is displayed. .

  Here, by referring to the board position data 31d, it is necessary to receive the mounting of the mounting component on the mounting target surface during the mounting operation based on the necessity of receiving specified in the data regarding the component characteristics included in the board position data 31d. It is determined whether or not there is a required part to be received (ST5). And, when the connector part Pd that requires a base for receiving the pressing load during the mounting operation is present on the mounting target surface, like the substrate 3 shown in FIG. Switch and display (ST6). As a result, the display for the mounting surface shown in FIG. 10B is switched to the display for the mounting surface shown in FIG. 10C, and the operator adds an arrangement position for the connector part Pd. And input.

  When there is no required part for receiving in (ST5), or after the process of (ST6) is completed, the presence / absence of interference between the receiving pin and the already mounted part is determined (interference determining step) (ST7). That is, by referring to the component data 31b and the receiving pin data 31c, the interference determination unit 33 stores in advance whether any of the receiving pin modules 22 to which the arrangement position is input interferes with the already mounted components. The determination is made based on the three-dimensional shape data of the electronic component indicated in the component data 31b and the three-dimensional shape data of the contact portion 25a of the lower pin module 22 indicated in the lower pin data 31c (see FIG. 9).

  If it is determined in (ST7) that there is interference, a notification means such as display by the display device 35 notifies that (warning process) (ST8), and the arrangement position for returning to (ST2) to eliminate the interference Make correction input. When it is determined in (ST7) that there is no interference, the receiving pin arrangement is determined (ST9), thereby completing the receiving pin arrangement determining support process.

  As described above, in the support determination of the arrangement of the receiving pins shown in the present embodiment, the determination of the arrangement of the receiving pin module 22 that receives the already mounted surface of the substrate 3 from the lower surface side in the substrate holding unit is already performed. An image including a board image indicating the shape and arrangement of the already mounted parts on the mounting surface is displayed, the arrangement position of the receiving pin module 22 is input on the displayed image, and the pin arrangement image with the arrangement position input is the board. The composite image superimposed on the image is displayed, and the image of the top portion 25 and the image of the abutting portion 25 a that abuts against the lower surface of the substrate 3 are included in the planar image of the receiving pin module 22 in the pin arrangement image. I am doing so. Thereby, in the arrangement | positioning determination operation | work of the receiving pin which makes the board | substrate 3 of high mounting density the object, the presence or absence of interference generation | occurrence | production of a receiving pin and an already mounted component can be judged more precisely.

  Also, a pin layout image in which an image including a first board image indicating an already mounted surface and a second board image indicating a mounting target surface is displayed, and the layout position of the receiving pin module 22 is input on the displayed image. In a pin image display process for displaying a composite image in which the first substrate image or the second substrate image is superimposed on the first substrate image, the composite image based on the first substrate image and the composite image based on the second substrate image are switched and displayed. I try to let them. As a result, it is possible to arrange an appropriate receiving pin taking into consideration the component arrangement of the receiving required components existing on the mounting target surface.

  Further, in the case where the substrate 3A that is sequentially positioned at a plurality of mounting work positions and is a target of a plurality of mounting work objects is the target, the placement position is input as a state in which the board 3A is positioned at the first mounting work position. The first pin arrangement image and the second pin arrangement image generated based on the first pin arrangement image on the assumption that the board is positioned at the second mounting work position are superimposed on the board image. The synthesized image is displayed. Thereby, it is possible to simplify the work of determining the receiving pin arrangement used in common for a plurality of mounting work positions.

  The underpinning pin arrangement determination support apparatus and the underpinning determination support method of the present invention have the effect of simplifying the underpinning pin arrangement determination work used in common for a plurality of mounting work positions. This is useful in the field of electronic component mounting where electronic components are mounted on a substrate that is received by a pin.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate conveyance mechanism 2c Board | substrate lower receiving mechanism 3,3A Board | substrate 8 Mounting head 21 Lower receiving base part 22 Lower receiving pin module 23 Base 24 Shaft part 25 Top part 25a Contact part 27 Magnet member

Claims (6)

A substrate that is sequentially positioned at a plurality of mounting operation positions including at least a first mounting operation position and a second mounting operation position and is a target of a plurality of mounting operations, and the substrate in a substrate holding unit of an electronic component mounting apparatus. A support pin arrangement determination support device for supporting the determination of the arrangement of the support pins for receiving the already mounted surface from the lower surface side,
Display means for displaying an image for pin placement determination support including a board image indicating the shape and placement of the mounted parts on the mounted surface;
A position input unit for inputting an arrangement position of the receiving pin on the displayed image;
A pin image display processing unit that causes the display means to display a composite image obtained by superimposing the board arrangement image with the pin arrangement image to which the arrangement position is input,
The pin image display processing unit includes a first pin arrangement image in which the arrangement position is input in a state in which the substrate is positioned at the first mounting operation position, and the substrate at the second mounting operation position. Arrangement of receiving pins, characterized by displaying a composite image in which a second pin arrangement image generated based on the first pin arrangement image is superimposed on the substrate image assuming a positioned state Decision support device. A storage unit for storing a positioning position of the substrate at each of the first mounting work position and the second mounting work position;
2. The device for supporting placement determination of a receiving pin according to claim 1, wherein the pin image display processing unit generates a second pin placement image based on the positioning position and the first pin placement image.   The planar image of the receiving pin in the first pin arrangement image and the planar image of the receiving pin in the second pin arrangement image are displayed in different display forms. Placement pin placement support device. A substrate that is sequentially positioned at a plurality of mounting operation positions including at least a first mounting operation position and a second mounting operation position and is a target of a plurality of mounting operations, and the substrate in a substrate holding unit of an electronic component mounting apparatus. A support pin placement determination support method for supporting the determination of the placement of the support pin for receiving the already mounted surface from the lower surface side,
A display step of displaying an image for pin placement determination support including a board image indicating the shape and arrangement of the mounted parts on the mounted surface;
A position input step of inputting an arrangement position of the receiving pin on the displayed image;
A pin image display processing step for causing the display means to display a composite image obtained by superimposing the pin arrangement image to which the arrangement position is input on the substrate image,
In the display processing step, the first pin arrangement image in which the arrangement position is input as the board is positioned at the first mounting work position, and the board is positioned at the second mounting work position. A layout determination support for a receiving pin, characterized in that a composite image obtained by superimposing a second pin arrangement image generated based on the first pin arrangement image on the board image is displayed assuming the state of the pin. Method.   In the display processing step, a second pin arrangement image is generated based on the substrate positioning position and the first pin arrangement image at the first mounting work position and the second mounting work position stored in advance. 5. A method for supporting placement determination of a receiving pin according to claim 4.   6. The flat image of the receiving pin in the first pin arrangement image and the flat image of the receiving pin in the second pin arrangement image are displayed in different display forms. Support method for determining the placement of support pins.

Images