JP5902310B2 - 能動電子走査アレイ(aesa)カード - Google Patents
能動電子走査アレイ(aesa)カード Download PDFInfo
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- JP5902310B2 JP5902310B2 JP2014541098A JP2014541098A JP5902310B2 JP 5902310 B2 JP5902310 B2 JP 5902310B2 JP 2014541098 A JP2014541098 A JP 2014541098A JP 2014541098 A JP2014541098 A JP 2014541098A JP 5902310 B2 JP5902310 B2 JP 5902310B2
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- 229910052751 metal Inorganic materials 0.000 claims description 133
- 239000002184 metal Substances 0.000 claims description 133
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000004642 Polyimide Substances 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 13
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 6
- 239000004917 carbon fiber Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Radar Systems Or Details Thereof (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
PWB 101’は、金属層(例えば、金属層202a―202t)および、エポキシ樹脂層(例えば、エポキシ樹脂層204a―204m)、ポリイミド誘電層(例えば、ポリイミド誘電層206a―206d)または、各々の金属層(202a―202t)の間に配置された複合層(例えば、複合層208a、208b)の1つを包含する。特に、複合層208aは金属層210e、210fの間に配置されている。そして、複合層208bは金属層210o、210pの間に配置される。ポリイミド誘電層206aは金属層202g、202hの間に配置されている。そして、ポリイミド誘電層206bは金属層202i、202jの間に配置されていて、ポリイミド誘電層206cは金属層202k、202lの間に配置されていて、そして、ポリイミド誘電層206dは金属層202m、202nの間に配置されている。残りの金属層は、図4に示すように金属層の間に配置されたエポキシ樹脂層(例えば、エポキシ樹脂層204a―204mの1つ)を含む。
Claims (19)
- 能動電子走査アレイ(AESA)カードであって、
RF信号配布を提供するために用いる金属層の第1のセットと、
デジタル論理的配布を提供するために用いる金属層の第2のセットと、
パワー配布を提供するために用いる金属層の第3のセットと、
RF信号配布を提供するために用いる金属層の第4のセットと、
を有するプリント配線板(PWB)と、
PWBの表面に配置されている一つ以上のモノリシックマイクロ波集積回路(MMIC)と、
複数の金属導管であって、各導管が複数の層のうちの1つを複数の層の他の1つに電気的に結合することを特徴とする複数の金属導管と、
前記複数の金属導管の第1の金属導管に結合された第1の端と、前記複数の金属導管の第2の金属導管に結合された前記第1の端と対向する第2の端とを有するRFバイアと、
を有し、
前記RFバイアが、前記RF信号配布を提供するのに用いる金属層の第4のセットを介して延びることなく、前記RF信号配布を提供するために用いる金属層の第1のセットから前記デジタル論理的配布を提供するために用いる金属層の第2のセットに、前記パワー配布を提供するために用いる金属層の第3のセットを介して延び、
PWBが、AESAにおいて、用いられる少なくとも一つの送信/受信(T/R)チャネルを備え、
AESAカードが、ワイヤー接合を含まない、
ことを特徴とする能動電子走査アレイ(AESA)カード。 - 金属層の第2のセットの金属層と金属層の第3のセットの金属層との間のエポキシおよび炭素繊維の第1の複合層と、
金属層の第3のセットの金属層と金属層の第4のセットの金属層と間のエポキシおよび炭素繊維の第2の複合層と、
を更に有することを特徴とする請求項1に記載のAESAカード。 - PWBが更に、
金属層の第1のセットの2つの金属層の間のエポキシ樹脂の層と、
金属層の第2のセットの2つの金属層の間のエポキシ樹脂の層と、
金属層の第1のセットの2つの金属層の間のエポキシ樹脂の層と
を有することを特徴とする請求項2に記載のAESAカード。 - PWBは、金属層の第3のセットの2つの金属層の間にポリイミド誘電体の層を更に含む請求項2に記載のAESAカード。
- PWBの表面に配置されている一つ以上のモノリシックマイクロ波集積回路(MMIC)を更有することを特徴とする請求項1のAESAカード。
- MMICがはんだ球を用いてPWBに取り付けられる請求項1のAESAカード。
- 複数の金属導管、複数の層の別のものに対する複数の層の各電気導管結合のうちの1つを更に有することを特徴とする請求項1のAESAカード。
- 第2の金属導管に連結する第1端部の反対側に第1の金属導管、および、第2の端に連結する第1端部を有するRFバイアを更に有し、
RFバイアは、パワー配布に関し用いられる金属層を通って延びる、ことを特徴とする請求項7のAESAカード。 - PWBが、
金属層の第1のセットの2つの金属層間のエポキシ樹脂の層と、
金属層の第2のセットの2つの金属層間のエポキシ樹脂の層と、
金属層の第1のセットの2つの金属層間のエポキシ樹脂の層と、
金属層の第3のセットの2つの金属層間のポリイミド誘電体の層と、
を更に有することを特徴とする請求項1のAESAカード。 - AESAカードがワイヤー接合を含まないことを特徴とする請求項1のAESAカード。
- 能動電子走査アレイ(AESA)アセンブリであって、
RF信号配布を提供するために用いる金属層の第1のセットと、
デジタル論理的配布を提供するために用いる金属層の第2のセットと、
パワー配布を提供するために用いる金属層の第3のセットと、
RF信号配布を提供するために用いる金属層の第4のセットと、
を有するプリント配線板(PWB)を備えるAESAカードと、
PWBの表面に配置されている一つ以上のモノリシックマイクロ波集積回路(MMIC)と、
複数の金属導管であって、各導管が複数の層のうちの1つを複数の層の他の1つに電気的に結合することを特徴とする複数の金属導管と、
前記複数の金属導管の第1の金属導管に結合された第1の端と、前記複数の金属導管の第2の金属導管に結合された前記第1の端と対向する第2の端とを有するRFバイアと、
を有し、
前記RFバイアが、前記RF信号配布を提供するのに用いる金属層の第4のセットを介して延びることなく、前記RF信号配布を提供するために用いる金属層の第1のセットから前記デジタル論理的配布を提供するために用いる金属層の第2のセットに、前記パワー配布を提供するために用いる金属層の第3のセットを介して延び、
PWBは、AESAにおいて、用いられる少なくとも一つの送信/受信(T/R)チャネルを備え、
AESAカードが、ワイヤー接合を含まない、
ことを特徴とする、能動電子走査アレイ(AESA)アセンブリ。 - MMICの一つ以上と接触する冷却機構を更に有することを特徴とする請求項11のAESAアセンブリ。
- 冷却機構が、
MMICと接触する熱的熱分散部材と、熱的熱分散部材と接触するコールドプレートと、を有することを特徴とする請求項12のASEAアセンブリ。 - MMICが、はんだ球を用いてPWBに取り付けられることを特徴とする請求項13のASEAアセンブリ。
- 複数の金属導管、複数の層の別のものに複数の層のひとつを結合する各電気導管を更に有することを特徴とする請求項11のASEAアセンブリ。
- 第1の金属導管に結合された第1端部と、第2の金属導管に接続している第1端部の反対側の第2の端部とを有するバイアを更に有し、
前記バイアは、パワー配布に関し用いられる金属層を通って延びる、ことを特徴とする請求項15のASEAアセンブリ。 - 金属層の第2のセットの金属層と金属層の第3のセットの金属層の間のエポキシおよび炭素繊維の第1の複合層と、
金属層の第3のセットの金属層と金属層の第4のセットの金属の層と間のエポキシおよび炭素繊維の第2の複合層と、
を更に有することを特徴とする請求項11のASEAアセンブリ。 - 金属層の第1のセットの2つの金属層間のエポキシ樹脂の層と、
金属層の第2のセットの2つの金属層間のエポキシ樹脂の層と、
金属層の第1のセットの2つの金属層間のエポキシ樹脂の層と、
金属層の第3のセットの2つの金属層間のポリイミド誘電体の層と
を更に有する請求項17のASEAアセンブリ:。 - AESAカードがワイヤー接合を含まないことを特徴とする請求項11のASEAアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/295,437 | 2011-11-14 | ||
US13/295,437 US9019166B2 (en) | 2009-06-15 | 2011-11-14 | Active electronically scanned array (AESA) card |
PCT/US2012/062542 WO2013074284A1 (en) | 2011-11-14 | 2012-10-30 | An active electronically scanned array (aesa) card |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015506118A JP2015506118A (ja) | 2015-02-26 |
JP5902310B2 true JP5902310B2 (ja) | 2016-04-13 |
Family
ID=48430039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014541098A Active JP5902310B2 (ja) | 2011-11-14 | 2012-10-30 | 能動電子走査アレイ(aesa)カード |
Country Status (7)
Country | Link |
---|---|
US (1) | US9019166B2 (ja) |
EP (1) | EP2748894B1 (ja) |
JP (1) | JP5902310B2 (ja) |
AU (1) | AU2012340002B2 (ja) |
CA (1) | CA2850529C (ja) |
TW (1) | TWI508370B (ja) |
WO (1) | WO2013074284A1 (ja) |
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