JP5899099B2 - Chemical liquid discharge amount measuring jig, chemical liquid discharge amount measuring mechanism and chemical liquid discharge amount measuring method - Google Patents

Description

  The present invention relates to a measurement jig, a measurement mechanism, and a measurement method for measuring a discharge amount of a chemical solution from a chemical solution supply unit to a substrate in a coating processing apparatus that applies the chemical solution to the substrate by the chemical solution supply unit.

  For example, in a photolithography process in a semiconductor device manufacturing process, for example, a resist coating process for applying a resist solution on a semiconductor wafer (hereinafter referred to as “wafer”) to form a resist film, and exposing the resist film to a predetermined pattern An exposure process, a development process for developing the exposed resist film, and the like are sequentially performed to form a predetermined resist pattern on the wafer.

  In the above-described resist solution coating process, the resist solution is supplied from the supply nozzle to the center of the wafer while being rotated while being held by the spin chuck, and the resist solution is diffused on the wafer by centrifugal force. Therefore, so-called spin coating for forming a resist film on a wafer is widely known.

  In order to control the film thickness of the resist film formed on the surface of the wafer in such spin coating with high accuracy, it is necessary to accurately control the discharge amount of the resist liquid discharged from the supply nozzle to the wafer. Therefore, in the above-described coating processing apparatus, the discharge amount from the supply nozzle is periodically measured, and the discharge pressure setting operation of the pump that sends the resist solution to the supply nozzle is performed as necessary.

  For example, Patent Document 1 proposes a resist coating processing apparatus having a mechanism for measuring the amount of resist solution supplied from a supply nozzle. Specifically, a container capable of storing a predetermined amount of resist solution is installed at a standby position where an unused supply nozzle waits, and the resist solution is discharged from the supply nozzle into the container at this standby position. Then, this container is unloaded from the resist coating apparatus by an operator, and the discharge amount of the resist solution from the supply nozzle is measured by, for example, a graduated cylinder by the operator's manual operation. And the discharge pressure of a pump is adjusted as needed.

JP-A-4-236419

  However, when carrying out the above-mentioned container from the resist coating apparatus or measuring with a graduated cylinder, there is a risk that the chemical solution may scatter and be applied to the worker, or the worker may be injured by the drive system device of the coating process apparatus. . Therefore, there is a demand for a method for measuring the discharge amount that does not cause the operator to perform work in the coating apparatus.

  The present invention has been made in view of such a point, and in a coating processing apparatus for applying a chemical solution to a substrate, the amount of the chemical solution discharged from the nozzle to the substrate is measured without the manual operation of an operator. It is an object.

In order to achieve the above object, the present invention provides an apparatus for supplying a chemical solution in a coating processing apparatus that performs a substrate coating process by holding a substrate in a substrate holder and discharging a chemical solution from a chemical solution supply unit to the held substrate. A measuring jig for measuring a discharge amount of a chemical solution from a means onto a substrate, a strain generating body that generates strain due to a load, and a resistance value that changes in accordance with the strain amount. a piezoelectric element, a lower substrate supporting the strain body, anda upper substrate supported by said strain generating body, wherein the lower substrate state, and are capable of holding by the substrate holding unit, the upper The upper surface of the substrate is characterized in that a groove communicating with an opening formed in the side surface of the upper substrate is formed .

  According to the present invention, since the piezoelectric element whose resistance value changes according to the amount of strain is arranged in the strain generating body, and the upper substrate is supported by the strain generating body, the strain generation accompanying the change in the load on the upper substrate. A change in the amount of strain of the body can be detected by the piezoelectric element. Therefore, based on the change in the resistance value of the piezoelectric element, the amount of change in the load on the upper substrate, in other words, the amount of the chemical liquid discharged from the chemical liquid supply means to the upper substrate can be obtained. Therefore, it is possible to measure the discharge amount of the chemical liquid from the chemical liquid supply means to the substrate without the manual operation of the worker.

  The upper substrate may have the same size as the substrate to be coated by the coating processing apparatus.

  The bottom of the groove may be provided with a weir that prevents the chemical solution from spilling out of the upper substrate.

According to another aspect of the present invention, there is provided a coating processing apparatus for performing a substrate coating process by holding a substrate on a substrate holding unit and discharging a chemical solution from the chemical solution supply unit to the held substrate. A measuring jig for measuring a discharge amount of the chemical liquid to the strain generating body that generates strain due to a load, and a piezoelectric element that is disposed on the strain generating body and has a resistance value that changes according to the strain amount A lower substrate supporting the strain generating body and an upper substrate supported by the strain generating body, the lower substrate being able to be held by the substrate holding portion, and the upper substrate being a central portion is characterized in Rukoto is not recessed. In such a case, the depression of the upper substrate may be formed in a tapered shape toward the central portion of the upper substrate.

  ADVANTAGE OF THE INVENTION According to this invention, in the coating processing apparatus which apply | coats a chemical | medical solution to a board | substrate, the discharge amount of the chemical | medical solution to a board | substrate from a nozzle can be measured without an operator's manual operation.

It is a longitudinal cross-sectional view which shows the outline of a structure of the coating processing apparatus concerning this Embodiment. It is a cross-sectional view which shows the outline of a structure of the coating processing apparatus concerning this Embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the chemical | medical solution discharge amount measuring jig. It is a perspective view which shows the outline of a structure of the jig | tool for chemical | medical solution discharge amount measurement. It is a flowchart which shows the main processes of the discharge amount measurement of a chemical | medical solution. It is explanatory drawing which shows the state which discharged the chemical | medical solution to the jig | tool for chemical | medical solution discharge amount measurement. It is explanatory drawing which showed a mode that the chemical | medical solution discharge amount measurement jig | tool was wash | cleaned. It is a top view which shows the outline of a structure of the jig | tool for chemical | medical solution discharge amount measurement concerning other embodiment. It is a perspective view which shows the outline of the shape of the upper board | substrate concerning other embodiment. It is a perspective view which shows the outline of a structure of the jig | tool for chemical | medical solution discharge amount measurement concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the chemical | medical solution discharge amount measuring jig concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of a groove | channel. It is a perspective view which shows the outline of the shape of the upper board | substrate concerning other embodiment. It is a perspective view which shows the outline of the shape of the upper board | substrate concerning other embodiment. It is a perspective view which shows the outline of the shape of the upper board | substrate concerning other embodiment. It is a perspective view which shows the outline of a structure of the jig | tool for chemical | medical solution discharge amount measurement concerning other embodiment. It is explanatory drawing which shows a mode that an upper board | substrate and a lower board | substrate are hold | maintained with a conveyance mechanism.

  Embodiments of the present invention will be described below. FIG. 1 is a longitudinal sectional view showing an outline of a configuration of a coating processing apparatus 10 using a chemical discharge amount measuring jig 1 according to the present embodiment. FIG. 2 is a cross-sectional view showing an outline of the configuration of the coating treatment apparatus 10.

  The coating processing apparatus 10 has a processing container 11 as shown in FIG. A spin chuck 20 serving as a holding unit that holds and rotates the substrate is provided at the center of the processing container 11. The spin chuck 20 has a horizontal upper surface, and a suction port (not shown) for sucking the substrate, for example, is provided on the upper surface. By suction from the suction port, the wafer W as a substrate can be sucked and held on the spin chuck 20. The wafer W in the present embodiment is a chemical liquid discharge amount measuring jig 1. Details of the chemical discharge amount measuring jig 1 will be described later.

  The spin chuck 20 includes a chuck drive mechanism 21 including, for example, a motor, and can be rotated at a predetermined speed by the chuck drive mechanism 21. Further, the chuck drive mechanism 21 is provided with an elevating drive source such as a cylinder, so that the spin chuck 20 can move up and down.

  Around the spin chuck 20, there is provided a cup 22 that receives and collects the liquid scattered or dropped from the wafer W. A discharge pipe 23 for discharging the collected liquid and an exhaust pipe 24 for exhausting the atmosphere in the cup 22 are connected to the lower surface of the cup 22.

  As shown in FIG. 2, a rail 30 extending along the Y direction (left and right direction in FIG. 2) is formed on the X direction negative direction (downward direction in FIG. 2) side of the cup 22. The rail 30 is formed, for example, from the outer side of the cup 22 on the Y direction negative direction (left direction in FIG. 2) to the outer side on the Y direction positive direction (right direction in FIG. 2). For example, two arms 31 and 32 are attached to the rail 30.

  As shown in FIGS. 1 and 2, the first arm 31 supports a supply nozzle 33 as a chemical solution supply unit that supplies a chemical solution to the wafer W.

  The first arm 31 is movable on the rail 30 by a nozzle driving unit 34 shown in FIG. As a result, the supply nozzle 33 can move from the standby part 35 installed outside the cup 22 on the positive side in the Y direction to above the center of the wafer W in the cup 22, and further on the surface of the wafer W It can move in the radial direction of W. The first arm 31 can be moved up and down by a nozzle drive unit 34 and the height of the supply liquid nozzle 33 can be adjusted. The standby unit 35 is provided with a standby block 35 a into which a plurality of supply nozzles 33 can be inserted. The standby block 35 a is configured so that a plurality of, for example, eight supply nozzles 33 can be inserted, and the standby arm 35 can hold an arbitrary supply nozzle 33 by the first arm 31.

  As shown in FIG. 1, a supply pipe 37 that communicates with a chemical solution supply source 36 is connected to the supply nozzle 33. A chemical solution is stored in the chemical solution supply source 36, and a pump (not shown) that pumps the chemical solution to the supply nozzle 33 is provided. The supply pipe 37 is provided with a supply device group 38 including a valve for controlling the flow of the chemical solution, a flow rate adjusting unit, and the like. Note that the chemical solution in the present embodiment is, for example, a resist solution.

  A pure water nozzle 40 that supplies pure water as a cleaning liquid is supported on the second arm 32. The second arm 32 is movable on the rail 30 by a nozzle drive unit 41 as a nozzle moving mechanism shown in FIG. 2, and the pure water nozzle 40 is provided outside the cup 22 on the Y direction negative direction side. The standby unit 42 can be moved up to the upper center of the wafer W in the cup 22. Further, the second arm 32 can be moved up and down by the nozzle drive unit 41, and the height of the pure water nozzle 40 can be adjusted.

  As shown in FIG. 1, a supply pipe 44 that communicates with a pure water supply source 43 is connected to the pure water nozzle 40. Pure water is stored in the pure water supply source 43. The supply pipe 44 is provided with a supply device group 45 including a valve for controlling the flow of pure water, a flow rate adjusting unit, and the like.

  Next, the configuration of the chemical discharge amount measuring jig 1 will be described. As shown in FIGS. 3 and 4, the chemical discharge amount measuring jig 1 includes a strain generating body 50 that generates strain due to a load, a lower substrate 51 that supports the strain generating body 50 from below, and the strain generating body 50. It has an upper substrate 52 supported on its lower surface.

  The strain body 50 is provided above the lower substrate 51 so as to extend along the diameter direction of the lower substrate 51. Inside the strain generating body 50, a cavity 50a is formed along the direction in which the strain generating body 50 extends. A hanging portion 60 that extends downward and is supported on the upper surface of the lower substrate 51 is provided at one end of the strain generating body 50. The strain body 50 is supported on the upper surface of the lower substrate 51 through the hanging part 60. A support body 61 that extends upward and supports the upper substrate 52 is provided at the end of the strain body 50 opposite to the side on which the hanging part 60 is provided. The upper substrate 52 is supported by the strain body 50 via the support body 61. Therefore, when a load is applied to the upper substrate 52, the strain generating body 52 is distorted with the hanging portion 60 supported by the lower substrate 51 as a fulcrum.

  A strain gauge 62, which is a piezoelectric element whose resistance value changes according to the amount of strain, is provided at a position corresponding to the end of the cavity 50a on the upper surface of the strain generating body 50 and the lower surface of the strain generating body 50. . That is, in this embodiment, four strain gauges 62 are provided. The arrangement and the number of installation of the strain gauges 62 are not limited to the present embodiment. The reason why the strain gauges 62 are provided corresponding to the hollow portions 50a is that the strain amount is the largest when the strain generating body 50 is strained. Arrangement and the number of installations can be set arbitrarily.

  The lower substrate 51 has a disk shape smaller than a semiconductor wafer used for manufacturing a semiconductor device. The lower surface of the lower substrate 51 is attracted and held by the spin chuck 20. The lower substrate 51 is provided with a predetermined device such as an electric circuit and a memory, a power source, and a transmitter (not shown) that transmits a signal to the control unit 100 described later. The change in resistance value that occurs when the strain gauge 62 expands and contracts due to the strain of the strain generating body 50 is transmitted to the control unit 100 by this transmitter. The lower substrate 51 is not necessarily smaller than the semiconductor wafer, and can be arbitrarily set as long as it can be suitably held by the spin chuck 20.

  The upper substrate 52 has a substantially disk shape that is the same size as a semiconductor wafer used for manufacturing a semiconductor device, and its upper surface is flat. The outer peripheral edge of the upper substrate 52 extends vertically downward and is formed so as to cover the outside of the strain generating body 50. Thereby, it can prevent that a chemical | medical solution adheres to the lower board | substrate 51 and the strain body 50. FIG. Note that the fact that the upper substrate 52 has the same size as the semiconductor wafer does not necessarily mean that the diameter of the upper substrate 52 is completely the same as the diameter of the semiconductor wafer. For example, the upper substrate 52 is held by the spin chuck 20. Any size can be set as long as it can rotate without interfering with the cup 22 in the state. It will be apparent to those skilled in the art that various changes and modifications can be made and these are naturally within the scope of the present invention.

  The rotation operation and the vertical operation of the spin chuck 20 described above, the movement operation of the developing solution nozzle 33 by the nozzle driving unit 34, the supply operation of the developing solution of the developing solution nozzle 33 by the supply device group 38, the pure water nozzle 40 by the nozzle driving unit 41. The operation of the drive system, such as the movement operation of the pure water nozzle 40 by the supply device group 45 and the supply operation of the pure water nozzle 40, is controlled by the control unit 100. The control unit 100 is configured to be able to receive a transmission signal from the transmitter of the lower substrate 51. The control unit 100 is configured by, for example, a computer having a CPU, a memory, and the like. For example, by executing a program stored in the memory, the coating process in the coating processing apparatus 10 can be realized.

  Further, the memory of the control unit 100 stores a correlation between the amount of change in resistance value due to strain of each strain gauge 62, the amount of load applied to the strain generating body 50, and the amount of strain of the strain generating body 50 as a program. Yes. Then, by this program, the resistance value of each strain gauge 62 in a state where no load is applied to the upper surface of the upper substrate 52 in advance, in other words, only a load applied to the strain generating body 50 by the upper substrate 52 is applied. The resistance value of each strain gauge 62 in a state where a load is applied to the upper substrate 52 is compared and calculated, and the load to the upper substrate 52 is calculated. In other words, the control unit 100 executes processing of a transmission signal from the transmitter of the lower substrate 51, and also serves as an arithmetic unit that calculates the amount of change in the load on the upper substrate 52 from the amount of change in the resistance value of the strain gauge 62. Function.

  Various programs for realizing the development processing in the coating processing apparatus 10 are, for example, a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), a memory card, and the like. That is stored in the storage medium H and installed in the control unit 100 from the storage medium H is used.

  The chemical solution discharge amount measuring jig 1 according to the present embodiment and the coating treatment apparatus 10 using the part chemical solution discharge amount measuring jig 1 are configured as described above. Next, the chemical solution discharge amount measuring tool is used. A process for measuring the discharge amount from the supply nozzle 33 using the jig 1 will be described. FIG. 5 is a flowchart showing an example of main steps of such development processing.

  In measuring the discharge amount of the chemical solution from the supply nozzle 33, first, the lower substrate 51 of the chemical discharge amount measurement jig 1 is held by a transport mechanism (not shown) provided outside the coating processing apparatus 10 to apply the solution. It is carried into the processing container 11 of the processing apparatus 10 (step S1 in FIG. 5). In the chemical solution discharge amount measuring jig 1 carried into the coating processing apparatus 10, first, the lower substrate 51 is sucked and held by the spin chuck 20.

  Subsequently, the supply nozzle 33 of the standby unit 35 is moved to above the center of the upper substrate 52 by the first arm 31 (step S2 in FIG. 5). Next, in a state where the chemical solution discharge amount measuring jig 1 is stopped, a predetermined amount of chemical solution is discharged from the supply nozzle 33, and the chemical solution K is dropped onto the upper surface of the upper substrate 52 as shown in FIG. (Step S3 in FIG. 5). Due to the weight of the dropped chemical solution K, the strain generating body 50 is distorted with the hanging portion 60 as a fulcrum. And along with distortion of the strain body 50, distortion also arises in each strain gauge 62, and the resistance value of each strain gauge 62 changes. The resistance value of the strain gauge 62 is transmitted to the control unit 100 by the transmitter of the lower substrate 51.

  The control unit 100 calculates the weight of the chemical solution K discharged from the supply nozzle 33 on the upper surface of the upper substrate 52 based on the signal transmitted from the transmitter of the lower substrate 51 (Step S4 in FIG. 5).

  When the measurement of the discharge amount for one supply nozzle 33 is completed, the first arm 31 moves to the standby unit 35. Next, the pure water nozzle 40 of the standby part 42 is moved to above the center part of the measuring wafer W by the second arm 32. Next, pure water is supplied from the pure water nozzle 40 to the center of the upper substrate 52 while rotating the chemical discharge amount measuring jig 1 by the spin chuck 20, and as shown in FIG. 1 is washed with pure water P (step S5 in FIG. 5). At this time, since the upper surface of the upper substrate 52 is flat, the chemical solution K is easily washed away by centrifugal force.

  Thereafter, the pure water nozzle 40 is moved to the standby unit 42. Next, the other supply nozzle 33 is moved again to the center of the upper substrate 52, and the discharge amount of the supply nozzle 33 is also measured. Then, the cleaning by the pure water nozzle 40 and the discharge of the chemical solution K by the supply nozzle 33 are alternately repeated, and the discharge amount is sequentially measured for all the eight supply nozzles 33.

  When the measurement of the discharge amount for all the supply nozzles 33 is completed, the chemical solution discharge amount measuring jig 1 is unloaded from the coating processing apparatus 10 by a transport mechanism (not shown) (step S6 in FIG. 5), and a series of measurement operations. Ends. In parallel with this, the control unit 100 determines whether or not the discharge amount from the supply nozzle 33 is a desired value. The set values of the discharge pressure and the flow rate adjustment unit of the supply device group 38 are changed.

  According to the embodiment described above, the strain gauge 50 of the chemical discharge amount measuring jig 1 is provided with the strain gauge 62 which is a piezoelectric element whose resistance value changes according to the strain amount. Since the upper substrate 52 is supported by 50, the strain gauge 62 can detect a change in the strain amount of the strain generating body 50 accompanying a change in the load on the upper substrate 52. Based on the change in the resistance value of the strain gauge 62, the control unit 100 obtains the amount of change in the load on the upper substrate 52, in other words, the amount of the chemical discharged from the supply nozzle 33 onto the upper substrate 52. Can do. Therefore, according to the present invention, it is possible to measure the discharge amount of the chemical liquid K from the supply nozzle 33 without the manual operation of the worker.

  In the above embodiment, the strain generating body 50 is provided to extend along the diameter direction of the upper substrate 52 and the lower substrate 51. However, the strain on the strain generating body 50 is generated by the load on the upper substrate 52. For example, the arrangement is not limited to the present embodiment, and can be arbitrarily set. For example, as shown in FIG. 8, it may be eccentrically arranged at a position shifted from the diameter direction of the lower substrate 51. If the arrangement of the strain generating body 50 is eccentric as shown in FIG. 8, the position of the center of gravity of the lower substrate 51 is shifted, and vibration may occur when the chemical discharge amount measuring jig 1 is rotated by the spin chuck 20. is there. Therefore, it is preferable that the device group 63 such as a predetermined circuit, a memory, a power supply, and a transmitter is also arranged eccentrically so that the center of gravity is located at the center of the lower substrate 51, for example, as shown in FIG.

  In the above embodiment, the upper surface of the upper substrate 52 is formed flat. However, the shape of the upper substrate 52 is not limited to the present embodiment, and the chemical solution K discharged from the supply nozzle 33 is used. Any setting that does not spill can be used. For example, as shown in FIG. 9, an upper substrate 70 having a shape that is tapered toward the center may be used. According to the tapered upper substrate 70, for example, when the discharge amount of the chemical liquid K from the supply nozzle 33 is large or when the chemical liquid K has good wettability with respect to the upper substrate 52, the discharged chemical liquid K is applied to the entire surface of the upper substrate 52. Even when the liquid K is diffused, the chemical liquid K can be prevented from spilling from the upper substrate 52.

  From the viewpoint of preventing the chemical liquid K from spilling from the upper substrate 52, for example, a frame body extending vertically upward may be provided at the end of the upper substrate 52. It is conceivable that the discharge of the chemical solution K and the pure water P from the upper substrate 52 is hindered. Therefore, by making the upper surface tapered like the upper substrate 70 of FIG. 9, the chemical solution K and the pure water P are easily discharged from the upper substrate 70 by centrifugal force.

  Further, as shown in FIGS. 10 and 11, an upper substrate 81 in which a groove 80 extending along the diameter direction is formed on the upper surface thereof may be used. The chemical solution K is discharged from the supply nozzle 33 into the groove 80. As the shape of the groove 80, for example, a slit-like introduction portion 80 a provided on the upper surface of the upper substrate 81 and an opening formed on the side surface of the upper substrate 52 are communicated, and below the introduction portion 80 a than the introduction portion 80 a. You may comprise by the discharge part 80b formed wide. In such a case, it is preferable to provide a protruding portion 82 that gently protrudes upward at a position near the outer peripheral portion of the upper substrate 81 in the discharge portion 80b, for example, as shown in FIG. By doing so, the protrusion 82 functions as a weir, and the chemical solution K can be retained in the region sandwiched between the protrusions 82. As a result, the chemical liquid K can be prevented from spilling from the upper substrate 81 in the same manner as the upper substrate 70 described above. When the upper substrate 81 in which the groove 80 is formed is used, the strain generating body 50 and the device group 63 are eccentrically arranged to avoid interference with the groove 80 as shown in FIG.

  Further, the shape of the protruding portion 82 can be arbitrarily set as long as the chemical solution K does not spill from the upper substrate 81 and does not hinder the discharge of the chemical solution K when washed with pure water P. The discharge part 80b may be tapered with a downward slope toward the center, or the protrusion 82 may be provided on the outer peripheral edge of the discharge part 80b. The cross-sectional shape of the discharge part 80b itself may be substantially trapezoidal as shown in FIG. 13, or may be elliptical as shown in FIG. Further, the introducing portion 80a may be formed in a slit shape only in the central portion of the upper substrate 52 as shown in FIG.

  In the above embodiment, the cleaning of the upper substrate 52 is performed inside the coating processing apparatus 10. However, the cleaning of the upper substrate 52 is not necessarily performed by the coating processing apparatus 10, and a chemical discharge amount measuring jig is used. 1 may be carried out after being carried out of the coating treatment apparatus 10. In such a case, the shape of the upper substrate 52 does not need to take into account the discharge of the chemical solution K, and therefore a frame body that extends vertically upward may be provided at the outer peripheral end of the upper substrate 52. Further, for example, as shown in FIG. 16, an upper substrate 91 provided with a recess 90 in which a central portion of the upper substrate is recessed downward in a cylindrical shape may be used. Further, the shape of the recessed portion 90 of the upper substrate 91 may be a slit shape, a prismatic shape, a conical shape, or a pyramidal shape as long as the chemical liquid discharged on the upper substrate 91 does not spill. Various shapes can be used. Moreover, the above-mentioned discharge part 80b may be formed in the upper board | substrate 91, and the hollow part 90 and the discharge part 80b may be connected. In such a case, the recess 90 functions in the same manner as the introduction portion 80 a of the groove 80.

  In the above embodiment, the lower substrate 51 is held by the transfer mechanism and the transfer is performed with the chemical solution discharge amount measuring jig 1. However, it is conceivable that the upper substrate 52 not held at the time of transfer shakes. In that case, stress is repeatedly applied to the strain generating body 50 and the strain gauge 62, resulting in deterioration. Therefore, it is preferable to hold not only the lower substrate 51 but also the upper substrate 52 during transportation in order to suppress shaking. In such a case, for example, as shown in FIG. 17, a substrate support portion 52 a may be provided in which the outer peripheral edge portion of the upper substrate 52 extends vertically downward and is further folded back horizontally toward the center portion of the upper substrate 52. When the upper substrate 52 is transported, the transport mechanism 110 holds both the lower substrate 51 and the substrate support portion 52a of the upper substrate 52, thereby preventing the upper substrate 52 from shaking.

In the above embodiment, the discharge amount of the chemical solution K is obtained by the control unit 100 based on the signal transmitted from the transmitter of the lower substrate 51. However, the calculation program is stored in the memory of the lower substrate 51, and the lower substrate 51 The volume of the chemical solution K may be calculated within 51.
In this case, the memory of the lower substrate 51 functions as a calculation unit, and the calculation result is transmitted to the control unit 100. In such a case, the chemical liquid discharge amount measuring mechanism 1 that performs the calculation of the discharge amount from the supply nozzle 33 is configured by the chemical liquid discharge amount measuring jig 1 and the calculation unit.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. For example, the present invention can be applied to the case where other processing liquids such as a developing solution and an etching solution are used in addition to the resist solution as the chemical solution. The above-described embodiment is an example of a semiconductor wafer coating apparatus, but the present invention applies other substrates such as an FPD (flat panel display) other than a semiconductor wafer and a mask reticle for a photomask. The present invention can also be applied to a processing apparatus.

  INDUSTRIAL APPLICABILITY The present invention is useful when measuring a discharge amount of a chemical solution from a nozzle to a substrate in a coating processing apparatus that applies the chemical solution to the substrate.

DESCRIPTION OF SYMBOLS 1 Chemical solution discharge amount measuring mechanism 10 Application | coating processing apparatus 11 Processing container 20 Spin chuck 21 Chuck drive mechanism 22 Cup 23 Ejection pipe 24 Exhaust pipe 30 Rail 31, 32 Arm 33 Supply nozzle 34 Nozzle drive part 35 Standby part 36 Chemical solution supply source 37 Supply Pipe 38 Supply equipment group 40 Pure water nozzle 41 Nozzle drive part 42 Standby part 43 Pure water supply source 44 Supply pipe 45 Supply equipment group 50 Strain body 51 Lower board 52 Upper board 60 Hanging part 61 Support part 62 Strain gauge 100 Control part
K chemical
P pure water

Claims (6)

In a coating processing apparatus that holds a substrate on a substrate holding unit and discharges a chemical solution from the chemical solution supply unit to the held substrate to perform a substrate coating process, the amount of the chemical solution discharged from the chemical solution supply unit to the substrate is measured. A measuring jig for
A strain generating body that generates strain due to a load;
A piezoelectric element that is disposed on the strain generating body and has a resistance value that varies according to the amount of strain;
A lower substrate that supports the strain body;
An upper substrate supported by the strain generating body,
The lower substrate state, and are capable of holding by the substrate holding unit,
A chemical solution discharge amount measuring jig , wherein a groove communicating with an opening formed on a side surface of the upper substrate is formed on an upper surface of the upper substrate . 2. The chemical solution discharge amount measuring jig according to claim 1, wherein the upper substrate has the same size as a substrate to be coated by the coating processing apparatus. 3. The chemical solution discharge amount measurement according to claim 1, wherein a weir is provided at a bottom portion of the groove to prevent the chemical solution from spilling out of the upper substrate from the groove. 4. Jig. In a coating processing apparatus that holds a substrate on a substrate holding unit and discharges a chemical solution from the chemical solution supply unit to the held substrate to perform a substrate coating process, the amount of the chemical solution discharged from the chemical solution supply unit to the substrate is measured. A measuring jig for
A strain generating body that generates strain due to a load;
A piezoelectric element that is disposed on the strain generating body and has a resistance value that varies according to the amount of strain;
A lower substrate that supports the strain body;
An upper substrate supported by the strain generating body,
The lower substrate can be held by the substrate holding unit,
The upper substrate is recessed at the center, and the chemical discharge amount measuring jig. The chemical solution discharge amount measuring jig according to claim 4, wherein the upper substrate has the same size as a substrate to be coated by the coating processing apparatus. The chemical liquid discharge amount measuring jig according to claim 4, wherein the depression of the upper substrate is formed in a tapered shape toward a central portion of the upper substrate.

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