JP4531659B2 - Method and apparatus for flattening coating film - Google Patents

Description

  The present invention relates to a method for planarizing a coating film formed on a substrate and a planarizing apparatus therefor.

  For example, in a semiconductor device manufacturing process using a photolithography technique, a process for forming a resist film by applying a resist solution on a wafer and a process for forming an insulating film by applying an insulating material on the wafer are performed.

  In the above-described processing for forming a coating film such as a resist film, a spin coating method in which a film material is dropped while the wafer W is rotated is widely used. However, in this spin coating method, the film near the periphery of the substrate tends to be thicker than that near the center due to centrifugal force. In addition, the coating film may be affected by the underlying pattern, and irregularities may be formed on the upper surface of the coating film.

  When the coating film is uneven as described above, for example, the focus at the time of exposure is not partially adjusted, and the line width of the pattern formed on the coating film varies. In addition, during etching, the depth of the groove formed by etching differs between the raised portion and the recessed portion on the upper surface of the coating film. For example, the length of the metal wiring embedded in the groove becomes uneven, and the electrical resistance As a result, the semiconductor device cannot be manufactured properly.

  In order to flatten the coating film, it has been proposed to vibrate the coating film with, for example, an ultrasonic vibrator (see, for example, Patent Document 1). However, this method is effective when a coating solution having a relatively low viscosity is used. When a normal coating solution is used, the fluidity of the coating film cannot be ensured sufficiently, and the coating film is sufficiently Cannot flatten stably.

Japanese Patent Laid-Open No. 10-168539

  The present invention has been made in view of this point, and an object thereof is to sufficiently and stably planarize a coating film on a substrate.

In order to achieve the above object, the present invention is a method for flattening a coating film on a substrate, and the substrate is reciprocated in the X and Y directions perpendicular to the horizontal direction in accordance with the underlying pattern of the coating film. In order to flatten the coating film on the pattern where the size of the recess is relatively large, a long period moving process is performed in which the substrate is reciprocated at a relatively long cycle, and the pattern on the pattern where the size of the recess is relatively small. In order to flatten the coating film, a short cycle moving process is performed in which the substrate is reciprocated at a relatively short cycle .

  According to the present invention, since the substrate is reciprocated in the X and Y directions, the fluidity of the coating film on the substrate can be sufficiently ensured. In addition, since the reciprocating movement is performed in an optimum cycle and number of times in accordance with the shape and arrangement of the level difference of the underlying pattern, it is possible to appropriately planarize the coating film on any pattern. Thus, the coating film can be sufficiently and stably planarized.

  The short cycle moving step may be performed after the long cycle moving step.

The number of reciprocating movements of the substrate in the long period moving step and the number of reciprocating movements of the substrate in the short period moving step are the sum of the areas of the recessed portions in the pattern having a relatively large ratio and the dents in the relatively small pattern . You may set so that it may become the ratio of the total of the area of a part .

A plurality of grooves extending in the X direction and the Y direction are formed in the base pattern, and when the number of grooves extending in the X direction is larger than the number of grooves extending in the Y direction, the reciprocation in the Y direction is performed. When the number of movements is set to be larger than the number of reciprocating movements in the X direction and the number of grooves extending in the Y direction is larger than the number of grooves extending in the X direction, the number of reciprocating movements in the X direction is You may make it set more than the frequency | count of a reciprocation.

The number of reciprocation times and the Y-direction of the reciprocating movement of the X-direction, also be set so that the ratio is the ratio of the number of grooves extending in the number and the X-direction groove extending in the Y direction Good.

  When unevenness having symmetry in the X direction and the Y direction is evenly arranged in the base pattern, the reciprocating movement of the substrate in the X direction and the reciprocating movement in the Y direction may be performed the same number of times. .

According to another aspect of the present invention, there is provided a flattening apparatus for flattening a coating film on a substrate, wherein the substrate is reciprocated in an X direction and a Y direction orthogonal to a horizontal direction in accordance with a base pattern of the coating film. In order to move and flatten the coating film on the pattern with a relatively large size of the recessed portion, a long period moving process is performed in which the substrate is reciprocated at a relatively long cycle, and the size of the recessed portion is on the pattern with a relatively small size. In order to flatten the coating film, a reciprocating mechanism for performing a short period moving process for reciprocating the substrate at a relatively short period is provided.

  The planarization apparatus may include a heating member that heats the substrate. The planarization apparatus may further include a solvent vapor supply unit that supplies the solvent vapor of the coating film to the periphery of the substrate.

  According to the present invention, since the coating film is sufficiently and stably planarized, exposure processing and etching processing are uniformly performed within the substrate surface, and an appropriate substrate product is manufactured.

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is a plan view showing an outline of the configuration of a coating and developing treatment system 1 provided with a flattening apparatus according to the present embodiment, and FIG. 2 is a front view of the coating and developing treatment system 1. FIG. 2 is a rear view of the coating and developing treatment system 1.

  As shown in FIG. 1, the coating and developing treatment system 1 is a cassette that carries, for example, 25 wafers W in and out of the coating and developing treatment system 1 from the outside in a cassette unit, and carries a wafer W in and out of the cassette C. A station 2, a processing station 3 in which a plurality of various processing apparatuses for performing predetermined processing in a single-wafer type in a photolithography process are arranged in multiple stages, and an unshown that is provided adjacent to the processing station 3 The interface unit 4 that transfers the wafer W to and from the exposure apparatus is integrally connected.

  The cassette station 2 is provided with a cassette mounting table 5 that can mount a plurality of cassettes C in a row in the X direction (vertical direction in FIG. 1). The cassette station 2 is provided with a wafer transfer body 7 that can move in the X direction on the transfer path 6. The wafer carrier 7 is also movable in the wafer arrangement direction (Z direction; vertical direction) of the wafers W accommodated in the cassette C, and is selective to the wafers W in each cassette C arranged in the X direction. Can be accessed.

  The wafer carrier 7 is rotatable in the θ direction around the Z axis, and can also access a temperature control device 60 and a transition device 61 belonging to a third processing device group G3 on the processing station 3 side described later.

  The processing station 3 adjacent to the cassette station 2 includes, for example, five processing device groups G1 to G5 in which a plurality of processing devices are arranged in multiple stages. On the negative side in the X direction (downward in FIG. 1) of the processing station 3, a first processing device group G1 and a second processing device group G2 are sequentially arranged from the cassette station 2 side. On the positive side in the X direction (upward in FIG. 1) of the processing station 3, the third processing device group G3, the fourth processing device group G4, and the fifth processing device group G5 are sequentially arranged from the cassette station 2 side. Has been placed. A first transfer device 10 is provided between the third processing device group G3 and the fourth processing device group G4. The first transfer device 10 can selectively access each processing device in the first processing device group G1, the third processing device group G3, and the fourth processing device group G4 to transfer the wafer W. A second transfer device 11 is provided between the fourth processing device group G4 and the fifth processing device group G5. The second transfer device 11 can selectively access the processing devices in the second processing device group G2, the fourth processing device group G4, and the fifth processing device group G5 to transfer the wafer W.

  As shown in FIG. 2, the first processing apparatus group G1 includes a liquid processing apparatus that supplies a predetermined liquid to the wafer W and performs processing, for example, resist coating apparatuses 20, 21, and 22 that apply a resist solution to the wafer W. , Bottom coating devices 23 and 24 for forming an antireflection film for preventing reflection of light during the exposure process are stacked in five stages in order from the bottom. In the second processing unit group G2, liquid processing units, for example, development processing units 30 to 34 for supplying a developing solution to the wafer W and performing development processing are stacked in five stages in order from the bottom. In addition, chemical chambers 40 and 41 for supplying various processing liquids to the liquid processing apparatuses in the processing apparatus groups G1 and G2 are provided at the bottom of the first processing apparatus group G1 and the second processing apparatus group G2. Each is provided.

  For example, as shown in FIG. 3, the third processing unit group G3 includes a temperature control device 60, a transition device 61 for delivering the wafer W, and a high-accuracy temperature for adjusting the temperature of the wafer W under high-precision temperature control. The adjusting devices 62 to 64 and the flattening devices 65 and 66 according to this embodiment are stacked in seven stages in order from the bottom. The configuration of the flattening devices 65 and 66 will be described later.

  In the fourth processing unit group G4, for example, a high-precision temperature control unit 70, pre-baking units 71 to 74 for heating the wafer W coated with the resist solution, and post-baking units 75 to 75 for heating the wafer W after the development processing. 79 are stacked in 10 steps from the bottom.

  In the fifth processing unit group G5, a plurality of heat treatment devices for heat-treating the wafer W, such as high-precision temperature control devices 80 to 83, and a plurality of post-exposure baking devices 84 to 89 for heat-treating the exposed wafer W are provided from the bottom. They are stacked in 10 steps in order.

  As shown in FIG. 1, a plurality of processing devices are arranged on the positive side in the X direction of the first transfer device 10, for example, an adhesion device 90 for hydrophobizing the wafer W as shown in FIG. 91, and heating devices 92 and 93 for heating the wafer W are stacked in four stages in order from the bottom. As shown in FIG. 1, a peripheral exposure device 94 that selectively exposes only the edge portion of the wafer W, for example, is disposed on the positive side in the X direction of the second transfer device 11.

  In the interface unit 4, for example, as shown in FIG. 1, a wafer transfer body 101 moving on a transfer path 100 extending in the X direction and a buffer cassette 102 are provided. The wafer carrier 101 is movable in the Z direction and is also rotatable in the θ direction, and accesses an exposure apparatus (not shown) adjacent to the interface unit 4, the buffer cassette 102, and the fifth processing unit group G5. The wafer W can be transferred.

  Next, the configuration of the flattening device 65 will be described. FIG. 4 is an explanatory view of a longitudinal section showing an outline of the configuration of the flattening device 65.

  The flattening device 65 includes, for example, a processing container 120 that can be sealed inside. A holding stand 121 as a holding member for mounting and holding the wafer W, for example, is provided at the center in the processing container 120. The holding stand 121 is formed in a substantially disc shape, for example. A suction port (not shown) is opened on the upper surface of the holding table 121, and the wafer W can be sucked and held by suction from the suction port.

  The holding stand 121 is fixed on an XY stage 122 as a reciprocating mechanism, for example. The XY stage 122 is movable in the X direction and the Y direction orthogonal to the horizontal direction, and can reciprocate the wafer W on the holding table 121 with a predetermined amplitude, number of times and cycle. The operation of the XY stage 122 is controlled by the control unit 123, for example. The control unit 123 can control the amplitude, number and period of the reciprocating movement of the wafer W in the X direction and the amplitude, number and period of the reciprocating movement in the Y direction according to the shape and arrangement of the underlying pattern of the wafer W, for example. . For example, a plurality of types of background patterns and recipes for reciprocal movement in the X and Y directions at that time are stored in the control unit 123 in advance, and the control unit 123 is based on the input background pattern information. The wafer W can be reciprocated according to a recipe registered in advance. For example, a computer is used for the control unit 123, and the control by the control unit 123 can be performed by executing a program stored in the computer.

  An air supply port 140 as a solvent vapor supply unit for supplying the solvent vapor of the resist solution is formed on one side wall surface of the processing container 120. For example, a solvent vapor supply pipe 142 communicating with the solvent vapor supply device 141 is connected to the air supply port 140. An exhaust port 143 is formed on the other side wall surface of the processing container 120. The exhaust port 143 is connected to the negative pressure generator 145 through an exhaust pipe 144, for example. The negative pressure generator 145 can exhaust the atmosphere in the processing container 120 from the exhaust port 143.

  For example, the operations of the solvent vapor supply device 141 and the negative pressure generation device 145 described above are controlled by the control unit 123. The control unit 123 can maintain the inside of the processing container 120 at a solvent vapor having a predetermined concentration. Further, the inside of the processing container 120 can be reduced to a predetermined pressure by the control unit 123.

  Note that the configuration of the flattening device 66 is the same as that of the flattening device 65, and a description thereof will be omitted.

  Next, the processing process of the wafer W in the flattening apparatus 65 configured as described above will be described together with the process of the photolithography process performed in the coating and developing processing system 1.

  First, an unprocessed wafer W is taken out from the cassette C on the cassette mounting table 5 by the wafer transfer body 7 and transferred to the temperature control device 60 of the third processing unit group G3. The wafer W transferred to the temperature control device 60 is adjusted to a predetermined temperature, and then transferred to the bottom coating device 23 by the first transfer device 10 to form an antireflection film. The wafer W on which the antireflection film is formed is sequentially transferred to the heating device 92 and the high-precision temperature control device 70 by the first transfer device 10 and subjected to predetermined processing in each device. Thereafter, the wafer W is transferred to the resist coating apparatus 20.

  In the resist coating apparatus 20, for example, a resist solution as a coating solution is dropped at the center of the rotated wafer W, and the resist solution diffuses on the surface of the wafer W, so that the resist solution is applied to the entire wafer surface. The The wafer W on which the resist film is thus formed is transferred to the flattening device 65 by the first transfer device 10, and the resist film is flattened. The processing process in the flattening device 65 will be described later.

  The wafer W whose resist film has been flattened in the flattening device 65 is sequentially transferred to the pre-baking device 71, the peripheral exposure device 94, and the high-precision temperature control device 83 by the first transfer device 10 and the second transfer device 11. Thus, predetermined processing is performed in each device. Thereafter, the wafer W is transferred to an exposure apparatus (not shown) by the wafer transfer body 101 of the interface unit 4 and exposed. The wafer W after the exposure processing is transferred to the post-exposure baking device 84, for example, by the wafer transfer body 101, subjected to heat treatment, and then transferred to the high-precision temperature control device 81 by the second transfer device 11 to be heated. Adjusted. Thereafter, the resist film on the wafer W is developed by being transferred to the development processing device 30. Thereafter, the wafer W is transferred to the post-baking device 75 by the second transfer device 11, subjected to heat treatment, and then transferred to the high-precision temperature control device 63 to adjust the temperature. Then, the wafer W is transferred to the transition device 61 by the first transfer device 10 and returned to the cassette C by the wafer transfer body 7 to complete a series of photolithography steps.

  Next, the process performed by the above-described flattening device 65 will be described in detail. The wafer W on which the resist film is formed is loaded into the processing container 120 as shown in FIG.

  In the processing container 120, for example, supply of a resist solution solvent vapor from the air supply port 140 and exhaust from the exhaust port 143 are performed, and the processing container 120 is maintained in a solvent atmosphere of a predetermined concentration. Thereby, drying of the resist film on the wafer W is suppressed.

  When the wafer W is held on the holding table 121, the wafer W is reciprocated in two directions, the X direction and the Y direction, by the XY stage 122. Recipes such as the order of reciprocation, period, amplitude, number of times, etc. are set in accordance with the underlying pattern of the resist film.

  For example, as shown in FIG. 5, when unevenness having symmetry in the X direction and the Y direction, for example, a plurality of holes H, are evenly arranged in the underlying pattern of the wafer W, the X direction and the Y direction The reciprocating movement of the wafer W having the same amplitude and cycle is performed the same number of times (recipe P1). In this recipe P1, for example, in the first step A1, the reciprocating movement in the X direction with an amplitude of 10 mm, a moving speed of 100 mm / s and a period of 0.2 s is performed once. In the second step A2, the reciprocating movement in the Y direction with an amplitude of 10 mm, a moving speed of 100 mm / s and a period of 0.2 s is performed once. The first step A1 and the second step A2 are alternately repeated, for example, 10 times. In such a case, an inertial force acts on the resist film by the acceleration / deceleration of the wafer W due to the reciprocal movement, and the resist film is sufficiently leveled. Further, since the same vibration is applied to the resist film on the holes H arranged uniformly in the X direction and the Y direction, the resist film is evenly flattened without unevenness. In this embodiment, the amplitude of the reciprocating movement is set to 1 mm or more and the period is set to 0.2 s or more.

  For example, as shown in FIG. 7, a groove Dx extending in the X direction and a groove Dy extending in the Y direction are formed in the underlying pattern of the wafer W, and a region area having a plurality of grooves Dy extending in the Y direction extends in the X direction. When it is larger than a certain area of the plurality of extending grooves Dx, the reciprocation in the X direction is performed more than the reciprocation in the Y direction. The number of reciprocations in the X direction and the Y direction at this time is set so that the ratio is, for example, the ratio of the area area of the groove Dy in the Y direction and the area area of the groove Dx in the X direction. For example, when the ratio of the area area of the groove Dy in the Y direction and the groove Dx in the X direction is 2: 1, the number of reciprocations in the X direction and the number of reciprocations in the Y direction are set to 2: 1 ( Recipe P2).

  In this recipe P2, for example, reciprocal movement with the same amplitude and period is performed in the X direction and the Y direction. For example, as shown in FIG. 8, in the first step B1, the reciprocating movement in the X direction with an amplitude of 10 mm, a moving speed of 100 mm / s and a period of 0.2 s is performed twice. In the second step B2, the reciprocating movement in the Y direction with an amplitude of 10 mm and a moving speed of 100 mm / s and a period of 0.2 s is performed once. The first process B1 and the second process B2 are alternately repeated, for example, 10 times.

  As shown in FIG. 9, when the area area of the groove Dx extending in the X direction is larger than the area area of the groove Dy extending in the Y direction, the reciprocation in the Y direction is more than the reciprocation in the X direction. Done. The number of reciprocations in the X direction and the Y direction at this time is set so that the ratio is, for example, the ratio of the area area of the groove Dy in the Y direction and the area area of the groove Dx in the X direction. For example, when the ratio of the area area of the groove Dx in the X direction and the groove Dy in the Y direction is 2: 1, the number of reciprocations in the Y direction and the number of reciprocations in the X direction are set to 2: 1.

  In this case, the resist film hardly flows in the Y direction with respect to the groove Dx in the X direction, and the resist film does not easily flow in the X direction with respect to the groove Dy in the Y direction. The resist film is sufficiently flattened by performing more reciprocal movements. In this example, the number of reciprocations in the X direction and the Y direction may be set so that the ratio is, for example, the ratio of the number of grooves Dy in the Y direction and the number of grooves Dx in the X direction.

  For example, as shown in FIG. 10, when a groove Dw having a relatively wide line width and a groove Ds having a relatively narrow line width extending in the X direction are formed in the underlying pattern of the wafer W, for example, On the other hand, the reciprocation in the Y direction with a relatively low speed and a long cycle is performed, and then the reciprocation in the Y direction with a relatively high speed and a short cycle is performed with respect to the narrow groove Ds. The number of reciprocations in the Y direction in the first step C1 and the second step C2 at this time is set so that the ratio is, for example, the ratio of the area of the region having the wide groove Dw and the narrow groove Ds. For example, when the ratio of the area area of the wide groove Dw and the narrow groove Ds is 2: 1, the ratio of the number of reciprocations in the first step C1 and the number of reciprocations in the second step C2 is set to 2: 1. The Thereafter, reciprocation in the X direction is performed (recipe P3).

  In this recipe P3, for example, as shown in FIG. 11, in the first step C1, the reciprocating movement in the Y direction with an amplitude of 10 mm, a moving speed of 20 mm / s, and a period of 1 s is performed twice with respect to the wide groove Dw. In the second step C2, the reciprocating movement in the Y direction is performed once with respect to the narrow groove Ds, for example, with an amplitude of 10 mm, a moving speed of 100 mm / s, and a cycle of 0.2 s. Thereafter, in the third step C3, the reciprocating movement in the X direction with an amplitude of 10 mm and a moving speed of 100 mm / s is performed once. These steps C1 to C3 are repeated a plurality of times, for example, 10 times in this order.

  In such a case, since the low-speed reciprocation is performed at a long cycle with respect to the relatively wide groove Dw, a sufficient time for the resist film to flow into the wide groove Dw is secured, and the resist film on the wide groove Dw is sufficiently flat. It becomes. In addition, the resist film sufficiently flows into the narrow groove Ds even if the narrow groove Ds is reciprocated at a high speed in a short cycle, so that a sufficiently flat resist film is formed on the narrow groove Ds. Is done. Furthermore, since the long-period reciprocation is performed before the short-period reciprocation, the uniformity of resist embedding in the entire wafer surface is improved.

  For example, as shown in FIG. 12, when the underlying pattern of the wafer W includes the hole H, the groove Dx extending in the X direction, the groove Dy extending in the Y direction, the wide groove Dw, and the narrow groove Ds, The above recipes P1 to P3 are combined. At this time, the number of reciprocations in each of the recipes P1 to P3 is calculated by calculating the area of various shapes from, for example, the number and diameter of the holes H, the number and width of the grooves Dx, Dy, Dw, and Ds. Set to be proportional.

  When the reciprocation of the wafer W a predetermined number of times is completed, the wafer W is unloaded from the processing container 120, and a series of flattening processes are completed.

  Note that each of the recipes P1 to P3 described above is executed by a program recorded in the control unit 123.

  According to the above embodiment, the wafer W is reciprocated at a predetermined amplitude, period, and number of times in the X and Y directions according to the shape and arrangement of the underlying pattern of the wafer W. Even if it is a thing, a resist film can be planarized sufficiently and stably.

  Further, since the inside of the processing container 120 is maintained in the solvent atmosphere of the resist film when the resist film is flattened, the drying of the resist film is suppressed and the fluidity of the resist film is ensured. As a result, the resist film can be effectively planarized.

  In the above embodiment, the wafer W may be heated when the resist film is planarized. In such a case, for example, a heater 150 as a heating member is provided inside the holding table 121 as shown in FIG. The heater 150 generates heat when supplied with power from the power source 151. The control unit 123 can heat the wafer W to a predetermined temperature by adjusting the amount of power supplied from the power source 151 to the heater 150 and controlling the amount of heat generated by the heater 150.

  When the wafer W is held on the holding table 121 and reciprocated by the XY stage 122, the wafer W is heated to a predetermined temperature. This heating increases the fluidity of the resist film and further improves the flatness of the resist film.

  The flattening apparatus 65 described in the above embodiment is of a single wafer type that processes wafers W one by one, but is of a batch type that processes a plurality of wafers W as shown in FIG. It may be. In this case, for example, a holding member 160 that holds, for example, a plurality of wafers W arranged in the vertical direction is provided on the XY stage 122 instead of the holding table 121. In such a case, the resist films on the plurality of wafers W can be simultaneously planarized.

  In the planarization apparatus 65 described in the above embodiment, only the planarization of the resist film is performed, but a process of drying the resist film may also be performed. In this case, for example, after the wafer W is reciprocated in the X direction and the Y direction in the processing container 120 to flatten the resist film, the inside of the processing container 120 is depressurized by the negative pressure generator 145, for example. May be dried. At this time, the wafer W may be heated. By doing so, a pre-baking process for drying the resist film can be performed by the flattening device 65.

  In the above example, the resist film may be dried while the wafer W is moved back and forth to flatten the resist film. In the planarization device 65 of the present embodiment, a decompression device can be configured by the exhaust port 143, the exhaust pipe 144, and the negative pressure generation device 145.

  In the above embodiment, the resist coating process and the planarization process are performed by separate apparatuses, but may be performed by the same apparatus. For example, the resist coating apparatus may be provided with functions such as the XY stage 122 and the control unit 123 of the planarizing apparatus 65, and the resist film may be planarized immediately after the resist film is coated.

  As a reference example, for example, after applying a resist solution to the wafer W, the wafer W may be intermittently rotated in one direction to flatten the resist film. In this case, due to acceleration / deceleration in the rotation direction of the wafer W, an inertial force acts in the circumferential direction of the wafer W, and the resist film is flattened.

  The preferred embodiment of the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to such an example. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the spirit described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs. For example, in the above embodiments, the base pattern is a hole, a groove, or a combination thereof, but the present invention can be applied to a base pattern of another shape or other combination. In the above embodiment, the resist film is flattened. However, the present invention is also applicable to the case of flattening other types of coating films, for example, insulating films such as SOD films and SOG films. it can. Further, the film coating method is not limited to the spin coating method in which the wafer W is applied in a rotated state, but is a scan coating method in which the nozzle for discharging the coating liquid and the wafer W are applied while relatively moving. Also good. The present invention can also be applied to flattening coating films such as an FPD (flat panel display) other than the wafer W, a mask reticle for a photomask, and a chip-like substrate.

  The present invention is useful for planarizing a coating film on a substrate sufficiently and stably.

It is a top view which shows the outline of a structure of a coating-development processing system. FIG. 2 is a front view of the coating and developing treatment system of FIG. 1. FIG. 2 is a rear view of the coating and developing treatment system of FIG. 1. It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of the planarization apparatus. It is a schematic diagram of the wafer in which the pattern of the hole was formed in the foundation | substrate. It is a table | surface which shows the recipe of the reciprocation with respect to the wafer of FIG. It is a schematic diagram of a wafer in which a groove in the X direction and a groove in the Y direction are formed in a base pattern. It is a table | surface which shows the recipe of the reciprocation with respect to the wafer of FIG. It is a schematic diagram of a wafer in which more grooves in the X direction are formed in the base pattern than grooves in the Y direction. It is a schematic diagram of a wafer in which grooves having different line widths are formed in a base pattern. It is a table | surface which shows the recipe of the reciprocation with respect to the wafer of FIG. It is a schematic diagram of a wafer in which holes, X-direction grooves, and Y-direction grooves are mixed in a base pattern. It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of the planarization apparatus provided with the heater. It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of a batch type planarization apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Application | coating development processing system 65 Planarization apparatus 120 Processing container 121 Holding stand 122 XY stage 123 Control part W Wafer

Claims (9)

A method of flattening a coating film on a substrate,
According to the pattern of the base of the coating film, the substrate is reciprocated in the X and Y directions perpendicular to the horizontal direction ,
In order to flatten the coating film on the pattern where the size of the recess is relatively large, a long period moving process is performed in which the substrate is reciprocated at a relatively long period.
A flattening method for a coating film, comprising: performing a short period moving step of reciprocating the substrate at a relatively short period in order to planarize the coating film on a pattern having a relatively small size of the recess . The method for planarizing a coating film according to claim 1, wherein the short period moving step is performed after the long period moving step. The number of reciprocating movements of the substrate in the long period moving step and the number of reciprocating movements of the substrate in the short period moving step are the sum of the areas of the recessed portions in the pattern having a relatively large ratio and the dents in the relatively small pattern 3. The method for planarizing a coating film according to claim 1, wherein the coating film is set so as to have a ratio of the total area of the portions. A plurality of grooves extending in the X direction and the Y direction are formed in the base pattern,
  When the number of grooves extending in the X direction is larger than the number of grooves extending in the Y direction, the number of reciprocating movements in the Y direction is set to be larger than the number of reciprocating movements in the X direction.
  When the number of grooves extending in the Y direction is larger than the number of grooves extending in the X direction, the number of reciprocating movements in the X direction is set larger than the number of reciprocating movements in the Y direction. Item 3. The method for planarizing a coating film according to Item 1 or 2. The number of reciprocations in the X direction and the number of reciprocations in the Y direction are set such that the ratio is a ratio of the number of grooves extending in the Y direction to the number of grooves extending in the X direction. The method for flattening a coating film according to claim 4. In the case where unevenness having symmetry in the X direction and the Y direction is evenly arranged in the base pattern, the reciprocation of the substrate in the X direction and the reciprocation of the Y direction are performed in the same manner. The method for flattening a coating film according to claim 1. A flattening device for flattening a coating film on a substrate,
  Compare the substrates in order to flatten the coating film on the pattern where the dimension of the recess is relatively large by reciprocating the substrate in the X and Y directions orthogonal to the horizontal direction according to the pattern of the coating film base A long-cycle movement process is performed in which the substrate is reciprocated at a relatively short period in order to flatten the coating film on the pattern having a relatively small recess size. A flattening device comprising a reciprocating mechanism. The flattening apparatus according to claim 7, further comprising a heating member that heats the substrate. 9. The flattening apparatus according to claim 7, further comprising a solvent vapor supply unit that supplies the solvent vapor of the coating film around the substrate.

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