JP5881400B2 - High frequency transmission line - Google Patents

Description

  The present invention relates to a high-frequency transmission line having low loss.

  For example, in Patent Document 1, a second dielectric layer is stacked on a first dielectric layer, and signal lines are disposed on inner layers of the first dielectric layer and the second dielectric layer, and both sides thereof are arranged. In addition, a multilayer high-frequency circuit board having a so-called coplanar line formed by disposing a ground conductor layer having the same conductor layer as the signal line is disclosed. In this multilayer high-frequency circuit board, ground conductor layers are further formed on the back surface of the first dielectric layer and the surface of the second dielectric layer, respectively, and the first dielectric layer and the second dielectric layer are formed. In the layer, a via for electrically connecting the ground conductor layer and the ground conductor layer is formed (see FIG. 19 of Patent Document 1).

  Non-Patent Document 1 discloses a single-layer high-frequency circuit substrate in which metal patterns are symmetrically wired on both surfaces of a dielectric substrate. In this single-layer high-frequency circuit board, signal line conductors that are parallel to each other are arranged on both surfaces via a dielectric substrate, these signal line conductors are electrically connected to each other by vias, and between the signal line conductors A double-sided metal-loaded triplate transmission line is formed by arranging the ground conductors via air.

  Further, FIG. 1 is a diagram showing a structure of a triplate line configured by combining the high-frequency transmission line of Patent Document 1 and the double-sided metal-loaded triplate line of Non-Patent Document 1, and is orthogonal to the extending direction of the signal line conductor. The cross section cut by the surface to be shown is shown. As shown in FIG. 1, when a conventional high-frequency transmission line is combined, a multi-layered high-frequency circuit can be realized, and the flexibility of layout is improved. For this reason, there is an advantage that high integration of the high frequency device becomes easy.

JP 2000-277661 A

T. Kuroki, Hiroyuki Kawazu, and Yusuke Omotesue, “Consideration of Unnecessary Mode in Double-sided Metal-Loaded Triplate Line”, Proceedings of Society Conference of IEICE 2009 Electronics (1), 103, 2009-09-01

The problems in the above-described conventional technology will be described with reference to FIGS.
FIG. 2 is a diagram showing the electric field distribution and magnetic field distribution when the distance between the layer 2 and the layer 3 in FIG. 1 is smaller than the ground conductor width of the same layer as the signal line conductor. It is a figure which shows the electric field distribution and magnetic field distribution in case the space | interval of the layer 2 and the layer 3 in is larger than the ground conductor width of the signal layer conductor and the same layer. As shown in FIG. 2 and FIG. 3, in the high-frequency transmission line, a part of the electric field is distributed between the layer 2 and the layer 3 (solid arrow in the figure). There is an insertion loss corresponding to the dielectric loss tangent.

  As shown in FIGS. 2 and 3, a part of the electromagnetic field is distributed between the layer 2 and the layer 3 (broken arrows in the figure), and the current is distributed on the surface of the conductor in contact with the electromagnetic wave. Since the thickness of the conductor pattern between the layer 2 and the layer 3 and the structure like a columnar conductor forming a via or a through hole are finer than the surface of the conductor pattern, the high-frequency transmission line As the electromagnetic field is distributed between layer 2 and layer 3, the insertion loss for the conductor increases.

Typical dielectrics of the multilayer high-frequency circuit board include ceramic LTCC (low temperature co-fired ceramic) dielectrics and resin dielectrics. Here, LTCC is a material made by mixing glass with alumina, and generally has a dielectric loss tangent of 0.001 or more. In addition, with a resin-based dielectric, a dielectric loss tangent as low as that of a ceramic-based material cannot be expected.
Therefore, the high-frequency transmission line composed of the multilayer high-frequency circuit board as shown in FIG. 1 has a larger insertion loss with respect to the dielectric than the high-frequency transmission line composed of a single-layer high-frequency circuit board such as an alumina substrate. .

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a high-frequency transmission line that can be easily multilayered with little loss due to dielectrics and conductors.

In the high-frequency transmission line according to the present invention, the upper main surface of the first layer dielectric to the (N-1) th layer dielectric and the second main layer to the lower main surface of the Nth layer dielectric are opposed to each other. N (N is a natural number greater than or equal to 3) flat plate-shaped dielectrics, and signal line conductors A disposed from the first dielectric layer to the upper principal surface of the N-1th dielectric layer. A signal line conductor B disposed on the lower principal surface of the second layer dielectric to the Nth layer dielectric, and a signal line conductor A and an upper layer of a lower dielectric layer between the dielectrics positioned immediately above and below A spherical conductor A that electrically and physically connects the dielectric signal line conductor B, and the signal line conductor A and the signal line conductor B disposed on the upper and lower main surfaces of the dielectric, pass through the dielectric. The columnar conductors A are electrically connected to each other, the ground conductor A is disposed on the lower main surface of the first layer dielectric, and the upper main surface of the Nth layer dielectric. It is the and a ground conductor B.

  According to the present invention, there is an effect that the loss due to the dielectric and the conductor is small and multilayering can be easily performed.

It is a figure which shows the structure of the triplate line comprised combining the high frequency transmission line of patent document 1, and the double-sided metal loading triplate line of nonpatent literature 1. It is a figure which shows electric field distribution and magnetic field distribution in case the space | interval of the layer 2 in FIG. 1 and the layer 3 is small compared with the ground conductor width of the same layer as a signal line conductor. It is a figure which shows electric field distribution and magnetic field distribution in case the space | interval of the layer 2 in FIG. 1 and the layer 3 is large compared with the ground conductor width of the same layer as a signal line conductor. It is a perspective view which shows the structure (structure example 1) of the high frequency transmission line which concerns on Embodiment 1 of this invention. It is an exploded view of the high frequency transmission line of FIG. FIG. 5 is a cross-sectional view taken along line AA in FIG. 4. It is a figure which shows the electric field distribution and magnetic field distribution in the high frequency transmission line of FIG. 6 is a cross-sectional view of Structural Example 2 of the high-frequency transmission line according to Embodiment 1. FIG. 6 is a cross-sectional view of Structural Example 3 of the high-frequency transmission line according to Embodiment 1. FIG. 6 is a cross-sectional view of Structural Example 4 of the high-frequency transmission line according to Embodiment 1. FIG. 6 is a cross-sectional view of Structural Example 5 of the high-frequency transmission line according to Embodiment 1. FIG. 6 is a cross-sectional view of Structural Example 6 of the high-frequency transmission line according to Embodiment 1. FIG. 7 is a cross-sectional view of Structural Example 7 of the high-frequency transmission line according to Embodiment 1. FIG. 10 is a cross-sectional view of Structural Example 8 of the high-frequency transmission line according to Embodiment 1. FIG. 10 is a cross-sectional view of Structural Example 9 of the high-frequency transmission line according to Embodiment 1. FIG. It is sectional drawing of the structural example 10 of the high frequency transmission line which concerns on Embodiment 1. FIG. It is sectional drawing of the structural example 11 of the high frequency transmission line which concerns on Embodiment 1. FIG. It is sectional drawing of the structural example 12 of the high frequency transmission line which concerns on Embodiment 1. FIG. It is a perspective view which shows the structure of the high frequency transmission line which concerns on Embodiment 2 of this invention. FIG. 20 is an exploded view of the high-frequency transmission line in FIG. 19. It is sectional drawing cut by the AA line of FIG. It is a perspective view which shows the structure of the high frequency transmission line which concerns on Embodiment 3 of this invention. It is an exploded view of the high frequency transmission line of FIG. It is sectional drawing cut by the AA line of FIG. It is a figure which shows the capacitive component in the high frequency transmission line of FIG. It is a figure which shows the capacitive component in the high frequency transmission line of FIG. FIG. 10 is a perspective view showing another structural example of the high-frequency transmission line according to Embodiment 3. It is a figure which shows the capacitive component in the high frequency transmission line of FIG. It is a perspective view which shows the structure of the high frequency transmission line which concerns on Embodiment 4 of this invention. FIG. 30 is an exploded view of the high-frequency transmission line in FIG. 29. It is sectional drawing cut by the AA line of FIG. It is a figure which shows the magnetic field distribution in the high frequency transmission line of FIG. It is a figure which shows the magnetic field distribution in the high frequency transmission line of FIG.

Embodiment 1 FIG.
4 to 6 are diagrams showing the structure of the high-frequency transmission line according to Embodiment 1 of the present invention. Here, FIG. 4 is a perspective view showing the structure of the high-frequency transmission line according to Embodiment 1 of the present invention. 5 is an exploded view of the high-frequency transmission line of FIG. 4, and FIG. 6 is a cross-sectional view taken along line AA of FIG. 4, showing a cross section orthogonal to the extending direction of the signal line. Moreover, FIG. 7 is a figure which shows the electric field distribution and magnetic field distribution in the high frequency transmission line of FIG.

  As shown in FIGS. 4 to 6, in the high-frequency transmission line according to the first embodiment, the ground conductor 13 is disposed on one surface (lower main surface) of the dielectric 11 in the dielectric substrate 10. A signal line conductor 12 and a plurality of grounding conductors 14 are disposed on the other surface (upper main surface) of 11. The ground conductor 13 is electrically connected to each of the plurality of ground conductors 14 via the plurality of columnar conductors 15.

  A signal line conductor 22 and a plurality of ground conductors 24 are disposed on one surface (lower main surface) of the dielectric 21 in the dielectric substrate 20, and on the other surface (upper main surface) of the dielectric 21. The ground conductor 23 is disposed. The ground conductor 23 is electrically connected to each of the plurality of ground conductors 24 via the plurality of columnar conductors 25.

The dielectric substrate 10 and the dielectric substrate 20 have a surface on which the signal line conductor 12 and the plurality of ground conductors 14 are disposed on the dielectric 11, and a surface on which the signal line conductor 22 and the plurality of ground conductors 24 are disposed on the dielectric 21. It arrange | positions so that it may oppose.
The signal line conductor 12 and the signal line conductor 22 are electrically and physically connected through a plurality of spherical conductors 36. As shown in FIG. 5, the spherical conductors 36 are arranged side by side along the direction in which the signal line conductor 12 and the signal line conductor 22 extend.
The plurality of ground conductors 14 and the plurality of ground conductors 24 are electrically and physically connected through a plurality of spherical conductors 37.

  The columnar conductors 15 and 25 and the spherical conductors 36 and 37 are arranged on the same plane parallel to the cross section of FIG. Therefore, when cut by the plane including the columnar conductors 15 and 25 and the spherical conductors 36 and 37, the cross section becomes as shown in FIG. 6, and the plane shifted in the normal direction (y-axis direction) of the cross section of FIG. 6 is a cross section excluding the columnar conductors 15 and 25 and the spherical conductors 36 and 37. That is, when the cross section is cut in order along the normal direction of the cross section of FIG. 6, the cross section where the columnar conductors 15 and 25 and the spherical conductors 36 and 37 can be seen and the cross section excluding these conductors appear alternately.

Next, an outline of the high-frequency transmission line according to Embodiment 1 will be described.
In the conventional high frequency transmission line, as shown in FIGS. 2 and 3, the electromagnetic field distribution between the layer 2 and the layer 3 increases the dielectric loss and the conductor loss.
On the other hand, in the high frequency transmission line according to the first embodiment, as shown in FIG. 7, since the space between the layer 2 and the layer 3 is hollow, compared with the conventional structure filled with a dielectric. Low loss for dielectrics.
Further, since the space between the layer 2 and the layer 3 is hollow, the distribution of the electromagnetic field between the layer 2 and the layer 3 is small as shown in FIG. 7 as compared with the conventional structure in which the dielectric is filled. The current is distributed on the xy plane where the conductor surface can be easily formed flat. For this reason, the loss regarding a conductor is also small.

Typical multilayer dielectric substrates include ceramic LTCC (low temperature co-fired ceramic) substrates and resin-based dielectric substrates. As described above, the dielectric of the LTCC substrate is a material made by mixing glass with alumina, and the dielectric loss tangent of the dielectric is usually 0.001 or more. Note that the dielectric of the resin-based dielectric substrate cannot have a dielectric loss tangent as low as that of the ceramic.
Therefore, the high-frequency transmission line according to the first embodiment is composed of a single-layer dielectric substrate such as an alumina substrate and solder balls.
Since the dielectric loss tangent of the dielectric in a single-layer dielectric substrate such as an alumina substrate is about 0.0001, it is sufficiently smaller than the dielectric loss tangent of the LTCC substrate and the resin-based dielectric substrate.
Therefore, the insertion loss of the high frequency transmission line according to the first embodiment is reduced.

  The cross-sectional view shown in FIG. 6 shows the case where a dielectric, a signal line conductor, a ground conductor, a spherical conductor, and a columnar conductor are present in the same cross section. There is no need.

In FIG. 7, the signal line is composed of a signal line conductor of two layers (layer 2 and layer 3) and a spherical conductor. However, the high-frequency transmission line according to the first embodiment has a signal line as shown in FIG. One layer (layer 2 or layer 3) may be used. FIG. 8 shows a case where the signal line is arranged only on the layer 2 (signal line conductor 12).
8 to 18 are cross-sectional views of the structure of the high-frequency transmission line according to Embodiment 1 taken along line AA in FIG.
Furthermore, the high-frequency transmission line according to the first embodiment may have a structure in which any one of the ground conductors 13 and 23 facing the signal line is not provided as shown in FIG. The example of FIG. 9 shows a structure in which there is no ground conductor portion on the side of the ground conductor 23 facing the signal line.
Furthermore, as shown in FIG. 10, the high-frequency transmission line according to Embodiment 1 does not have any one of the ground conductors 13 and 23 facing the signal line, and has one signal line (layer). 2 or layer 3). In the example shown in FIG. 10, there is no ground conductor portion on the side of the ground conductor 23 facing the signal line, and the signal line (signal line conductor 12) is arranged on the layer 2.

Further, the high-frequency transmission line according to the first embodiment may have a structure in which the ground conductor portions of both the ground conductors 13 and 23 facing the signal line are not provided, as shown in FIG.
Furthermore, as shown in FIG. 12, the high-frequency transmission line according to the first embodiment does not have the ground conductor portions of both of the ground conductors 13 and 23 facing the signal line, and has one layer (layer 2 or layer). The structure 3) may be employed. In the example shown in FIG. 12, there is no ground conductor portion of both of the ground conductors 13 and 23 facing the signal line, and the signal line (signal line conductor 12) is arranged on the layer 2.
Furthermore, in the high-frequency transmission line according to the first embodiment, a plurality of signal lines including the signal line conductors 12 and 22 and the spherical conductor 36 may be arranged as shown in FIG.
Furthermore, in the high-frequency transmission line according to the first embodiment, as shown in FIG. 14, the signal line is one layer (layer 2 or layer 3), and a plurality of signal lines (signal line conductors) are arranged in the same layer. It may be a configuration. In the example of FIG. 14, a case where two signal lines (signal line conductors 12) are arranged on the layer 2 is shown.

Further, in the high frequency transmission line according to Embodiment 1, a plurality of signal lines may be configured in different layers as shown in FIG. In the example of FIG. 15, the signal line (signal line conductor 12) is arranged on the layer 2, and the signal line (signal line conductor 22) is arranged on the layer 3 at a position not in front of this.
Further, in the high-frequency transmission line according to the first embodiment, as shown in FIG. 16, the conductors 14 ′ and 24 ′ on both sides (± x axis direction) of the signal line may not be grounded.
Furthermore, as shown in FIG. 17, the high-frequency transmission line according to the first embodiment is such that the conductors 14 ′ and 24 ′ on both sides (± x axis direction) of the signal line are not grounded, and the signal line 1 The structure may be a layer (layer 2 or layer 3). FIG. 17 shows a case where the signal line (signal line conductor 12) is arranged in the layer 2.
Furthermore, the high-frequency transmission line according to Embodiment 1 may have a configuration in which no conductor is disposed on both sides (± x-axis direction) of the signal line, as shown in FIG. In the example of FIG. 18, no conductor is provided on both sides of the signal line composed of the signal line conductors 12 and 22 and the spherical conductor 36.

As described above, according to the first embodiment, the plate-shaped dielectric 11, the plate-shaped dielectric 21 having the lower main surface opposed to the upper main surface of the dielectric 11, and the dielectric 11, the signal line conductor 12 disposed on the upper main surface, the signal line conductor 22 disposed on the lower main surface of the dielectric 21 so as to face the signal line conductor 12, and the signal line conductor 12 and the signal line conductor 22. A spherical conductor 36 that is electrically and physically connected, a ground conductor 13 disposed on the lower main surface of the dielectric 11, and a ground conductor 23 disposed on the upper main surface of the dielectric 21 are provided.
With this configuration, a hollow layer is formed between the dielectric 11 and the dielectric 21 by the spherical conductor 36, so that a high-frequency transmission line with little loss of the dielectric and the conductor can be realized. In addition, since a plurality of dielectric substrates can be stacked via the spherical conductor 36, it can be easily multi-layered.

Further, according to the first embodiment, the plate-shaped dielectric 11, the plate-shaped dielectric 21 having the lower main surface opposed to the upper main surface of the dielectric 11, and the upper surface of the dielectric 11 The signal line conductor 12 or 22 is disposed on at least one of the main surface and the lower main surface of the dielectric 21, and is disposed on the upper main surface of the dielectric 21 along the direction in which the signal line conductor 12 or 22 extends. The conductor 14, the conductor 24 disposed on the lower main surface of the dielectric 21 along the direction in which the signal line conductor 12 or 22 extends and facing the conductor 14, and the conductor 14 and the conductor 24 are electrically and A spherical conductor 37 physically connected, a ground conductor 13 disposed on the lower main surface of the dielectric 11, and a ground conductor 23 disposed on the upper main surface of the dielectric 21 are provided.
With this configuration, a hollow layer is formed between the dielectric 11 and the dielectric 21 by the spherical conductor 37, so that a high-frequency transmission line with little loss of the dielectric and the conductor can be realized. In addition, since a plurality of dielectric substrates can be stacked via the spherical conductor 37, it can be easily multi-layered.

  Furthermore, according to the first embodiment, the conductor 14 or 14 'disposed along the direction in which the signal line conductor 12 extends on the upper main surface of the dielectric 11, and the lower main surface of the dielectric 21, The conductor 24 or 24 ′, the conductor 14 or 14 ′, and the conductor 24 or 24 ′ disposed along the direction in which the signal line conductor 22 extends and opposite to the conductor 14 or 14 ′ are electrically and physically connected. A spherical conductor 37 to be connected, the conductor 14 or 14 'is arranged on both sides via the signal line conductor 12 on the same plane, and the conductor 24 or 24' via the signal line conductor 22 on the same plane. Located on both sides. Even if comprised in this way, the effect similar to the above can be acquired.

  Furthermore, according to the first embodiment, the columnar conductor 15 that electrically connects the ground conductor 13 and the conductor 14 through the dielectric 11, the ground conductor 23 and the conductor 24, and penetrates the dielectric 21. And a columnar conductor 25 electrically connected. With this configuration, the ground conductor is disposed so that the signal line conductors 12 and 22 are electrically isolated from the outside of the high-frequency transmission line in a cross section orthogonal to the direction in which the signal line extends. For this reason, the high frequency transmission line which improved transmission quality is realizable.

  Furthermore, according to the first embodiment, a plurality of signal line conductors 12 are arranged on the upper main surface of the dielectric 11, and the signal line conductors 22 are arranged on the lower main surface of the dielectric 21, respectively. A plurality of opposing signal line conductors 12 and a plurality of signal line conductors 22 are electrically and physically connected to each other by a spherical conductor 36. Even with this configuration, the same effect as described above can be obtained.

  Further, according to the first embodiment, the spherical conductors 36 are arranged side by side along the direction in which the signal line conductor 12 and the signal line conductor 22 extend, or the spherical conductors 37 are formed of the conductors 14 and 24. Since they are arranged side by side along the extending direction, a high-frequency transmission line with improved transmission quality can be realized.

  Further, according to the first embodiment, since at least one of the ground conductor 13 and the ground conductor 23 is a ground conductor from which the ground conductor portion facing the signal line conductor is excluded, it is orthogonal to the propagation direction of the electromagnetic wave. Therefore, a high impedance high frequency transmission line can be realized.

Embodiment 2. FIG.
19 to 21 are diagrams showing the structure of a high-frequency transmission line according to Embodiment 2 of the present invention. FIG. 19 is a perspective view showing the structure of a high-frequency transmission line according to Embodiment 2 of the present invention. 20 is an exploded view of the high-frequency transmission line of FIG. 19, and FIG. 21 is a cross-sectional view taken along the line AA of FIG. 19, showing a cross section orthogonal to the extending direction of the signal line.

  As shown in FIGS. 19 to 21, in the high-frequency transmission line according to the second embodiment, the ground conductor 13 is disposed on one surface (lower main surface) of the dielectric 11 in the dielectric substrate 10, and the dielectric 11 A signal line conductor 12 and a plurality of ground conductors 14 are arranged on the other surface (upper main surface). The ground conductor 13 is electrically connected to each of the plurality of ground conductors 14 via the plurality of columnar conductors 15.

Further, a signal line conductor 22a and a plurality of ground conductors 24a are arranged on one surface (lower main surface) of the dielectric 21 in the dielectric substrate 20, and on the other surface (upper main surface) of the dielectric 21. The signal line conductor 22b and a plurality of ground conductors 24b are arranged.
The plurality of ground conductors 24a and the plurality of ground conductors 24b are electrically connected via a plurality of columnar conductors 25, and the signal line conductor 22a and the signal line conductor 22b are connected via a plurality of columnar conductors 26. Electrically connected.

  Further, a signal line conductor 32 and a plurality of ground conductors 34 are disposed on one surface (lower main surface) of the dielectric 31 in the dielectric substrate 30, and on the other surface (upper main surface) of the dielectric 31. A ground conductor 33 is disposed. The ground conductor 33 is electrically connected to each of the plurality of ground conductors 34 via the plurality of columnar conductors 35.

The dielectric substrate 10 and the dielectric substrate 20 have a surface on which the signal line conductor 12 and the plurality of ground conductors 14 are disposed on the dielectric 11, and a surface on which the signal line conductor 22a and the plurality of ground conductors 24a are disposed on the dielectric 21. It arrange | positions so that it may oppose.
The signal line conductor 12 and the signal line conductor 22 a are electrically and physically connected through a plurality of spherical conductors 47.
The plurality of ground conductors 14 and the plurality of ground conductors 24 a are electrically and physically connected via a plurality of spherical conductors 48.

On the other hand, the dielectric substrate 20 and the dielectric substrate 30 have the surface on which the signal line conductor 22b and the plurality of ground conductors 24b are disposed on the dielectric 21, and the signal line conductor 32 and the plurality of ground conductors 34 on the dielectric 31. It arrange | positions so that a surface may oppose.
The signal line conductor 22 b and the signal line conductor 32 are electrically and physically connected through a plurality of spherical conductors 57.
The plurality of ground conductors 24 b and the plurality of ground conductors 34 are electrically and physically connected through the plurality of spherical conductors 58.

The columnar conductors 15, 25 and 35 and the spherical conductors 48 and 58, and the columnar conductor 26 and the spherical conductors 47 and 57 are arranged on the same plane parallel to the cross section of FIG.
Therefore, when cut by a plane including the columnar conductors 15, 25, 35 and the spherical conductors 48, 58 and the columnar conductor 26 and the spherical conductors 47, 57, a cross section as shown in FIG. 21 is obtained, and the normal direction of the cross section of FIG. The plane shifted in the (y-axis direction) is a cross section excluding the columnar conductors 15, 25, and 35 and the spherical conductors 48 and 58 and the columnar conductor 26 and the spherical conductors 47 and 57 in FIG. That is, when the cross sections are cut in order along the normal direction of the cross section of FIG. 21, the cross sections in which the columnar conductors 15, 25, 35 and the spherical conductors 48, 58 and the columnar conductor 26 and the spherical conductors 47, 57 can be seen. Cross sections excluding the conductors appear alternately.

Next, an outline of the high-frequency transmission line according to the second embodiment will be described.
In the first embodiment, the case where two dielectric substrates are used has been described. However, the same effect can be obtained when three dielectric substrates are used as in the second embodiment.
That is, the high-frequency transmission line according to Embodiment 2 has a dielectric between the layers 2 and 3 and between the layers 4 and 5 as shown in FIGS. The loss related to the dielectric is small compared to the conventional structure filled with.
Further, since the space between the layer 2 and the layer 3 and the space between the layer 4 and the layer 5 are respectively hollow, the layers 2 and 3 and the layers 4 and 4 are compared with the conventional structure in which the dielectric is filled. The distribution of the electromagnetic field between the layers 5 is small, and the current is distributed on the xy plane where the conductor surface can be easily formed flat. For this reason, the loss regarding a conductor is also small.

The cross-sectional view shown in FIG. 21 shows the case where a dielectric, a signal line conductor, a ground conductor, a spherical conductor, and a columnar conductor are present in the same cross section. There is no need.
Moreover, you may comprise the high frequency transmission line which concerns on Embodiment 2 similarly to either of FIG. 8 to FIG. 18 shown in the said Embodiment 1. FIG.
That is, in the high-frequency transmission line according to the second embodiment, the signal line may be composed of one layer (any one of layer 2, layer 3, layer 4, and layer 5) (see FIGS. 8 and 21). .
Furthermore, the high-frequency transmission line according to the second embodiment may have a structure without any one of the ground conductors 13 and 33 facing the signal line (see FIGS. 9 and 21).
Furthermore, the high-frequency transmission line according to the second embodiment may have a structure in which one of the ground conductors 13 and 33 does not have any ground conductor portion facing the signal line and the signal line is one layer ( (Refer FIG. 10, FIG. 21).

Further, the high-frequency transmission line according to the second embodiment may have a structure in which neither of the ground conductor portions of the ground conductors 13 and 33 facing the signal line is present (see FIGS. 11 and 21).
Furthermore, the high-frequency transmission line according to Embodiment 2 does not have the ground conductor portions of both of the ground conductors 13 and 33 facing the signal line, and the signal line has one layer (layer 2, layer 3, layer 4, layer 5). Any one of these layers may be used (see FIGS. 12 and 21).
Furthermore, in the high-frequency transmission line according to the second embodiment, a plurality of signal lines including the signal line conductors 12, 22a, 22b, 32, the columnar conductor 26, and the spherical conductors 47, 57 may be arranged (FIGS. 13 and 21). reference).
Furthermore, the high-frequency transmission line according to the second embodiment has one signal line (any one of layer 2, layer 3, layer 4, and layer 5) and a plurality of signal lines (signal line conductors) in the same layer. ) May be arranged (see FIGS. 14 and 21).

In the high-frequency transmission line according to Embodiment 2, a plurality of signal lines may be configured in different layers (see FIGS. 15 and 21).
Furthermore, in the high-frequency transmission line according to the second embodiment, the conductors on both sides (± x axis direction) of the signal line may not be grounded (see FIGS. 16 and 21). For example, the ground conductors 14, 24a and the ground conductors 24b, 34 in FIG. 21 are conductors that are not grounded without the columnar conductors 15, 25, 35.
Furthermore, in the high-frequency transmission line according to the second embodiment, the conductors on both sides (± x axis direction) of the signal line are not grounded, and the signal line has one layer (layer 2, layer 3, layer 4, layer 5 (any one layer of 5) may be used (see FIGS. 17 and 21).
Furthermore, the high-frequency transmission line according to the second embodiment may have a configuration in which no conductor is disposed on both sides (± x axis direction) of the signal line (see FIGS. 18 and 21). For example, the ground conductors 14 and 24a and the ground conductors 24b and 34 in FIG. 21 are not provided.

  In the above description, the case where a high frequency transmission line is configured using three dielectric substrates is shown, but four or more dielectric substrates may be used. In this case, in a configuration in which four or more dielectric substrates are stacked, the signal line conductors 22a and 22b and the columnar conductors 26 are formed on the dielectric substrate sandwiched between the two dielectric substrates from above and below. The signal line conductor 12 is formed at a position facing the signal line conductor 22a in the dielectric of the dielectric substrate on the surface and connected by the spherical conductor 47, and is opposed to the signal line conductor 22b in the dielectric of the dielectric substrate on the upper main surface. A signal line conductor 32 is formed at a position where the conductor is to be connected, and a spherical conductor 57 is connected.

As described above, according to the second embodiment, the upper principal surface and the second dielectric of the dielectric of the first layer (N = 3, dielectric 11) to the N−1th layer (dielectric 21). N (N is a natural number of 3 or more) flat plate-like dielectrics disposed so that the lower principal surfaces of the dielectric layer (dielectric material 21) to the N-th layer dielectric material (dielectric material 31) face each other. , Signal line conductors A (signal line conductors 12 and 22b) disposed on the upper principal surfaces of the first layer dielectric (dielectric 11) to the N-1th layer dielectric (dielectric 21), The signal line conductors B (signal line conductors 22a and 32) disposed on the lower main surface of the two-layer dielectric (dielectric 21) to the N-th layer dielectric (dielectric 31) are positioned immediately above and below. A spherical conductor A (spherical conductor) that electrically and physically connects the lower dielectric signal line conductor A and the upper dielectric signal line conductor B between the dielectrics. 7, 57) and a columnar conductor A (columnar conductor 26) that electrically connects the signal line conductor A and the signal line conductor B disposed on the upper and lower main surfaces of the dielectric through the dielectric. And a ground conductor 13 disposed on the lower main surface of the first layer dielectric (dielectric 11) and a ground conductor 33 disposed on the upper main surface of the N-th layer dielectric (dielectric 31). .
With this configuration, a hollow layer is formed between the dielectric 11 and the dielectric 21 and between the dielectric 21 and the dielectric 31 by the spherical conductor A (spherical conductors 47 and 57). In addition, a high-frequency transmission line with less conductor loss can be realized.
In addition, since a plurality of dielectric substrates can be stacked via the spherical conductor A (spherical conductors 47 and 57), multilayering can be easily performed.

Further, according to the second embodiment, the upper principal surface of the first layer dielectric (N = 3, dielectric 11) to the N−1th layer dielectric (dielectric 21) and the second layer dielectric N (N is a natural number of 3 or more) flat plate-like dielectrics, in which the lower principal surfaces of the body (dielectric 21) to the N-th layer dielectric (dielectric 31) face each other; From the dielectric layer (dielectric 11) to the upper principal surface of the N-1th layer dielectric (dielectric 21) and from the second layer dielectric (dielectric 21) to the Nth layer dielectric (dielectric 31). ) Arranged on one of the lower main surfaces of the signal line conductor C (at least one of the signal line conductors 12, 22a, 22b, 32) and the first layer dielectric (dielectric 11) to the N-1th. The conductor A (conductors 14 and 24b) disposed along the direction in which the signal line conductor C extends on the upper main surface of the layer dielectric (dielectric 21) and the second layer induction Conductors B (disposed from the body (dielectric 21) to the lower main surface of the N-th layer dielectric (dielectric 31) along the direction in which the signal line conductor C extends and facing the conductor A ( Spherical conductors B (spherical conductors 48, 58) that electrically and physically connect the conductors 24a and 34) and the lower dielectric conductor A and the upper dielectric conductor B between the dielectrics positioned immediately above and below. ), A ground conductor 13 disposed on the lower main surface of the first-layer dielectric (dielectric 11), and a ground conductor 33 disposed on the upper main surface of the N-th dielectric (dielectric 31). Is provided.
With this configuration, a hollow layer is formed between the dielectric 11 and the dielectric 21 and between the dielectric 21 and the dielectric 31 by the spherical conductor B (spherical conductors 48 and 58). In addition, a high-frequency transmission line with less conductor loss can be realized.
In addition, since a plurality of dielectric substrates can be stacked via the spherical conductor B (spherical conductors 48 and 58), multilayering can be easily performed.

  Further, according to the second embodiment, the columnar conductor 15 that electrically connects the ground conductor 13 and the conductor 14 through the dielectric 11, the ground conductor 33 and the conductor 34, and penetrates the dielectric 31. Since the columnar conductor 35 electrically connected to each other and the conductor 24b and the conductor 24a arranged on the upper and lower main surfaces of the dielectric 21 through the dielectric 21 are provided, the columnar conductor 25 is electrically connected. In the cross section orthogonal to the direction in which the signal line extends, the ground conductor is disposed so that the signal line conductor is electrically isolated from the outside of the high-frequency transmission line. For this reason, the high frequency transmission line which improved transmission quality is realizable.

Embodiment 3 FIG.
22 to 24 are diagrams showing the structure of a high-frequency transmission line according to Embodiment 3 of the present invention. FIG. 22 is a perspective view showing the structure of a high-frequency transmission line according to Embodiment 3 of the present invention. 23 is an exploded view of the high-frequency transmission line of FIG. 22, and FIG. 24 is a cross-sectional view taken along line AA of FIG. 22, showing a cross section orthogonal to the extending direction of the signal line. 22 is the same as the cross section excluding the columnar conductors 15 and 25 and the spherical conductors 36 and 37 in FIG. 6 shown in the first embodiment.

  As shown in FIGS. 22 to 24, in the high-frequency transmission line according to the third embodiment, the ground conductor 13 is disposed on one surface (lower main surface) of the dielectric 11 in the dielectric substrate 10, and the dielectric 11 A signal line conductor 12 and a plurality of ground conductors 14 are arranged on the other surface (upper main surface). The ground conductor 13 is electrically connected to each of the plurality of ground conductors 14 via the plurality of columnar conductors 15.

A signal line conductor 22 and a plurality of ground conductors 24 are disposed on one surface (lower main surface) of the dielectric 21 in the dielectric substrate 20, and on the other surface (upper main surface) of the dielectric 21. The ground conductor 23 is disposed. The ground conductor 23 is electrically connected to each of the plurality of ground conductors 24 via the plurality of columnar conductors 25.
A hole 29 is formed at a position facing the signal line of the ground conductor 23.
It is assumed that the size (diameter) in the x-axis direction in the cross section shown in FIG. 24 is smaller than the wavelength of the high frequency signal propagating through the high frequency transmission line according to the third embodiment.

The dielectric substrate 10 and the dielectric substrate 20 have a surface on which the signal line conductor 12 and the plurality of ground conductors 14 are disposed on the dielectric 11, and a surface on which the signal line conductor 22 and the plurality of ground conductors 24 are disposed on the dielectric 21. It arrange | positions so that it may oppose.
The signal line conductor 12 and the signal line conductor 22 are electrically and physically connected through a plurality of spherical conductors 36.

The plurality of ground conductors 14 and the plurality of ground conductors 24 are electrically and physically connected through a plurality of spherical conductors 37.
The columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched holes 29 are arranged on the same plane parallel to the cross section of FIG. Therefore, when cut by a plane including the columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched hole 29, the cross section becomes as shown in FIG. 24, and is shifted in the normal direction (y-axis direction) of the cross section of FIG. 24 is a cross section excluding the columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched holes 29 in FIG. That is, when the cross section is cut in order along the normal direction of the cross section of FIG. 24, the cross section in which the columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched holes 29 can be seen, and the cross section excluding these conductors are alternately. appear.

Next, an outline of the high-frequency transmission line according to Embodiment 3 will be described.
FIG. 25 is a diagram showing capacitance components in the high-frequency transmission line of FIG. FIG. 26 is a diagram showing a capacitance component in the high-frequency transmission line of FIG. 6 shown in the first embodiment.
In order to make the high-frequency transmission line according to the first and second embodiments have high impedance, the dielectric constant of the dielectric of the dielectric substrate is lowered or the thickness of the dielectric of the dielectric substrate is increased. Alternatively, it is conceivable to reduce the thickness of the signal line or reduce the width of the signal line conductor.
However, in taking the above method, it is difficult to adjust the relative dielectric constant and thickness of the dielectric of the dielectric substrate. Further, since the thickness and width of the signal line are determined by the size of the spherical conductor, adjustment is difficult.

Therefore, the high frequency transmission line according to the third embodiment can cancel the capacitance component by the amount of the punch hole 29 as shown in FIG. 25, as compared with the capacitance component in the configuration of the first embodiment shown in FIG. Is possible. The impedance becomes high by this amount.
Further, since the hole 29 can be formed in the same manner as the process of forming the conductor pattern, the shape and size of the hole 29 can be easily changed.
Thereby, the high-frequency transmission line according to Embodiment 3 can be easily adjusted to high impedance.

  A plurality of the punched holes 29 may be provided on both sides of the signal line as shown by the encircled broken line in FIG. In the case of this configuration, the capacitance component that is canceled (adjusted) is further increased as shown in FIG. FIG. 28 shows a capacitance distribution in a cross section of the high-frequency transmission line in FIG. 27 taken along line AA in FIG.

In addition, the configuration in which the hole 29 is formed in the ground conductor 23 of the dielectric substrate 20 of the high-frequency transmission line has been described so far, but the hole 29 may be formed in the ground conductor 13 of the dielectric substrate 10. Open holes 29 may be formed on both surfaces of the ground conductors 13 and 23.
Furthermore, in the cross-sectional view shown in FIG. 24, the case where the dielectric, the signal line conductor, the ground conductor, the spherical conductor, the columnar conductor, and the punched hole (the punched hole 29) are present in the same cross section is shown. One of the columnar conductors may be omitted.

Further, the high-frequency transmission line according to the third embodiment may be configured in the same manner as any of FIGS. 8 to 10 and FIGS. 13 to 18 shown in the first embodiment.
That is, the high-frequency transmission line according to Embodiment 3 may be configured with one signal line (layer 2 or layer 3) (see FIGS. 8 and 24).
Furthermore, the high-frequency transmission line according to the third embodiment has a structure without any one of the ground conductors 13 and 23 that faces the signal line (the one that is not the ground conductor in which the hole 29 is formed). It may be present (see FIGS. 9 and 24).
Furthermore, the high-frequency transmission line according to Embodiment 3 does not have any one of the ground conductors 13 and 23 that faces the signal line (one that is not the ground conductor in which the hole 29 is formed), and The signal line may have a single layer (layer 2 or layer 3) (see FIGS. 10 and 24).

Further, in the high-frequency transmission line according to the third embodiment, a plurality of signal lines including the signal line conductors 12 and 22 and the spherical conductor 36 may be arranged (see FIGS. 13 and 24).
Furthermore, the high-frequency transmission line according to Embodiment 3 may have a configuration in which the signal line is one layer (layer 2 or layer 3) and a plurality of signal lines (signal line conductors) are arranged in the same layer ( 14 and 24).
Furthermore, in the high-frequency transmission line according to Embodiment 3, a plurality of signal lines may be configured in different layers (see FIGS. 15 and 24).

In the high-frequency transmission line according to Embodiment 3, the conductors on both sides (± x axis direction) of the signal line may not be grounded (see FIGS. 16 and 24). For example, the ground conductors 14 and 24 in FIG. 24 are conductors that are not grounded by eliminating the columnar conductors 15 and 25.
Furthermore, the high-frequency transmission line according to the third embodiment has a structure in which the conductors on both sides (± x axis direction) of the signal line are not grounded and the signal line is one layer (layer 2 or layer 3). It may be present (see FIGS. 17 and 24).
Furthermore, the high frequency transmission line according to the third embodiment may be configured such that no conductor is disposed on both sides (± x axis direction) of the signal line (see FIGS. 18 and 24). For example, the ground conductors 14 and 24 in FIG. 24 are not provided.

Further, the high-frequency transmission line according to the third embodiment may be composed of three or more dielectric substrates, as in the second embodiment. In this case, in a configuration in which three or more dielectric substrates are stacked, the signal line conductors 22a and 22b and the columnar conductors 26 shown in FIG. 24 are placed on the dielectric substrate sandwiched from above and below by the two dielectric substrates. In the dielectric of the dielectric substrate on the lower main surface, the signal line conductor 12 is formed at a position facing the signal line conductor 22a in the dielectric of the lower main surface and connected by the spherical conductor 47, and in the dielectric of the dielectric substrate on the upper main surface. A signal line conductor 32 is formed at a position facing the signal line conductor 22 b and connected by a spherical conductor 57. Then, the hole 29 is formed in at least one of the uppermost ground conductor and the lowermost ground conductor as described above.
In this configuration, the configurations from FIGS. 8 to 10 and FIGS. 13 to 18 may be applied.

  As described above, according to the third embodiment, at least one of the ground conductor 13 and the ground conductor 23 or 33 includes the punched hole 29 at a position facing the signal line conductor. In particular, the through holes 29 are arranged side by side along the direction in which the signal line conductor extends, and the size of the through holes 29 in the cross section orthogonal to the direction in which the signal line conductor extends extends relative to the wavelength of the high frequency signal. It is formed to be smaller. By configuring in this way, it is possible to realize a high-frequency transmission line with low insertion loss and easy adjustment to high impedance.

Embodiment 4 FIG.
29 to 31 are diagrams showing the structure of a high-frequency transmission line according to Embodiment 4 of the present invention. FIG. 29 is a perspective view showing the structure of a high-frequency transmission line according to Embodiment 4 of the present invention. 30 is an exploded view of the high-frequency transmission line of FIG. 29, and FIG. 31 is a cross-sectional view taken along line AA of FIG. 29, showing a cross section orthogonal to the extending direction of the signal line. 29 is equivalent to the cross section excluding the columnar conductors 15 and 25 and the spherical conductors 36 and 37 in FIG. 6 shown in the first embodiment.

  As shown in FIGS. 29 to 31, in the high-frequency transmission line according to the fourth embodiment, the ground conductor 13 is arranged on one surface (lower main surface) of the dielectric 11 in the dielectric substrate 10, and the dielectric 11 A signal line conductor 12 and a plurality of ground conductors 14 are arranged on the other surface (upper main surface). The ground conductor 13 is electrically connected to each of the plurality of ground conductors 14 via the plurality of columnar conductors 15.

  A signal line conductor 22 and a plurality of ground conductors 24 are disposed on one surface (lower main surface) of the dielectric 21 in the dielectric substrate 20, and on the other surface (upper main surface) of the dielectric 21. The ground conductor 23 is disposed. The ground conductor 23 is electrically connected to each of the plurality of ground conductors 24 via the plurality of columnar conductors 25.

A hole 29a is formed at a position facing the signal line of the ground conductor 23. The hole 29a has a size that cannot be ignored with respect to the wavelength of the high-frequency signal propagating through the high-frequency transmission line according to the fourth embodiment.
For example, the size (diameter) in the x-axis direction in the cross section shown in FIG. 31 of the punched hole 29a is larger than the wavelength of the high-frequency signal propagating through the high-frequency transmission line according to the fourth embodiment, and the high-frequency signal propagates. It is assumed that the magnitude of the direction (y-axis direction) is small with respect to the wavelength of the high frequency signal.

The dielectric substrate 10 and the dielectric substrate 20 have a surface on which the signal line conductor 12 and the plurality of ground conductors 14 are disposed on the dielectric 11, and a surface on which the signal line conductor 22 and the plurality of ground conductors 24 are disposed on the dielectric 21. It arrange | positions so that it may oppose.
The signal line conductor 12 and the signal line conductor 22 are electrically and physically connected through a plurality of spherical conductors 36.
The plurality of ground conductors 14 and the plurality of ground conductors 24 are electrically and physically connected through a plurality of spherical conductors 37.

  The columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched holes 29a are arranged on the same plane parallel to the cross section of FIG. Therefore, when cut by a plane including the columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched hole 29a, the cross section becomes as shown in FIG. 31, and is shifted in the normal direction (y-axis direction) of the cross section of FIG. The cross section is a cross section excluding the columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched holes 29a of FIG. That is, when the cross section is cut in order along the normal direction of the cross section of FIG. 31, the cross section in which the columnar conductors 15 and 25, the spherical conductors 36 and 37, and the punched holes 29a can be seen, and the cross section excluding these conductors alternately. appear.

Next, an outline of the high-frequency transmission line according to Embodiment 4 will be described.
32 is a diagram showing a magnetic field distribution in the high-frequency transmission line of FIG. FIG. 33 is a diagram showing a magnetic field distribution in the high-frequency transmission line of FIG. 6 shown in the first embodiment.
As is clear from a comparison between FIG. 32 and FIG. 33, the high-frequency transmission line according to the fourth embodiment forms a through hole 29a, thereby creating a magnetic field distribution orthogonal to the propagation direction of the electromagnetic wave (the broken line in FIG. (Indicated by an arrow) increases. For this reason, it becomes a high impedance and the inductive component in series when a high frequency transmission line is seen as a distributed constant line increases.
In the high-frequency transmission line according to the fourth embodiment, the cross section in which the series inductive component shown in FIG. 32 is dominant and the cross section in which the parallel capacitive component shown in FIG. 26 is dominant are alternately arranged. Therefore, the wavelength of the high-frequency signal that propagates is shortened.

In the above description, the structure in which the hole 29a is formed in the ground conductor 23 of the dielectric substrate 20 of the high-frequency transmission line is shown, but the hole 29a may be formed in the ground conductor 13 of the dielectric substrate 10. The through holes 29 a may be formed on both surfaces of the ground conductors 13 and 23.
Further, in the cross-sectional view shown in FIG. 31, the case where the dielectric, the signal line conductor, the ground conductor, the spherical conductor, the columnar conductor, and the punched hole (the punched hole 29a) are present in the same cross section is shown. Either of the columnar conductors may be omitted.

Moreover, you may comprise the high frequency transmission line which concerns on this Embodiment 4 similarly to either of FIGS. 8-10 shown in the said Embodiment 1, and FIGS. 13-18.
That is, the high-frequency transmission line according to the fourth embodiment may be configured with one signal line (layer 2 or layer 3) (see FIGS. 8 and 31).
Further, the high-frequency transmission line according to the fourth embodiment has a structure in which any of the ground conductors 13 and 23 that face the signal line (the one that is not the ground conductor that forms the hole 29a) is opposed to the signal line. (See FIGS. 9 and 31).
Furthermore, in the high-frequency transmission line according to the fourth embodiment, there is no ground conductor portion (which is not the ground conductor forming the punched hole 29a) facing the signal line among the ground conductors 13 and 23, and The signal line may have a single layer (layer 2 or layer 3) (see FIGS. 10 and 31).

Further, in the high-frequency transmission line according to the fourth embodiment, a plurality of signal lines including the signal line conductors 12 and 22 and the spherical conductor 36 may be arranged (see FIGS. 13 and 31).
Furthermore, the high-frequency transmission line according to Embodiment 4 may have a configuration in which the signal line is one layer (layer 2 or layer 3) and a plurality of signal lines (signal line conductors) are arranged in the same layer ( 14 and 31).
Furthermore, in the high-frequency transmission line according to Embodiment 4, a plurality of signal lines may be configured in different layers (see FIGS. 15 and 31).

In the high-frequency transmission line according to the fourth embodiment, conductors on both sides (± x axis direction) of the signal line may not be grounded (see FIGS. 16 and 31). For example, the ground conductors 14 and 24 in FIG. 31 are conductors that are not grounded by eliminating the columnar conductors 15 and 25.
Furthermore, the high-frequency transmission line according to the fourth embodiment has a structure in which the conductors on both sides (± x axis direction) of the signal line are not grounded and the signal line is one layer (layer 2 or layer 3). It may be present (see FIGS. 17 and 31).
Further, the high-frequency transmission line according to Embodiment 4 may be configured such that no conductor is disposed on both sides (± x axis direction) of the signal line (see FIGS. 18 and 31). For example, the ground conductors 14 and 24 in FIG. 31 are not provided.

Further, the high-frequency transmission line according to the fourth embodiment may be composed of three or more dielectric substrates, as in the second embodiment. In this case, in a configuration in which three or more dielectric substrates are stacked, the signal line conductors 22a and 22b and the columnar conductors 26 shown in FIG. 24 are placed on the dielectric substrate sandwiched from above and below by the two dielectric substrates. In the dielectric of the dielectric substrate on the lower main surface, the signal line conductor 12 is formed at a position facing the signal line conductor 22a in the dielectric of the lower main surface and connected by the spherical conductor 47, and in the dielectric of the dielectric substrate on the upper main surface. A signal line conductor 32 is formed at a position facing the signal line conductor 22 b and connected by a spherical conductor 57. Then, the hole 29a is formed in at least one of the uppermost ground conductor and the lowermost ground conductor as described above.
In this configuration, the configurations from FIGS. 8 to 10 and FIGS. 13 to 18 may be applied.

  As described above, according to the fourth embodiment, at least one of the ground conductor 13 and the ground conductor 23 or 33 includes the punched hole 29a at a position facing the signal line conductor. In particular, the holes 29a are arranged side by side along the direction in which the signal line conductor extends, and the size of the holes 29a in the cross section orthogonal to the direction in which the signal line conductor extends is greater than the wavelength of the high frequency signal. It is formed so that the size in the direction in which the signal line conductor extends is small with respect to the wavelength of the high-frequency signal. By configuring in this way, it is possible to realize a high-frequency transmission line with high impedance and a reduced signal wavelength for propagation.

  In the present invention, within the scope of the invention, any combination of each embodiment, any component of each embodiment can be modified, or any component can be omitted in each embodiment. .

  10, 20, 30 Dielectric substrate, 11, 21, 31 Dielectric, 12, 22, 22a, 22b, 32 Signal line conductor, 13, 23, 14, 24, 24a, 24b, 33, 34 Ground conductor, 15, 25, 26, 35 Columnar conductor, 14 ', 24' conductor, 29, 29a Open hole, 36, 37, 47, 48, 57, 58 Spherical conductor.

Claims (15)

N (N is 3) where the upper principal surface of the dielectric from the first layer to the dielectric of the N-1th layer and the lower major surface of the dielectric from the second layer to the dielectric of the Nth layer are opposed to each other. The above natural number) plate-shaped dielectric,
A signal line conductor A disposed from the first dielectric layer to the upper principal surface of the N-1th dielectric layer;
A signal line conductor B disposed on the lower principal surface of the second layer dielectric to the Nth layer dielectric,
A spherical conductor A for electrically and physically connecting the signal line conductor A of the lower dielectric layer and the signal line conductor B of the upper dielectric layer between the dielectrics positioned immediately above and below;
A columnar conductor A for electrically connecting the signal line conductor A and the signal line conductor B disposed on the upper and lower main surfaces of the dielectric through the dielectric;
A ground conductor A disposed on a lower principal surface of the first layer dielectric;
A high-frequency transmission line comprising a ground conductor B disposed on an upper main surface of the N-th layer dielectric. Conductors A respectively disposed along the direction in which the signal line conductor A extends from the first layer dielectric to the upper principal surface of the N-1th layer dielectric;
Conductors B respectively disposed along the direction in which the signal line conductor B extends from the second layer dielectric to the lower principal surface of the Nth layer dielectric;
A spherical conductor B that electrically and physically connects the conductor A of the lower dielectric layer and the conductor B of the upper dielectric layer between the dielectrics positioned immediately above and below;
The conductor A is disposed on both sides of the signal line conductor A on the same plane,
The conductor B is, high-frequency transmission line according to claim 1, characterized in that disposed on both sides via the signal line conductor B on the same plane. A columnar conductor A that electrically connects the ground conductor A and the conductor A through the dielectric of the first layer;
A columnar conductor B electrically connecting the ground conductor B and the conductor B through the N-th layer dielectric;
The high-frequency transmission according to claim 2, further comprising a columnar conductor (C) that electrically connects the conductor (A) and the conductor (B) disposed on the upper and lower main surfaces of the dielectric through the dielectric. line. A plurality of the signal line conductors A are arranged on the upper main surface of the dielectric of the N-1th layer from the dielectric of the first layer,
A plurality of the signal line conductors B are arranged from the second layer dielectric to the lower main surface of the Nth layer dielectric so as to face the signal line conductor A, respectively.
Claim from claim 1 between the opposite signal line conductors in the plurality of the signal line conductors A and the plurality of signal line conductors B is characterized in that it is electrically and physically connected to each other by the spherical conductor A any one of claims of the high-frequency transmission line of the three. The said spherical conductor A is arrange | positioned along with the direction where the said signal line conductor A and the said signal line conductor B are extended | stretched, The any one of Claims 1-4 characterized by the above-mentioned. High frequency transmission line. N (N is 3) where the upper principal surface of the dielectric from the first layer to the dielectric of the N-1th layer and the lower major surface of the dielectric from the second layer to the dielectric of the Nth layer are opposed to each other. The above natural number) plate-shaped dielectric,
A signal line disposed from one of the first dielectric layer to the upper principal surface of the N-1th layer dielectric material and from the second dielectric layer to the lower major surface of the Nth layer dielectric material. Conductor C;
Conductors A respectively disposed along the direction in which the signal line conductor C extends from the dielectric of the first layer to the upper principal surface of the dielectric of the (N-1) th layer;
Conductors B arranged from the second layer dielectric to the lower principal surface of the Nth layer dielectric along the direction in which the signal line conductor C extends and facing the conductor A;
A spherical conductor B electrically and physically connecting the conductor A of the lower dielectric and the conductor B of the upper dielectric between the dielectrics positioned immediately above and below;
A ground conductor A disposed on a lower principal surface of the first layer dielectric;
A high-frequency transmission line comprising a ground conductor B disposed on an upper main surface of the N-th layer dielectric. The conductor A is arranged on both sides through a position facing the signal line conductor C arranged on the signal line conductor C on the same plane or the dielectric of another layer,
The conductor B is, according to claim 6, characterized in that disposed on both sides through a position opposed to said signal line conductors C which are arranged in the dielectric of the signal line conductors C or other layers on the same plane High frequency transmission line. A columnar conductor A that electrically connects the ground conductor A and the conductor A through the dielectric of the first layer;
A columnar conductor B electrically connecting the ground conductor B and the conductor B through the N-th layer dielectric;
And the conductor A is disposed above and below the principal surface of the dielectric and the conductor B, according to claim 6 or claim 7, characterized in that it comprises a columnar conductor C for electrically connecting through the dielectric The high-frequency transmission line described. The signal line conductor C may be any one of the upper main surface of the first layer dielectric to the N−1th layer dielectric and the lower main surface of the second layer dielectric to the Nth layer dielectric. any one of claims of the high-frequency transmission line of claim 8 claims 6, characterized in that the crab plurality placed. The spherical conductor B is set forth in any one of claims 2, claim 6 or we claim 9, wherein the conductor B and the conductor A is characterized in that it is arranged along the direction of stretching High frequency transmission line. Wherein at least one grounding conductor A and the ground conductor B is any of the claims 1 to 10, wherein the ground conductor portion facing the signal line conductor is the ground conductor excluded 1 The high-frequency transmission line described in the item. At least one of the ground conductor A and the ground conductor B is, the high frequency transmission according to any one of claims 1 to 10, characterized in that it comprises a punching at a position opposed to the signal line conductors line. The high frequency transmission line according to claim 12 , wherein the punched holes are arranged side by side along a direction in which the signal line conductor extends. The vent hole, claim 12 or claim 13, wherein the high-frequency transmission line size in a cross section of the signal line conductors is orthogonal to the direction of stretching being less for the wavelength of the high frequency signal. The size of the hole in the cross section perpendicular to the direction in which the signal line conductor extends is large with respect to the wavelength of the high-frequency signal, and the size in the direction in which the signal line conductor extends extends with respect to the wavelength of the high-frequency signal. wherein the small Te claim 12 or claim 13, wherein the high-frequency transmission line.

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