JP6013280B2 - High frequency transmission line - Google Patents

Description

  The present invention relates to a high-frequency transmission technique, and more particularly to a high-frequency transmission line for propagating an input high-frequency signal from the uppermost layer to the lowermost layer of a multilayer wiring board.

  In a high-frequency transmission line that propagates an input high-frequency signal vertically from the top layer to the bottom layer in a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, the transmission loss and reflection loss of the high-frequency signal should be minimized. There is a need to reduce it.

Conventionally, as such a high-frequency transmission line, a technique has been proposed in which a high-frequency signal via is formed in a stepped manner from the uppermost layer to the lowermost layer of a multilayer wiring board and propagated (see, for example, Non-Patent Document 1).
8A and 8B are explanatory views showing a configuration of a conventional high-frequency transmission line, in which FIG. 8A is a top view, FIG. 8B is a cross-sectional view taken along line bb in FIG. 8A, and FIG. Is a bottom view, and FIG. 8D is a sectional view taken along the line dd of FIG. 8B.

  The high-frequency transmission line 50 is formed in a multi-layered wiring board 51 in which conductor layers 51M and insulator layers 51P are alternately stacked as a whole, and high-frequency signal vias 52 that connect the conductor layers 51M are formed stepwise for each layer. The upper-layer upper conductor pad 53A and the lower-layer lower conductor pad 53B are connected via the high-frequency signal via 52.

In the uppermost layer, a linear high-frequency signal line 54A is connected to the upper conductor pad 53A, and the upper anti-pad region 55A is sandwiched between the upper conductor pad 53A and the upper high-frequency signal line 54A. A ground plane 56A is formed.
In the lowermost layer, a linear lower high-frequency signal line 54B is connected to the lower conductor pad 53B, and a lower antipad region 55B is sandwiched between the lower conductor pad 53B and the lower high-frequency signal line 54B. Thus, the lower ground plane 56B is formed.

Y. C. Lee, et al, "A Novel CPW-to-Stripline Vertical Via Transition Using a Stagger Via Structure and Embedded Air Cavities for V-band LTCC SiP Applications", APMC2005.

According to the above-described prior art, since the high-frequency signal via 52 is formed in a staircase pattern from the uppermost layer to the lowermost layer in the multilayer wiring board 51, the high-frequency signal line is bent vertically in a small region. However, it is easy to generate unnecessary radiation at the bent portion of such a high-frequency signal line, and it is possible to suppress a certain amount of radiation by increasing the effective bending radius at the bent portion. There is a problem that the radiation component of the signal cannot be completely removed, and the passage loss and reflection loss increase.
In addition, in order to form the high-frequency signal via 52 in a stepped manner from the uppermost layer to the lowermost layer of the multilayer wiring board 51, precise processing is required and also the volume of the multilayer wiring board is increased. There was a problem of causing it.

  The present invention is to solve such a problem, and provides a high-frequency transmission line capable of propagating a high-frequency signal with a small passage loss and reflection loss at a bent portion from the substrate plane direction to the vertical direction. It is an object.

  In order to achieve such an object, a high-frequency transmission line according to the present invention includes a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, and the inside of the multilayer wiring board vertically from the top layer to the bottom layer. A high-frequency signal via formed in a penetrating manner, formed in a substantially circular shape in plan view in the uppermost layer, and connected to an upper end of the high-frequency signal via, and formed in a linear shape in the uppermost layer An upper anti-pad region in which an upper high-frequency signal line whose tip is connected to the upper conductor pad and a conductor layer formed on the uppermost layer and connected to a ground potential is selectively removed. An upper ground plane formed around the upper conductor pad and the upper high-frequency signal line, and a lower portion formed in a substantially circular shape in plan view on the lowermost layer and connected to the lower end of the high-frequency signal via A body pad, a lower high-frequency signal line formed linearly on the lowermost layer and having a tip connected to the lower conductor pad, and a conductor layer formed on the lowermost layer and connected to the ground potential. A lower ground plane formed around the lower conductor pad and the lower high-frequency signal line across the lower antipad region from which the conductor layer is selectively removed, and formed in the multilayer wiring board, The upper ground plane is composed of a ground via connecting the upper ground plane and the lower ground plane, and the conductor layers stacked between the ground planes, and a thick conductor connected to the ground potential. An upper conductor block disposed adjacent to the upper antipad region of the surface of the upper conductor block, A bilateral positions sandwiching the body pad, and are arranged in one and the other positions in the orthogonal direction orthogonal to the extending direction of the upper high-frequency signal transmission line.

  Further, another configuration example of the high-frequency transmission line according to the present invention includes a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, and vertically penetrates the multilayer wiring board from the uppermost layer to the lowermost layer. The formed high-frequency signal via, the uppermost layer formed in a substantially circular shape in plan view, and connected to the upper end of the high-frequency signal via, and the uppermost layer formed in a linear shape, the tip thereof An upper high-frequency signal line connected to the upper conductor pad and a conductor layer formed on the uppermost layer and connected to the ground potential, with the upper antipad region where the conductor layer is selectively removed interposed therebetween An upper ground plane formed around the upper conductor pad and the upper high-frequency signal line; a lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via; , The conductor layer is formed of a lower high-frequency signal line that is linearly formed in the lowermost layer and has a tip connected to the lower conductor pad, and a conductor layer that is formed in the lowermost layer and connected to the ground potential. And a lower ground plane formed around the lower conductor pad and the lower high-frequency signal line, and an upper ground plane formed in the multilayer wiring board with the lower antipad region selectively removed therebetween. And a ground via for connecting the lower ground plane and the conductor layers stacked between the ground planes, and a thick conductor connected to the ground potential, of the surface of the upper ground plane. The upper conductor block disposed adjacent to the upper antipad region and a thick conductor connected to the ground potential, A lower conductor block disposed adjacent to the lower antipad region on the surface of the land plane, wherein the upper conductor block is located on both sides of the upper conductor pad and the upper high frequency signal line The lower conductor block is located on both sides of the lower conductor pad and perpendicular to the extending direction of the lower high-frequency signal line. Arranged at one and the other position in the direction.

  Also, in one configuration example of the high-frequency transmission line according to the present invention, the upper conductor block has one end portion facing the upper conductor pad, the upper antipad region from the upper ground plane toward the upper conductor pad. It arrange | positions so that it may protrude upwards.

  Also, in one configuration example of the high-frequency transmission line according to the present invention, the lower conductor block has one end facing the lower conductor pad, the lower antipad region from the lower ground plane toward the lower conductor pad. It arrange | positions so that it may protrude below.

  Further, another configuration example of the high-frequency transmission line according to the present invention includes a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, and vertically penetrates the multilayer wiring board from the uppermost layer to the lowermost layer. The formed high-frequency signal via, the uppermost layer formed in a substantially circular shape in plan view, and connected to the upper end of the high-frequency signal via, and the uppermost layer formed in a linear shape, the tip thereof An upper high-frequency signal line connected to the upper conductor pad and a conductor layer formed on the uppermost layer and connected to the ground potential, with the upper antipad region where the conductor layer is selectively removed interposed therebetween An upper ground plane formed around the upper conductor pad and the upper high-frequency signal line; a lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via; , Formed in the multilayer wiring board, comprising a ground via for connecting the upper ground plane and each of the conductor layers, and a thick conductor connected to the ground potential, of the surface of the upper ground plane An upper conductor block disposed adjacent to the upper antipad region, and the upper conductor block is located on both sides of the upper conductor pad and orthogonal to the extending direction of the upper high-frequency signal line Arranged at one and the other position in the direction.

  Further, another configuration example of the high-frequency transmission line according to the present invention includes a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, and vertically penetrates the multilayer wiring board from the uppermost layer to the lowermost layer. The formed high-frequency signal via, the uppermost layer formed in a substantially circular shape in plan view, the upper conductor pad connected to the upper end of the high-frequency signal via, and the lowermost layer formed in a substantially circular shape in plan view A lower conductor pad connected to the lower end of the high-frequency signal via; a lower conductor pad formed linearly on the lowermost layer; and a lower high-frequency signal line whose tip is connected to the lower conductor pad; and formed on the lowermost layer. A lower ground plane formed around the lower conductor pad and the lower high-frequency signal line, with a lower antipad region formed of a conductor layer connected to a ground potential and selectively removing the conductor layer. , Formed in the multilayer wiring board, comprising a ground via for connecting the lower ground plane and each conductor layer, and a thick conductor connected to the ground potential, of the surface of the lower ground plane A lower conductor block disposed adjacent to the lower antipad region, wherein the lower conductor block is located on both sides of the lower conductor pad and orthogonal to the extending direction of the lower high-frequency signal line Are arranged at one and the other positions.

  Further, in one configuration example of the high-frequency transmission line according to the present invention, the ground via includes a plurality of ground vias arranged so as to surround the high-frequency signal via, and the pseudo-coaxial line with respect to the high-frequency signal via Form a structure.

  According to the present invention, the capacitance component generated between the upper conductor pad and the ground potential across the upper antipad region is compared with the extension capacitance component generated along the extension direction of the upper high-frequency signal line. Thus, the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extending direction increases. Therefore, anisotropy occurs in the electric field density in the upper conductor pad, and electric field lines in the orthogonal direction are concentrated as compared with the extending direction, and the electric field density is increased. As a result, unnecessary radiation is suppressed, so that it is possible to efficiently couple the electromagnetic fields of the high-frequency signal propagating in the distraction direction and the high-frequency signal propagating in the vertical direction with the generation of unnecessary radiation suppressed. The high-frequency signal can be propagated from the uppermost layer to the lowermost layer of the multilayer wiring board with a small passage loss and reflection loss at the bent portion.

It is a top view which shows the structure of the high frequency transmission line concerning 1st Embodiment. It is II-II sectional drawing of FIG. FIG. 3 is a sectional view taken along line III-III in FIG. 1. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIGS. 2 and 3. It is a bottom view which shows the other structure of the high frequency transmission line concerning 1st Embodiment. It is sectional drawing which shows the structure of the high frequency transmission line concerning 2nd Embodiment. It is sectional drawing which shows the other structure of the high frequency transmission line concerning 3rd Embodiment. It is explanatory drawing which shows the structure of the conventional high frequency transmission line.

Next, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
First, with reference to FIGS. 1-4, the high frequency transmission line 10 concerning the 1st Embodiment of this invention is demonstrated. FIG. 1 is a top view showing the configuration of the high-frequency transmission line according to the first embodiment. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIGS. 2 and 3.

  The high-frequency transmission line 10 according to this embodiment is configured such that an input high-frequency signal is transmitted from the uppermost layer (the upper surface of the substrate) to the lowermost layer (the substrate) in the multilayer wiring substrate 11 in which the conductor layers 11M and the insulating layers 11P are alternately stacked. This is a high-frequency transmission line for propagating vertically to the bottom surface. The high-frequency transmission line 10 is suitable for an electronic device or an electronic component in which a high-speed electrical signal of 10 GHz to 100 GHz or less propagates through the multilayer wiring board 11, for example.

  As shown in FIGS. 1 to 4, the high-frequency transmission line 10 mainly includes a multilayer wiring board 11, a high-frequency signal via 12, an upper conductor pad 13A, an upper high-frequency signal line 14A, an upper ground plane 16A, a lower conductor pad 13B, It is composed of a lower high-frequency signal line 14B, a lower ground plane 16B, a ground via 17, and upper conductor blocks 18A and 18B.

The high-frequency signal via 12 is a via made of a conductor such as a metal and vertically penetrating through the multilayer wiring board 11 from the uppermost layer to the lowermost layer.
The upper conductor pad 13 </ b> A is a conductor pad made of a conductor such as metal, formed in a substantially circular shape in plan view on the uppermost layer, and connected to the upper end of the high-frequency signal via 12.

The upper high-frequency signal line 14A is a high-frequency signal line that is made of a conductor such as metal, is formed in a linear shape on the uppermost layer, and has a tip connected to the upper conductor pad 13A.
The upper ground plane 16A is formed of a conductive layer such as a metal formed on the uppermost layer and connected to the ground potential, and the conductive layer is selectively removed in a substantially circular shape in plan view with the upper conductive pad 13A as the center. The ground conductor is formed around the upper conductor pad 13A and the upper high-frequency signal line 14A with the upper antipad region 15A interposed therebetween.

The lower conductor pad 13 </ b> B is a conductor pad made of a conductor such as a metal, formed in a substantially circular shape in plan view in the lowermost layer, and connected to the lower end of the high-frequency signal via 12.
The lower high-frequency signal line 14B is a high-frequency signal line that is made of a conductor such as metal, is formed in a linear shape in the lowermost layer, and has a tip connected to the lower conductor pad 13B.

The lower ground plane 16B is formed of a conductive layer made of metal or the like formed in the lowermost layer and connected to the ground potential, and the conductive layer is selectively removed in a substantially circular shape in plan view with the lower conductive pad 13B as the center. This is a ground conductor formed around the lower conductor pad 13B and the lower high-frequency signal line 14B across the lower antipad region 15B.
The ground via 17 is made of a conductor such as metal, and is formed in the multilayer wiring board 11, and includes an upper ground plane 16A and a lower ground plane 16B, and each conductor layer 11M stacked between the ground planes 16A and 16B. Is a via.

  The upper conductor blocks 18A and 18B are made of a thick (substantially rectangular parallelepiped) conductor such as a metal connected to the ground potential, and are arranged adjacent to the upper antipad region 15A on the surface of the upper ground plane 16A. The upper conductor blocks 18A and 18B are generated along the extending direction X of the upper high-frequency signal line 14A among the capacitance components generated between the upper conductor pad 13A and the ground potential across the upper antipad region 15A. An orthogonal capacitance component CA (upper conductor block 18A side) and an orthogonal capacitance component CB (upper conductor block 18B side) generated along an orthogonal direction Y orthogonal to the extension direction X as compared with the extension capacitance component CXA. In order to increase the distance, the upper conductor pads 13A are disposed on both sides of the upper conductor pad 13A and at one and the other positions in the orthogonal direction Y.

  As shown in FIG. 2, the upper high-frequency signal line 14A formed in the extending direction X along the substrate plane is connected to the high-frequency signal via 12 formed in the vertical direction Z perpendicular to the substrate plane by the upper conductor pad 13A. In the high frequency transmission line, the propagation direction of the high frequency signal is bent from the extending direction X to the vertical direction Z. Therefore, unnecessary radiation of the high-frequency signal is generated at the bent portion of the high-frequency transmission line, and the passage loss and the reflection loss are increased.

According to the present invention, such unnecessary radiation can be suppressed by the anisotropy of the electric field density in the upper conductor pad 13A, whereby electromagnetic waves between a high frequency signal propagating in the extending direction X and a high frequency signal propagating in the vertical direction Z The focus is on the efficient coupling of the fields.
As a specific method for generating such anisotropy of the electric field density, the upper conductor blocks 18A and 18B are located on both sides of the upper conductor pad 13A and at one and the other positions in the orthogonal direction Y. Is arranged.

  As a result, the density of electric lines of force extending from the upper conductor pad 13A to the upper ground plane 16A increases, and is generated between the upper conductor pad 13A and the upper ground plane 16A that is the ground potential across the upper antipad region 15A. Among the capacitance components to be transmitted, the orthogonal capacitance component generated along the orthogonal direction Y orthogonal to the extension direction X as compared with the extension capacitance component CXA generated along the extension direction X of the upper high-frequency signal line 14A CA and CB become large. Therefore, anisotropy occurs in the electric field density in the upper conductor pad 13A, and electric field lines in the orthogonal direction Y are concentrated as compared with the extending direction X, and the electric field density is increased.

In FIG. 2, the electric field strength distribution 20 indicates the electric field strength distribution (simulation result) in the upper conductor pad 13A when the upper conductor blocks 18A and 18B are arranged, and the electric field strength distribution 21 indicates the upper conductor blocks 18A and 18B. The electric field strength distribution (simulation result) when no is arranged is shown.
Since the unnecessary radiation is suppressed by arranging the upper conductor blocks 18A and 18B in this way, the high-frequency signal propagating in the extending direction X and the vertical direction Z in a state where the generation of unnecessary radiation is suppressed. The electromagnetic field with the propagating high-frequency signal can be efficiently coupled, and the high-frequency signal can be propagated with a small passage loss and reflection loss at the bent portion from the substrate plane direction to the vertical direction.

  In the present embodiment, as the upper conductor blocks 18A and 18B for providing the electric field density anisotropy in the upper conductor pad 13A, a thick conductor connected to the ground potential, for example, a ground conductor having a substantially rectangular parallelepiped shape is used. Since this is realized, the upper conductor blocks 18A and 18B can be formed by a very simple process of forming a conductor on the surface of the upper ground plane 16A, and the cost of the high-frequency transmission line can be reduced.

  At this time, by increasing the thickness of the upper conductor blocks 18A and 18B, the area facing the upper conductor pad 13A can be increased, thereby increasing the orthogonal capacitance components CA and CB and more effectively. Anisotropy of electric field density can be given.

  The upper conductor blocks 18A and 18B are arranged so that one end portion facing the upper conductor pad 13A protrudes from the upper ground plane 16A to the upper antipad region 15A toward the upper conductor pad 13A. Also good. As a result, the distance between the upper conductor pad 13A and the upper conductor blocks 18A and 18B becomes shorter than the distance between the upper conductor pad 13A and the upper ground plane 16A facing each other in the extending direction X. , CB can be increased, and anisotropy of the electric field density can be given more effectively.

  In the present embodiment, the upper conductor blocks 18A and 18B have been described as an example of a thick conductor connected to the ground potential, for example, a ground conductor having a substantially rectangular parallelepiped shape. However, the shape, quantity, and arrangement pattern are described. However, the present invention is not limited to such a configuration. For example, the upper conductor blocks 18A and 18B may be formed in other shapes instead of a substantially rectangular parallelepiped, and each of the upper conductor blocks 18A and 18B may be composed of a plurality of conductor blocks. In addition, at one and the other positions in the orthogonal direction Y, they may be arranged in a straight line or an arc.

  Also, the upper conductor blocks 18A and 18B are formed by changing the shape of one end of the upper ground plane 16A at both sides of the upper conductor pad 13A and at one and the other positions in the orthogonal direction Y. May be. For example, an anisotropy of the electric field density in the upper conductor pad 13A can be provided by forming a protruding portion protruding toward the upper conductor pad 13A or a comb-shaped portion having a comb shape at one end portion of the upper ground plane 16A. it can.

Further, instead of the upper ground plane 16A or in addition to the upper ground plane 16A, the shape of one end of the upper conductor pad 13A may be changed in the same manner as described above.
Furthermore, among the upper ground plane 16A and the upper conductor pad 13A, by changing the shape of one end facing the extending direction X instead of one end facing the orthogonal direction Y across the upper antipad region 15A, The distracted electric capacitance component CXA may be reduced.

  In the present embodiment, a plurality of ground vias 17 may be formed so as to surround the high-frequency signal vias 12, and a pseudo coaxial line structure may be formed for the high-frequency signal vias 12. Thereby, as shown in FIG. 4, the electric field strength distribution in the pseudo coaxial line structure has a circular shape centered on the high-frequency signal via 12 on the substrate plane without causing distortion such as an ellipse. It becomes substantially equal to the electric field distribution intensity of the propagating high-frequency signal. This means that only the fundamental mode of the pseudo coaxial line structure is excited and propagated, that is, it is well coupled with the fundamental mode.

  When the fundamental mode is not well coupled, the electric field strength distribution in the pseudo-coaxial line structure shown in FIG. 4 is not circular, but the center fluctuates back and forth with respect to the extending direction X of the upper high-frequency signal line 14A. The high-frequency signal via 12 propagates so as to meander in the vertical direction Z. At this time, if the electric field overlaps with the ground plane in the inner layer of the multilayer wiring substrate 11, the energy of the high-frequency signal is absorbed by the ground potential according to the amount of the overlap, so that stable propagation cannot be obtained.

  On the other hand, according to the present embodiment, as described above, since it is well coupled with the fundamental mode of the pseudo coaxial line structure, the line length of the pseudo coaxial line structure, that is, the upper conductor pad 13A and the lower conductor pad 13B. Regardless of the line length of the high-frequency signal via 12 connected to the high-frequency signal, the high-frequency signal can be stably propagated with low loss and low reflection.

  Further, in the present embodiment, since the power supply layer and the constant speed signal layer can be simultaneously formed by increasing the number of layers of the multilayer wiring board 11, a multifunctional multilayer wiring board is not dedicated to the high-frequency signal line. It can also be provided.

Next, another high-frequency transmission line 10 according to the present embodiment will be described with reference to FIG. FIG. 5 is a bottom view showing the configuration of another high-frequency transmission line according to the first embodiment.
1-4, the case where the upper conductor blocks 18A and 18B are disposed on the surface of the upper ground plane 16A has been described as an example. However, the example of FIG. 5 also illustrates the upper conductor block 18A on the surface of the lower ground plane 16B. , 18B, lower conductor blocks 18C, 18D are arranged.

  In FIG. 5, the lower conductor blocks 18C and 18D are made of a thick (substantially rectangular parallelepiped) conductor such as a metal connected to the ground potential, and are arranged adjacent to the lower antipad region 15B on the surface of the lower ground plane 16B. Has been. The lower conductor blocks 18C and 18D are generated along the extending direction X of the lower high-frequency signal line 14B out of the capacitance component generated between the lower conductor pad 13B and the ground potential with the lower antipad region 15B interposed therebetween. An orthogonal capacitance component CC (lower conductor block 18C side) and an orthogonal capacitance component CD (lower conductor block 18D side) generated along an orthogonal direction Y orthogonal to the extension direction X as compared with the extension capacitance component CXB. In order to increase the height, the lower conductor pad 13B is disposed on both sides of the lower conductor pad 13B and at one and the other positions in the orthogonal direction Y so as to protrude downward from the lower antipad region 15B.

  As a result, among the capacitance components generated between the lower conductor pad 13B and the ground potential across the lower antipad region 15B, the extension capacitance component CXB generated along the extension direction X of the lower high-frequency signal line 14B. In comparison, the orthogonal capacitance components CC and CD generated along the orthogonal direction Y orthogonal to the extending direction X are increased. For this reason, anisotropy is generated in the electric field density in the lower conductor pad 13B, and electric field lines in the orthogonal direction Y are concentrated compared to the extending direction X, and the electric field density is increased.

  Accordingly, since the unnecessary radiation is suppressed by arranging the lower conductor blocks 18C and 18D, the high-frequency signal propagating in the extending direction X and the high-frequency signal propagating in the vertical direction Z in a state where generation of unnecessary radiation is suppressed. The electromagnetic field with the signal can be efficiently coupled, and the high-frequency signal can be propagated with a small passage loss and reflection loss at the bent portion from the substrate plane direction to the vertical direction.

[Second Embodiment]
Next, with reference to FIG. 6, the high frequency transmission line 10 concerning the 2nd Embodiment of this invention is demonstrated. FIG. 6 is a cross-sectional view illustrating a configuration of a high-frequency transmission line according to the second embodiment. 6 corresponds to a cross-section at the same position as FIG. 2 in the high-frequency transmission line 10 according to the present embodiment, that is, a II-II cross-sectional view of FIG.

Compared with the configuration of FIGS. 1-4, the configuration of FIG. 6 leaves only the lower conductor pad 13B without forming the lower high-frequency signal line 14B, the lower antipad region 15B, and the lower ground plane 16B in the lowermost layer. Is. At this time, the configuration relating to the uppermost layer is the same as that shown in FIGS.
Thereby, the high frequency signal propagated to the lowermost end of the high frequency signal via 12 is electrically connected to the lower conductor pad 13B without being bent at a right angle from the vertical direction Z to the substrate plane direction in the lowermost layer (see FIG. (Not shown), and it is possible to avoid the occurrence of high-frequency signal passing loss and reflection loss at the lowermost bent portion.

[Third Embodiment]
Next, with reference to FIG. 7, the high frequency transmission line 10 concerning the 3rd Embodiment of this invention is demonstrated. FIG. 7 is a cross-sectional view illustrating a configuration of a high-frequency transmission line according to the third embodiment. 7 corresponds to a cross-section at the same position as FIG. 2 in the high-frequency transmission line 10 according to the present embodiment, that is, a II-II cross-sectional view of FIG.

Compared with the configuration of FIGS. 1-4, in the configuration of FIG. 7, only the upper conductor pad 13A is left without forming the upper high-frequency signal line 14A, the upper antipad region 15A, and the upper ground plane 16A in the uppermost layer. Is. At this time, the configuration in the lowermost layer is the same as in FIG.
Thus, a connector (not shown) is electrically connected to the upper conductor pad 13A without bending the high-frequency signal input from the uppermost end of the high-frequency signal via 12 at a right angle from the substrate plane direction to the vertical direction Z at the uppermost layer. Therefore, it is possible to avoid the occurrence of high-frequency signal passing loss and reflection loss at the bent portion of the uppermost layer.

[Extended embodiment]
The present invention has been described above with reference to the embodiments, but the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention. In addition, each embodiment can be implemented in any combination within a consistent range.

  DESCRIPTION OF SYMBOLS 10 ... High frequency transmission line, 11 ... Multilayer wiring board, 11M ... Conductor layer, 11P ... Insulating layer, 12 ... High frequency signal via, 13A ... Upper conductor pad, 13B ... Lower conductor pad, 14A ... Upper high frequency signal line, 14B ... Lower High frequency signal line, 15A: upper antipad region, 15B: lower antipad region, 16A ... upper ground plane, 16B ... lower ground plane, 17 ... ground via, 18A, 18B ... upper conductor block, 18C, 18D ... lower conductor block CA, CB, CC, CD: orthogonal capacitance component, CXA, CXB: distraction capacitance component.

Claims (7)

A multilayer wiring board in which conductor layers and insulating layers are alternately laminated;
A high-frequency signal via formed vertically through the multilayer wiring board from the uppermost layer to the lowermost layer;
An upper conductor pad formed in the uppermost layer in a substantially circular shape in plan view and connected to an upper end of the high-frequency signal via;
An upper high-frequency signal line formed linearly on the uppermost layer and having a tip connected to the upper conductor pad;
The uppermost layer is formed of a conductor layer connected to the ground potential, and the upper antipad region where the conductor layer is selectively removed is sandwiched between the upper conductor pad and the upper high-frequency signal line. The formed upper ground plane;
A lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via;
A lower high-frequency signal line that is formed in a line shape in the lowermost layer and has a tip connected to the lower conductor pad,
The conductor layer is formed in the lowermost layer and is connected to the ground potential, and the lower conductor pad and the lower high-frequency signal line are surrounded by a lower antipad region where the conductor layer is selectively removed. A lower ground plane formed in
A ground via formed in the multilayer wiring board for connecting the upper ground plane and the lower ground plane and the conductor layers stacked between the ground planes;
The upper conductor block is formed of a thick conductor connected to the ground potential, and is disposed adjacent to the upper antipad region in the surface of the upper ground plane.
The upper conductor block is located on both sides of the upper conductor pad and at one and the other positions in the orthogonal direction orthogonal to the extending direction of the upper high-frequency signal line. Transmission line. A multilayer wiring board in which conductor layers and insulating layers are alternately laminated;
A high-frequency signal via formed vertically through the multilayer wiring board from the uppermost layer to the lowermost layer;
An upper conductor pad formed in the uppermost layer in a substantially circular shape in plan view and connected to an upper end of the high-frequency signal via;
An upper high-frequency signal line formed linearly on the uppermost layer and having a tip connected to the upper conductor pad;
The uppermost layer is formed of a conductor layer connected to the ground potential, and the upper antipad region where the conductor layer is selectively removed is sandwiched between the upper conductor pad and the upper high-frequency signal line. The formed upper ground plane;
A lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via;
A lower high-frequency signal line that is formed in a line shape in the lowermost layer and has a tip connected to the lower conductor pad,
The conductor layer is formed in the lowermost layer and is connected to the ground potential, and the lower conductor pad and the lower high-frequency signal line are surrounded by a lower antipad region where the conductor layer is selectively removed. A lower ground plane formed in
A ground via formed in the multilayer wiring board for connecting the upper ground plane and the lower ground plane and the conductor layers stacked between the ground planes;
An upper conductor block made of a thick conductor connected to the ground potential, and disposed adjacent to the upper antipad region in the surface of the upper ground plane;
A thick conductor connected to the ground potential, comprising a lower conductor block disposed adjacent to the lower antipad region of the surface of the lower ground plane,
The upper conductor block is located on both sides of the upper conductor pad and at one and the other positions in a direction perpendicular to the extending direction of the upper high-frequency signal line,
The lower conductor block is disposed on both sides of the lower conductor pad and at one and the other positions in a direction orthogonal to the extending direction of the lower high-frequency signal line. line. In the high frequency transmission line according to claim 1 or claim 2,
The upper conductor block is arranged such that one end portion facing the upper conductor pad protrudes from the upper ground plane upward to the upper antipad region toward the upper conductor pad. line. In the high frequency transmission line according to claim 2,
The lower conductor block is arranged such that one end portion facing the lower conductor pad protrudes downward from the lower ground plane toward the lower conductor pad from the lower ground plane. line. A multilayer wiring board in which conductor layers and insulating layers are alternately laminated;
A high-frequency signal via formed vertically through the multilayer wiring board from the uppermost layer to the lowermost layer;
An upper conductor pad formed in the uppermost layer in a substantially circular shape in plan view and connected to an upper end of the high-frequency signal via;
An upper high-frequency signal line formed linearly on the uppermost layer and having a tip connected to the upper conductor pad;
The uppermost layer is formed of a conductor layer connected to the ground potential, and the upper antipad region where the conductor layer is selectively removed is sandwiched between the upper conductor pad and the upper high-frequency signal line. The formed upper ground plane;
A lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via;
A ground via formed in the multilayer wiring board for connecting the upper ground plane and each conductor layer;
The upper conductor block is formed of a thick conductor connected to the ground potential, and is disposed adjacent to the upper antipad region in the surface of the upper ground plane.
The upper conductor block is located on both sides of the upper conductor pad and at one and the other positions in an orthogonal direction orthogonal to the extending direction of the upper high-frequency signal line. Transmission line. A multilayer wiring board in which conductor layers and insulating layers are alternately laminated;
A high-frequency signal via formed vertically through the multilayer wiring board from the uppermost layer to the lowermost layer;
An upper conductor pad formed in the uppermost layer in a substantially circular shape in plan view and connected to an upper end of the high-frequency signal via;
A lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via;
A lower high-frequency signal line that is formed in a line shape in the lowermost layer and has a tip connected to the lower conductor pad,
The conductor layer is formed on the lowermost layer and is connected to the ground potential, and the lower conductor pad and the lower high-frequency signal line are surrounded by the lower antipad region where the conductor layer is selectively removed. The lower ground plane formed,
A ground via formed in the multilayer wiring board for connecting the lower ground plane and the conductor layers;
It is composed of a thick conductor connected to the ground potential, and comprises a lower conductor block disposed adjacent to the lower antipad region of the surface of the lower ground plane,
The lower conductor block is located on both sides of the lower conductor pad and at one and the other positions in the orthogonal direction perpendicular to the extending direction of the lower high-frequency signal line. Transmission line. In the high frequency transmission line according to any one of claims 1 to 6,
The high-frequency transmission line according to claim 1, wherein the ground via includes a plurality of ground vias arranged side by side so as to surround the high-frequency signal via, and forms a pseudo coaxial line structure with respect to the high-frequency signal via.

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