JP5880082B2 - Multilayer substrate manufacturing method and multilayer substrate manufacturing apparatus - Google Patents

Description

  The technology disclosed in the present application relates to a multilayer substrate manufacturing method and a multilayer substrate manufacturing apparatus.

  In a method of manufacturing a laminated substrate by laminating a plurality of substrate structures (for example, a circuit substrate), a method of using a molded plate sandwiching a circuit board or a prepreg and having a shape in which an end is urged upward is used. It has been known. By using a molding plate with such a shape, when heating and pressure molding between hot plates, the end of the molding plate is prevented from sagging, so that the end of the prepreg is also prevented from being compressed. ing. And it suppresses that resin flows out from the edge part of a prepreg, and it can shape | mold to uniform thickness by preventing that the board | plate thickness of the peripheral edge part of a laminated board becomes thin.

JP 2008-137294 A

  However, when using a curved shaped plate, the shape of the laminated substrate to be manufactured is affected by the shape of the molded plate, so that the shape of the molded plate (for example, the degree of curvature) is highly accurate. Required. As a result, the manufacturing cost of the laminated substrate also increases.

  An object of the disclosed technique of the present application is to provide a multilayer substrate manufacturing method and a multilayer substrate manufacturing apparatus capable of making the thickness of the multilayer substrate manufactured uniform while suppressing an increase in manufacturing cost.

The method for manufacturing a laminated substrate disclosed in the present application is based on a laminated body constituted by laminating a plurality of substrate constituents constituting the laminated substrate and an adhesive member for bonding these substrate constituents. On at least one side in the stacking direction, an intervening plate in which the facing surface to the stacked body and the opposite surface of the facing surface are symmetrical with respect to the center line in the plate thickness direction is disposed. And a laminated body and an interposition board are pressurized in the lamination direction, and the said board | substrate structure body is adhere | attached with an adhesive member.

In the laminated substrate manufacturing apparatus disclosed in the present application, a laminated body in which a plurality of substrate constituents constituting the laminated substrate and an adhesive member that bonds these substrate constituents are laminated is held by a holding member. On at least one side in the laminating direction, an intervening plate in which the opposing surface to the laminate and the opposite surface of the opposing surface are symmetrical with respect to the center line in the thickness direction is disposed. And a laminated body and an interposition board are pressurized to a lamination direction with a pressurization member, and a board | substrate structure body is adhere | attached with an adhesive member.

  According to the multilayer substrate manufacturing method and the multilayer substrate manufacturing apparatus disclosed in the present application, it is possible to make the thickness of the manufactured multilayer substrate uniform while suppressing an increase in manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic front view showing a part of a configuration of a multilayer substrate manufacturing apparatus according to a first embodiment. It is a schematic sectional drawing which shows the laminated substrate manufacturing method of 1st Embodiment. It is sectional drawing which shows the multilayer substrate manufactured by the multilayer substrate manufacturing method of 1st Embodiment. It is a schematic sectional drawing which shows the laminated substrate manufacturing method of a comparative example. (A)-(C) are all sectional drawings which show the example of the interposition board applicable to a laminated substrate manufacturing method and a laminated substrate manufacturing apparatus. It is sectional drawing which shows the process of manufacturing the interposition board applied to the laminated substrate manufacturing method and laminated substrate manufacturing apparatus of 1st Embodiment. It is sectional drawing which shows the state which manufactured the interposition board applied to the laminated substrate manufacturing method and laminated substrate manufacturing apparatus of 1st Embodiment. It is sectional drawing which shows the process of manufacturing the interposition board applied to the laminated substrate manufacturing method and laminated substrate manufacturing apparatus of 1st Embodiment. It is a graph which shows the change of the board thickness difference (maximum value-minimum value) to the 10th cycle in a laminated substrate manufacturing method in an Example.

  Embodiments of a multilayer substrate manufacturing method and a multilayer substrate manufacturing apparatus disclosed in the present application will be described below in detail with reference to the drawings.

  As shown in FIG. 1, the laminated substrate manufacturing apparatus 12 of this embodiment has a pressure member 16 having a pair of laminated dies 14A and 14B. The laminated molds 14A and 14B of the present embodiment are both formed in a flat plate shape with metal or the like, and are held in a parallel state by the pressurizing mechanism 18. When the pressurizing mechanism 18 is driven, the stacked dies 14A and 14B approach each other. The pressurizing mechanism 18 is controlled by the control device 20. An operation member 22 is connected to the control device 20, and the pressurizing mechanism 18 can be driven and stopped by an operator operating the operation member 22.

  Examples of the stacked molds 14A and 14B include metal plates such as stainless steel having a plate thickness of about 1 to 10 mm, but are not limited to this structure. Hereinafter, when the stacked molds 14A and 14B are not particularly distinguished, the stacked mold 14 will be described.

  As shown in FIG. 2, in the laminated substrate manufacturing method of the present embodiment, one or a plurality of core substrates 24 (one in the example of FIG. 2) are used. As shown in FIG. 3, the core substrate 24 is arranged inside and forms at least a part of a desired circuit or the like in the multilayer substrate 40 manufactured by the multilayer substrate manufacturing method of the present embodiment. Examples of the core substrate 24 include a circuit-formed substrate (circuit-formed copper-clad laminate) in which a desired circuit is formed of a metal such as copper on the surface or inside of a base material such as glass epoxy.

  The core substrate 24 is an example of a substrate structure. The substrate structure is not limited to the core substrate 24. For example, an insulating plate-like member whose circuit is not formed on the surface or inside, or a plate-like member formed only of a material (metal) having a conductive material is used. It may be a member (a bus bar as an example).

  A surface layer material 26 is disposed above and below the core substrate 24. The surface layer material 26 is also an example of a substrate structure. As shown in FIG. 3, the surface layer material 26 constitutes a surface layer in the multilayer substrate 40 manufactured by the multilayer substrate manufacturing method of the present embodiment. As the surface layer material 26, for example, a copper clad laminate in which a copper foil is uniformly applied to the surface of a base material such as copper foil or glass epoxy can be cited.

  An adhesive sheet 28 is disposed between the core substrate 24 and the surface layer material 26 (and between the core substrates 24 when a plurality of core substrates 24 are used). The adhesive sheet 28 of the present embodiment is a sheet that is formed in a semi-cured state (a state where the thermosetting resin is cured to an intermediate stage without being completely cured). By laminating the core substrate 24 and the surface layer material 26 with the adhesive sheet 28 interposed therebetween and pressurizing in the laminating direction (in some cases, heating may be used together, hereinafter referred to as “heating / pressing”). The core substrate 24 and the surface layer material 26 can be bonded via the adhesive sheet 28. After the bonding, the adhesive sheet 28 is cured, so that the core substrate 24 and the surface layer material 26 are not inadvertently peeled off.

  Thus, the laminated body 30 is comprised as a whole by laminating | stacking the core board | substrate 24, the adhesive sheet 28, and the surface layer material 26. FIG. However, as described above, when the adhesive sheet 28 is cured, it is possible to constitute the surface layer of the laminated substrate 40 by itself.

  2 and 3, the stacking direction (arrow PU direction) of the core substrate 24, the adhesive sheet 28 and the surface layer material 26 is the vertical direction. However, in the stacked substrate manufacturing method of the present embodiment, the stacking direction is There is no particular limitation. In the example shown in FIG. 2, the core substrate 24, the adhesive sheet 28, and the intermediate plate 34 have the same width (appears in the horizontal direction in FIG. 2) and length (appears in the depth direction in FIG. 3). A shape having However, the width and length of the core substrate 24, the adhesive sheet 28, and the intermediate plate 34 are appropriately determined according to the structure and physical properties of the laminated substrate 40 (see FIG. 4) to be manufactured.

  As shown in FIG. 1, the laminated substrate manufacturing apparatus 12 includes a holding member 32 that holds the laminated body 30. Since the laminated body 30 is held by the holding member 32, the state where the core substrate 24, the adhesive sheet 28, and the surface layer material 26 are laminated is maintained. In addition, as the holding member 32, the laminated body 30 should just be hold | maintained in this way. Therefore, the holding member 32 may be a simple base, or may have a structure in which the stacked body 30 is sandwiched from both sides in the stacking direction (up and down in FIG. 1).

  Intermediate plates 34 are disposed on both sides of the stacked body 30 in the stacking direction. The intermediate plate 34 is made of a metal (for example, stainless steel such as SUS), and is a thin plate-like member in which surface flatness (mirror surface property) is ensured.

  In addition, intervening plates 36 are arranged on both end sides in the stacking direction with respect to the intermediate plate 34. In the example of FIG. 2, the interposed plate 36 is formed to have a longer width and length than the intermediate plate 34. And the plate | board thickness of 36 C of center parts in the cross section shown in FIG. 2 is thick, and it is set as the shape where plate | board thickness reduces gradually as it goes to the peripheral part 36E. In the drawing, in order to clarify the shape of the interposition plate 36, the thickness of the central portion is exaggerated from the actual one.

  In the intervening plate 36, the surface facing the laminated body 30 (in the example of FIG. 3, the intermediate plate 34 is opposed to the laminated body 30), the central portion 36 </ b> C of the intervening plate 36 is convex with respect to the laminated body 30. It has become. In particular, in the present embodiment, the facing surface 38A has a gently curved convex shape without locally abruptly changing shape (for example, the facing surface 38A is bent when viewed in cross section).

  The intervening plate 36 of this embodiment has a symmetrical shape (mirror image) with respect to a center line CL (strictly, a surface) in the thickness direction when viewed in the cross section shown in FIG. The opposite surface 38B (the surface facing the stacked mold 14), which is the surface opposite to the facing surface 38A, has a curved shape that is convex in the direction opposite to the stacked body 30. In other words, the interposition plate 36 can be disposed between the intermediate plate 34 (laminated body 30) and the laminated mold 14 without particularly distinguishing both surfaces. And as a result of arranging the interposition board 36 in this way, the surface which opposes the intermediate | middle board 34 (laminated body 30) becomes the opposing surface 38A, and the surface on the opposite side turns into the opposing surface 38B.

  Note that both the opposing surface 38A and the opposite surface 38B have symmetrical shapes on the left and right in FIG.

  As can be seen from the above description, in the multilayer substrate manufacturing method of the present embodiment, first, as shown in FIG. 2, the core substrate 24 and the surface layer material 26 are laminated via the adhesive sheet 28 to form the laminate 30. To do. And the laminated body 30 is hold | maintained on the holding member 32 (refer FIG. 1) of the laminated substrate manufacturing apparatus 12. FIG.

  Next, the intermediate plate 34 is disposed on both sides of the stacked body 30 in the stacking direction, and the intervening plates 36 are further disposed on both sides of the stacked body 30 in the stacking direction than the intermediate plate 34. Alternatively, the intermediate plate 34 and the intervening plate 36 may be set in advance in a predetermined position of the laminated substrate manufacturing apparatus 12 and the laminated body 30 may be disposed between the two intermediate plates 34.

  In this state, the laminate 30, the intermediate plate 34 and the interposition plate 36 are pressurized and heated in the direction of the arrow PR by the laminate mold 14. Since force is applied to the laminated body 30 in a direction in which the laminated body 30 is in close contact via the interposition plate 36 and the intermediate plate 34, the core substrate 24 and the surface layer material 26 are bonded by the adhesive sheet 28. In an example in which a plurality of core substrates 24 are arranged, the core substrates 24 are bonded together. In FIG. 2, the force acting on the laminate 30 from the interposition plate 36 through the intermediate plate 34 in this case is indicated by an arrow FP. In particular, the thickness of the arrow FP is expressed so as to correspond to the magnitude of the force.

  FIG. 4 shows a part of a process of manufacturing a multilayer substrate by the multilayer substrate manufacturing method of the comparative example. The laminated substrate manufacturing method of the comparative example is different from the laminated substrate manufacturing method of the above embodiment in that the intervening plate 36 is not used. Also in the comparative example, the force acting on the laminate 30 from the interposition plate 36 via the intermediate plate 34 is indicated by an arrow FP.

  In the laminated substrate manufacturing method of the comparative example, the intermediate plate 34 acts on the laminated body 30 substantially evenly (however, it is not completely uniform and is not necessary). Here, the adhesive sheet 28 has physical properties for adhering the surface layer material 26 and the core substrate 24 by melting by pressurization and heating and then gradually curing. The amount of flow when the adhesive sheet 28 is melted is larger in the peripheral portion 30E than in the central portion 30C when the laminated body 30 is viewed in the arrow PR direction. For this reason, the thickness of the laminated substrate after bonding may be thick at the central portion and thin at the peripheral portion. That is, there is a possibility that the finally obtained multilayer substrate is a multilayer substrate having a non-uniform thickness.

  On the other hand, in the laminated substrate manufacturing method of the present embodiment, as can be seen from FIGS. 1 and 2, the laminated substrate 40 is formed using the interposed plate 36. Since the facing surface 36A of the interposition plate 36 has a convex shape toward the stacked body 30, the pressure acting in the stacking direction gradually decreases from the central portion 30C of the stacked body 30 toward the peripheral portion 30E. Accordingly, a relatively large pressure acts on the center portion (see the center portion 30C of the laminated body 30) where the flow is slow with respect to the molten adhesive sheet 28, and the peripheral portion (the laminated body 30 of the laminated body 30) easily flows. A relatively small pressure acts on the peripheral portion 30E). Further, an extra portion of the resin constituting the adhesive sheet 28 can escape from the peripheral edge portion 30E of the laminate 30 to the outside. And the non-uniform | heterogenous flow of the adhesive sheet 28 in the laminated body 30 was suppressed, As a result, as shown in FIG. 3, as the laminated board | substrate 40 after adhesion | attachment, thickness uniformity was achieved rather than the comparative example. A laminated substrate 40 is obtained.

  Note that a final laminated substrate can be obtained by forming through holes, forming surface layer circuits, or the like on the laminated substrate 40 as necessary.

  In the multilayer substrate manufacturing method of the present embodiment, it is only necessary to interpose the intervening plate 36 between the intermediate plate 34 and the multilayer mold 14, and it is necessary to greatly change the manufacturing process and manufacturing conditions in the multilayer substrate manufacturing method. Absent. In particular, when a conventional curved forming plate (metal plate) is used, it is necessary to manufacture the forming plate itself and to maintain the shape of the forming plate with high accuracy. That is not necessary. Therefore, it is possible to make the thickness of the manufactured laminated substrate 40 uniform while suppressing an increase in manufacturing cost when manufacturing the laminated substrate.

  Furthermore, since the flatness of the multilayer substrate 40 is high, for example, burrs generated around the through hole when the through hole is formed are reduced. In addition, when forming the surface layer circuit of the laminated substrate 40, a resist (thin film-like member) is attached to the surface, but since the adhesive property of the resist is increased, the formation of the surface layer circuit is facilitated, The quality of the formed surface layer circuit is also stabilized. By these, it becomes possible to improve the production yield of the finally obtained multilayer substrate.

  In the above embodiment, an example in which the interposition plate 36 is disposed between the laminated mold 14 and the intermediate plate 34 is described. However, the position of the interposition plate 36 is not limited to this, and for example, the intermediate plate 34 and the laminated body 30. It may be between. Moreover, when actually manufacturing a laminated substrate, a plate-like member (for example, a carrier plate) may be arranged further outside the lamination method than the laminated mold 14. In this case, the interposition plate 36 may be disposed between a plate-like member such as a carrier plate and the laminated mold 14.

  Moreover, in the said embodiment, although the example which has arrange | positioned the interposition board 36 on both sides of the lamination direction of the laminated body 30 using the two interposition boards 36 is given, the single interposition board 36 is used, The interposition plate 36 may be disposed only on one side in the stacking direction of the stacked body 30. However, when the two interposition plates 36 are arranged on both sides in the stacking direction of the stacked body 30 as in the above embodiment, the pressure gradually decreasing from the central portion 30C to the peripheral portion 30E is applied to each of the plurality of adhesive sheets 28. Can act. For this reason, it is preferable to arrange the two interposition plates 36 on both sides in the stacking direction of the stacked body 30 from the viewpoint of making the thickness of the manufactured stacked substrate 40 (laminated substrate) uniform.

  In the above embodiment, as the interposition plate 36, the facing surface 38A (and the opposite surface 38B) has a gently curved convex shape, but in short, the facing surface 38A only needs to be convex. . For example, as shown in FIG. 5 (A), a shape that is linear in cross section from the central portion 36C to the peripheral portion 36E, or as shown in FIGS. 5 (B) and 5 (C) 38 A (and the opposite surface 38B) may have a shape in which both a curved portion and a flat portion are present. However, if the facing surface 38A is convex and gently curved, the pressure can be gradually reduced from the central portion 30C toward the peripheral portion 30E. That is, from the viewpoint of achieving uniform thickness of the laminated substrate 40 (laminated substrate) to be manufactured, it is preferable that the opposing surface has a curved convex shape.

  Further, depending on the structure of the substrate structure such as the core substrate 24, the thickness of the stacked body 40 may be non-uniform. In this case, slight irregularities may be provided on the surface shape of the facing surface 38A in accordance with the thickness of the stacked body 40 (substrate structure).

  Thus, when using the interposition board 36 of the shape with unevenness | corrugation in 38 A of opposing surfaces, or the shape shown to FIG. 5 (A)-(C), the position where 38 A of opposing surfaces do not contact the laminated body 30 directly. If it arrange | positions to, it can suppress that the shape of 38 A of opposing surfaces is transcribe | transferred to the lamination | stacking type | mold 14. For example, the interposition plate 36 may be disposed not between the laminate 30 and the intermediate plate 34 but between the intermediate plate 34 and the laminated mold 14.

  In the above embodiment, as the interposition plate 36, not only the facing surface 38 </ b> A to the laminated body 30 but also the opposite surface 38 </ b> B has a convex shape, but at least the facing surface 38 </ b> A has a convex shape. If so, it is possible to make the thickness of the laminated substrate 40 to be manufactured uniform. However, as in the above-described embodiment, the intervening plate 36 having a shape that is symmetric with respect to the center line CL in the thickness direction can be used without particularly distinguishing two surfaces curved in a convex shape. And by arrange | positioning the interposition board 36 in a predetermined position (between the intermediate | middle board 34 and the lamination | stacking type | mold 14 in the said example), the surface by the side of the laminated body 30 is 38 A of opposing surfaces, and the surface of the other side is opposite surface 38B. It becomes.

  The material of the interposition plate 36 does not exclude metals such as stainless steel, copper, iron, and aluminum. However, when these metal materials are used as the interposition plate 36, when the laminated body 30 is pressed in the laminating direction, the dimensional behavior is different from that of the laminated body 30, so there is a possibility that a difference in dimensional behavior may occur. Further, the metal interposition plate 36 is likely to be deformed, scratched, indented or the like due to repeated use. On the other hand, if the interposed plate 36 is made of resin, deformation, scratches, and the like due to repeated use are less likely to occur compared to a metallic interposed plate. Further, compared to metal, the interposer plate 36 using resin is easy to dispose and reuse.

  The resin in this case may be a thermosetting resin or a thermoplastic resin, but at least when used as the interposition plate 36, it has a rigidity that does not affect the moldability of the laminated substrate 40. (Shape stability) may be sufficient. Specifically, a heat resistant epoxy resin can be mentioned, for example. In particular, if the laminate 30 (adhesive sheet 28) is made of the same material as the resin, the dimensional behavior is the same, so the influence on the stretchability when the laminate 30 is pressurized is reduced.

  In order to manufacture the intervening plate 36 using the same material (resin) as the laminated body 30 (adhesive sheet 28) in this way, as shown in FIG. 44). The curved mold 44 may be a laminated mold when a laminated body (the laminated body 30 according to the present embodiment or a laminated body different from the present embodiment) may be pressed in the laminating direction. It is possible to use a metal plate that has been used as Thus, the metal plate (curved metal mold | die 44) from which curvature does not restore | restore is unpreferable to use again in order to pressurize the laminated body 30 in the lamination direction, and shape | mold a laminated substrate. However, it can be used when the interposition plate 36 is manufactured. In other words, the curved mold is effectively used.

  A plurality of semi-cured adhesive sheets 28 are laminated between a pair of curved molds 44, and a surface layer material 26 is disposed on both sides in the laminating direction (the adhesive sheet 28 is attached by the surface layer material 26). Sandwiched in the stacking direction). In this state, the interposed plate 36 can be formed by pressurizing and heating the laminated body 30 in the laminating direction with the curved mold 44.

  When the interposed plate 36 is molded using such a curved mold 44, the warp of the curved mold 44 is reflected on the opposing surface 38A and the opposite surface 38B of the interposed plate 36. At the time of molding, as shown in FIG. The intervening plate 36 having two convex surfaces can be formed.

  On the other hand, as shown in FIG. 8, a flat mold (flat mold 46) may be used. That is, even when the flat mold 46 is used, the resin material constituting the adhesive sheet 28 flows out from the peripheral portion, so that the interposer plate 36 having two convex surfaces as shown in FIG. 2 is formed. it can.

  As mentioned above, although one embodiment of the technique disclosed in the present application has been described, the technique disclosed in the present application is not limited to the above, and various modifications may be made without departing from the spirit of the present invention. Of course, it is possible.

  Hereinafter, the laminated substrate manufacturing method disclosed in the present application will be described in more detail with reference to examples. However, the laminated substrate manufacturing method disclosed in the present application is not limited to the contents of this embodiment.

  In this example, two intervening plates 36 were formed using the curved mold 44 shown in FIGS. Then, using these intervening plates 36, the laminate 30 was pressed and heated in the laminating direction as shown in FIG. The adhesive sheet 28 constituting the laminate 30 is a heat-resistant glass epoxy resin, and the intervening plate 36 is similarly molded using the heat-resistant glass epoxy resin.

  Specifically, 20 sheets of adhesive sheet 28 having a heat of 0.10 mm are prepared and laminated for each intervening plate, and a copper foil having a thickness of 35 μm is formed as a surface layer material 26 on both ends in the laminating direction. Arranged. The adhesive sheet 28 thus laminated was pressed and heated using a curved mold 44 as shown in FIG. In the interposer plate 36 after molding, the plate thickness difference between the thickest portion and the thinnest portion was 0.62 mm for one sheet and 0.65 mm for the other sheet.

  Next, the five laminated bodies 30 were configured, and an intermediate plate 34 was sandwiched between the both ends of the laminated bodies 30 in the stacking direction as shown in FIG. Further, intervening plates 36 are arranged between the upper intermediate plate 34 and the laminated die 14A and between the lower intermediate plate 34 and the laminated die 14B. Then, the laminate 30 was pressurized and heated by the laminate mold 14. About each of the five laminated substrates 40 after shaping | molding, the plate | board thickness difference (The difference of the plate | board thickness of the thickest part and the thinnest part) was measured (Examples 1-5).

  Moreover, although the intermediate | middle board 34 is arrange | positioned at the both ends part of the lamination direction of the laminated body 30, the above-mentioned interposition board 36 was arrange | positioned, and the laminated body 30 was pressurized and heated by the same process (refer FIG. 4). ). And about each of the laminated substrate 40 after shaping | molding, the board thickness difference (Difference in board thickness of the thickest part and the thinnest part) was measured similarly to Examples 1-5 (comparative examples 1-5). The results are shown in Table 1.

From Table 1, it can be seen that in the laminated substrate 40 of the example, higher flatness is obtained at any of the average value, the maximum value, and the minimum value of the plate thickness difference than the laminated substrate of the comparative example. In particular, the flatness of the example is 0.05 mm higher than that of the comparative example at the average value of the plate thickness difference.

  Moreover, the unevenness | corrugation, the wave | undulation, curvature, etc. were not confirmed about the surface state of the laminated substrate 40 of Examples 1-5. Furthermore, no abnormalities that are particularly problematic were observed in terms of dimensional accuracy and molding quality.

  Next, the deterioration of the intervening plate 36 itself due to repeated use of the intervening plate 36 and the influence on the molded laminated substrate 40 were confirmed.

  Specifically, the process of heating and pressurizing the laminate 30 using the intervening plate 36 is repeated 10 cycles, and the plate of the laminated substrate 40 after molding in the specific cycle (1, 3, 5, 8, 10th cycle). The thickness difference was measured. The results are shown in Table 2 and FIG.

From Table 2 and FIG. 9, when the intervening plate 36 according to the example is used, even in the 10th cycle, the molded laminated substrate 40 is more flat than the comparative example shown in Table 1. You can see that. This is considered to be due to the fact that the deformation of the interposed plate 36 is suppressed even at the 10th cycle.

  In particular, in this embodiment, since the intervening plate 36 is made of the same material as the adhesive sheet 28 constituting the laminated body 30, the dimensional behavior of the intervening plate 36 is close to the dimensional behavior of the laminated body 30. . And it is considered that the interposition plate 36 expands and contracts in the same manner as the laminated body 30 when the laminated body 30 is pressed and heated, and the shape change due to repeated use hardly occurs.

DESCRIPTION OF SYMBOLS 12 Laminated substrate manufacturing apparatus 14 Laminated mold 16 Pressurization member 18 Pressurization mechanism 20 Control apparatus 22 Operation member 24 Core board (an example of board | substrate structure)
26 Surface layer material (example of substrate structure)
28 Adhesive sheet (an example of an adhesive member)
30 Laminated body 30C Central portion 30E Peripheral portion 32 Holding member 34 Intermediate plate 36 Intermediary plate 36A Opposing surface 38B Opposite surface 36C Central portion 36E Peripheral portion 40 Laminated substrate 44 Curved mold 46 Flat mold

Claims (5)

A laminated body is formed by laminating a plurality of substrate constituents constituting a laminated substrate and an adhesive member for bonding the substrate constituents,
On at least one side in the stacking direction of the stacked body, an intervening plate in which a facing surface to the stacked body and a surface opposite to the facing surface are symmetrical with respect to the center line in the plate thickness direction is disposed,
Pressurizing the laminated body and the interposition plate in the laminating direction to bond the substrate structure by the adhesive member;
Multilayer substrate manufacturing method.   The laminated substrate manufacturing method according to claim 1, wherein an intervening plate having the opposing surface curved into the convex shape is used as the intervening plate.   The method for manufacturing a laminated substrate according to claim 1, wherein an intermediate plate in which a material of the same material as the adhesive member is cured is used as the intermediate plate. The laminated substrate manufacturing method according to any one of claims 1 to 3 , wherein the interposed plate is disposed on both sides of the laminated body in the lamination direction. A holding member for holding a laminated body in which a plurality of substrate constituting bodies constituting the laminated substrate and an adhesive member for bonding the substrate constituting bodies are laminated;
An interposed plate that is disposed on at least one side in the stacking direction of the stacked body, and the opposing surface of the stacked body and the opposite surface of the facing surface have a symmetrical convex shape with respect to the center line in the thickness direction ;
A pressure member that pressurizes the laminated body and the interposition plate in the laminating direction and adheres the substrate structure by the adhesive member;
An apparatus for manufacturing a multilayer substrate.