JP2013211388A - Manufacturing method of multilayer wiring board and jig for pressure regulation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board which can be applied for general purposes at a lower cost while ensuring high plate thickness accuracy, and to provide a pressure regulation jig during press molding used in this manufacturing method.SOLUTION: In the manufacturing method of a multilayer wiring board including a step for holding both sides of a molded object superposing a wiring board and an adhesive material for lamination by means of a lamination jig, and press molding the entirety while holding by means of a heating platen, press molding is carried out by disposing a planar pressure regulation jig smaller than the molded object, between the lamination jig and heating platen, in a region corresponding to the molded object.

Description

  The present invention relates to a method for manufacturing a multilayer wiring board and a pressure adjusting jig during press molding, and more particularly to a method for manufacturing a multilayer wiring board having a highly accurate thickness distribution and a pressure adjusting jig used in the manufacturing method. .

  In general, the thickness of the multilayer wiring board tends to be thicker at the center and thinner at the outer periphery due to the resin flow of the prepreg during press molding (hereinafter referred to as a board in a single multilayer wiring board). The maximum and minimum deviation of thickness is called thickness deviation.) Since the number of prepregs to be stacked increases as the number of layers increases, the thickness deviation tends to increase with the increase in the number of layers of wiring boards due to the recent increase in the density of electronic devices. When the plate thickness deviation is large, in the manufacturing process after the press forming of the multilayer wiring board, there is a concern that the processing accuracy and quality are deteriorated due to the non-uniform thickness. In addition, after the completion of the multilayer wiring board, it may be considered to adversely affect the yield and the like when components are mounted on the surface of the multilayer wiring board. From these things, reduction of thickness deviation is calculated | required.

  Conventional techniques for reducing the thickness deviation of multilayer wiring boards include the use of a frame member installed around the object to be molded, which restricts the fluidity of the prepreg resin during press molding to a low level, or heats the prepreg in advance. Methods have been proposed in which the fluidity of the resin is reduced by proceeding with curing by treatment (Patent Documents 1 and 2). In addition, a method has been proposed in which the resin flows sequentially from the center by providing a thermal gradient from the center to the outer periphery of the temperature distribution of the press machine, which is a heat supply source during heating (Patent Document 3). . Further, a method has been proposed in which uniform pressurization and local pressurization are performed and molding is performed with high accuracy by controlling the pressurizing force with a heating medium filled in a container provided on a hot platen of a press machine (Patent Document 4). 5). Further, a method for preventing a reduction in the thickness of the peripheral edge of the substrate by making the peripheral edge of the molding plate used in the press thinner than the central part and increasing the resin content of the prepreg at the peripheral edge from the central part. Has been proposed (Patent Document 6). Furthermore, a method has been proposed in which a plate-like pressure adjusting jig having a size smaller than that of the molding is placed between a laminating jig and a heating plate in a region corresponding to the molding to be press-molded. (Patent Document 7).

JP 2003-298241 A JP-A-6-152131 Japanese Patent Laid-Open No. 5-121876 Japanese Unexamined Patent Publication No. 7-195391 JP-A-8-192300 Japanese Patent Laid-Open No. 8-198982 JP 2011-014597 A

  However, in the method of reducing the fluidity of the resin described in Patent Documents 1 and 2, there is a risk that the molding performance for filling the gaps between the conductors is lowered and voids remain between the conductors. In addition, as in Patent Documents 3 to 5, a special press machine is required to give a thermal gradient to the press machine heat plate or to control the pressurizing force locally, which requires a large amount of cost. There was a problem. Moreover, in patent document 6, the exclusive shaping | molding plate which adjusted board thickness deviation is required, and the special prepreg which adjusted resin content is needed, and there exists a problem that versatility is scarce. Further, in Patent Document 7, since the thickness of the entire multilayer wiring board as a product is not necessarily uniform, depending on the multilayer wiring board to be applied, the required uniformity of the board thickness may not be obtained. there were. In particular, in a multilayer wiring board for a semiconductor tester, a needle stand area in which an inspection needle is arranged is provided in a disk shape in the central area of the multilayer wiring board. If the height is large, the heights of the tips of the inspection needles become uneven, which may hinder semiconductor inspection.

  The present invention has been made in view of the above problems, and by applying a pressure adjusting jig to a multilayer wiring board for a semiconductor tester, the inclination of a needle stand region in which a needle for inspection is arranged is suppressed. The present invention provides a method for manufacturing a multilayer wiring board and a pressure adjusting jig used therefor, capable of suppressing problems in inspection caused by uneven heights of tips of inspection needles.

The present invention relates to the following.
1. A method of manufacturing a multilayer wiring board for a semiconductor tester, comprising the steps of sandwiching both sides of a molded article in which a wiring board and an adhesive material for multilayering are stacked with a laminating jig, and further press-molding the whole with a heating platen In the press molding step, the support has a pressure adjusting body laminated on the support, and the pressure adjusting body is smaller than the support and becomes smaller as the upper layer is formed. A multilayer wiring board for a semiconductor tester in which a pressure adjusting jig laminated in a step shape is placed between the laminating jig and a heating plate in a region corresponding to the object to be molded and press-molded. Production method.
2. Item 2. The method of manufacturing a multilayer wiring board for a semiconductor tester according to Item 1, wherein the multilayer wiring board for a semiconductor tester has a needle stand region at a central portion where a needle for semiconductor inspection is arranged.
3. Item 3. The method for manufacturing a multilayer wiring board according to Item 1 or 2, wherein the needle holder region is circular.
4). The pressure adjusting jig used in the method for manufacturing a multilayer wiring board according to any one of Items 1 to 3, wherein an adhesive and a covering larger than the pressure adjusting body are provided on the pressure adjusting body, and the covering Pressure adjusting jig that integrates the pressure adjusting body and the support.
5. Item 5. The pressure adjusting jig according to Item 4, wherein the size of the uppermost pressure adjusting body stacked stepwise corresponds to the needle holder region of the multilayer wiring board.
6). Item 6. The pressure adjusting jig according to Item 4 or 5, wherein the total thickness of the stacked pressure adjusting bodies is 105 to 175 μm.
7). Item 7. The pressure adjusting jig according to any one of Items 4 to 6, wherein the support is a copper clad laminate, and the pressure adjusting body and the covering are metal foil.

  According to the present invention, by applying a pressure adjusting jig to a multilayer wiring board for a semiconductor tester, it is possible to suppress the inclination of the needle stand region in which the inspection needle is disposed and to increase the height of the tip of the inspection needle. It is possible to provide a method for manufacturing a multilayer wiring board and a pressure adjusting jig used therefor, which can suppress problems in inspection due to unevenness of the length.

Sectional drawing which isolate | separated and showed the structural member the manufacturing method of the multilayer wiring board of this invention, and the usage method of the jig for pressure adjustment. The top view of the jig | tool for pressure adjustment of the shape used by the manufacturing method of this invention in which the center part of a board | substrate is thick and becomes thin in steps toward a peripheral part. Sectional drawing of the jig for pressure adjustment of the shape used in the manufacturing method of this invention in which the board | substrate center part is thick and becomes thin in steps toward a peripheral part.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 3.

  As shown in FIG. 1, the present invention sandwiches the upper and lower sides of a molded article 1 in which a wiring board and a multi-layered adhesive material such as a prepreg are stacked with a lamination jig 7 (end plate 2 and lamination jig board 3), A method of manufacturing a multilayer wiring board for a semiconductor tester having a step of press molding by sandwiching the entirety of the whole with a heating platen, and in the step of press molding, a support and a laminate are formed on the support. A pressure adjusting jig 4 which is smaller than the support and is stacked stepwise so as to become smaller as it becomes an upper layer, corresponding to the object to be molded. This is a method for manufacturing a multilayer wiring board for a semiconductor tester which is placed between the laminating jig 7 and the heating plate 6 in a region and press-molded.

  In the present invention, the wiring substrate refers to an inner layer substrate for multilayering in which a conductor circuit is formed on an insulating substrate. As a wiring board, for example, a substrate having a conductor circuit formed by etching a copper foil of a copper clad laminate, or a shield layer having a conductor circuit formed by etching a copper foil bonded on a wiring board A wiring board etc. are mentioned. The wiring board refers to a sheet in which a wiring pattern is formed on an adhesive sheet bonded on a wiring core board. The wiring core board is a state in which a prepreg is bonded to both sides of a board on which a conductor circuit is formed. Say things. A multilayer wiring board is formed by pressing a multilayer adhesive material such as a prepreg between a plurality of wiring boards.

  The multi-layer adhesive material is used for multi-layer bonding of wiring substrates when a plurality of wiring substrates are laminated to form a multilayer wiring board, and a prepreg using glass fiber as a reinforcing material can be used. .

  The object 1 is multi-layer bonded by press molding or the like. In the present invention, the multi-layer adhesive material is sandwiched and stacked between a plurality of wiring boards for press molding. The one in the configured state.

  The laminating jig 7 includes the end plate 2 and the laminating jig plate 3, keeps the press surface smooth and transmits heat from the heating platen 6, and shifts the position of the wiring board and the multilayered adhesive material. This is prevented by a guide pin or the like of the laminated jig plate 3.

  The end plate 2 keeps the press surface smooth and transmits heat from the hot platen 6, for example, a stainless steel plate having a thickness of about 1.2 mm, which is usually used in the manufacturing process of a multilayer wiring board. Can be used. The end plate 2 is arranged so as to sandwich both the upper and lower sides of the whole molding object 1 in which a plurality of wiring boards and a multi-layer adhesive material are stacked, and the upper and lower end panels 2 sandwiching the molding object 1 are further arranged. It arrange | positions so that the lamination jig board 3 mentioned later may be in the state pinched | interposed from the up-and-down both sides.

  The laminated jig plate 3 prevents the displacement of the wiring board and the multilayer adhesive material by the guide pins of the laminated jig plate 3 and transmits heat from the hot platen 6. It is ˜12 mm thick and is mainly made of special stainless steel (SUS630 etc.). It arrange | positions so that the up-and-down both sides of the end plate 2 provided in the upper and lower sides of the whole to-be-molded object 1 may be pinched | interposed. Press molding is performed by heating and pressurizing the molding 1 in a sandwiched state.

  The hot platen 6 is generally a member attached to a press used in the press molding process, and sandwiches the entire stacking jig 7 (the stacking jig plate 3 and the end plate 2) and the object to be molded. 7, the object to be molded is heated and pressurized.

  The step of press molding is one of the manufacturing processes of the multilayer wiring board, and is a step of superimposing the wiring board and the multilayered adhesive material, and heating and pressurizing them using a press or the like to integrate them. .

  The multilayer wiring board for a semiconductor tester is a multilayer wiring board used to constitute a tester for testing a semiconductor, and an inspection needle to be brought into contact with a semiconductor electrode to be inspected is arranged. A needle holder region 10 is provided. When the needle holder region 10 is disposed at the central portion of the multilayer wiring board for the semiconductor tester, the pressure adjusting body 9 of the pressure adjusting jig 4 to be described later is connected to the central portion of the multilayer wiring board corresponding to the needle holder region 10. It is preferable that the needle holder region 10 is easily flattened by being placed in a press molding. Further, it is more preferable that the needle holder region 10 is circular because the pressure adjusting body 9 of the pressure adjusting jig 4 corresponding to the needle holder region 10 may be circular.

  The pressure adjusting jig 4 adjusts the distribution of pressure applied to the molding 1 from the heating plate via the laminating jig 7 (the laminating jig plate 3 and the end plate 2). As a material of the pressure adjusting jig 4 of the present invention, any material such as a metal material or a resin material can be used as long as it has heat resistance capable of withstanding the press temperature. If the stainless steel material is a metal material, and the copper-clad laminate or copper foil is a multilayer substrate material that is the molding object 1, the thermal conductivity is close to that of the molding object 1, and the temperature distribution during lamination is Since there is little influence, it becomes possible to apply the conventional press temperature conditions.

  As shown in FIG. 1, the method for manufacturing a multilayer wiring board of the present invention includes a support 8 and a pressure adjusting body 9 laminated on the support 8 in the step of press molding. The body 9 is smaller than the support 8 and is stacked in a stepped manner so as to become smaller as it becomes an upper layer, and the pressure adjusting jig 4 is connected to the stacking jig 7 in the region corresponding to the molding 1. It press-molds by arrange | positioning between the hot plates 6. As described above, in the present invention, the pressure adjustment prepared separately is not applied to the laminating jig 7 (the laminating jig plate 3 and the end plate 2) and the heating plate 6 itself used in the press molding process. By using the jig 4 for use, the pressure distribution to the article 1 during press molding is adjusted. For this reason, the conventionally used stacking jig 7 and hot platen 6 can be used as they are, and the pressure adjusting jig 4 can be manufactured inexpensively and easily using a general-purpose material, so that it can be manufactured at a lower cost. Applicable universally. Further, by using the rigid support 8, even if the pressure adjusting body 9 is thin, the rigidity of the pressure adjusting jig 4 as a whole can be secured, so that handling becomes easy.

  The support 8 used for the pressure adjusting jig 4 is for supporting the pressure adjusting body 9, and it is preferable to use a plate-like body having rigidity necessary for handling and having a uniform thickness. Further, the pressure adjusting body 9 is arranged so as to be convex on the support 8 and actually adjusts the pressure in the press formation. In order to enable fine pressure adjustment, a sheet-like one thinner than the support 8 is preferable. As the support 8 and the pressure adjuster 9, any material such as a metal material or a resin material can be used as long as it is a material having heat resistance capable of withstanding the press temperature. The use of a tension laminate or copper foil is advantageous from the viewpoint of cost and workability.

  In the press molding process, when the pressure adjusting jig 4 is sandwiched between the hot platen 6 and the laminating jig 7 of the press machine, the pressure adjusting jig 4 and the hot platen 6 The cushion material 5 is disposed between them. As the cushion material 5, a material generally used in a step of press-molding a multilayer wiring board such as paper or a resin sheet can be used. The thickness of the cushion material 5 is desirably about 1.5 to 5 times thicker than the entire thickness of the pressure adjusting body 9 of the pressure adjusting jig 4. Thereby, it is possible to prevent the heating platen 6 from being damaged or deformed by a step or the like at the end of the pressure adjusting body 9 of the pressure adjusting jig 4, and the cushion material 5 is deformed even if there is a step. Therefore, the pressure and heat from the hot platen 6 can be transmitted to the workpiece 1 through the pressure adjusting jig 4 and the stacking jig 7.

  If the total thickness of the pressure adjusting body 9 of the pressure adjusting jig 4 is equal to or less than the thickness of the cushion material 5 to be used together, for example, about 105 to 175 μm, the plate thickness in the needle stand region 10 of the multilayer wiring board after press molding. This is preferable because the heating platen 6 and the laminating jig 7 are not deformed.

  As shown in FIGS. 2 and 3, the plate-like pressure adjusting jig 4 has a support 8 and a pressure adjusting body 9 stacked on the support 8, and the pressure adjusting body 9 is The layers are stacked in a stepped manner so as to be smaller than the support 8 and smaller as it becomes an upper layer. The pressure adjusting body 9 is preferably formed by stacking a plurality of plate-like bodies having the same shape, thickness, and material but different in size. As a result, even when the pressure adjusting jig 4 is manufactured by bonding a plurality of pressure adjusting jigs 4, a necessary number of plate-like bodies having a uniform thickness can be cut out and bonded together. Therefore, the production is simple. In addition, the pressure adjusting jig 4 having a distribution in thickness can be easily manufactured by changing the thickness in steps for a desired region. When the thickness of the pressure adjusting jig 4 is thus distributed, the pressure can be finely adjusted in the surface where the press molding is performed, so that it is uniform over the entire surface of the molding 1. A plate thickness can be obtained. As the shape of the thickness distribution, for example, as shown in FIG. 2 and FIG. 3, if the shape gradually decreases from the central part to the peripheral part of the molding 1, the resin from the central part to the peripheral part is used. Therefore, the thickness of the center part and the peripheral part of the molding 1 can be made uniform. In addition, for example, if the portion where the thickness is thick due to the denseness of the wires in the multi-wire wiring board is selectively set to a high pressure compared to the portion where the wire is sparse, the plate where the wire is dense and the portion where the wire is sparse The thickness difference can be reduced. For this reason, it becomes possible to control the resin flow of the molding 1 in a desired region, and the thickness accuracy can be improved even when the multilayer wiring board is press-molded.

  As shown in FIG. 2 and FIG. 3, the plate-like pressure adjusting jig 4 is thinned in a stepped manner from the central portion toward the end portion by stacking the central portions in order of size. It is desirable to form so that it becomes. Thereby, since the pressure applied to the central portion of the molding 1 is larger and the pressure applied to the peripheral portion of the molding 1 is smaller, the central portion of the molding 1 having a small resin flow and the periphery having a large resin flow. The difference in the resin flow of the part can be reduced, and the thickness of the multilayer wiring board which is the molding 1 after press molding can be made uniform.

  As shown in FIGS. 2 and 3, an adhesive 11 and a covering body 12 larger than the pressure adjusting body 9 are provided on the pressure adjusting body 9, and the covering body 12, the pressure adjusting body 9 and the support body 8 are integrated. It is desirable to use the pressure adjusting jig 4 that has been converted into a pressure. Thereby, it is not necessary to arrange | position the support body 8 and the pressure adjustment body 9 in piles for every press molding, and since these can be handled as an integrated jig, workability | operativity improves. It is more preferable to use a copper-clad laminate as a support and a metal foil as a pressure regulator and a covering because it can withstand the heat of press molding and has good thermal conductivity.

  As shown in FIGS. 2 and 3, in the plate-like pressure adjusting jig 4, the size of the uppermost pressure adjusting body 9 stacked in a step shape corresponds to the needle stand region 10 of the multilayer wiring board. It is desirable to set as follows. As a result, the needle holder region 10 requiring flatness is pushed by the most protruding pressure adjusting body 9 and is easily flattened by preferentially applying pressure. For this reason, the needle holder region 10 can be flattened.

  The shape of the plate-like pressure adjusting jig 4 is desirably a shape that is symmetrical from the center of the molding 1 such as a circle, an ellipse, or a quadrangle. As a result, the wiring substrate or multilayer adhesive material as the molding 1 is often either a circle, an ellipse, or a quadrangle. Therefore, the resin flow of a general multilayer adhesive material such as a prepreg can be reduced. In accordance with the shape of the molded product 1, it can be controlled from the central portion toward the peripheral portion. For this reason, even if it is a multilayer wiring board, a uniform board thickness can be obtained over the whole and board thickness precision can be improved. Note that the shape of the pressure adjusting jig 4 is not limited to a circular shape, an elliptical shape, or a rectangular shape, and may be an arbitrary shape according to the resin fluidity and the wiring pattern of the article 1.

  Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to the examples.

Example 1
As a material for the wiring board, MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a copper-clad laminate, having a substrate size of 510 mm × 615 mm, a resin thickness of 0.10 mm, and a copper foil thickness of 35 μm was used. On both surfaces of the copper-clad laminate, a conductor circuit serving as an inner layer circuit was formed by resist film laminating, baking, developing, and etching processes to obtain a wiring substrate serving as an inner layer substrate. The inner layer circuit was a pattern with a remaining copper ratio of 84% in which a clearance was disposed on the solid copper foil. This operation was performed for 21 sheets, and 21 wiring boards were produced.

  Subsequently, by a pin lamination method, a wiring board, glass epoxy prepreg GEA-679N (trade name, manufactured by Hitachi Chemical Co., Ltd.), high Tg (Tg indicates a glass transition point), and a thickness of 0.06 mm, electrolytic Copper article YGP-18 (manufactured by Nippon Electrolytic Co., Ltd., trade name) was stacked to form object 1. The order of the configuration for press molding is as follows. First, one electrolytic copper foil is placed, and two prepregs and one wiring board are alternately laminated thereon, so that a total of 21 wiring boards and prepreg 44 are formed. The sheets were stacked and finally the electrolytic copper foil was stacked.

  As shown in FIG. 1, the stacking jig 7 has a structure in which SUS301 plates having a thickness of 1.2 mm and a size of 540 mm × 640 mm are arranged on both the upper and lower sides outside the molding 1 as the end plate 2. As the jig plate 3, SUS630 plates having a thickness of 8.0 mm and a size of 540 mm × 640 mm were arranged on both upper and lower sides outside the end plate 2. Further, as the pressure adjusting jig 4, MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a resin thickness of 0.10 mm and a copper foil thickness of 18 μm cut to 510 mm × 615 mm is used as the support 8. At the center of the support 8, as the pressure adjusting body 9, a copper foil having a thickness of 18 μm cut into a circle having a diameter of 490 mm, a diameter of 360 mm, a diameter of 280 mm, and a diameter of 200 mm is aligned so that it becomes smaller as it becomes an upper layer. The adhesive material 11 (GIA-671N, thickness 0.05 mm, manufactured by Hitachi Chemical Co., Ltd., trade name) and the covering material 12 (copper foil having a thickness of 35 μm) are stacked thereon, and the vacuum press Using machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), heating plate temperature rising rate 6.0 ° C./min, maximum hot plate temperature 200 ° C., 200 ° C. holding time 120 minutes, surface pressure 2.0 MPa The It was prepared which was empty press molding. In addition, the size (circular with a diameter of 200 mm) of the uppermost pressure adjusting body 9 stacked in a step shape was set so as to correspond to the needle stand region 10 (circular with a diameter of 200 mm) of the multilayer wiring board. This pressure adjusting jig 4 is arranged on both the upper and lower sides outside the central portion of the laminated jig plate 3, and further, as the cushion material 5, a paper cushion material KS190 having a thickness of 0.2 mm (trade name, manufactured by Oji Paper Co., Ltd.) ) Five sheets were arranged on both the upper and lower sides outside the pressure adjusting jig 4.

  Thereafter, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), a hot platen heating rate of 6.0 ° C / min, a maximum hot platen temperature of 200 ° C, a 200 ° C holding time of 120 minutes, a surface pressure. Multilayer adhesion was performed by vacuum press molding at 2.0 MPa. The multilayer wiring board after the multi-layer bonding is cut with a cut-and-saw at 5 mm on the short side of the substrate and 7.5 mm on the two long sides, the substrate size is 500 mm × 600 mm, the plate thickness is 6.2 mm, and the number of inner layers is 42. Multilayer wiring board.

(Example 2)
As the pressure adjusting jig 4, the size of the uppermost pressure adjusting body 9 stacked stepwise is a circle having a diameter of 150 mm and does not correspond to the needle holder region 10 (a circle having a diameter of 200 mm) of the multilayer wiring board. Set to. A multilayer wiring board was produced in the same manner as in Example 1 except for this.

(Example 3)
As a wiring board material, a copper-clad laminate MCL-I-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a substrate size of 510 mm × 610 mm, a resin thickness of 0.10 mm, and a copper foil thickness of 35 μm was used. On both surfaces of the copper-clad laminate, a conductor circuit serving as an inner layer circuit was formed by resist film laminating, baking, developing, and etching processes to obtain a wiring substrate serving as an inner layer substrate. The inner layer circuit was a pattern with a remaining copper ratio of 84% in which a clearance was disposed on the solid copper foil. This operation was performed for 15 sheets, and 15 wiring boards to be inner layer substrates were produced.

  Thereafter, 12 out of 15 sheets were stored as they were as the wiring board serving as the inner layer board, and a wiring board serving as a wiring board with a shield layer was produced using 3 out of the remaining 15 sheets.

  Fabrication of a wiring board to be a wiring board with a shield layer is as follows. First, a modified polyimide prepreg GIA-671N (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 0.03 mm is formed on both sides of the wiring board to be an inner layer board. Stack one sheet, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), hot plate heating rate 4.1 ° C./min, maximum hot plate temperature 175 ° C., 175 ° C. holding time 80 minutes, Bonding was performed by vacuum press molding at a surface pressure of 3.0 MPa to obtain a wired core substrate.

  An acrylic adhesive sheet AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 80 μm is laminated on both sides of the wiring core substrate using a roll laminator, and then a core wire is used using a numerical control wiring machine. An insulated wire HAW (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a diameter of 0.08 mm and having a polyimide coating layer was wired to prepare a wiring board. The wire pattern has a wiring length ratio per unit area of an area of one side of the square in the center of the substrate of 200 mm, an area of one side of the square of 200 mm to 400 mm, and an area of one side of the square from 400 mm to the outer periphery of the substrate. 1: 2.44: 0.14 pattern was used.

  Thereafter, two sheets of modified polyimide prepreg GIA-671N (manufactured by Hitachi Chemical Co., Ltd., trade name) having a thickness of 0.03 mm and electrolytic copper foil YGP-35 (manufactured by Nippon Electro Co., Ltd.) are provided on both upper and lower sides of the wiring board. , Product name) are stacked one on the other, and using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), the heating plate heating rate is 4.1 ° C./min, the maximum heating plate temperature is 175 ° C., 175 Bonding was performed by vacuum press molding at a holding pressure of 80 ° C. and a surface pressure of 3.0 MPa. Next, a shield layer pattern was formed on both sides in the same process as that for forming the inner layer circuit, and a wiring board to be a wiring board with a shield layer was produced. The shield layer pattern was a pattern with a residual copper ratio of 84% in which clearance was disposed on the solid copper foil, as in the case of the inner layer circuit.

  Subsequently, by a pin lamination method, a wiring board serving as an inner layer board, a wiring board serving as a wiring board with a shield layer, a modified polyimide prepreg GIA-671N having a thickness of 0.03 mm (trade name, manufactured by Hitachi Chemical Co., Ltd.), The molded object 1 was configured by stacking electrolytic copper foil YGP-18 (manufactured by Nippon Electrolytic Co., Ltd., trade name). The order of the configuration was such that three wiring boards serving as the inner layer board and one wiring board serving as the wiring board with the shield layer were repeatedly configured to form a multilayer structure. At that time, the two prepregs were formed between the respective wiring boards. Moreover, electrolytic copper foil YGP-18 (manufactured by Nippon Electrolytic Co., Ltd., product name) serving as an outer layer was formed on the upper and lower sides on the outermost side.

  As shown in FIG. 1, the stacking jig 7 has a structure in which SUS301 plates having a thickness of 1.2 mm and a size of 540 mm × 640 mm are arranged on both the upper and lower sides outside the molding 1 as the end plate 2. As the jig plate 3, SUS630 plates having a thickness of 8.0 mm and a size of 540 mm × 640 mm were arranged on both upper and lower sides outside the end plate 2. Further, as the pressure adjusting jig 4, the same one as in Example 1 was prepared. Further, the size (circular shape with a diameter of 200 mm) of the uppermost pressure adjusting body 9 stacked stepwise was set so as to correspond to the needle stand region 10 (circular shape with a diameter of 200 mm) of the multilayer wiring board. This pressure adjusting jig 4 is arranged on both the upper and lower sides outside the central portion of the laminated jig plate 3, and further, as a cushion material 5, KS190 (trade name, manufactured by Oji Paper Co., Ltd.) having a thickness of 0.2 mm Were arranged on both upper and lower sides outside the pressure adjusting jig 4.

  Thereafter, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), a hot platen heating rate of 4.1 ° C./minute, a maximum hot platen temperature of 175 ° C., a 175 ° C. holding time of 80 minutes, a surface pressure. Multilayer adhesion was performed by vacuum press molding at 4.0 MPa. The multilayer wiring board after the multi-layer bonding is cut with a cut-and-saw at 5 mm each on the four sides of the substrate, the substrate size is 500 mm × 600 mm, the plate thickness is 6.3 mm, the number of inner layers is 36 layers, and the number of wiring layers is 6 A multilayer multi-wire wiring board was obtained.

Example 4
As the pressure adjusting jig 4, the size of the uppermost pressure adjusting body 9 stacked stepwise is a circle having a diameter of 150 mm and does not correspond to the needle holder region 10 (a circle having a diameter of 200 mm) of the multilayer wiring board. Set to. A multilayer wiring board was produced in the same manner as in Example 2 except for this.

(Comparative Example 1)
A substrate was produced in the same manner as in Example 1 except that the pressure adjusting jig 4 was not installed outside the lamination jig 7 in the configuration at the time of press molding.

(Comparative Example 2)
A substrate was produced in the same manner as in Example 2 except that the pressure adjusting jig 4 was not installed outside the lamination jig 7 in the press configuration.

  Table 1 shows the results of measuring the thicknesses of the multilayer wiring boards and multilayer multi-wire wiring boards manufactured in Examples 1 to 4 and Comparative Examples 1 and 2 using a board thickness measurement system (manufactured by Keyence Corporation) using a CCD laser displacement meter. 1 and Table 2. Table 1 shows measured values for the entire final size (500 mm × 600 mm) as a product of the multilayer multi-wire wiring board. The plate thickness measurement points were in the form of a grid with an interval of 50 mm (total of 143 points, 11 points in the 500 mm direction and 13 points in the 600 mm direction). Table 2 shows the measured values for the needle holder region (diameter 200 mm). The plate thickness measurement points were in the form of a grid with an interval of 50 mm. When Examples 1 and 2 are compared with Comparative Example 1, and Examples 3 and 4 are compared with Comparative Example 2, respectively, the Examples using the pressure adjusting jig 4 have the pressure adjusting jig 4 installed. It was found that the plate thickness deviation (maximum-minimum of plate thickness) was smaller than that of the comparative example, and the plate thickness accuracy as a multilayer wiring board was excellent.

DESCRIPTION OF SYMBOLS 1 ... Molding object 2 ... End plate 3 ... Lamination jig board 4 ... Pressure adjustment jig 5 ... Cushion material 6 ... Heating board 7 ... Lamination jig 8 ... Support body 9 ... Pressure adjustment body 10 ... Needle stand area 11 ... Adhesive 12 ... cover

Claims (7)

  A method of manufacturing a multilayer wiring board for a semiconductor tester, comprising the steps of sandwiching both sides of a molded article in which a wiring board and an adhesive material for multilayering are stacked with a laminating jig, and further press-molding the whole with a heating platen In the press molding step, the support has a pressure adjusting body laminated on the support, and the pressure adjusting body is smaller than the support and becomes smaller as the upper layer is formed. A multilayer wiring board for a semiconductor tester in which a pressure adjusting jig laminated in a step shape is placed between the laminating jig and a heating plate in a region corresponding to the object to be molded and press-molded. Production method.   2. The method of manufacturing a multilayer wiring board for a semiconductor tester according to claim 1, wherein the multilayer wiring board for a semiconductor tester has a needle stand region in a central portion where a needle for semiconductor inspection is arranged.   The method for manufacturing a multilayer wiring board according to claim 1 or 2, wherein the needle holder region is circular.   A pressure adjusting jig used in the method for manufacturing a multilayer wiring board according to any one of claims 1 to 3, wherein an adhesive material and a covering body larger than the pressure adjusting body are provided on the pressure adjusting body, and the covering Pressure adjusting jig that integrates the body, pressure adjusting body and support.   5. The pressure adjusting jig according to claim 4, wherein a size of the uppermost pressure adjusting body stacked in a step shape is set so as to correspond to a needle stand region of the multilayer wiring board.   The jig for pressure adjustment according to claim 4 or 5, wherein the total thickness of the laminated pressure adjusting bodies is 105 to 175 µm.   The pressure adjusting jig according to any one of claims 4 to 6, wherein the support is a copper clad laminate, and the pressure adjusting body and the covering are metal foils.

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