JP5872409B2 - 金属充填装置 - Google Patents

金属充填装置 Download PDF

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Publication number
JP5872409B2
JP5872409B2 JP2012167592A JP2012167592A JP5872409B2 JP 5872409 B2 JP5872409 B2 JP 5872409B2 JP 2012167592 A JP2012167592 A JP 2012167592A JP 2012167592 A JP2012167592 A JP 2012167592A JP 5872409 B2 JP5872409 B2 JP 5872409B2
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Japan
Prior art keywords
molten metal
metal
processed
pressing
semiconductor wafer
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Expired - Fee Related
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JP2012167592A
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English (en)
Japanese (ja)
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JP2013077806A (ja
Inventor
山口　征隆
征隆 山口
敏二 滝川
敏二 滝川
利泰 速水
利泰 速水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
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Sumitomo Precision Products Co Ltd
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Priority to JP2012167592A priority Critical patent/JP5872409B2/ja
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Publication of JP5872409B2 publication Critical patent/JP5872409B2/ja
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012167592A 2011-09-14 2012-07-27 金属充填装置 Expired - Fee Related JP5872409B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012167592A JP5872409B2 (ja) 2011-09-14 2012-07-27 金属充填装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011200093 2011-09-14
JP2011200093 2011-09-14
JP2012167592A JP5872409B2 (ja) 2011-09-14 2012-07-27 金属充填装置

Publications (2)

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JP2013077806A JP2013077806A (ja) 2013-04-25
JP5872409B2 true JP5872409B2 (ja) 2016-03-01

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ID=48481037

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012167592A Expired - Fee Related JP5872409B2 (ja) 2011-09-14 2012-07-27 金属充填装置
JP2013115832A Expired - Fee Related JP5952778B2 (ja) 2011-09-14 2013-05-31 金属充填装置

Family Applications After (1)

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JP2013115832A Expired - Fee Related JP5952778B2 (ja) 2011-09-14 2013-05-31 金属充填装置

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JP (2) JP5872409B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6404745B2 (ja) * 2015-02-25 2018-10-17 住友精密工業株式会社 液状物充填装置
JP6466735B2 (ja) * 2015-02-25 2019-02-06 住友精密工業株式会社 充填装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3488586B2 (ja) * 1996-12-24 2004-01-19 株式会社東芝 半導体装置の製造方法
JP2002368083A (ja) * 2001-06-08 2002-12-20 Fujikura Ltd 微細空間への金属充填方法および装置
JP4186545B2 (ja) * 2002-08-06 2008-11-26 住友電気工業株式会社 成形用金型
US7449067B2 (en) * 2003-11-03 2008-11-11 International Business Machines Corporation Method and apparatus for filling vias
US7966966B2 (en) * 2005-07-29 2011-06-28 Mikado Technos Co., Ltd. Vacuum high pressure filling equipment
JP4694358B2 (ja) * 2005-11-30 2011-06-08 トヨタ自動車株式会社 鋳造方法と鋳造型の製造方法
JP4505540B1 (ja) * 2009-06-02 2010-07-21 有限会社ナプラ 金属充填装置

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Publication number Publication date
JP5952778B2 (ja) 2016-07-13
JP2013179350A (ja) 2013-09-09
JP2013077806A (ja) 2013-04-25

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