JP5872409B2 - 金属充填装置 - Google Patents
金属充填装置 Download PDFInfo
- Publication number
- JP5872409B2 JP5872409B2 JP2012167592A JP2012167592A JP5872409B2 JP 5872409 B2 JP5872409 B2 JP 5872409B2 JP 2012167592 A JP2012167592 A JP 2012167592A JP 2012167592 A JP2012167592 A JP 2012167592A JP 5872409 B2 JP5872409 B2 JP 5872409B2
- Authority
- JP
- Japan
- Prior art keywords
- molten metal
- metal
- processed
- pressing
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title claims description 316
- 229910052751 metal Inorganic materials 0.000 title claims description 316
- 238000003825 pressing Methods 0.000 claims description 144
- 238000012545 processing Methods 0.000 claims description 66
- 238000007789 sealing Methods 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 8
- 238000013459 approach Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 103
- 239000004065 semiconductor Substances 0.000 description 98
- 239000007789 gas Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 10
- 238000011084 recovery Methods 0.000 description 8
- 238000005336 cracking Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005429 filling process Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012167592A JP5872409B2 (ja) | 2011-09-14 | 2012-07-27 | 金属充填装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011200093 | 2011-09-14 | ||
| JP2011200093 | 2011-09-14 | ||
| JP2012167592A JP5872409B2 (ja) | 2011-09-14 | 2012-07-27 | 金属充填装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013077806A JP2013077806A (ja) | 2013-04-25 |
| JP5872409B2 true JP5872409B2 (ja) | 2016-03-01 |
Family
ID=48481037
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012167592A Expired - Fee Related JP5872409B2 (ja) | 2011-09-14 | 2012-07-27 | 金属充填装置 |
| JP2013115832A Expired - Fee Related JP5952778B2 (ja) | 2011-09-14 | 2013-05-31 | 金属充填装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013115832A Expired - Fee Related JP5952778B2 (ja) | 2011-09-14 | 2013-05-31 | 金属充填装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP5872409B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6404745B2 (ja) * | 2015-02-25 | 2018-10-17 | 住友精密工業株式会社 | 液状物充填装置 |
| JP6466735B2 (ja) * | 2015-02-25 | 2019-02-06 | 住友精密工業株式会社 | 充填装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3488586B2 (ja) * | 1996-12-24 | 2004-01-19 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2002368083A (ja) * | 2001-06-08 | 2002-12-20 | Fujikura Ltd | 微細空間への金属充填方法および装置 |
| JP4186545B2 (ja) * | 2002-08-06 | 2008-11-26 | 住友電気工業株式会社 | 成形用金型 |
| US7449067B2 (en) * | 2003-11-03 | 2008-11-11 | International Business Machines Corporation | Method and apparatus for filling vias |
| WO2007013212A1 (ja) * | 2005-07-29 | 2007-02-01 | Mikado Technos Co., Ltd. | 真空高圧充填装置 |
| JP4694358B2 (ja) * | 2005-11-30 | 2011-06-08 | トヨタ自動車株式会社 | 鋳造方法と鋳造型の製造方法 |
| JP4505540B1 (ja) * | 2009-06-02 | 2010-07-21 | 有限会社ナプラ | 金属充填装置 |
-
2012
- 2012-07-27 JP JP2012167592A patent/JP5872409B2/ja not_active Expired - Fee Related
-
2013
- 2013-05-31 JP JP2013115832A patent/JP5952778B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5952778B2 (ja) | 2016-07-13 |
| JP2013179350A (ja) | 2013-09-09 |
| JP2013077806A (ja) | 2013-04-25 |
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