JP5871656B2 - Coating device and component mounting system - Google Patents

Description

  The present invention relates to a semiconductor manufacturing technique. The present invention particularly relates to a technique for bonding a semiconductor chip to a substrate, and more particularly to a coating apparatus that applies a paste (bonding material) to a substrate and an electronic component mounting apparatus using the same.

  The electronic component mounting process in the semiconductor manufacturing process includes a paste application process for applying a paste to a substrate such as a lead frame, and an electronic component mounting process for bonding the substrate and the semiconductor chip thereafter.

  A coating apparatus is used in the paste coating process for coating the paste, and the coating apparatus guides the paste discharged from the dispenser to the coating nozzle and coats it in the coating area of the substrate. As one of the coating methods, drawing coating is known in which paste coating is performed by drawing a coating line with a coating nozzle. In this drawing application, the application nozzle is moved in accordance with a paste application pattern set according to the chip shape and size to be bonded. As a mechanism for moving the coating nozzle, a moving mechanism including an XYZ table that performs a three-dimensional motion by combining a linear motion mechanism has been used.

  Japanese Patent Laid-Open No. 2001-217263 (Patent Document 1) discloses a moving mechanism that includes a linear motion mechanism that uses a drive motor and a feed screw as a moving mechanism that moves an application nozzle. A configuration is disclosed in which only a movable part is moved by fixedly arranging driving means for each axis by slidably configuring a coupling mechanism between the movable part and a driving means for driving these movable parts. Other techniques include Patent Documents 2 to 4.

JP 2001-217263 A JP-A-11-297719 JP 2002-110709 A JP 2011-110524 A

  In order to improve productivity in an electronic component mounting apparatus, the efficiency of drawing application by high-speed movement of an application nozzle is required. A moving mechanism such as an XYZ table using a conventional linear motion mechanism is generally used in combination with a single-axis linear motion mechanism. That is, what is disclosed as the prior art is a configuration in which one linear motion mechanism that directly holds the application nozzle and moves it in one axial direction is moved in another direction by another linear motion mechanism. Therefore, in the prior art, when the entire X direction linear motion mechanism is driven by the Z direction linear motion mechanism, the entire XZ direction linear motion mechanism is driven by the Y direction linear motion mechanism. The drive load in the Z direction is larger than the drive load of the drive mechanism, and the drive load in the Y direction is larger than the drive load of the drive mechanism in the Z direction. In such an approach, even if the motor is increased in size to realize high-speed movement of the coating nozzle, the driving load increases due to the accompanying increase in weight, and it is difficult to move the coating nozzle at high speed. Found in the invention.

  Therefore, an object of the present invention is to provide a paste coating apparatus that can perform coating at higher speed than before.

  The present invention is characterized by converting the motion of the rotating body into two motions for applying paste.

  According to the present invention, it is possible to apply a paste at a higher speed than before.

The top view of an electronic component mounting system. The figure explaining the structure of the paste application | coating mechanism 100. FIG. The figure explaining the side view of the 1st drive mechanism 110. FIG. The figure explaining the front view of the 1st drive mechanism 110. FIG. The figure explaining the front view of the 1st drive mechanism 110 (continuation). The operation of the first drive mechanism 110 (particularly the relationship between the link means 50 and the application nozzle 41) will be described. The figure explaining the relationship between rotation of the 1st drive motor 20, and a motion of the application nozzle 41. FIG. The figure explaining the locus | trajectory which the front-end | tip of the application nozzle 41 draws. The figure explaining the relationship between rotation angle (theta) of the motor 20 for 1st drive, and the application nozzle 41 front-end | tip. The figure explaining the paste pattern drawn on a board | substrate. FIG. 6 is a diagram illustrating a second embodiment. The figure explaining arrange | positioning two or more mechanisms driven by a link structure in parallel.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view of the electronic component mounting system of the present embodiment, and FIG. 2 is a front view of a paste application mechanism.

  First, the configuration of the electronic component mounting apparatus will be described with reference to FIG. The movable table 300 includes a conveyor, and a substrate 400 is mounted on the movable table 300 and is conveyed from the upstream (left side in FIG. 1) in the direction indicated by the arrow (downstream). A paste application mechanism 100 that performs a paste application process from the upstream side is disposed on the side of the movable table 300, and an electronic component transfer mechanism 200 that performs an electronic component transfer process further downstream from the paste application mechanism 100. Has been placed.

  The paste application mechanism 100 draws and applies the paste on the substrate 400 positioned on the movable table 300 by moving the application nozzle 41 at the chip mounting position of the substrate 400.

  Next, the electronic component transfer mechanism 200 on the downstream side of the movable table 300 includes a wafer holding table 500, and a wafer sheet 510 on which a large number of chips 520 are attached is mounted on the wafer holding table 500. The transfer head 530 picks up the chip 520 on the wafer sheet 510 and transfers and mounts the chip on the paste applied to the substrate 400 on the movable table 300. The substrate 400 after mounting the chip is carried out to the downstream side by the transfer conveyor of the movable table 300.

  Next, the configuration of the paste application mechanism 100 will be described in detail with reference to FIG. The paste application mechanism 100 of this embodiment has an application nozzle 41 that applies paste to the substrate 400. The application nozzle 41 is connected to a dispenser 40 filled with paste. The dispenser 40 is connected to a link means 50 described later. In this embodiment, a moving mechanism for moving the coating nozzle 41 in three directions XYZ is provided. The application nozzle 41 is driven by the first drive mechanism 110 in the X direction, by the second drive mechanism 120 in the Y direction, and by the third drive mechanism 130 in the Z direction. More specifically, the first drive mechanism 110 can be expressed as including the link means 50. The third drive mechanism 130 connects the first drive mechanism 110 and the second drive mechanism 120.

  The structure of the first drive mechanism 110 will be described later. The second drive mechanism 120 includes a second drive motor 121 and a feed screw 122 driven by the second drive motor 121. The third drive mechanism 130 includes a base 134 connected to the feed screw 122, a feed screw 132 connected to the base 134, and a motor 131 for driving the feed screw 132. That is, the second drive mechanism 120 and the third drive mechanism 130 each constitute a rotation / linear motion mechanism. The second drive mechanism 120 is fixed to a holding unit (not shown).

  Next, the first drive mechanism 110 will be mainly described in detail with reference to FIGS. 3, 4, and 5. 3 is a side view of the first drive mechanism 110, and FIGS. 4 and 5 are front views of the first drive mechanism 110. FIG. The base plate 10 of the first drive mechanism 110 is fixed to the movable portion 133 of the rotation / linear motion mechanism of the third drive mechanism 130, and the first drive mechanism 110 is movable in the Z direction. Further, the first drive mechanism can be driven in the Y direction by the second drive mechanism 120.

  The first drive mechanism 110 is mainly composed of a first drive motor 20 connected to the base plate 10, a link means 50, a sliding member 30, and a rotation support member 60. A dispenser 40 for supplying the paste to the application nozzle 41 is connected to the first driving mechanism 110.

  The link means 50 will be described in detail. The link means 50 includes seven link members having different lengths of the links 50a to 50g (this link member can also be expressed as an arm), and a rotation support member 60 that rotatably connects the link members. Have. Here, for example, the links 50f and 50g are the first link, the link 50e is the second link, the link 50a and the link 50b are the third link, the link 50c is the fourth link, and the link 50d is the fifth link. It can also be expressed as a link.

  A link 50 f is fixed to the shaft of the first drive motor 20 fixed to the base plate 10, and a link 50 g having the same length as 50 f is held on the base plate 10 via a rotation support member 60. In addition, a fixed portion 31 of the sliding member 30 is disposed on the base plate 10 so as to be slidable in the Z direction, and the movable portion 32 of the sliding member 30 is fixed to the link 50d. For this reason, the link 50d can be translated in the Z direction. Further, a dispenser 40 is fixed to the link 50c, and an application nozzle 41 for applying a paste is fixed to the tip of the dispenser 40.

  By using the link means 50 and the sliding member 30 described above, the rotation of the first driving motor 20 causes the application nozzle 41 to move in the Z direction (for example, the first direction) and the X direction (for example, the second direction). ) To two movements. The link means 50 comprises a parallel link mechanism with the links 50a to 50e, and the links 50c, 50d and 50e move in parallel horizontally, so that the nozzle of the application nozzle 41 fixed to the link 50c is perpendicular to the application surface. Move as it is. The distance in the Z direction between the substrate and the tip of the application nozzle 41 is L1, and can be changed by the rotation of the first drive motor 20.

  FIG. 5 shows a state in which the first drive motor is driven to rotate 180 degrees. Since the application nozzle 41 is lowered in the Z direction by the link means 50 and the sliding member 30, the application nozzle 41 can approach the distance L2 with respect to the substrate 400. As described above, the distance between the tip of the application nozzle 41 and the substrate 400 can be changed between L1 and L2 by the rotational movement of the first drive motor 20.

  Next, the operation of the first drive mechanism 110 (particularly the relationship between the link means 50 and the application nozzle 41) will be described with reference to FIG. 6 shows a state in which the shaft of the first drive motor 20 has rotated by θ1, and the link means 50 is deformed from the state shown in FIG. 5 as shown in FIG. 6 by the rotational movement of the first drive motor 20. That is, the parallel link mechanism composed of the links 50a, 50b, 50c, 50d, and 50e causes the links 50a and 50b to incline around the rotation support member 60 of the link 50d, and the link 50c is parallel to the X direction in FIG. The link 50e moves in the -X direction in FIG. 6 in parallel. Further, the link 50e is lifted in the + Z direction of FIG. 6 by the inclination of the links 50f and 50g, so that the link 50d is translated in the + Z direction by s by the sliding of the movable portion 32 of the sliding member 30. Accordingly, the application nozzle 41 fixed to the link 50c moves in parallel in the X direction by + X1, and the Z direction moves only by the difference between the lowering of the link 50c due to the deformation of the link means 50 and the rising s of the link 50d. The distance between the tip of the nozzle 41 and the substrate 400 in the Z direction is L3 which is slightly changed from L2. Here, the link means 50 is configured symmetrically with the application nozzle 41 interposed therebetween, but the link means 50 does not necessarily have the configuration shown in FIGS. 4 to 6, and the movement of the first drive motor 20 is at least two. It is sufficient if it can be converted into a movement in the direction.

  Next, the relationship between the rotation of the first drive motor 20 and the movement of the application nozzle 41 will be described with reference to FIG. FIG. 7 shows a state in which the rotation angle of the first drive motor 20 is further rotated from θ1 in FIG. 6 to θ2. The application nozzle 41 translates in the X direction to X2 larger than X1 described in FIG. At the same time, the application nozzle 41 moves upward with respect to the substrate to L4 larger than L2 in FIG. 6 in the Z direction.

  As can be seen from the above, the amount of movement of the tip of the application nozzle 41 in the X direction and the Z direction depends on the rotation angle θ of the first drive motor 20 and the dimensions of the link means 50 (for example, the links 50f and 50g). Length a, length b from the rotation support member 601 connecting the link 50d to the rotation support member 602 connecting the link 50e, and length between the rotation support member 602 connecting the links 50a and 50c from the rotation support member 603 C). Therefore, the movement range L1 to L2 of the coating nozzle 41 in the Z direction is the length 2a.

  Further, such a relationship is that the amount of movement of the tip of the application nozzle 41 (for example, the amount of movement in the X direction and the Z direction) is at least the rotation angle θ of the first drive motor 20 and the dimensions of the link means 50. It can be expressed as a function related to one. That is, (1) if the dimension of the link means 50 is predetermined, the movement amount of the tip of the application nozzle 41 is a function of the rotation angle θ of the first drive motor 20. Further, (2) if the rotation angle θ of the first drive motor 20 is predetermined, the movement amount of the tip of the application nozzle 41 is a function of the dimension of the link means 50. Further, (3) if neither the dimension of the link means 50 nor the rotation angle θ of the first drive motor 20 is default (changes), the movement amount of the tip of the application nozzle 41 is a function of these two functions. Show.

  Next, the locus drawn by the tip of the application nozzle 41 will be described with reference to FIG. FIG. 8 shows a locus drawn by the application nozzle 41. As shown in FIG. 8, at the rotation angle θ of the first drive motor 20, it can be seen that there is a range X5 in which the amount of movement in the Z direction is minute and approximate horizontal movement in the X direction. Here, considering the paste application to the substrate 400, it is desirable that the distance in the Z direction from the application nozzle 41 to the substrate 400 is constant, but even if there is a variation in the Z direction, the variation amount is substantially in terms of mounting performance. If the fluctuation amount is fine without any problem, it can be considered that the paste can be sufficiently applied even if there is a fluctuation. When this is applied to FIG. 8, if the height variation ΔL5 is in a range where there is substantially no problem in applying the paste, X5 is the range in which the paste 400 is applied to the substrate. That is, it is shown that the first application motor 20 is driven forward and reverse, and the application nozzle 41 is moved approximately in the horizontal direction to sufficiently apply the paste. Further, drawing and coating can be freely performed by interlocking with the second drive mechanism 120 for moving the coating nozzle 41 in the Y direction. In addition, when the movement amount in the Z direction of the tip of the coating nozzle 41 is corrected using the third drive mechanism 130 for moving the coating nozzle 41 in the Z direction, more specifically, when the tip of the nozzle moves by ΔL5. If the movement amount in the Z direction is corrected by −ΔL5, the application nozzle 41 can be moved more precisely horizontally.

  Furthermore, the other side surface of this locus will be described. As shown in FIG. 8, the tip of the application nozzle 41 describes a trajectory in which the amount of movement in the Z direction suddenly increases due to the rotation of the first drive motor 20. For this reason, the operation of retracting the application nozzle 41 from the substrate 400 when moving to the next application location after applying the paste to the substrate 400 is usually unnecessary. Since the coating nozzle 41 of the present embodiment draws a trajectory that moves in the X and Z directions, the paste can be continuously applied to the substrate 400 by continuously rotating the first driving motor 20 in one direction. Become. Here, the applicable width X5 that moves approximately horizontally is determined by the dimensions of the link means 50 (for example, the link lengths a, b, and c described above). For this reason, by designing the link length in accordance with the paste application width to the substrate 400 to be used, the application nozzle 41 is approximately horizontally moved to apply the paste on the substrate 400, and Z is terminated at the end of the paste. It is possible to perform an ideal operation that can increase the rising angle α in the direction and prevent the excessive paste from being applied to the substrate 400.

  As described above, the configuration in which the application nozzle 41 draws a two-dimensional trajectory including approximate horizontal movement in the X direction (for example, a substantial circular movement in the XZ direction) enables the application of paste at a higher speed than before. It becomes. The trajectory of the application nozzle 41 shown in FIG. 8 is an example based on the link lengths a, b, and c described above. Depending on the setting of the link length, the approximate horizontal movement distance, the Z-direction movement amount, and the Z-direction elevation angle α can be changed, and are not limited to the illustrated locus.

  Next, the relationship between the rotation angle θ of the first drive motor 20 and the tip of the application nozzle 41 will be described. FIG. 9 is a diagram for explaining the relationship between the rotation angle θ of the first drive motor 20 and the tip of the application nozzle 41. Assuming that the link length b = c, the movement amount X of the coating nozzle 41 in the X direction has a relationship of X = a · sin θ. Therefore, if the rotation angle θ of the first drive motor 20 is a small angle, it can be approximated to a linear function represented by X = k · θ. From this, the rotation angle θ of the first drive motor 20 and the movement amount X of the coating nozzle 41 in the X direction have an approximate linear function relationship. For this reason, in the paste application operation on the substrate 400, the complex drawing application can be easily controlled by the first drive mechanism 110 in the X direction and the second drive mechanism 120 in the Y direction. Generally, the paste path for drawing application is composed of straight lines, and the smaller the error between the target application shape and the application state after applying the paste, the less misalignment occurs when the chip is mounted on the substrate. The easier the chip mounting accuracy can be improved. The ratio between the link lengths b and c indicates the amplification ratio of the movement amount of the coating nozzle 41, and the movement amount is amplified only in the X direction by c / b times.

  Next, how the paste pattern is drawn on the substrate 400 by the operation of the paste application mechanism 100 described above will be described. FIG. 10 is a diagram illustrating a paste pattern drawn on a substrate. As shown in FIG. 10, the paste application mechanism 100 of this embodiment can form a plurality of types of paste patterns on a substrate.

  First, the pattern a will be described. In this embodiment, the application nozzle 41 is in the order of a → b → c → a → d → e → a by the first drive mechanism 110 for moving in the X direction and the second drive mechanism 120 for moving in the Y direction. Then, an “X” -like paste pattern is formed on the substrate. In the formation of the pattern a, the amount of movement in the X and Y directions is constant. That is, the first and second drive mechanisms 110 and 120 in the X and Y directions are driven so that the amount of movement is constant. Since the first drive mechanism 110 is lighter than the second drive mechanism 120, the first drive mechanism 110 can operate at high speed. Therefore, drawing can be performed in a shorter time than when the application nozzle 41 is driven at substantially the same speed.

  Next, the pattern b will be described. The pattern b is a pattern obtained by rotating “W” counterclockwise by 90 °. In the case of pattern b, the application trajectory is a → b → c → d → e, and the first drive mechanism 110 capable of high-speed application with a long X-direction application movement amount with respect to the Y direction is actively used. Yes. Therefore, further high-speed application can be expected.

  There are other examples in which the first drive mechanism 110 is actively used. For example, pattern c. The pattern c is a pattern in which two rhombuses are adjacent to each other. In the case of the pattern c, the locus of application is a → b → c → d → e → f → g → a.

  The patterns a and b are more suitable for mounting the chip because air can escape from the chip when the chip is mounted on the pattern.

  The above paste pattern is an example, and other paste patterns are also conceivable. In addition to the above, high-speed coating can be similarly applied to a paste pattern in which the movement amount in the X direction is longer than the movement amount in the Y direction. In addition, although the coating shape with a short drawing distance can shorten the coating time, the mounting accuracy of the chip differs depending on the material of the paste, the viscosity, the shape of the electronic component to be mounted, and the like. Therefore, it is possible to select an optimum application shape and application operation in consideration of these conditions. With such a configuration, it becomes possible to apply the paste in a shorter time than conventional.

  Next, Example 2 will be described. In the second embodiment, differences from the first embodiment will be mainly described. FIG. 11 is a diagram for explaining the second embodiment. In the present embodiment, the first drive mechanism 110 shown in FIG. 5 is rotated 180 degrees with the arrangement of the dispenser 40 and the application nozzle 41 as it is, and the dispenser 40 and the application nozzle 41 are connected to the link 50c. In the present embodiment, the application locus of the application nozzle 41 is a locus obtained by rotating the application locus shown in FIG. 8 by 180 °. Therefore, the configuration of this embodiment can also be used as the first drive mechanism 110 in the X direction. In this configuration, since the minute movement in the Z direction during drawing application moves closer to the substrate 400, the distance between the substrate 400 and the application nozzle 41 becomes closer at the end where high application accuracy is required in the application operation. There is a merit that accuracy is hard to deteriorate.

  In addition, the application precision at the time of paste application | coating can be improved by using a lightweight and highly rigid material for the material of the link means 50. FIG. Further, a bearing may be used for the rotation support member 60 between the link members, or the link member 50 may be deformed by fixing the link members with a leaf spring and utilizing the deformation of the leaf spring.

  Further, the first drive mechanism 110 can be thinly configured except for the drive motor because of the link configuration. Therefore, as shown in FIG. 12, two or more mechanisms that are driven by a link configuration such as the first drive mechanism 110a and the first drive mechanism 110b may be arranged in parallel. In this case, the first drive mechanism 110a and the first drive mechanism 110b are connected by one first drive motor 20. In this case, it is possible to apply and paint continuously by the number of mechanisms driven by the link configuration, and further increase the speed. Further, the same effect can be obtained with a configuration in which a plurality of application nozzles 41 are arranged in the link 50c.

  Although the embodiments have been described above, the present invention is not limited to the embodiments. For example, two or more sliding members 30 may be used, or the rigidity of the parallel links may be increased by increasing the number of parallel links. In the first and second embodiments, the second drive mechanism 120 is used in the Y direction and the first drive mechanism 110 is used in the XZ direction. However, the same applies even if the first drive mechanism 110 is used in the YZ direction. The effect of. Further, the present invention may be applied to technical fields other than the semiconductor manufacturing process. That is, an apparatus for applying some paste to an object such as a substrate can be expressed as being within the scope of the idea of the present invention.

DESCRIPTION OF SYMBOLS 10 Base plate 20 1st drive motor 30 Sliding member 31 Sliding member fixed part 32 Sliding member movable part 40 Dispenser 41 Application nozzle 50 Link means 50a-50g Link 60 Rotation support member 100 Paste application mechanism 110 First drive Mechanism 120 Second drive mechanism 121 Second drive motors 122 and 132 Feed screw 130 Third drive mechanism 131 Third drive motor 133 Movable part 200 Electronic component transfer mechanism 300 Movable table 400 Substrate 500 Wafer holding table 510 Wafer sheet 520 Chip 530 Transfer head 600 Application paste

Claims (12)

In a coating device for applying a material to a substrate,
An application part for applying a paste-like material;
A first moving unit that moves the application unit with respect to the substrate;
The first moving unit includes:
A rotating body,
A conversion mechanism that converts the rotation of the rotating body into a first motion in a first direction with respect to the substrate performed by the application unit, and a second motion in a second direction that intersects the first direction; , have a,
The conversion mechanism is a link mechanism;
The application unit is connected to the link mechanism,
The link mechanism is rotatably connected to the first link rotatably connected to the rotating body, the second link rotatably connected to the first link, and the second link. A third link, and a fourth link rotatably connected to the third link,
The coating unit, the coating apparatus according to claim Rukoto connected to the fourth link. The coating apparatus according to claim 1 ,
The third link is disposed along the first direction;
A moving body that moves along the first direction;
An application apparatus comprising: a fifth link connecting the third link and the moving body. The coating apparatus according to claim 1,
And a second moving part that moves the application part in a third direction different from the first direction and the second direction,
The coating apparatus according to claim 1, wherein a speed at which the coating unit moves by the first moving unit is faster than a speed at which the coating unit moves by the second moving unit. In the coating device according to claim 3 ,
The distance by which the said application part moves by the said 1st moving part is longer than the distance by which the said application part moves by the said 2nd moving part. The coating apparatus according to claim 1, wherein
The coating apparatus according to claim 1, wherein the first movement is a movement about an upper side of the substrate. The coating apparatus according to claim 1,
The movement distance of the second movement is expressed as a function of the rotation angle of the rotating body. In a component mounting system for mounting components on a board,
Having a coating device for applying a paste-like material to the substrate;
The coating device includes:
An application part for applying a paste-like material;
A first moving unit that moves the application unit with respect to the substrate;
The first moving unit includes:
A rotating body,
A conversion mechanism that converts the rotation of the rotating body into a first motion in a first direction with respect to the substrate performed by the application unit, and a second motion in a second direction that intersects the first direction; Have
further,
A component mounting device for mounting a component on the region where the material is applied by the coating device;
The component mounting device is disposed downstream of the coating device ,
The conversion mechanism is a link mechanism;
The application unit is connected to the link mechanism,
The link mechanism is rotatably connected to the first link rotatably connected to the rotating body, a second link rotatably connected to the first link, and the second link. A third link, and a fourth link rotatably connected to the third link,
The application part is connected to the fourth link . In the component mounting system according to claim 7 ,
The third link is disposed along the first direction;
A moving body that moves along the first direction;
A component mounting system comprising a fifth link connecting the third link and the moving body. In the component mounting system according to claim 7 ,
And a second moving part that moves the application part in a third direction different from the first direction and the second direction,
The component mounting system according to claim 1, wherein a speed at which the application unit is moved by the first moving unit is faster than a speed at which the application unit is moved by the second moving unit. In the component mounting system according to claim 9 ,
The component mounting system, wherein a distance that the application unit moves by the first moving unit is longer than a distance that the application unit moves by the second moving unit. The component mounting system according to claim 9 , wherein
The component mounting system according to claim 1, wherein the first movement is a movement about the upper side of the substrate. In the component mounting system according to claim 7 ,
The component mounting system according to claim 1, wherein a movement distance of the second movement is expressed as a function of a rotation angle of the rotating body.