JP4901683B2 - Parts supply device - Google Patents

Description

  The present invention relates to a component supply device, and more particularly to a component supply device that is suitable for application when an electronic component is reversed and supplied to a surface mounting device as necessary.

  For example, Patent Document 1 discloses a conventional component supply device that supplies an electronic component by reversing the front and back to a surface mount device that mounts the electronic component on a substrate that has been positioned.

  In this component supply device, electronic components prepared individually are reversed in advance by a reversing means and sucked in a reversed state by a plurality of suction nozzles arranged in the shuttle, and then the shuttle is supplied to the component of the surface mounting device. It is supplied with linear movement to the position.

  Although Patent Document 1 discloses an example in which the shuttle is swung using a rotary table, it is more advantageous to move the shuttle linearly in terms of space saving and control accuracy. It is.

JP 2004-179524 A

  However, in the case of the conventional component supply device that linearly moves the shuttle that holds the electronic component and supplies the electronic component to the surface mounting device, the surface mounting device supplies the electronic component for mounting on the substrate. While adsorbing the electronic component, it is not possible to prepare for supply including the reversing operation of the electronic component to be supplied next, and conversely, while preparing to supply the electronic component to the shuttle, Since the electronic component cannot be mounted on the substrate, a waiting time is generated, and there is a problem that it is not possible to cope with the recent increase in the speed of component mounting.

  The present invention has been made to solve the above-described conventional problems, and employs a shuttle (supply head) that linearly moves to a supply position of a surface mount device to supply components, and then supplies electronic components to the shuttle. It is an object of the present invention to provide a component supply device that can perform a mounting operation in a surface mounting device even during preparation.

  The present invention relates to a component supply apparatus in which an electronic component taken out from a holding unit by a transfer head is appropriately reversed by a reversing head, and the electronic component is supplied to a supply position of a surface mounting device on which the electronic component is mounted on a substrate by a mounting head. A first supply head and a second supply head for holding a component; a first delivery position and a second delivery position reachable by the transfer head; and a first supply position and a second supply position reachable by the mounting head A first drive mechanism and a second drive mechanism for alternately moving the first supply head and the second supply head back and forth alternately, a first reverse position corresponding to the first delivery position, and the second By providing a third drive mechanism for reciprocating linearly moving the reversing head between the second reversing position corresponding to the delivery position, the problem is solved.

  In the present invention, the first drive mechanism may further include a first drive belt wound around the separated first A pulley and first B pulley, and a first linear motion guide provided along the drive belt. The second drive mechanism includes a second drive belt wound around the second A pulley and the second B pulley disposed opposite to the first A pulley and the first B pulley at the same interval, and the drive belt is provided along the drive belt. A third drive belt wound around a third A pulley and a third B pulley coaxially fixed with the first A pulley and the second A pulley, respectively. And a third linear motion guide provided along the drive belt, wherein the first supply head is at the first delivery position, the second supply head is at the second supply position, and the reversing head is at the first reversing position. The first drive belt in a state of being coincident with each position. The third drive belt is fixed to the second drive belt and the third drive belt, and is engaged with the first linear motion guide, the second linear motion guide, and the third linear motion guide in a guideable manner, and constitutes the third drive mechanism. The rotating shaft on which either the pulley or the third B pulley is fixed may be rotated by the drive motor.

  In the present invention, each of the mounting head, the first supply head, the second supply head, and the reversing head may include a plurality of suction nozzles arranged at the same pitch in the same direction.

  According to the present invention, the first supply head and the second supply head can be alternately positioned at the first delivery position and the second delivery position where the transfer head for transferring the electronic component from the holding unit can reach. At the same time, the electronic component transferred by the transfer head and held by the reversing head is reversed at the first reversing position or the second reversing position, so that the reversing operation is performed on the first feeding head or the second feeding head. Since it is possible to selectively deliver, the other supply that has moved to the supply position even while preparing to supply a part including a reversing operation to one supply head at any delivery position Parts can be mounted from the head. Therefore, the electronic component can be continuously mounted on the substrate without generating a waiting time.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing an outline of a surface mounting apparatus to which a component supply apparatus according to an embodiment of the present invention is applied.

  In the surface mounting apparatus 1 having a rectangular base portion, a mounting head 3 on which a plurality of suction nozzles 2 are mounted is moved in the X direction by an X axis robot arm 4 and is integrated with the X axis robot arm 4. The electronic component moved in the Y direction by the Y-axis robot arm 5 and sucked and held by the suction nozzle 2 is mounted on the substrate S that has been transported and positioned by the transport device 6. Yes.

  The component supply apparatus of the present embodiment indicated by reference numeral 10 in the drawing is connected and positioned to the base portion of the surface mounting apparatus 1 via the joint portion 10A, and is electrically connected between the two, and exchanges signals with each other. By doing so, the cooperation of the operation and the grasp of the state are realized.

  In this component supply apparatus, a stock portion 12 is formed on the opposite side of the surface mounting apparatus 1 as shown in a plan view of FIG. The stock portion 12 is a silicon wafer (hereinafter referred to as a dicing wafer) that is separated into a plurality of bare chips by dicing in a grid pattern in units of a predetermined circuit formation region, and having an adhesive sheet attached to the back side. Are stored in piles.

  The dicing wafer W stored in the stock unit 12 is pulled out to the holding unit 14 and positioned and fixed to the ring-shaped holding tool as shown in the drawing. Above the holding portion 14, a suction head (transfer head) 16 having a vacuum nozzle that sucks and holds an electronic component at the lower end is attached so as to be movable up and down. The robot arm 20 is moved in the X direction, and is integrated with the X axis robot arm 20 so as to be movable in the Y direction by a Y axis robot arm 22.

  In the component supply apparatus 10 of the present embodiment, the suction head 16 is XY-moved above the dicing wafer W positioned on the holding unit 14 by the X-axis robot arm 20 and the Y-axis robot arm 22 and specified bear chips ( (Not shown) is sucked and transferred to the nozzle 24 </ b> A sucked by the reversing head 24, so that it can be transferred to the reversing head 24.

  In the present embodiment, the first supply head 26 and the second supply head 28 that hold electronic components by suction are arranged on the left and right, respectively.

  Further, the first delivery position A and the second delivery position A ′ are set in the reachable range of the suction head 16 that moves XY, and the first supply position B is set in the reachable range of the mounting head 3 of the surface mounting apparatus 1. And a second supply position B ′ are set.

  The first supply head 26 is between the first delivery position A and the first supply position B located on the left side in the drawing, and the second delivery position A ′ and the second supply position B ′ are located on the right side. The second supply head 28 is alternately reciprocated linearly by the first drive mechanism 30 and the second drive mechanism 32.

  Further, as shown in an enlarged view in FIG. 3, the first drive mechanism 30 has an endless first coil wound between a first A pulley 34 and a first B pulley 36 that are spaced apart in the Y direction. A first belt that engages and guides a timing belt (first driving belt) 38 and a first supply head 26 that is provided along the first timing belt 38 and that is fixed along with the rotation. And a moving guide 40.

  Similarly, the second drive mechanism 32 has an endless second timing belt (second drive) wound between a second A pulley 42 and a second B pulley 44 that are spaced apart at the same interval in the Y direction. Belt) 46, and a second linear guide 48 that engages and guides the second supply head 28 that is provided along the second timing belt 46 and that is fixed as the belt rotates. ing.

  In the present embodiment, the first reversing position A ″ at which the reversed electronic component can be delivered to the first feeding head 26 at the first delivery position A, and the second feeding head 28 at the second delivery position A ′. In addition, a third drive mechanism 50 is provided for moving the reversing head 24 back and forth between the second reversing position B ″ where the reversed electronic component can be delivered.

  The third drive mechanism 50 includes a drive pulley (third B pulley) 54 that is rotated by a drive motor 52 shown in an enlarged manner in FIG. 4 and a driven pulley (third A pulley) 56 that is spaced apart in the X direction. And an endless third timing belt (third drive belt) 58 wound between the belt and the reversing head 24 which is provided along the third timing belt 58 and is fixed along with the rotation. And a third linear motion guide 60 that engages and guides in the direction.

  As shown in FIGS. 3 and 4, the drive pulley 54 and the driven pulley 56 are coaxially fixed below the second A pulley 42 and the first A pulley 34, respectively.

  Accordingly, the first supply head 36, the second supply head 28, and the reversing head 24 are connected and fixed to the first timing belt 38, the second timing belt 46, and the third timing belt 58, respectively, in the illustrated positional relationship, By engaging with the corresponding linear motion guides 40, 48 and 60, the operation described later is possible.

  Similarly to the plurality of suction nozzles 2 mounted on the mounting head 3, the same number of suction nozzles 24A, 26A, and 28A are the same in the reversing head 24, the first supply head 26, and the second supply head 28, respectively. Are mounted in a row in the X direction at a pitch of.

  Further, the reversing head 24 extracts the main part in FIG. 5, and the base 62 is rotated in the direction of the arrow through the base shaft 64 so as to show the correspondence with the first supply head 26 in FIG. A reversing head 24 having a plurality of suction nozzles 24A attached thereto is fixed to the tip of a frame 65 that is pivotally supported, and a first reversing pulley 66A and a second reversing pulley that are rotated by a reversing motor 68 on the back side. The electronic component (not shown) can be reversed and delivered to the suction nozzle 26A of the first supply head 26 by rotating about 180 ° by the reverse belt 70 wound around 66B.

  The component supply device of the present embodiment will be described more specifically. The first supply head 26 and the second supply head 28 have a plurality of nozzles 26A and 28A for sucking and holding electronic components by vacuum, The first linear motion guide 40 and the second linear motion guide 48 are movable in opposite Y directions. The first A pulley 34, the first B pulley 36, the second A pulley 42, and the second B pulley 44 are connected to each other by a first timing belt 38 and a second timing belt 46, and are supplied to the belts 38 and 46, respectively. The head 26 and the second supply head 28 are fixed, so that the head 26 and the second supply head 28 move in the Y direction according to the driving of the belt.

  The reversing head 24 is fixedly supported so as to be movable in the X direction on the third linear motion guide 60, and is integrated with a reversing belt 70 stretched between the first reversing pulley 66A and the second reversing pulley 66B. By being fixed so as to be, it is driven in the X direction. The first A pulley 34 and the driven pulley 56, and the second A pulley 42 and the driving pulley 54 are fixed coaxially, and integrally rotate around the axis.

  The shaft that fixes the second A pulley 42 is rotatably connected to the drive motor 52. When the drive motor 52 rotates the drive pulley 54, all the pulleys rotate at the same angle at the same time. The first supply head 26 and the second supply head 28 move together in the opposite Y direction, and the reversing head 24 moves together in the X direction.

  The reversing head 24 is fixed so as to be rotatable about the base shaft 64, and is rotated about 180 ° in the direction of the arrow as shown in FIG. The electronic component can be reversed and delivered to the second supply head 28.

  With the above configuration, the bare chip mounting operation in the present embodiment will be described.

  The suction head 16 sucks an arbitrary bare chip from the dicing wafer W fixed to the holding unit 14, and then stops at either the first reverse position A ″ or the second reverse position B ″ that is the left and right stroke ends. XY moves above one of the nozzles 24A mounted on the reversing head 24, and is positioned.

  The positioned suction head 16 lowers the nozzle so that the vacuum on the suction head 16 side is turned OFF and the vacuum on the reverse head 24 side is turned ON when the bare chip at the lower end contacts the nozzle 24A of the reverse head 24. Thus, the bare chip is transferred onto the nozzle 24A of the reversing head 24. Here, it is assumed that the reversing head 24 is at the first reversing position A ″ facing the first delivery position A on the left side as shown in FIG.

  When delivery of a necessary number of bare chips to the reversing head 24 is completed, the reversing motor 65 is driven to rotate the reversing head 24 around the base shaft 64. The tip of each nozzle 24A of the reversing head 24 abuts the nozzle 26A of the first supply head 26 stopped at the stroke end (first delivery position A) in the direction of arrow A1 while holding a bare chip (not shown). Deliver bare chips by switching the vacuum.

  When the delivery of the bare chip from the reversing head 24 to the first supply head 26 is completed, the drive motor 52 is operated to move the three heads of the first supply head 26, the reversing head 24, and the second supply head 28 to the arrows B1, Move in the B2 and B3 directions. That is, each head moves to the stroke end opposite to the position shown in FIGS. 2 and 3, and the second supply head 28 stops at the second delivery position A ′.

  The mounting head 3 performs a bare chip receiving operation on the first supply head 26 stopped at the first supply position B at the stroke end indicated by the arrow B1, and the received bare chip is mounted on the mounting substrate S. During this mounting operation, the suction head 16 newly sucks the bare chip from the dicing wafer W of the holding unit 14 and moves onto the reversing head 24 positioned at the second reversing position B ″ at the stroke end in the arrow B2 direction. Then, the transfer operation is performed with respect to the suction nozzle 24 A. When the necessary number of transfer operations are completed, the reversing head 24 is rotated and the bare chip is reversed to the second supply head 28 located at the opposite position. And hand it over.

  When the bare chip delivery to the mounting head 3, that is, the mounting operation from the first supply head 26 to the substrate S is completed, the drive motor 52 is driven again, and the first supply head 26, the reversing head 24, and the second supply head. The three heads 28 are moved in the directions of arrows A1, A2, and A3.

  When the bare chip is not reversed, the transfer destination by the suction head 16 can be realized by using the first supply head 26 or the second supply head 28 instead of the reversing head 24.

  According to the embodiment described in detail above, since the two supply heads can alternately supply the components, the mounting operation by the delivery when the electronic components are transferred to the supply head by the suction head 16 as in the prior art. Can be prevented from occurring.

  In addition, by operating the reversing head 24, the first supply head 26, and the second supply head 28 with one drive motor 52, it is possible to reduce cost and power consumption, and to eliminate complicated control. .

  Further, a plurality of suction nozzles 2 mounted on the mounting head 3 of the surface mounting apparatus, a suction head 26A mounted on the first supply head 26, and a plurality of suction heads mounted on the second supply head 28. 28A and the plurality of suction nozzles 24A mounted on the reversing head 24 are all arranged in the same direction in a line at the same pitch, thereby greatly improving the efficiency of simultaneous suction of the reversing parts together with the non-reversing parts. It becomes possible.

  In the above-described embodiment, the timing belt is used as the driving belt. However, the timing belt is not limited to this. The belt may be a general belt or a steel belt with a hole, and a chain may be used. In addition, the pulley shaft rotated by the drive motor is advantageous in that two pulleys are coaxially fixed in terms of transmission efficiency of the driving force, but is not limited to this.

The top view which shows the outline | summary of the relationship between the component supply apparatus and surface mounting apparatus of one Embodiment which concern on this invention The top view which shows the outline | summary of the whole component supply apparatus of this embodiment. The top view which expands and shows the principal part of the components supply apparatus of this embodiment Perspective view showing relationship between drive motor and coaxial pulley A perspective view showing a reversing head extracted and enlarged The perspective view which shows the relationship between a reversing head and a 1st supply head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Component supply apparatus 10A ... Joint part 12 ... Stock part 14 ... Holding part 16 ... Adsorption head (transfer head)
DESCRIPTION OF SYMBOLS 18 ... Adsorption position recognition apparatus 20 ... X-axis robot arm 22 ... Y-axis robot arm 24 ... Reversing head 26 ... L supply head (1st supply head)
28 ... R supply head (second supply head)
DESCRIPTION OF SYMBOLS 30 ... 1st drive mechanism 32 ... 2nd drive mechanism 34 ... 1st A pulley 36 ... 1st B pulley 38 ... 1st timing belt (1st drive belt)
40 ... 1st linear motion guide 42 ... 2A pulley 44 ... 2B pulley 46 ... 2nd timing belt (2nd drive belt)
48 ... Second linear motion guide 50 ... Third drive mechanism 52 ... Drive motor 54 ... Drive pulley 56 ... Driven pulley 58 ... Third timing belt (third drive belt)
60 ... Third linear motion guide

Claims (3)

In the component supply apparatus for supplying the electronic component taken out from the holding unit by the transfer head to the supply position of the surface mounting apparatus for appropriately reversing the electronic component by the reversing head and mounting the electronic component on the substrate by the mounting head.
A first supply head and a second supply head for holding electronic components;
The first supply head and the second supply head are arranged between the first delivery position and the second delivery position reachable by the transfer head and the first supply position and the second supply position reachable by the mounting head. A first drive mechanism and a second drive mechanism that alternately reciprocate linearly move,
A third drive mechanism that linearly moves the reversing head between a first reversing position corresponding to the first delivery position and a second reversing position corresponding to the second delivery position; A component supply device. The first drive mechanism has a first drive belt wound around the separated first A pulley and first B pulley, and a first linear motion guide provided along the drive belt,
The second drive mechanism is disposed along the drive belt, the second drive belt wound around the second A pulley and the second B pulley disposed opposite to the first A pulley and the first B pulley at the same interval. A second linear motion guide,
The third drive mechanism includes a third drive belt wound around a third A pulley and a third B pulley coaxially fixed to the first A pulley and the second A pulley, respectively, and a third straight belt provided along the drive belt. A moving guide,
The first drive belt, the second drive, with the first supply head in the first delivery position, the second supply head in the second supply position, and the reversing head in the first reversing position, respectively. The belt is fixed to the third drive belt, and engaged with the first linear guide, the second linear guide, and the third linear guide so as to be guided.
The component supply device according to claim 1, wherein a rotation shaft on which either the third A pulley or the third B pulley constituting the third drive mechanism is fixed is rotated by a drive motor.   2. The component according to claim 1, wherein each of the mounting head, the first supply head, the second supply head, and the reversing head has a plurality of suction nozzles arranged at the same pitch in the same direction. Feeding device.

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