JP6913718B2 - Electronic component mounting system and board production method - Google Patents

Description

The present invention relates to an electronic component mounting system or the like that uses a circuit board holder for holding a circuit board.

Examples of the workpiece to be worked on by the working machine include a circuit board on which electronic components are mounted. The circuit board includes not only a circuit board having only a flat component mounting surface but also a circuit board having an uneven component mounting surface such as a curved surface or an uneven surface. When mounting an electronic component on such an uneven component mounting surface, it is necessary to maintain the component mounting surface at an angle close to a horizontal plane. Therefore, as described in the following patent documents, the circuit board is mounted on a horizontal plane. Development of a substrate holder that holds the angle of the board in a changeable state is underway.

Japanese Unexamined Patent Publication No. 2012-119634

The present invention has been made in view of such circumstances, and provides an electronic component mounting system or the like using a substrate holder capable of appropriately mounting electronic components on an uneven component mounting surface. Make it an issue.

In order to solve the above problems, the present specification is an electronic component mounting system using a circuit board holder for holding a circuit board, the conveyor device of the electronic component mounting machine for supporting the circuit board holder, and the above. The electronic component mounting machine is provided with a changing mechanism provided at a position different from that of the conveyor device in the transport direction of the electronic component mounting machine, which changes the angle of the circuit board with respect to the horizontal plane by operating the circuit board holder. Disclosed is an electronic component mounting system in which the circuit board holder supported by a conveyor device of a component mounting machine is moved to the changing mechanism, and the angle of the circuit board with respect to the horizontal plane is changed by the changing mechanism.

In the electronic component mounting system and the like described in the present specification, a changing mechanism for changing the angle of the circuit board with respect to the horizontal plane is provided at a position different from that of the conveyor device of the electronic component mounting machine. The supported circuit board holder is moved to the changing mechanism, and the changing mechanism changes the angle of the circuit board with respect to the horizontal plane. This makes it possible to appropriately mount the electronic component on the uneven component mounting surface.

It is a figure which shows the electronic component mounting machine which performs the mounting work on the circuit board held by the board holder which is an Example of this invention. It is a figure which shows the substrate holder which is an Example of this invention. It is a figure which shows the substrate holder of the modification. It is a figure which shows the electronic component mounting system which performs the mounting work on the circuit board held by the board holder shown in FIG.

Hereinafter, examples of the present invention will be described in detail as embodiments for carrying out the present invention with reference to the drawings.

<Configuration of electronic component mounting machine>
FIG. 1 shows the electronic component mounting machine 10. The electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 22, a mounting head 24, and a supply device 26.

The conveyor 20 includes a pair of conveyor belts 30 extending in the X-axis direction and an electromagnetic motor (not shown) that orbits the conveyor belts 30. The circuit board 34 is supported by the pair of conveyor belts 30, and is conveyed in the X-axis direction by driving an electromagnetic motor. Further, the transfer device 20 has a substrate holding device (not shown). The substrate holding device fixedly holds the circuit board 34 supported by the conveyor belt 30 at a predetermined position (the position where the circuit board 34 in FIG. 1 is shown). The circuit board 34 has a flat plate shape, and the mounting surface of electronic components is flat.

The moving device 22 is composed of an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52. The X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction. The X-axis slider 56 moves to an arbitrary position in the X-axis direction by driving an electromagnetic motor (not shown). Further, the Y-axis direction slide mechanism 52 has a Y-axis slider 60 provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction. The Y-axis slider 60 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (not shown). A mounting head 24 is attached to the Y-axis slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.

The mounting head 24 mounts electronic components on the circuit board 34. The mounting head 24 has a suction nozzle 70 provided on the lower end surface. The suction nozzle 70 communicates with a positive / negative pressure supply device (not shown) via a negative pressure air and a positive pressure air passage. The suction nozzle 70 sucks and holds the electronic component by a negative pressure, and releases the held electronic component by a positive pressure. Further, the mounting head 24 has an elevating device (not shown) for elevating and lowering the suction nozzle 70. The elevating device causes the mounting head 24 to change the vertical position of the electronic component to be held.

The feeder 26 is a feeder type feeder and has a plurality of tape feeders 80. The tape feeder 80 houses the taped parts in a wound state. The taped component is a taped electronic component. Then, the tape feeder 80 feeds the taped parts by a feeding device (not shown). As a result, the feeder type supply device 26 supplies the electronic components at the supply position by sending out the taped components.

<Mounting work on a circuit board with a flat mounting surface>
In the electronic component mounting machine 10, the mounting work can be performed on the circuit board 34 having a flat mounting surface by the above-described configuration. Specifically, the circuit board 34 is conveyed to a working position by a command of a control device (not shown) of the electronic component mounting machine 10, and the circuit board 34 is fixedly held at that position. Further, the tape feeder 80 sends out the taped component and supplies the electronic component at the supply position according to the command of the control device. Then, the mounting head 24 moves above the supply position of the electronic component according to the command of the control device, and the suction nozzle 70 sucks and holds the electronic component. Subsequently, the mounting head 24 moves above the circuit board 34 and mounts the held electronic component on the circuit board.

<Structure of board holder>
In the electronic component mounting machine 10, the electronic component mounting operation is performed on the circuit board 34 having a flat mounting surface by the above-mentioned procedure. On the other hand, the mounting work on a circuit board having an uneven surface such as a curved surface or an uneven surface is performed by using the substrate holder 100 shown in FIG. The substrate holder 100 has a fixing plate 102, a rotating plate 104, and a holding mechanism 106. Fixed plate 1
02 and the rotating plate 104 are plate-shaped members having the same dimensions, and the rotating plate 104 is laminated on the fixing plate 102. At the center of the fixed plate 102 and the rotating plate 104, a shaft 108 extending in the vertical direction between the fixed plate 102 and the rotating plate 104 is provided, and the fixed plate 102 and the rotating plate 104 are centered on the shaft 108. It rotates relative to.

Further, the holding mechanism 106 is composed of a pair of support portions 110 and a substrate holding portion 112, and the pair of support portions 110 are erected on the rotating plate 104. The board holding portion 112 holds the circuit board 116 and has a longitudinal shape. The substrate holding portions 112 are sandwiched by a pair of support portions 110 so as to be swingable around an axial center extending in the longitudinal direction at both ends in the longitudinal direction.

The circuit board 116 has a longitudinal shape and is curved in a direction orthogonal to the longitudinal direction, that is, in the lateral direction. The convex side of the curved surface of the circuit board 116 is a mounting surface for electronic components, and mounting portions 118 for electronic components are formed on the mounting surface so as to be arranged in three rows in the longitudinal direction. .. Of the plurality of mounting portions 118 arranged in three rows, the mounting portion 118a in the central row (hereinafter, may be referred to as “first mounting portion”) 118a is located on the same plane. Further, the mounting portion 118b in the side row on one side of the first mounting portion 118a (hereinafter, may be referred to as "second mounting portion") 118b is a plane different from the plane on which the first mounting portion 118a is located. Located on top. Further, the mounting portions (hereinafter, may be referred to as "third mounting portion") 118c in the other side row of the first mounting portion 118a are the positions of the first mounting portion 118a and the second mounting portion 118b. It is located on a plane different from the plane to be used. That is, the plane on which the first mounting portion 118a is located, the plane on which the second mounting portion 118b is located, and the plane on which the third mounting portion 118c is located are inclined to each other.

The substrate holder 100 further includes electromagnetic motors 120 and 122, a battery 124, and a control device 126. The electromagnetic motor 120 relatively rotates the fixed plate 102 and the rotating plate 104, and the electromagnetic motor 122 swings the substrate holding portion 112. The electromagnetic motors 120 and 122 are connected to the battery 124 and are driven by the power supply from the battery 124. Further, the electromagnetic motors 120 and 122 are connected to the control device 126 and are controlled by the control device 126. The electromagnetic motors 120 and 122, the battery 124, and the control device 126 are arranged on the upper surface of the rotating plate 104.

Further, the substrate holder 100 has operation switches 128, 130, 132, 134. The operation switch 128 is a switch for operating the electromagnetic motor 122, and the board holding portion 112 is shaken by the operation of the operation switch 128 so that the plane on which the first mounting portion 118a of the circuit board 116 is located becomes horizontal. Move. The operation switch 130 is a switch for operating the electromagnetic motor 122, and the board holding portion 112 is shaken by the operation of the operation switch 130 so that the plane on which the second mounting portion 118b of the circuit board 116 is located becomes horizontal. Move. The operation switch 132 is a switch for operating the electromagnetic motor 122, and the board holding portion 112 is shaken by the operation of the operation switch 132 so that the plane on which the third mounting portion 118c of the circuit board 116 is located becomes horizontal. Move. The operation switch 134 is a switch for operating the electromagnetic motor 120, and the rotating plate 104 rotates with respect to the fixed plate 102 according to the operating time of the operating switch 130. The operation switches 128, 130, 132, and 134 are arranged on the upper surface of the control device 126 and are exposed on the upper surface of the substrate holder 100.

<Mounting work on a circuit board with an uneven mounting surface>
The substrate holder 100 having the above configuration is conveyed by the transfer device 20 of the electronic component mounting machine 10, and the fixing plate 102 is fixedly held by the substrate holding device of the transfer device 20. As a result, the electronic component mounting machine 10 can perform mounting work on the circuit board 116 held by the board holder 100. Specifically, first, the circuit board 116 is held by the substrate holding portion 112 so that the longitudinal direction of the substrate holding portion 112 and the longitudinal direction of the circuit board 116 coincide with each other. Then, the substrate holder 100 is supported by the conveyor belt 30 of the transport device 20 so that the longitudinal direction of the substrate holding portion 112, that is, the extending direction of the swing center of the substrate holding portion 112 and the X-axis direction coincide with each other. ..

The board holder 100 supported by the conveyor belt 30 is conveyed to a working position by a command of the control device of the electronic component mounting machine 10, and at that position, the fixing plate 102 of the board holder 100 is fixed by the board holding device. Is held in. Then, the mounting head 24 moves above the operation switch 128 of the substrate holder 100 according to the command of the control device, and moves the suction nozzle 70 downward to operate the operation switch 128. As a result, the substrate holding portion 112 swings, and the plane on which the first mounting portion 118a of the circuit board 116 is located becomes horizontal.

Further, the tape feeder 80 sends out the taped component and supplies the electronic component at the supply position according to the command of the control device. Then, the mounting head 24 moves above the supply position of the electronic component according to the command of the control device, and the suction nozzle 70 sucks and holds the electronic component. Subsequently, the mounting head 24 moves above the first mounting portion 118a of the circuit board 116, and mounts the held electronic component on the first mounting portion 118a. By repeating this operation, the electronic components are mounted on the plurality of first mounting portions 118a.

When the electronic components are mounted on the plurality of first mounting portions 118a, the mounting head 24 moves above the operation switch 130 of the substrate holder 100 and moves the suction nozzle 70 downward by a command of the control device. Then, the operation switch 130 is operated. As a result, the substrate holding portion 112 swings, and the plane on which the second mounting portion 118b of the circuit board 116 is located becomes horizontal. Then, the mounting work is performed on the plurality of second mounting portions 118b in the same manner as the mounting work on the first mounting portion 118a.

Then, when the electronic components are mounted on the plurality of second mounting portions 118b, the mounting head 24 moves above the operation switch 132 of the substrate holder 100 and moves the suction nozzle 70 downward according to the command of the control device. By letting it operate, the operation switch 130 is operated. As a result, the substrate holding portion 112 swings, and the plane on which the third mounting portion 118c of the circuit board 116 is located becomes horizontal. Then, as with the mounting work on the first mounting portion 118a, the mounting work is performed on the plurality of third mounting portions 118c. The operation switch 134 is not operated during mounting work on the circuit board 116, but is operated when it is necessary to rotate the circuit board around an axis extending in the vertical direction during mounting work on a circuit board having a different shape. Will be done.

As described above, in the electronic component mounting machine 10, by using the substrate holder 100, it is possible to perform mounting work on the circuit board 116 having a non-flat mounting surface. That is, by using the substrate holder 100, the mounting work on the circuit board 116 having an uneven mounting surface can be performed by the electronic component mounting machine 10 that mounts the normal circuit board, that is, the flat plate-shaped circuit board 34. It is possible to do it. As a result, it is possible to perform mounting work on the circuit board 116 having an uneven mounting surface without mounting a new mechanism or the like on the conventional electronic component mounting machine, which is very economical.

Further, the substrate holder 100 is provided with a control device 126 that controls the operation of the electromagnetic motors 120 and 122, and the substrate holder 100 has an inclination angle of the circuit board 116 with respect to the horizontal plane, that is, the circuit board 116. It is possible to change the holding posture in a controllable manner. Therefore, it is not necessary to control the operation of the electromagnetic motors 120 and 122 by the electronic component mounting machine 10, and it is not necessary to send and receive command data and the like between the electronic component mounting machine 10 and the substrate holder 100. As a result, it is possible to perform mounting work on the circuit board 116 having an uneven mounting surface without providing a new control device, a data transceiver, or the like on the conventional electronic component mounting machine.

Furthermore, in the substrate holder 100, the operation switches 128, 130, 132, 134 for operating the electromagnetic motors 120, 122 are exposed on the upper surface of the substrate holder 100. Therefore, by operating the operation switches 128, 130, 132, and 134 by the mounting head 24 of the electronic component mounting machine 10, the inclination angle of the circuit board 116 with respect to the horizontal plane changes. As a result, the electronic component mounting machine 10 can change the tilt angle of the circuit board 116 at an arbitrary timing, and the mounting work can be performed efficiently. Further, during the execution of the mounting program, the mounting head 24 moves to a predetermined position and the operation switch is pressed, which makes it possible to create and operate a standard mounting program.

Incidentally, in the above embodiment, the electronic component mounting machine 10 is an example of a working machine. The substrate holder 100 is an example of a work piece holder. The fixing plate 102 is an example of a pallet. The holding mechanism 106 is an example of the holding mechanism. The circuit board 116 is an example of a work piece. The electromagnetic motors 120 and 122 are examples of actuators. The battery 124 is an example of a power source. The control device 126 is an example of the control device. The operation switches 128, 130, 132, and 134 are examples of operation switches.

The present invention is not limited to the above examples, and can be carried out in various modes with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the electronic components are mounted on the circuit board by using the technique of the present invention, but various operations can be performed. Specifically, for example, it is possible to apply a viscous fluid to the work piece, assemble the work piece, and process the work piece. Therefore, as the workpiece, not only the circuit board but also various objects can be adopted.

Further, in the above embodiment, the control device 126 for controlling the operation of the electromagnetic motors 120 and 122 is provided on the substrate holder 100, but the electronic component mounting machine 10 is provided with the control device for the electromagnetic motors 120 and 122. You may. When the control device is provided in the electronic component mounting machine 10, command data or the like wirelessly communicated from the control device provided in the electronic component mounting machine 10 through, for example, a receiving function provided in the substrate holder is transmitted. It is transmitted to the electromagnetic motors 120 and 122, and the operation of the electromagnetic motors 120 and 122 is controlled by the command data.

Further, in the above embodiment, the substrate holder 100 is provided with the electromagnetic motors 120 and 122 for changing the inclination angle of the circuit board 116, but even if the substrate holder is not provided with the electromagnetic motor, the substrate holder is also provided. It is possible to perform mounting work on the circuit board 116 by the electronic component mounting machine 10. Specifically, for example, the substrate holder 140 shown in FIG. 3 will be described below as an example of the substrate holder not provided with the electromagnetic motor.

The substrate holder 140 has a fixing plate 142 and a rotating plate 144. The fixing plate 142 and the rotating plate 144 have the same structure as the fixing plate 102 and the rotating plate 104 of the substrate holder 100, and rotate relative to each other about the shaft 146. Further, the same mechanism as the holding mechanism 106 of the substrate holder 100 is fixed to the upper surface of the rotating plate 144. In the substrate holder 140, similarly to the substrate holder 100, the circuit board 116 having an uneven surface is fixedly held by the substrate holding portion 112, and the inclination angle of the circuit board 116 is changed by the shaking of the substrate holding portion 112. It changes with movement. In the substrate holder 140, unlike the substrate holder 100, when the fixing plate 142 and the rotating plate 144 rotate relative to each other and when the substrate holding portion 112 swings, for example, a mechanical notch mechanism such as a ball plunger or a mechanical notch mechanism may be used. By equipping each rotating shaft with a one-way clutch or the like, it is possible to maintain each operating position.

The circuit board 116 held by the board holder 140 is mounted by a system including a working machine for changing the tilt angle of the circuit board 116. As shown in FIG. 4, the system includes a working machine 150 for changing the inclination angle of the circuit board 116 and two electronic component mounting machines 10. The working machine 150 has a transport device 152 having the same structure as the transport device 20 of the electronic component mounting machine 10, and the transport device 20 of the electronic component mounting machine 10a is connected to the upstream side of the transport device 152. A transport device 20 of the electronic component mounting machine 10b is connected to the downstream side. As a result, the substrate holder 140 holding the circuit board 116 is conveyed in the order of the electronic component mounting machine 10a, the working machine 150, and the electronic component mounting machine 10b.

The working machine 150 further has a rotation mechanism 154 and a swing mechanism 156. The rotation mechanism 154 is a mechanism for rotating the rotating plate 144 of the substrate holder 140 conveyed by the transfer device 152, and the swing mechanism 156 is a substrate holding portion of the substrate holder 140 conveyed by the transfer device 152. This is a mechanism for swinging the 112.

In the system having the above structure, the substrate holder 140 is conveyed by the transfer device 20 of the electronic component mounting machine 10a so that the plane on which the first mounting portion 118a of the circuit board 116 is located is horizontal, and the electronic component mounting machine By performing the mounting work at 10a, the electronic components are mounted on the first mounting portion 118a of the circuit board 116. Next, in the working machine 150, the swing mechanism 156 swings the substrate holding portion 112 so that the plane on which the second mounting portion 118b of the circuit board 116 is located is horizontal. Then, the electronic component mounting machine 10b performs mounting work on the board holder 140 that holds the circuit board 116 in a state where the plane on which the second mounting portion 118b is located is horizontal, so that the second mounting portion 116b is second. Electronic components are mounted on the mounting portion 118b. As a result, the electronic components are mounted on the first mounting portion 118a and the second mounting portion 118b that are inclined from each other on the circuit board 116.

10: Electronic component mounting machine (working machine) 100: Board holder (working object holder) 102: Fixed plate (pallet) 106: Holding mechanism 116: Circuit board (working body) 120: Electromagnetic motor (actuator) 122 : Electromagnetic motor (actuator) 124: Battery (power supply) 126: Control device 128: Operation switch 130: Operation switch 132: Operation switch 134: Operation switch

Claims (1)

An electronic component mounting system that uses a circuit board holder that holds a circuit board.
A conveyor device for an electronic component mounting machine that supports the circuit board holder, and
It is provided with a changing mechanism provided at a position different from that of the conveyor device in the transport direction of the conveyor device of the electronic component mounting machine, which changes the angle of the circuit board with respect to the horizontal plane by operating the circuit board holder.
An electronic component mounting system in which the circuit board holder supported by a conveyor device of the electronic component mounting machine is moved to the changing mechanism, and the angle of the circuit board with respect to the horizontal plane is changed by the changing mechanism.

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